CN102456835B - Glass substrate and the manufacture method thereof of light can be extracted expeditiously - Google Patents
Glass substrate and the manufacture method thereof of light can be extracted expeditiously Download PDFInfo
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- CN102456835B CN102456835B CN201110314076.8A CN201110314076A CN102456835B CN 102456835 B CN102456835 B CN 102456835B CN 201110314076 A CN201110314076 A CN 201110314076A CN 102456835 B CN102456835 B CN 102456835B
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Abstract
The present invention relates to a kind of glass substrate and the manufacture method thereof that can extract light expeditiously, to improve the light extraction efficiency of the glass substrate being applied to LED illumination, solar cell or flat-panel display panel.According to the present invention, glass substrate immersion is placed the several seconds to after several minutes in etching solution, and clean, now the surface of glass substrate is by the multiple indentures of nanometer to micron-scale that distribute randomly, thus improved more than 25% to 30% by light extraction efficiency.
Description
Technical field
The present invention relates to and be applied to OLED illumination, the glass substrate of solar cell or display pannel and manufacture method thereof, especially in particular to the technology of light transmittance improving the glass substrate be applied on said elements.
Background technology
Usually, be applied to OLED illumination, solar cell, flat-panel display panel glass substrate there is the side and light transmission arranging various driving elements etc. after form the side of light-emitting area, wherein for the glass substrate forming light-emitting area, the light propagated among the light sent outside glass substrate is more, then more favourable.
Especially, OLED is thrown light on, owing to developing phosphorescent organic material, the internal quantum efficiency (internalquantumefficiency) of OLED is 100%, but as shown in Figure 1, luminescent layer produce light among about 50% light because of layer between formed waveguide (waveguide) and to side propagate, the light of about 30% disappears because of total reflection.
Therefore, in the inner light produced, only the light of 20% can propagate into actual components outside, so the external quantum efficiency of OLED is on the low side.In order to head it off (that is, the light confined in element internal being extracted outside), as shown in Figure 2, studying the technology inserting special layer in the inside of element.The layer with low-refraction (Lowrefractiveindex) is inserted between transparent anode electrode and substrate, the light loss because total reflection causes can be reduced accordingly.This effect can increase further by inserting microcavity (microcavity) layer, and also can obtain similar effect by insertion to the layer that light carries out scattering (scattering).And, by element-external, namely paste special film (bright dipping coupling membrane: outcouplingfilm) or microlens array film (microlensarrayfilm) on the glass substrate, can light extraction efficiency be improved.
But above listed method all forms the technique of high cost, need loaded down with trivial details effort, and light extraction efficiency, namely light transmission rate also can not be increased to desired degree.
Summary of the invention
Therefore, the object of the present invention is to provide one easier, and the glass substrate of light extraction efficiency can be improved with cheap technique.
The present invention can provide on the glass substrate randomly (randomly) to form the multiple indentures (dimple) of number nanometer (nm) to several microns (μm), improves the glass substrate that can extract light expeditiously of light extraction efficiency thus.
And the present invention can provide a kind of manufacture method can extracting the glass substrate of light expeditiously, it is characterized in that, the described glass substrate that can extract light is expeditiously manufactured by immersion (dipping) glass substrate in the etch solution.
And, the present invention can provide a kind of manufacture method can extracting the glass substrate of light expeditiously, it is characterized in that, the etching solution selection used in described etch process during etching glass substrate, has the etching solution of the etch capabilities within several μm per minute when applying external pressure.
And the present invention can provide a kind of manufacture method can extracting the glass substrate of light expeditiously, it is characterized in that, in described immersion technique, comprising fluorine (F
+) ion etching solution in the impregnate glass substrate several seconds to several minutes.
And the present invention can provide a kind of manufacture method can extracting the glass substrate of light expeditiously, it is characterized in that, comprising:
Shelter on the glass substrate and possess the step that lateral length and vertical extension are the mask of the mesh (mesh) of several μm to tens of μm;
Can by fluorine ion (F by mixing
+) average grain diameter that etches is the several μm of steps coating on described mask to the metal dust of tens of μm of sizes and the slurry of adhesive (binder) with silk screen printing;
Irradiate UV to applied described slurry or at 50 DEG C ~ 200 DEG C, dry step carried out to described slurry;
Can not be pasted on described slurry also can not be utilized sprayer to be ejected into step on the glass substrate being coated with described slurry by the resin material that fluorine particle etches;
Irradiate UV to described resin material or at 50 DEG C ~ 200 DEG C, dry step carried out to described slurry;
Etch being coated with described slurry and resin material and carrying out dry glass substrate, the glass part of the position of pressurizeing with the particle being close to metal dust and the described metal dust being pressurized to glass substrate to being contained in described slurry etches, to form average diameter for several μm to an etching step of the micron indenture of tens of μm of sizes; And
After terminating a described etching step, to the second etching step that glass substrate etches, to form average diameter for several nm is to the nanometer indenture of tens of nm size in the micron indenture being formed at glass substrate, form micron indenture on the glass substrate thus and form nanometer indenture on described micron indenture face.
