CN102508583B - Preparation method for metal lead of capacitance type touch screen - Google Patents
Preparation method for metal lead of capacitance type touch screen Download PDFInfo
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- CN102508583B CN102508583B CN201110296985.3A CN201110296985A CN102508583B CN 102508583 B CN102508583 B CN 102508583B CN 201110296985 A CN201110296985 A CN 201110296985A CN 102508583 B CN102508583 B CN 102508583B
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Abstract
Disclosed is a preparation method for a metal lead of a capacitance type touch screen. The preparation method is characterized in that firstly, resin protecting adhesive is in screen printing and thermal curing to form protecting films, ITO (indium tin oxide) patterns are arranged on two surfaces of a glass substrate, ITO outgoing lines are disposed on the periphery of the glass substrate, the ITO patterns on the glass substrate are covered by the protecting films, and the ITO outgoing lines are exposed; and secondly, copper and nickel metal films are sequentially covered on surfaces of the exposed ITO outgoing lines on the periphery of the glass substrate by the aid of a chemical plating method, and accordingly the metal lead of the touch screen is formed. The metal lead manufactured by the aid of the preparation method is excellent in conductivity, and the preparation method is simple in manufacture process and low in cost as compared with other methods.
Description
Technical field
The present invention relates to a kind of capacitive touch screen technology of preparing, the preparation method of metal lead wire on especially a kind of touch-screen, specifically a kind of method of making metal lead wire on condenser type touch screen substrate by electroless copper and chemical nickel plating.
Background technology
In order to reduce the capacitive touch screen resistance of extension line part around, touch-screen is made into metal wire by glass surrounding extension line in making and obtains good electrical property.The metal lead wire method for making of patent report has serigraphy conductive metal slurry to make after metal wire [CN101996007A] sputter deposited metal film photoetching and metal wire [CN102096534A] is made in etching, and electroless gold-plating method is made metal lead wire [CN10184625A].All there is complex manufacturing technology, problem that cost of manufacture is high in these methods.
Summary of the invention
The object of the invention is for existing touch-screen metal lead wire complicated process of preparation, the problem that cost is high, invents a kind of cost low, the preparation method of metal lead of capacitance type touch screen simple for process.
Technical scheme of the present invention is:
A kind of preparation method of metal lead of capacitance type touch screen, it is characterized in that first forming diaphragm by serigraphy resin protection glue heat curing covers in the ITO figure on the two-sided glass substrate that has ITO extension line with ITO figure, surrounding, and ITO extension line is exposed; Secondly, ITO extension line surface covering copper and the nickel metal film successively exposing by chemical plating method in glass substrate surrounding, finally forms touch-screen metal lead wire.
Described electroless copper and chemical nickel plating comprise degreasing, alligatoring, colloid palladium activation, dispergation, electroless copper, ionic palladium activation, chemical nickel plating and oven dry:
(1) degreasing: the glass substrate with protection glue is immersed in 3-5 minute in the neutral degreaser of 40-50 ℃, after taking out with mobile deionized water rinsing glass;
(2) alligatoring: glass substrate is put into the acid solution 3-5 minute that pH value is 1-3, with deionized water, glass substrate is rinsed well;
(3) colloid palladium activation: glass substrate immerses 3-5 minute in room temperature alkali palladium colloid, cleans glass substrate after activation in ionized water;
(4) dispergation: glass substrate immerses 10-60s in sodium hydroxide solution, then takes out glass substrate deionized water and rinses well;
(5) electroless copper: glass substrate immerses 1-3 minute in the chemical bronze plating liquid that temperature is 11-12.5 35-50 ℃ of pH value, the copper film that forms 1-5 micron thickness on the ITO of glass substrate surrounding extension line covers, and takes out glass substrate and rinses well with deionized water;
(6) ionic palladium activation: glass substrate is put into 1-2 minute in ionic palladium activating solution, rinses glass substrate well with deionized water;
(7) chemical nickel plating: glass substrate is put into the chemical nickel-plating solution 2-5 minute that 80-95 ℃ of pH value is 4-6 forms the nickel metal layer of 3-6 micron on the copper film of glass surrounding ITO lead-in wire, with deionized water, glass substrate is rinsed well;
(8) remove the upper diaphragm covering of glass substrate graphics field ITO, glass substrate is put into 150 ℃ of baking ovens, be incubated 30 minutes.
