CN102515493B - Cutting device and cutting method of liquid crystal panel - Google Patents
Cutting device and cutting method of liquid crystal panel Download PDFInfo
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- CN102515493B CN102515493B CN201110384890.7A CN201110384890A CN102515493B CN 102515493 B CN102515493 B CN 102515493B CN 201110384890 A CN201110384890 A CN 201110384890A CN 102515493 B CN102515493 B CN 102515493B
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- 238000005520 cutting process Methods 0.000 title claims abstract description 171
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 117
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims description 133
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 42
- 239000007921 spray Substances 0.000 claims description 10
- 238000005507 spraying Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000005251 gamma ray Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Liquid Crystal (AREA)
Abstract
The invention discloses a cutting device and a cutting method of a liquid crystal panel. The liquid crystal panel comprises a first base plate and a second plate which are mutually fit. The cutting device of the liquid crystal panel comprises a first cutting part used for cutting the first base plate and a second cutting part used for cutting the second base plate, wherein the second cutting part comprises a supporting part; and the supporting part is used for supporting the first base plate when the first cutting part is used for cutting the first base plate and the second cutting part is not used for cutting the second base plate. By using the cutting device and the cutting method, the cutting quality is ensured, cutting efficiency is improved, and cutting cost is saved.
Description
[technical field]
The invention belongs to the production technical field of liquid crystal panel, particularly relate to a kind of cutting unit and cutting method of liquid crystal panel.
[background technology]
Along with constantly popularizing of liquid-crystal display, the production efficiency of liquid crystal panel is had higher requirement.
In the making processes of liquid crystal panel, by Thin Film Transistor (TFT) (Thin Film Transistor, TFT) substrate and colorized optical filtering (Color Filter, CF) after substrate in combination, owing to need to sliver being carried out to expose the metal wire at TFT substrate two ends in CF substrate two ends, make length or the width of TFT substrate and CF substrate inconsistent, thereby form portion of terminal.
Refer to Figure 1A, liquid crystal panel 10' comprises TFT substrate 11' and CF substrate 12', and wherein, the portion of terminal 111' at TFT substrate 11' two ends comprises many metal line 1111', and many metal line 1111' arranges along direction B.
Refer to Figure 1B, cutting facility comprises cutter head 21' and lower cutter head 22', in the time the liquid crystal panel 10' shown in Figure 1A being cut by cutting facility, if the cut direction L(of cutting facility is the flow direction of liquid crystal panel 10') vertical with the orientation B of metal wire 1111', in the time that liquid crystal panel 10' is cut, cutting facility need to pass through portion of terminal 111', now will occur two kinds of situations:
If when the first upper cutter head 21' starts to cut to TFT substrate 11', lower cutter head 22' starts CF substrate 12' to cut simultaneously, go up cutter head 21' and lower cutter head 22' in the distance at cut direction L interval by excessive, can cause the fracture of liquid crystal panel;
If the second upper cutter head 21' and lower cutter head 22' are too little at cut direction L spacing distance, will make cutter head 21' cut TFT substrate 11' time, lower cutter head 22' also cuts TFT substrate 11', when cutter head 22' moves to CF substrate 12' instantly, the side of CF substrate 12' will be touched, cause liquid crystal panel 10' that irregular movement occurs, or cause lower cutter head 22' to halt in the side edge of CF substrate 12', greatly affected cutting quality.
The vertical above-mentioned detrimentally affect of bringing to the cutting of liquid crystal panel 10' of orientation B for fear of the cut direction L due to cutting facility with metal wire 1111', prior art takes following two kinds of modes that portion of terminal 111' is excised conventionally:
The first, refer to Fig. 1 C, the orientation B that controls the metal wire 1111' of liquid crystal panel 10' is parallel to the cut direction L of cutting facility, by existing cutting facility, the portion of terminal 111' of liquid crystal panel 10' is cut away.But under which, if the cut direction L of the orientation B of metal wire 1111' and cutting facility is not parallel, need to readjust the flow direction of liquid crystal panel 10', cause the single products production time to increase, reduced formation efficiency.
The second, on cutting facility, set up a precut portion, by this precut portion, the portion of terminal 111' of liquid crystal panel 10' is excised in advance, make TFT substrate 11' consistent with width with the length of CF substrate 12', by existing cutting facility, liquid crystal panel 10' is cut again afterwards.But which need to increase a precut portion on existing cutting facility, make processing procedure become complicated, but also increase production cost.