And the present invention can provide a kind of manufacture method can extracting the glass substrate of light expeditiously, it is characterized in that, the etching degree of described second etch compare described in the etching degree that once etches more weak.
And, the present invention can provide a kind of manufacture method can extracting the glass substrate of light expeditiously, it is characterized in that, described metal dust is formed by one of them in Ag, Fe, Cu, Al, and described resin material is formed by some in epoxy resin or polyester.
And, the present invention can provide a kind of glass substrate that can extract light expeditiously, it is characterized in that, formed on the glass substrate average diameter be several μm to the micron indenture of tens of μm of sizes with to form average diameter on the surface of described micron indenture be several nm to the nanometer indenture of hundreds of nm size.
And the present invention can provide a kind of manufacture method can extracting the glass substrate of light expeditiously, it is characterized in that, from comprising fluorine ion (F
+) solution surface interval and glass substrate is set, and to glass substrate surface spray evaporate from described solution surface comprise fluorine ion (F
+) etching steam (fume), to form average diameter for several nm is to the nanometer indenture of hundreds of nm size.
And, the present invention can provide a kind of manufacture method can extracting the glass substrate of light expeditiously, it is characterized in that, the interval comprised between the solution surface of described fluorine ion and described glass baseplate surface is decided to be several cm, comprising fluorine ion (F by mutually adjusting
+) solution concentration, spray etching steam time, form described nanometer indenture.
And the present invention can provide a kind of manufacturing system can extracting the glass substrate of light expeditiously, it is characterized in that, comprising:
Solution tank, is equipped with and comprises fluorine ion (F
+) solution;
Etching steam supply pipe, is communicated with the space of described solution tank, is discharged on glass substrate by the etching steam that the solution from described solution tank evaporates;
Etching steam suction pipe, sucks etching steam, to make the etching steam of discharging from described etching steam supply pipe move horizontally on the glass substrate,
The exhaust pressure of described etching steam supply pipe is maintained the suction pressure being greater than described etching steam suction pipe,
Described etching steam is the nanometer indenture of several nm to hundreds of nm size for making the surface of described glass substrate form average diameter.
According to the present invention, because being formed at the indenture of nanometer to micron-scale of glass substrate, refraction and irregular reference is formed by the indentation surface being similar to the sphere of concavees lens at the light of the surface reflection of glass substrate in the past, reduce total reflection (totalinternalreflection) rate, thus can extract from glass substrate expeditiously, therefore on the whole compared to existing light extraction efficiency, light extraction efficiency can improve more than 25% to 50%.
And, according to the present invention, form micron indenture on the glass substrate and form nanometer indenture further on micron indenture, dispersed by the light being similar to lens of multiple described indenture thus and the generation of irregular reference, prevent total reflection, thus the light sent from luminescent layer can be extracted into outside glass substrate expeditiously, therefore, it is possible to manufacture the light-emitting component of high brightness.
Accompanying drawing explanation
Fig. 1 represents the light path of existing OLED illumination and the cutaway view of light extraction efficiency;
Fig. 2 is the cutaway view of the various trials representing the prior art that the light extraction efficiency for improving OLED illumination carries out;
Fig. 3 is the SEM photo on the surface of the glass substrate that shooting is general;
Fig. 4 represents SEM photo that form indenture on the glass substrate according to the present invention, that can extract the difference different multiplying on the surface of the glass substrate of light expeditiously;
The luminous photo that can expeditiously extract the OLED illumination of the glass substrate of light of Fig. 5 for adopting one embodiment of the invention to provide;
The luminous photo that can expeditiously extract the OLED illumination of the glass substrate of light of Fig. 6 for adopting another embodiment of the present invention to provide;
Fig. 7 and Fig. 8 is for illustration of using mesh mask to be coated with the pie graph comprising the step of the slurry of metal dust in another embodiment of the invention;
Fig. 9 represents the cutaway view comprising the slurry of metallic be pressed on silk screen printing coating slurry in another embodiment of the invention on glass substrate;
Figure 10 represents the cutaway view being filled in the resin material between metallic in another embodiment of the present invention with sprayer sprayed resin material;
Figure 11 is formed at the micron indenture of glass substrate and the cutaway view of nanometer indenture after expression completes etching step according to another embodiment of the present invention;
Figure 12 is the skeleton diagram that another embodiment of the present invention is described;
Figure 13 is the composition cutaway view representing another embodiment of the present invention;
Figure 14 is the side composition diagram for Figure 13;
Figure 15 represents the side composition diagram increasing inscape on Figure 14.
