CN102469728A - 壳体及其制造方法 - Google Patents

壳体及其制造方法 Download PDF

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CN102469728A
CN102469728A CN2010105349400A CN201010534940A CN102469728A CN 102469728 A CN102469728 A CN 102469728A CN 2010105349400 A CN2010105349400 A CN 2010105349400A CN 201010534940 A CN201010534940 A CN 201010534940A CN 102469728 A CN102469728 A CN 102469728A
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magnesium
layer
housing
corrosion
alloy substrate
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张新倍
陈文荣
蒋焕梧
陈正士
陈晓强
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to US13/213,410 priority patent/US20120114967A1/en
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K5/02—Details
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0015—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterized by the colour of the layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C23C14/025—Metallic sublayers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12542—More than one such component
    • Y10T428/12549—Adjacent to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component

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Abstract

一种壳体，包括镁或镁合金基体，形成于该镁或镁合金基体表面的防腐蚀层，及形成于防腐蚀层表面的色彩层，所述防腐蚀层包括依次形成于镁或镁合金基体表面的镁层和氧化镁层。所述壳体具有良好的耐腐蚀性及装饰性外观。本发明还提供了所述壳体的制造方法，包括以下步骤：提供镁或镁合金基体；在该镁或镁合金基体上磁控溅射防腐蚀层，所述防腐蚀层包括依次形成于镁或镁合金基体表面的镁层和氧化镁层；在该防腐蚀层上磁控溅射具有装饰性的色彩层。