To sum up, in prior art in the time that liquid crystal panel is cut, because TFT substrate exists portion of terminal, cause the limited or cutting processing procedure complexity of liquid crystal panel when cutting flow direction, cost higher, be one of liquid crystal panel production technical field technical issues that need to address.
[summary of the invention]
One object of the present invention is to provide a kind of cutting unit of liquid crystal panel, to solve in prior art in the time that liquid crystal panel is cut, because TFT substrate two ends exist portion of terminal, cause the limited or cutting processing procedure complexity of liquid crystal panel when cutting flow direction, problem that cost is higher.
For addressing the above problem, the present invention has constructed a kind of cutting unit of liquid crystal panel, and described liquid crystal panel comprises first substrate bonded to each other and second substrate; The cutting unit of described liquid crystal panel comprises the first cutting part for cutting described first substrate and for cutting the second cutting part of described second substrate;
Described the second cutting part comprises a support portion, and described support portion is for cutting described first substrate at described the first cutting part, and described the second cutting part is while not yet cutting described second substrate, supports described first substrate;
Wherein, described the first cutting part comprises the first cutter head for cutting described first substrate, described the second cutting part comprises the second cutter head for cutting described second substrate, described the first cutter head shifts to install in the direction vertical with described liquid crystal panel with described the second cutter head, and described the first cutter head with described the second cutter head in direction interval one distance parallel with described liquid crystal panel;
Described the second cutting part also comprises the second pedestal and the second support, and described the second support and described support portion are all arranged on described the second pedestal, and the distance of described the second support and described first substrate is less than the distance of described support portion and described first substrate.
In the cutting unit of liquid crystal panel of the present invention, described the second cutter head with described second substrate in the direction interval vertical with the plane of described liquid crystal panel cutter distance once.
In the cutting unit of liquid crystal panel of the present invention, described the first cutting part comprises described the first cutter head, the first support, the first pedestal, the first motor and the first leading screw; Described the first cutter head is arranged on described the first support, described the first support is arranged on described the first pedestal, described the first motor connects described the first pedestal, described the first pedestal described the first leading screw that is slidably connected, described the first motor is used for driving described the first pedestal to slide along described the first leading screw;
Described the second cutting part comprises described the second cutter head, described the second support, described the second pedestal, the second motor, the second leading screw and described support portion; Described the second motor connects described the second pedestal, described the second pedestal described the second leading screw that is slidably connected, and described the second motor is used for driving described the second pedestal to slide along described the second leading screw.
In the cutting unit of liquid crystal panel of the present invention, described the first cutter head is less than or equal to 3.5 millimeters with described the second cutter head in the distance of the direction parallel with described liquid crystal panel.
In the cutting unit of liquid crystal panel of the present invention, described support portion is a nozzle, and described nozzle is used for spraying gas to support described first substrate.
Another object of the present invention is to provide a kind of cutting method of liquid crystal panel, to solve in prior art in the time that liquid crystal panel is cut, because TFT substrate two ends exist portion of terminal, cause the limited or cutting processing procedure complexity of liquid crystal panel when cutting flow direction, problem that cost is higher.
For addressing the above problem, the present invention has constructed a kind of cutting method of liquid crystal panel, and described liquid crystal panel comprises first substrate bonded to each other and second substrate; The cutting method of described liquid crystal panel comprises the following steps:
The cutting unit of one liquid crystal panel is provided, and the cutting unit of described liquid crystal panel comprises the first cutting part and the second cutting part, and described the second cutting part comprises a support portion;
Control described the first cutting part contact first substrate, and start described first substrate to cut, support described first substrate by described support portion simultaneously;
Control described the second cutting part and contact described second substrate, and start described second substrate to cut, stop the support of described support portion to described first substrate;
Wherein, described the first cutting part comprises the first cutter head for cutting described first substrate, described the second cutting part comprises the second cutter head for cutting described second substrate, described the first cutter head shifts to install in the direction vertical with described liquid crystal panel with described the second cutter head, and described the first cutter head with described the second cutter head in direction interval one distance parallel with described liquid crystal panel;
Described the second cutting part also comprises the second pedestal and the second support, and described the second support and described support portion are all arranged on described the second pedestal, and the distance of described the second support and described first substrate is less than the distance of described support portion and described first substrate.