Beneficial effect of the present invention:
The present invention adopts the method for electroless copper and chemical nickel plating to form copper nickel metal lead wire in glass edge, and it has advantages of, and manufacture craft is simplified, cost of manufacture is low.
Embodiment
Below in conjunction with embodiment, the present invention is further illustrated.
A kind of preparation method of metal lead of capacitance type touch screen; first on glass substrate, make two-sided ITO figure; and form ITO extension line in the surrounding of glass substrate; cover in the ITO figure on glass substrate by serigraphy resin protection glue; after oven dry, between this protection glue and ITO figure and glass substrate, there is good adhesion; in the chemical plating fluid of strong acid and strong base, there is not chemistry, physical change, can not come off.
Then, glass substrate is put into neutral degreaser and soak 3～5 minutes, degreaser concentration is 25g/L, and temperature is 40～50 ℃, removes the grease that glass substrate processing and fabricating transmittance process forms.After degreasing, with mobile deionized water rinsing 2 minutes, degreaser is rinsed well completely.It is 1～3 that glass substrate immerses pH value under room temperature, the best is in 2 acid solution 3～5 minutes, ITO extension line on glass substrate is carried out to alligatoring, and this coarsening solution is made up of oxalic acid, hydrochloric acid, nitric acid, hydrofluorite, sodium chloride etc., after alligatoring, with deionized water, glass substrate is rinsed well.In the colloidal pd activation solution of glass substrate immersion room temperature, within 3～5 minutes, allow palladium micelle be adsorbed on ITO surface, use deionized water rinsing 2 minutes after activation, contain sodium chloride, palladium bichloride, stannous chloride in this colloid palladium, weight ratio is respectively 11%, 0.02%, 0.86%.In the sodium hydroxide solution that glass substrate immerses under room temperature, concentration is 25g/L, 10-60 the best second is 15s, deionized water rinsing 1 minute, and object is that the palladium ion in micelle is come out.Glass substrate is put into 35～50 ℃, and the best is that 45 ℃, pH are 11-12.5, and 1-3 minute in the chemical bronze plating liquid that the best is 12 obtains thickness and be the copper film (also can by THICKNESS CONTROL in 1-5 micron) of 2 microns, takes out and rinses well with deionized water.Copper sulphate 16g/L, EDTA-2Na 25g/L, copper plating additive 7mL/L, formaldehyde 15mL/L, NaOH 14g/L in this chemical bronze plating liquid.The substrate that plates copper film is put into ionic palladium activating solution and is rinsed well with deionized water for 1-2 minute, contains palladium bichloride 0.1g/L, hydrochloric acid 0.2g/L in this ionic palladium.Glass substrate is put into 85 ℃ of (also can be 80-95 ℃) pH values and also can be 4-6 for 4.5() within nickel plating solution 2-5 minute, on copper film, obtain the nickel film that thickness is 3 microns (also can between 3-6 micron), under ionized water, rinse well.In chemical nickel-plating liquid, chemical composition has nickelous sulfate 25g/L, lactic acid 25mL/L, sodium acetate 15g/L, inferior sodium phosphate 30g/L, chemical nickel adjuvant 5mL/L.Form copper and mickel plain conductor touch screen base plate by chemical plating method, remove the diaphragm of ITO graphics field on substrate, put into that in 150 ℃ of drying boxes, to be incubated the adhesion making for 30 minutes between metal film and substrate further firm.
The part that the present invention does not relate to all prior art that maybe can adopt same as the prior art is realized.