Description

壳体及其制造方法
技术领域
本发明涉及一种壳体及其制造方法。
背景技术
真空镀膜技术(PVD)是一种非常环保的成膜技术。以真空镀膜的方式所形成的膜层具有高硬度、高防磨性的化学稳定性、与基体结合牢固以及亮丽的金属外观等优点，因此真空镀膜在镁、镁合金及不锈钢等金属基材表面装饰性处理领域的应用越来越广。
然而，由于镁或镁合金的标准电极电位很低，与PVD镀层，如TiN层或CrN层的电位差较大，且PVD镀层本身不可避免的会存在微小的孔隙，如针孔、裂纹，致使镁或镁合金基体易于发生微电池腐蚀。因此，直接于镁或镁合金基体表面镀覆所述TiN层、CrN等色彩层并不能有效提高所述镁或镁合金基体的耐腐蚀性能，同时该PVD镀层本身也会发生异色、脱落等现象，难以维持良好的装饰外观。
发明内容
鉴于此，提供一种具有良好的耐腐蚀性及装饰性外观的壳体。
另外，还提供一种上述壳体的制造方法。
一种壳体，包括镁或镁合金基体，形成于该镁或镁合金基体表面的防腐蚀层，及形成于防腐蚀层表面的色彩层，所述防腐蚀层包括依次形成于镁或镁合金基体表面的镁层和氧化镁层。
一种壳体的制造方法，包括以下步骤：
提供镁或镁合金基体；
在该镁或镁合金基体上磁控溅射防腐蚀层，所述防腐蚀层包括依次形成于镁或镁合金基体表面的镁层和氧化镁层；
在该防腐蚀层上磁控溅射色彩层。
所述壳体的制造方法，通过磁控溅射法依次于镁或镁合金基体上形成防腐蚀层及具有装饰性的色彩层。所述防腐蚀层包括依次形成于镁或镁合金基体表面的镁层和氧化镁层，当壳体处于腐蚀性介质中时，由于所述防腐蚀层与镁或镁合金基体之间的电位差小，减缓了壳体发生微电池腐蚀的速率，从而提高了壳体的耐腐蚀性。在所述壳体耐腐蚀性提高的同时，还可避免所述色彩层发生异色、脱落等失效现象，从而使该壳体经长时间使用后仍具有较好的装饰性外观。
附图说明
图1为本发明较佳实施例的壳体的剖视图。
主要元件符号说明
壳体              10
镁或镁合金基体    11
防腐蚀层          13
镁层              131
氧化镁层          133
色彩层            15
具体实施方式
请参阅图1，本发明一较佳实施例的壳体10包括镁或镁合金基体11、依次形成于该镁或镁合金基体11上的防腐蚀层13及色彩层15。该壳体10可以为3C电子产品的壳体，也可为工业、建筑用件及汽车等交通工具的零部件等。
所述防腐蚀层13包括镁层131和氧化镁层133，所述镁层131形成于基体11的表面，所述氧化镁层133形成于镁层131的表面。所述镁层131的厚度为1.0～3.0μm；所述氧化镁层133的厚度为0.5～1.0μm。
所述色彩层15为Ti-N层，其厚度为1.0～3.0μm。可以理解，所述色彩层15还可以为Cr-N层或其他具有装饰性的膜层。
所述防腐蚀层13及色彩层15均可通过磁控溅射法沉积形成。
本发明一较佳实施例的制造所述壳体10的方法主要包括如下步骤：
提供镁或镁合金基体11，并对镁或镁合金基体11依次进行研磨及电解抛光。电解抛光后，再依次用去离子水和无水乙醇对该镁或镁合金基体11表面进行擦拭。再将擦拭后的镁或镁合金基体11放入盛装有丙酮溶液的超声波清洗器中进行震动清洗，以除去镁或镁合金基体11表面的杂质和油污等。清洗完毕后吹干备用。
对经上述处理后的镁或镁合金基体11的表面进行氩气等离子清洗，进一步去除镁或镁合金基体11表面的油污，以改善镁或镁合金基体11表面与后续涂层的结合力。该等离子清洗的具体操作及工艺参数可为：将镁或镁合金基体11放入一磁控溅射镀膜机(图未示)的镀膜室内，对该镀膜室进行抽真空处理至真空度为1.0×10-3Pa，以250～500sccm(标准状态毫升/分钟)的流量向镀膜室中通入纯度为99.999％的氩气，于镁或镁合金基体11上施加偏压为-300～-800V，对镁或镁合金基体11表面进行等离子清洗，清洗时间为3～10min。
在对镁或镁合金基体11进行等离子清洗后，在该镁或镁合金基体11上形成防腐蚀层13。首先形成所述防腐蚀层13中的镁层131。形成该镁层131的具体操作及工艺参数如下：以氩气为工作气体，调节氩气流量为100～300sccm，占空比为50％～80％，于镁或镁合金基体11上施加-50～-100V的偏压，并加热镀膜室至80～120℃(即溅射温度为80～120℃)；选择镁为靶材，设置其功率为8～13kw，沉积镁层131。沉积该镁层131的时间为30～60min。
形成镁层131后，在该镁层131上形成氧化镁层133，以氩气为工作气体，设置氩气流量为100～300sccm，以氧气为反应气体，设置氧气流量为50～100sccm，设置占空比为50～80％，对镁和镁合金基体11施加-50～-100V的偏压，并加热镀膜室至100～150(即溅射温度为100～150)；选择镁为靶材，设置其功率为5～8kw，沉积氧化镁层133。沉积氧化镁层133的时间为20～40min。
形成氧化镁层133后，在其上形成色彩层15，该色彩层15为Ti-N膜层或Cr-N膜层。形成所述Ti-N膜层或Cr-N膜层的具体操作及工艺参数如下：关闭所述镁靶的电源，开启已置于所述镀膜机内的一钛靶或铬靶的电源，设置其功率为8～10kw，保持上述氩气的流量不变，并向镀膜室内通入流量为20～150sccm的反应气体氮气，沉积色彩层15。沉积该色彩层15的时间为20～30min。
本发明较佳实施方式的壳体10的制造方法，通过磁控溅射法依次于镁或镁合金基体11上形成防腐蚀层13及色彩层15。当壳体10处于腐蚀性介质中时，由于所述防腐蚀层13的镁层131及氧化镁层133与镁或镁合金基体11之间的电位差小，减缓了壳体10发生微电池腐蚀的速率，从而提高了壳体10的耐腐蚀性。所述壳体10耐腐蚀性提高的同时，还可避免所述色彩层15发生异色、脱落等失效现象，从而使该壳体10经长时间使用后仍具有较好的装饰性外观。

Claims (9)