In the cutting method of liquid crystal panel of the present invention, before controlling described the second cutting part contact second substrate, described method is further comprising the steps of:
Control described the second cutting part and move cutter distance along the direction vertical with the plane of described liquid crystal panel, to contact described second substrate.
In the cutting method of liquid crystal panel of the present invention, described support portion is a nozzle, and the step that supports described first substrate by described support portion specifically comprises:
Spray gas to support described first substrate by described nozzle.
The present invention is compared to prior art, by one support portion being set at the second cutting part, for example nozzle, at the first cutting part, first substrate is cut, and the second cutting part is while not yet cutting second substrate, support described first substrate by described support portion, obviously, the present invention no matter exist portion of terminal liquid crystal panel flow direction how, can both effectively cut liquid crystal panel, eliminate the detrimentally affect that portion of terminal causes the cutting of liquid crystal panel, guarantee cutting quality, improve cutting efficiency, and without besides increasing precut portion, reduce processing procedure cost.
For foregoing of the present invention can be become apparent, preferred embodiment cited below particularly, and coordinate appended graphicly, be described in detail below:
[accompanying drawing explanation]
Figure 1A is the structural representation of liquid crystal panel;
Figure 1B-1C is the cutting schematic diagram of liquid crystal panel in prior art;
Fig. 2 is the preferred embodiment of cutting unit and the position relationship schematic diagram of liquid crystal panel of liquid crystal panel of the present invention;
Fig. 3 is the structural representation that adopts the liquid crystal panel that the cutting unit of liquid crystal panel of the present invention cuts;
Fig. 4 is the structural representation of the preferred embodiment of the nozzle of the cutting unit of liquid crystal panel of the present invention;
Fig. 5 is the zero position schematic diagram that the cutting unit of liquid crystal panel of the present invention cuts liquid crystal panel;
Fig. 6 is the process position view that the cutting unit of liquid crystal panel of the present invention cuts liquid crystal panel; And
Fig. 7 is the preferred embodiment schematic flow sheet of the cutting method of liquid crystal panel of the present invention.
[embodiment]
The explanation of following embodiment is graphic with reference to what add, can be in order to the specific embodiment of implementing in order to illustrate the present invention.
Referring to Fig. 2, is the preferred embodiment of cutting unit and the position relationship schematic diagram of liquid crystal panel of liquid crystal panel of the present invention, and the cutting unit of described liquid crystal panel comprises the first cutting part 10 and the second cutting part 20.
Described the first cutting part 10 comprises the first cutter head 11, the first support 12, the first pedestal 13, the first motor 14 and the first leading screw 15.Described the first cutter head 11 is arranged on described the first support 12, described the first support 12 is arranged on described the first pedestal 13, described the first motor 14 connects described the first pedestal 13, described the first pedestal 13 described the first leading screw 15 that is slidably connected, described the first motor 14 is for driving described the first pedestal 13 to slide along described the first leading screw 15.
Described the second cutting part 20 comprises the second cutter head 21, the second support 22, the second pedestal 23, the second motor 24, the second leading screw 25 and nozzle 26.Described the second cutter head 21 is arranged on described the second support 22, described the second support 22 and described nozzle 26 are arranged on described the second pedestal 23, described the second motor 24 connects described the second pedestal 23, described the second pedestal 23 described the second leading screw 25 that is slidably connected, described the second motor 24 is for driving described the second pedestal 23 to slide along described the second leading screw 25.
Refer to Fig. 3, its schematic perspective view that is the liquid crystal panel 30 that adopts the cutting unit of liquid crystal panel of the present invention and cut, described liquid crystal panel 30 comprises described first substrate 31 and second substrate 32.Described first substrate 31 is fitted with second substrate 32, and forms portion of terminal 311 at described first substrate 31 two ends, and described portion of terminal 311 has many metal line 3111, and described many metal line 3111 are arranged along direction B.