Primary symbols illustrates: 100 is mesh mask, and 200 is glass substrate, and 300 is metallic, and 400 is resin portion, and 500 is micron indenture, and 550 is nanometer indenture, and 1000 is solution tank, and 2000 is etching steam supply pipe, and 3000 is air intake duct.
Embodiment
Below, the preferred embodiments of the present invention are described in detail with reference to accompanying drawing.
Embodiment one
First, the necessary etching solution when impregnate glass substrate is prepared.
Etching solution 600 is fabricated to and comprises fluorine (F) ion, and mix the weak acid of distilled water and/or citric acid (being not limited thereto) etc., spray in the mode using sprayer etc. to apply external pressure to glass substrate, the etching performance thus under this occupation mode of constant and manufacture etching solution.Now, select the content ratio of the etch capabilities that can possess within several μm per minute better in boosting productivity to manufacture etching solution.
Now, thickness for the glass substrate used does not limit, employ the glass substrate of 0.2mm to 2mm in the present embodiment, etching solution is made up of the acid solution comprising F ion, but without the need to its content ratio is limited to some number ranges, as long as enable by adjustment rose and its expulsion pressure to glass substrate spray and the etching test result that draws with the rate etch glass substrate within etching number per minute μm, then can become satisfied etching solution.This etch capabilities is also exemplary, is the etching solution considered productivity ratio etc. and have selected the etch capabilities had as above.
Material for glass substrate does not also limit, and employs the soda lime glass substrate between 0.2mm to 2mm in the present embodiment, and sets rank to the concentration of F ion, simultaneously through having fixing expulsion pressure (0.5 to 2kgf/cm
2) sprayer injection etching test, constitute etching solution with various mixing ratio.The manufacture of this etching solution is exemplary, and the manufacture of etching solution, by mutually adjusting the concentration of F ion, expulsion pressure and time of immersion technique described later together with etch capabilities related to this, can have the embodiment of multiple combination completely.
When the etching solution equally manufactured as mentioned above is at room temperature filled in tank, and impregnate glass substrate and make glass substrate in the several seconds to when maintaining immersion state in several minutes, the nanometer of severals nm as shown in the photo of Fig. 4 extremely several μm of sizes will be produced on the glass substrate to the indenture of micron.Compared to the left photo of Fig. 4, right photograph is high magnification photo.This can with the immersion process implementing of Fig. 3 before the surface of general glass substrate compare, nanometer is formed as illustrated in fig. 4 randomly to the size of micron indenture.This nanometer to micron indenture as concavees lens, irregular reference is caused while divergent rays, prevent from producing total reflection etc. on the critical surface of plane, thus make more light transmission outer (namely to glass substrate, more light propagates into outside glass substrate, to present higher brightness).For the etching solution with predetermined etch capabilities, if the immersion time is too short, then the formation degree of indenture does not reach requirement, the extraction efficiency of light also can not rise, but the immersion of exceedance minute is then unfavorable for productivity ratio, and also may there is the albinism that glass substrate fogs, be therefore necessary to select the best immersion time.The immersion time can be adjusted to best selection according to the etch capabilities of etching solution and the thickness etc. of glass substrate as described above.
Nanometer can be formed at the two sides of glass substrate to micron indenture, but mask or film etc. also can be utilized only to be formed on a side.
Then, cleaning is formed with the glass substrate of nanometer to micron indenture.Cleaning is as follows.
Described glass substrate is carried out in distilled water the single-steeping within 10 minutes, in new distilled water, then carry out the double-steeping within 10 minutes, with diluted strong solution composition.
Then, utilize alkaline aqueous solution as NaOH (NaOH) to clean the glass substrate completing etch process, residued in the acid ingredient of glass substrate and the likely etching solution of etching glass substrate by neutralization reaction removing.
Preferably, the pH value of the alkaline solution used in above-mentioned steps is 12 ± 2, and treatment temperature is 45 ± 5 DEG C, and the processing time is about 10 minutes, but is not limited thereto, and can mutually adjust each variable and change.
Processing method for the glass substrate that will clean is loaded into conveyer belt and level transfer, with spray pattern, sodium hydroxide solution is ejected into the upper and lower sides of glass substrate by nozzle, cleans glass substrate on the whole thus.The expulsion pressure of nozzle is decided to be 1.5 ± 0.5kgf/cm
2, the screen of glass substrate is decided to be 1.0 to 1.5m/min, with applicable cleaning, is preferably set to 1.2m/min.