1.一种壳体，包括镁或镁合金基体，形成于该镁或镁合金基体表面的防腐蚀层，及形成于防腐蚀层表面的色彩层，其特征在于：所述防腐蚀层包括依次形成于镁或镁合金基体表面的镁层和氧化镁层。
2.如权利要求1所述的壳体，其特征在于：所述镁层的厚度为1.0～3.0μm。
3.如权利要求1所述的壳体，其特征在于：所述氧化镁层的厚度为0.5～1.0μm。
4.如权利要求1所述的壳体，其特征在于：所述色彩层为Ti-N层或Cr-N层。
5.如权利要求1所述的壳体，其特征在于：所述防腐蚀层及色彩层以磁控溅射镀膜法形成。
6.一种壳体的制造方法，包括以下步骤：
提供镁或镁合金基体；
在该镁或镁合金基体上磁控溅射防腐蚀层，所述防腐蚀层包括依次形成于镁或镁合金基体表面的镁层和氧化镁层；
在该防腐蚀层上磁控溅射色彩层。
7.如权利要求6所述的壳体的制造方法，其特征在于：磁控溅射所述镁层的工艺参数为：以氩气为工作气体，其流量为100～300sccm，设置占空比为50％～80％，于镁或镁合金基体上施加50～-100V的偏压，以镁为靶材，设置其功率为5～8kw，溅射温度为80～120℃，溅射时间为30～60min。
8.如权利要求6所述的壳体的制造方法，其特征在于：磁控溅射所述氧化镁层的工艺参数为：设置氩气流量为100～300sccm，以氧气为反应气体，设置氧气流量为50～100sccm，设置占空比为50～80，对基体施加-50～-100V的偏压，选择镁为靶材，设置其功率为5～8kw，沉积氧化镁层的时间为20～40min。
9.如权利要求6所述的壳体的制造方法，其特征在于：磁控溅射所述色彩层的工艺参数为：开启一钛靶或铬靶的电源，设置其功率为8～10kw，设置氮气流量为20～150sccm，溅射时间为20～30min。
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105744782A (zh) * 2016-03-14 2016-07-06 联想(北京)有限公司 一种电子设备及电子设备的金属壳体的制成方法
CN107254660A (zh) * 2017-06-06 2017-10-17 沈阳工程学院 一种室外配电电缆低压派接箱保护壳体及其制备方法
CN107949658A (zh) * 2015-09-21 2018-04-20 Posco公司 经过显色处理的基板及该基板的显色处理方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1432662A (zh) * 2002-01-16 2003-07-30 精工爱普生株式会社 装饰品的表面处理方法、装饰品和钟表
CN101119860A (zh) * 2005-02-17 2008-02-06 桑德维克知识产权股份公司 涂敷的金属产品、其制备方法及该方法的用途

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU3708495A (en) * 1994-08-01 1996-03-04 Franz Hehmann Selected processing for non-equilibrium light alloys and products
FR2764310B1 (fr) * 1997-06-10 1999-07-09 Commissariat Energie Atomique Materiau multicouches a revetement anti-erosion, anti-abrasion, et anti-usure sur substrat en aluminium, en magnesium ou en leurs alliages
US6582200B2 (en) * 2000-07-14 2003-06-24 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Swash plate compressor having shoes made of a magnesium-based material
DE102004044919A1 (de) * 2004-09-14 2006-03-30 Martin Balzer Dekorative Beschichtung zum Korrosionsschutz auf Basis von Refraktärmetall-Magnesium-Nitriden sowie Verfahren zur Herstellung derselben
US7651758B2 (en) * 2005-10-18 2010-01-26 Endres Machining Innovations Llc System for improving the wearability of a surface and related method
TWI296037B (en) * 2006-04-28 2008-04-21 Delta Electronics Inc Light emitting apparatus
US20100051973A1 (en) * 2008-08-28 2010-03-04 Seiko Epson Corporation Light-emitting device, electronic equipment, and process of producing light-emitting device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1432662A (zh) * 2002-01-16 2003-07-30 精工爱普生株式会社 装饰品的表面处理方法、装饰品和钟表
CN101119860A (zh) * 2005-02-17 2008-02-06 桑德维克知识产权股份公司 涂敷的金属产品、其制备方法及该方法的用途

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107949658A (zh) * 2015-09-21 2018-04-20 Posco公司 经过显色处理的基板及该基板的显色处理方法
CN105744782A (zh) * 2016-03-14 2016-07-06 联想(北京)有限公司 一种电子设备及电子设备的金属壳体的制成方法
CN107254660A (zh) * 2017-06-06 2017-10-17 沈阳工程学院 一种室外配电电缆低压派接箱保护壳体及其制备方法
CN107254660B (zh) * 2017-06-06 2019-08-23 沈阳工程学院 一种室外配电电缆低压派接箱保护壳体及其制备方法

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