See also Fig. 2 and Fig. 3, in figure, B1 is the direction parallel with described liquid crystal panel 30, and B2 is the direction vertical with described liquid crystal panel 30.Described the first cutting part 10 and described the second cutting part 20 are oppositely arranged, thereby described the first cutter head 11 and described the second cutter head 21 shift to install in direction B1 interval one distance B 4 at direction B2.Described liquid crystal panel 30 is arranged between the first cutter head 11 and the second cutter head 21, and described the first cutter head 11 is arranged on described first substrate 31 tops, described the second cutter head 21 and is arranged on the below of described second substrate 32.Described nozzle 26 has a support distances D1 with described first substrate 31 at direction B2, and described the second support 22 has a space D 2 with described first substrate 31 at direction B2, and described the second cutter head 21 has cutter distance B 3 with described second substrate 32 at direction B2.
Refer to Fig. 2, described nozzle 26 can, along direction B2 ejection air-flow, in the time that described the first cutter head 11 cuts the portion of terminal 311 of described first substrate 31, support described first substrate 31 again.
See also Fig. 2 and Fig. 4, Fig. 4 is the structural representation of a preferred embodiment of described nozzle 26 of the present invention.Described nozzle 26 is convergent-divergent channel, described nozzle 26 comprises outlet 261 and throat 262, and this convergent-divergent channel can spray pressure, and enough large gas is to support described first substrate 31, and described nozzle 26 also comprises the cavity configuration for spraying gas, in view of for knowing technology, repeat no more herein.Certainly, in specific implementation process, described nozzle 26 can be also the support portion of other structure, for example one can automatic telescopic pole, as long as can be in the time that described the first cutter head 11 cuts the portion of terminal 311 of described first substrate 31, support described first substrate 31, do not enumerate herein.
When the cutting unit of described liquid crystal panel cuts in the portion of terminal 311 to described first substrate 31, and described the second cutter head 21 does not cut described second substrate 32, now described nozzle 26 sprays gas to support described first substrate 31, has avoided the damage described liquid crystal panel 30 being caused because the described portion of terminal 311 of described first substrate 31 is subject to force unbalance.
Please continue to refer to Fig. 2, on direction B1, the space D 2 of described the second support 22 and described first substrate 31 is less than the support distances D1 of described nozzle 26 and described first substrate 31.Therefore, in the time that described the second pedestal 23 moves along direction B1, can avoid contacting of described nozzle 26 and described second substrate 32, further guarantee cutting quality.
In the present embodiment, for avoiding because described the first cutter head 11 and described the second cutter head 21 are in the excessive excessive situation of cutting section that causes described liquid crystal panel 30 of space D 4 of direction B1, described the first cutter head 11 and described the second cutter head 21 are unsuitable excessive in the distance B 4 at direction B1 interval, preferably, the distance B 4 at this interval is less than or equal to 3.5mm.
Described the second cutter head 21 and the described second substrate 32 lower cutter distance B 3>0 between direction B2.In the time that described the second motor 24 drives described the second pedestal 23 to move along direction B1, control described the second cutter head 21 simultaneously and move described lower cutter distance B 3 along direction B2, to make described the second cutter head 21 contact described second substrate 32.The present embodiment, by interval cutter distance B 3 once between described the second cutter head 21 and described second substrate 32, has guaranteed that described the second cutter head 21 does not bump with the edge of described second substrate 32 before to described second substrate 32 cuttings.In specific implementation process, described the second cutter head 21 is adjusted in translational speed and the described lower cutter distance B 3 of direction B1 according to described the second cutter head 21 in the translational speed (descending cutter speed) of direction B2, repeat no more herein.
Describe the process of the cutting liquid crystal panel of the preferred embodiment of the cutting unit of liquid crystal panel in the present invention in detail below in conjunction with Fig. 2, Fig. 5 and Fig. 6.
Refer to Fig. 2 and Fig. 5, the cutting unit of described liquid crystal panel cuts described liquid crystal panel 30 along direction B1, described the first motor 14 drives described the first pedestal 13 to slide along described the first leading screw 15, described the first cutter head 11 contacts described first substrate 31 and starts portion of terminal 311 places of described first substrate 31 are cut, now, described nozzle 26 sprays gas to support described first substrate 31, described the second motor 24 drives described the second pedestal 23 to slide along described the second leading screw 25, and control described the second cutter head 21 simultaneously and move to described second substrate 32 along direction B2, move along direction B2 after described lower cutter distance B 3 at described the second cutter head 21 of control, described the second cutter head 21 contacts described second substrate 32.