Then, utilize mild acid wash glass substrate, to prevent the strong basicity component residue of sodium hydrate aqueous solution in glass substrate.The weak acid used comprises citric acid, acetic acid, carbonic acid etc., and its pH value can be prepared as 3 or 4 and use.The clean temperature of weak acid is utilized to be set as normal temperature to 60 DEG C, be preferably 45 ± 5 DEG C, the glass substrate that will clean is loaded into conveyer belt by cleaning way employing and level is transferred, and by nozzle, weak acid solution is ejected into the upper and lower sides of glass substrate with spray pattern, the mode of cleaning on the whole thus.The expulsion pressure of nozzle is decided to be 1.0 ± 0.5kgf/cm
2, the screen of glass substrate is decided to be 1.0 to 1.5m/min, with applicable cleaning, is preferably set to 1.2m/min.This cleaning condition is only exemplary, can mutually adjust variable and use other selection also can reach optimization.
After having carried out described mild acid wash step, clean glass substrate with distilled water (pure water), terminated cleaning step thus.
Utilized light source to carry out according to the luminance test of light extraction efficiency by above-mentioned technique to being formed with the glass substrate of nanometer to micron indenture, its photo as shown in Figures 5 and 6.From Fig. 5 and Fig. 6, can with the naked eye confirm to present according to the difference of immersion time under identical etching solution, according to being formed with the luminance difference of nanometer to the light extraction efficiency of the glass substrate of micron indenture.Thereby, it is possible to find out composition and the combination of immersion time of the etching solution presenting best brightness.
Constructed in accordance go out nanometer to the light extraction efficiency of the glass substrate of micron indenture that is formed compare existing light extraction efficiency and improve 25% to 50%, its result presents more than 25% to 30% light extraction efficiency for luminous quantity.
Embodiment two
Below, with reference to Fig. 7 to Figure 11, another embodiment of the present invention is described.
As shown in Figure 7, prepare laterally and to be vertically all formed with that there are the several μm of mesh masks 100 to more than 300 mesh of tens of μm of sizes, and be positioned on glass substrate 200, as shown in Figure 8, comprise the slurry of metal dust with silk screen printing coating.The metal dust being contained in described slurry is made up of several μm of metallics to tens of μm of sizes, and the kind for metal is not particularly limited, as long as can by fluorine ion (F
+) etching is just passable, but preferably use one of them in Ag, Fe, Cu, Al.Described slurry uses mixed metal powder and adhesive (binder) and manufactures the slurry of the state of easily coating.
As shown in Figure 8, by utilizing squash type scraper by described slurry silk screen printing on glass substrate 200, metallic 300 is pressed on glass substrate 200 as illustrated in fig. 9 by the mesh of described mesh mask 100.In this case, be fixing metal particle 300, in the drying machine of 50 DEG C to 200 DEG C, drying implemented to the glass substrate 200 being coated with slurry.The drying that drying can adopt natural drying or use ultraviolet (UV) to irradiate, has no particular limits for drying time, suitably can adjust according to the state of slurry.
After drying terminates, remove described mesh mask 100 from glass substrate 200, and to described glass substrate 200 sprayer sprayed resin material, fill the blank between metallic 300 by resin material as illustrated in fig. 10 thus.Now used resin material should use and can not to be pasted onto on slurry and can not by the heat-curing resin of fluoride ion etch, is preferably that to use in epoxy resin or mylar some.
In order to make described heat-curing resin form resin portion 400 securely between metallic 300, at 50 DEG C to 200 DEG C, carry out drying.Glass substrate 200 be coated with metallic 300 that average grain diameter is micron order (several μm to tens of μm) and utilize resin portion 400 to fill between metallic 300, and this glass substrate 200 is put into etching solution once etching.The object once etched is to melt described metallic 300, and then etches the glass substrate 200 of the part that metallic 300 covers, to form the micron indenture 500 of micron-scale.Therefore, fluorine ion (F is preferably used
+) etching solution 600 that concentration is slightly high, preferably at least comprise the F of 55%
+etching solution 600.But, without the need to F
+concentration limits especially, this is because can implement the etching of short time in higher concentrations, or implements etching for a long time at low concentrations.
Take out glass substrate 200 after completing once etching, and by being immersed in alkaline solution, resin portion 400 is stripped out or is peeled off by physics mode, and then put into new etching solution and implement second etch.The object of second etch is that in the micron indenture 500 formed, form average diameter is the nanometer indenture 550 of several nm to hundreds of nm nano-scale, and should implement relatively once to etch more weak etching.