Claims (1)
1. the preparation method of a metal lead of capacitance type touch screen, it is characterized in that first forming diaphragm by serigraphy resin protection glue heat curing covers in the ITO figure on the two-sided glass substrate that has ITO extension line with ITO figure, surrounding, and ITO extension line is exposed; Secondly, ITO extension line surface covering copper and the nickel metal film successively exposing in glass substrate surrounding by chemical plating method, forms touch-screen metal lead wire; Described electroless copper and chemical nickel plating comprise degreasing, alligatoring, colloid palladium activation, dispergation, electroless copper, ionic palladium activation, chemical nickel plating and oven dry:
Degreasing: the glass substrate with protection glue is immersed in 3-5 minute in the neutral degreaser of 40-50 ℃, after taking out with mobile deionized water rinsing glass;
Alligatoring: glass substrate is put into the acid solution 3-5 minute that pH value is 1-3, with deionized water, glass substrate is rinsed well;
Colloid palladium activation: glass substrate immerses 3-5 minute in room temperature alkali palladium colloid, cleans glass substrate after activation in ionized water;
Dispergation: glass substrate immerses 10-60s in sodium hydroxide solution, then takes out glass substrate deionized water and rinses well;
Electroless copper: it is that 35-50 ℃ of pH value is 1-3 minute in the chemical bronze plating liquid of 11-12.5 that glass substrate immerses temperature, and the copper film that forms 1-5 micron thickness on the ITO of glass substrate surrounding extension line covers, and takes out glass substrate and rinses well with deionized water;
Ionic palladium activation: glass substrate is put into 1-2 minute in ionic palladium activating solution, rinses glass substrate well with deionized water;
Chemical nickel plating: glass substrate is put into the chemical nickel-plating solution 2-5 minute that 80-95 ℃ of pH value is 4-6 forms the nickel metal layer of 3-6 micron on the copper film of glass surrounding ITO lead-in wire, with deionized water, glass substrate is rinsed well;
Dry: remove the upper resin protection film covering of glass substrate graphics field ITO, glass substrate is put into 150 ℃ of baking ovens, be incubated 30 minutes.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110296985.3A CN102508583B (en) | 2011-09-30 | 2011-09-30 | Preparation method for metal lead of capacitance type touch screen |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110296985.3A CN102508583B (en) | 2011-09-30 | 2011-09-30 | Preparation method for metal lead of capacitance type touch screen |
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| CN102508583A CN102508583A (en) | 2012-06-20 |
| CN102508583B true CN102508583B (en) | 2014-05-21 |
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| CN201110296985.3A Expired - Fee Related CN102508583B (en) | 2011-09-30 | 2011-09-30 | Preparation method for metal lead of capacitance type touch screen |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102799326A (en) * | 2012-07-03 | 2012-11-28 | 深圳市长江力伟股份有限公司 | Capacitive screen function sheet with double-faced electrode routing and machining method thereof |
| CN102765267B (en) * | 2012-07-31 | 2015-02-25 | 意力(广州)电子科技有限公司 | Roll-to-roll printing process of capacitance product |
| CN102929450A (en) * | 2012-11-21 | 2013-02-13 | 南京华显高科有限公司 | Preparation method for peelable glue protection graph of capacitive touch screen |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85108685A (en) * | 1985-04-23 | 1986-10-22 | 施林工业产权保护股份公司 | The method and apparatus of coating metal on goods |
| CN1245223A (en) * | 1998-08-14 | 2000-02-23 | 金艺企业股份有限公司 | Process for electroplating on single surface of plastics without electrolysis and its resultant structure |
| CN1420416A (en) * | 2001-11-17 | 2003-05-28 | 余章军 | Process for mfg. light-transmission character electroplated key |
| CN1646728A (en) * | 2002-04-23 | 2005-07-27 | 新加坡科技研究局 | Method for electroless deposition of a metal layer on selected portions of a substrate |
| CN101220491A (en) * | 2007-10-08 | 2008-07-16 | 四川长虹电器股份有限公司 | Partially plating method for plastic parts |
-
2011
- 2011-09-30 CN CN201110296985.3A patent/CN102508583B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85108685A (en) * | 1985-04-23 | 1986-10-22 | 施林工业产权保护股份公司 | The method and apparatus of coating metal on goods |
| CN1245223A (en) * | 1998-08-14 | 2000-02-23 | 金艺企业股份有限公司 | Process for electroplating on single surface of plastics without electrolysis and its resultant structure |
| CN1420416A (en) * | 2001-11-17 | 2003-05-28 | 余章军 | Process for mfg. light-transmission character electroplated key |
| CN1646728A (en) * | 2002-04-23 | 2005-07-27 | 新加坡科技研究局 | Method for electroless deposition of a metal layer on selected portions of a substrate |
| CN101220491A (en) * | 2007-10-08 | 2008-07-16 | 四川长虹电器股份有限公司 | Partially plating method for plastic parts |
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| CN102508583A (en) | 2012-06-20 |
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Effective date of registration: 20130802 Address after: 210002 Zhongshan East Road, Jiangsu, China, No. 301, No. Applicant after: Nanjing Xiongmao Electronics Co., Ltd. Address before: 210061 commercial building, room 413, hi tech Development Zone, Jiangsu, Nanjing Applicant before: Nanjing Huaxian High-Tech Co., Ltd. |
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