Refer to Fig. 2 and Fig. 6, described the second cutter head 21 contacts described second substrate 32, and starts described second substrate 32 to cut.Now, described nozzle 26 stops spraying gas, when described second substrate 32 cutting due to described the second cutter head 21, described liquid crystal panel 30 is produced to an anchorage force, offset described the first cutter head 11 pressure to described liquid crystal panel 30 when described first substrate 31 is cut, therefore can there is not perk phenomenon in described liquid crystal panel 30, guaranteed the quality of cutting.
The present invention is by described the second cutting part 20, described nozzle 26 being set, and in the time that described the first cutting part 10 cuts the portion of terminal 311 of described first substrate 31, described nozzle 26 sprays gas to support described first substrate 31.Obviously, the present invention no matter exist described portion of terminal 311 described liquid crystal panel 30 flow direction how, can both effectively cut described liquid crystal panel 30, eliminate the detrimentally affect of described portion of terminal 311 to cutting, guarantee cutting quality, improve cutting efficiency, and without besides increasing precut portion, reduced processing procedure cost.
Refer to Fig. 7, Fig. 7 is the preferred embodiment schematic flow sheet of the cutting method of liquid crystal panel in the present invention, and the cutting method of described liquid crystal panel comprises the steps:
Step S701: the cutting unit of a liquid crystal panel is provided, and the detailed construction of the cutting unit of this liquid crystal panel refers to the description of Fig. 2-Fig. 6, repeats no more herein.
Step S702: the first cutting part 21 cuts first substrate 31, and nozzle 26 sprays gas.
In this step, the first motor 14 drives the first pedestal 13 to slide along the first leading screw 15, and the first cutter head 11 contacts first substrate 31, and starts described first substrate 31 to cut.Wherein, the zero position that liquid crystal panel 30 is cut is the one end at portion of terminal 311 places in described liquid crystal panel 30, and the cut direction of described the first cutter head 11 is perpendicular to the orientation B of described metal wire 3111.
Described nozzle 26 sprays gas, supports described first substrate 31.Now, due to γ-ray emission one anchorage force that described nozzle 26 sprays, this anchorage force supports described first substrate 31, has offset the pressure of described the first cutter head 11 to described first substrate 31.In specific implementation process, described nozzle 26 can be also the support portion of other structure, for example one can automatic telescopic pole, as long as can be in the time that described the first cutter head 11 cuts the portion of terminal 311 of described first substrate 31, support described first substrate 31, do not enumerate herein.
Step S703: described the second motor 24 drives described the second pedestal 23 to slide along described the second leading screw 25, control described the second cutter head 22 moves to described second substrate 32 along direction B2 simultaneously, described the second cutter head 22 is moving after time cutter distance B 3 along direction B2, contacts described second substrate 32.
Step S704: described the second cutter head 21 cuts described second substrate 32, and described nozzle 26 stops spraying gas.
The present invention is by arranging described nozzle 26 at described the second cutting part 20, in the time that described the first cutting part 10 cuts the portion of terminal 311 of described first substrate 31, described nozzle 26 sprays gas to support described first substrate 31, obviously, the present invention no matter exist described portion of terminal 311 described liquid crystal panel 30 flow direction how, can both effectively cut described liquid crystal panel 30, eliminate the detrimentally affect of described portion of terminal 311 to cutting, guarantee cutting quality, improve cutting efficiency, and without besides increasing precut portion, reduce processing procedure cost.
In sum; although the present invention discloses as above with preferred embodiment; but above preferred embodiment is not in order to limit the present invention; those of ordinary skill in the art; without departing from the spirit and scope of the present invention; all can do various changes and retouching, the scope that therefore protection scope of the present invention defines with claim is as the criterion.
Claims (8)
1. a cutting unit for liquid crystal panel, described liquid crystal panel comprises first substrate bonded to each other and second substrate; The cutting unit of described liquid crystal panel comprises the first cutting part for cutting described first substrate and for cutting the second cutting part of described second substrate, it is characterized in that:
Described the second cutting part comprises a support portion, and described support portion is for cutting described first substrate at described the first cutting part, and described the second cutting part is while not yet cutting described second substrate, supports described first substrate;
Wherein, described the first cutting part comprises the first cutter head for cutting described first substrate, described the second cutting part comprises the second cutter head for cutting described second substrate, described the first cutter head shifts to install in the direction vertical with described liquid crystal panel with described the second cutter head, and described the first cutter head with described the second cutter head in direction interval one distance parallel with described liquid crystal panel;
Described the second cutting part also comprises the second pedestal and the second support, and described the second support and described support portion are all arranged on described the second pedestal, and the distance of described the second support and described first substrate is less than the distance of described support portion and described first substrate.
2. the cutting unit of liquid crystal panel according to claim 1, is characterized in that, described the second cutter head with described second substrate in the direction interval vertical with the plane of described liquid crystal panel cutter distance once.
3. the cutting unit of liquid crystal panel according to claim 1, is characterized in that,
Described the first cutting part comprises described the first cutter head, the first support, the first pedestal, the first motor and the first leading screw; Described the first cutter head is arranged on described the first support, described the first support is arranged on described the first pedestal, described the first motor connects described the first pedestal, described the first pedestal described the first leading screw that is slidably connected, described the first motor is used for driving described the first pedestal to slide along described the first leading screw;
Described the second cutting part comprises described the second cutter head, described the second support, described the second pedestal, the second motor, the second leading screw and described support portion; Described the second motor connects described the second pedestal, described the second pedestal described the second leading screw that is slidably connected, and described the second motor is used for driving described the second pedestal to slide along described the second leading screw.
4. the cutting unit of liquid crystal panel according to claim 1, is characterized in that, described the first cutter head is less than or equal to 3.5 millimeters with described the second cutter head in the distance of the direction parallel with described liquid crystal panel.
5. the cutting unit of liquid crystal panel according to claim 1, is characterized in that, described support portion is a nozzle, and described nozzle is used for spraying gas to support described first substrate.
6. a cutting method for liquid crystal panel, described liquid crystal panel comprises first substrate bonded to each other and second substrate; It is characterized in that, the cutting method of described liquid crystal panel comprises the following steps:
The cutting unit of one liquid crystal panel is provided, and the cutting unit of described liquid crystal panel comprises the first cutting part and the second cutting part, and described the second cutting part comprises a support portion;
Control described the first cutting part contact first substrate, and start described first substrate to cut, support described first substrate by described support portion simultaneously;
Control described the second cutting part and contact described second substrate, and start described second substrate to cut, stop the support of described support portion to described first substrate;
Wherein, described the first cutting part comprises the first cutter head for cutting described first substrate, described the second cutting part comprises the second cutter head for cutting described second substrate, described the first cutter head shifts to install in the direction vertical with described liquid crystal panel with described the second cutter head, and described the first cutter head with described the second cutter head in direction interval one distance parallel with described liquid crystal panel;
Described the second cutting part also comprises the second pedestal and the second support, and described the second support and described support portion are all arranged on described the second pedestal, and the distance of described the second support and described first substrate is less than the distance of described support portion and described first substrate.
7. the cutting method of liquid crystal panel according to claim 6, is characterized in that, before controlling described the second cutting part contact second substrate, described method is further comprising the steps of:
Control described the second cutting part and move cutter distance along the direction vertical with the plane of described liquid crystal panel, to contact described second substrate.
8. the cutting method of liquid crystal panel according to claim 6, is characterized in that, described support portion is a nozzle, and the step that supports described first substrate by described support portion specifically comprises:
Spray gas to support described first substrate by described nozzle.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110384890.7A CN102515493B (en) | 2011-11-28 | 2011-11-28 | Cutting device and cutting method of liquid crystal panel |
| PCT/CN2011/083201 WO2013078632A1 (en) | 2011-11-28 | 2011-11-30 | Cutting apparatus and cutting method for liquid crystal panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110384890.7A CN102515493B (en) | 2011-11-28 | 2011-11-28 | Cutting device and cutting method of liquid crystal panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102515493A CN102515493A (en) | 2012-06-27 |
| CN102515493B true CN102515493B (en) | 2014-05-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110384890.7A Expired - Fee Related CN102515493B (en) | 2011-11-28 | 2011-11-28 | Cutting device and cutting method of liquid crystal panel |
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| Country | Link |
|---|---|
| CN (1) | CN102515493B (en) |
| WO (1) | WO2013078632A1 (en) |
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| CN102757175B (en) * | 2012-07-17 | 2016-03-02 | 创维液晶器件(深圳)有限公司 | The cutting method of thin slice sheet glass and cutting machine |
| CN103833204B (en) * | 2014-02-22 | 2016-11-23 | 蚌埠中建材信息显示材料有限公司 | A kind of wind-force jacking device crosscutting for ultra-thin flat glass |
| CN103833209B (en) * | 2014-02-22 | 2016-01-20 | 蚌埠中建材信息显示材料有限公司 | A kind of strength jacking device for ultra-thin flat glass crosscut |
| JP6384264B2 (en) * | 2014-10-20 | 2018-09-05 | 三星ダイヤモンド工業株式会社 | Scribing method and scribing apparatus |
| JP6384265B2 (en) * | 2014-10-20 | 2018-09-05 | 三星ダイヤモンド工業株式会社 | Scribing method and scribing apparatus |
| CN106405887B (en) * | 2016-06-13 | 2023-06-20 | 江西合力泰科技有限公司 | Strip breaking device and strip breaking method for liquid crystal display panel strip breaking equipment |
| CN107718323A (en) * | 2017-09-20 | 2018-02-23 | 重庆市顺华安全玻璃有限公司 | A kind of glass cutting device |
| CN110405490B (en) * | 2019-07-24 | 2021-05-28 | Tcl华星光电技术有限公司 | Cutting device and plate cutting method |
| CN110928008B (en) * | 2019-11-26 | 2022-05-31 | 深圳市华星光电半导体显示技术有限公司 | Panel cutting device |
| CN112379545A (en) * | 2020-12-03 | 2021-02-19 | 深圳市华星光电半导体显示技术有限公司 | Display panel cutting device |
| CN114750232B (en) * | 2022-06-13 | 2022-08-16 | 季华实验室 | Cutting method of LED display unit based on glass substrate |
| CN115453782A (en) * | 2022-09-29 | 2022-12-09 | 深圳市思迪科科技有限公司 | Secondary cutting process for liquid crystal display screen |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1678439A (en) * | 2002-07-02 | 2005-10-05 | 三星钻石工业股份有限公司 | Pasted base board cutting system and base board cutting method |
| CN101134639A (en) * | 2006-08-29 | 2008-03-05 | 精工爱普生株式会社 | Method of scribing stuck mother substrate and method of dividing stuck mother substrate |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05105465A (en) * | 1991-10-15 | 1993-04-27 | Nec Kagoshima Ltd | Glass scriber |
| KR100724474B1 (en) * | 2002-10-22 | 2007-06-04 | 엘지.필립스 엘시디 주식회사 | Device for cutting liquid crystal display panel and method for cutting the same |
| KR101074397B1 (en) * | 2004-12-23 | 2011-10-17 | 엘지디스플레이 주식회사 | Apparatus and method for scribing of display panel |
| JP4987266B2 (en) * | 2005-08-08 | 2012-07-25 | パナソニック株式会社 | Glass cutting method and apparatus |
| CN102976599B (en) * | 2008-04-21 | 2015-06-24 | 塔工程有限公司 | Method of step-scribing bonded substrate and control system thereof |
| KR100937965B1 (en) * | 2008-07-16 | 2010-01-21 | 삼성모바일디스플레이주식회사 | Flat display panel cutting apparatus |
| CN201473449U (en) * | 2009-09-03 | 2010-05-19 | 北京京东方光电科技有限公司 | Liquid crystal glass substrate cutting device |
-
2011
- 2011-11-28 CN CN201110384890.7A patent/CN102515493B/en not_active Expired - Fee Related
- 2011-11-30 WO PCT/CN2011/083201 patent/WO2013078632A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1678439A (en) * | 2002-07-02 | 2005-10-05 | 三星钻石工业股份有限公司 | Pasted base board cutting system and base board cutting method |
| CN101134639A (en) * | 2006-08-29 | 2008-03-05 | 精工爱普生株式会社 | Method of scribing stuck mother substrate and method of dividing stuck mother substrate |
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| WO2013078632A1 (en) | 2013-06-06 |
| CN102515493A (en) | 2012-06-27 |
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