That is, compare and once etch, reduce the concentration of etching solution, if or the etching solution of same concentrations, then reduce etching period, or suitably reduce concentration and the etching period of etching solution, form nanometer indenture 550 (with reference to Figure 11).
When completing second etch, from etching solution, take out glass substrate 200, clean with the cleaning way described in previous embodiment one.
Embodiment three
Another embodiment of the present invention is described in detail referring to Figure 12 to Figure 15.
The size prep solution groove of corresponding glass substrate, and load in this solution tank and improve fluorine ion (F a little
+) etching solution 600 of concentration.Be preferably the F using and comprise at least 55%
+etching solution 600, but without the need to being particularly limited to F
+concentration, this is because the etching can implementing the short time in higher concentrations, or implements etching for a long time at low concentrations.When loading etching solution 600 in solution tank, in the height of solution tank should vacant go out several about cm, be preferably vacant go out 5cm to 10cm, with the etching steam space that can exist produced after guaranteeing solution evaporation.The direct placing glass substrate in the upper end of described solution tank, implements etching to make the etching steam (fume) comprising fluorine ion to the surface of described glass substrate.Accordingly, multiple indenture with the average diameter of nano-scale will be formed randomly on the surface of glass substrate.
That is, the molecule of composition etching steam does the Brownian movement of random movement in the clearance spaces of described solution tank, the therefore surface of Ground shock waves glass substrate out of order, thus with fine size etching glass substrate surface, forms the indenture of nano-scale thus randomly.
Consider productivity ratio, when the concentration of etching solution 600 being decided to be high concentration (about 70%), it is then relatively abundant that etching period reaches 1 minute to 5 minutes, along with the concentration of etching solution is high, and can the slightly high alkaline cleaning fluid of working concentration in cleaning.
And, as one of scheme boosted productivity, also can select the etching solution that volatility is high, to form nanometer indenture at short notice.
In the present embodiment, under normal temperature (18 ~ 25 DEG C), make F
+concentration is the etching solution evaporation of about 55%, jetted 15 seconds to the 1 point etching steam of about 30 seconds thus to glass substrate.
Below, with reference to Figure 13, another embodiment of the present invention is described.
Etching solution is loaded in solution tank 1000, and the etching steam evaporated thus is sprayed to glass substrate, nanometer indenture 550 is formed randomly thus on the surface of glass substrate, identical with the embodiment of Figure 12 in this, but in the present embodiment, for reaching higher productivity ratio and also forming nanometer indenture all fully at the marginal position of glass baseplate surface, as shown in figure 13, etching steam supply pipe 2000 and suction pipe 3000 are set.Namely, following etching steam supply pipe 2000 can be provided, on transmission mechanism glass substrate being equipped on roller etc., the solution tank 1000 that etching solution is housed is arranged in the downside of described glass substrate, the pipeline be communicated with the space of solution tank is set, etching steam is discharged, to form nanometer indenture 550 to the surface of described glass substrate thus by this pipeline.And, consider because etching steam is discharged constantly and likely can cause etching in vapor collection the local be distributed on glass substrate, the etching steam suction pipe 3000 moved horizontally that can promote to etch steam can be set.In the present embodiment, two described suction pipes 3000 are symmetrically set, but multiple suction pipe can be arranged to triangle or radiation symmetric shape.Now, relative to pressure etching steam is discharged on the upside of glass substrate, the pressure sucking etching steam should be less, the numerical value of the etching exhaust pressure of steam supply pipe 2000 and the suction pressure of suction pipe 3000, by combining the concentration of etching solution on the whole and etching steam being ejected into the variablees such as the time of glass substrate, reaches optimization in every way.The surface of the upper end relate etch solution of described solution tank 1000 is necessary the clearance spaces maintained for arranging etching steam suction pipe 3000 and etching steam supply pipe 2000, the height in this space is preferably about more than 40cm, and preferably liquid level sensor is set, for the liquid level of adjustment etching solution.
And, because of etching solution evaporation, when being necessary new etching solution to be filled in solution tank 1000, valve being set and being connected to the flexible pipe of this valve, open the valve being in closed condition at ordinary times thus, fill etching solution by flexible pipe.The filling, pressure etc. of this etching solution control easily by arranging control board.
In the present embodiment, under normal temperature (18 ~ 25 DEG C), F is made
+concentration is the etching solution evaporation of about 55%, jetted 30 seconds to the 1 point etching steam of about 30 seconds thus to glass substrate.Etching steam supply pipe 2000 and suction pipe 3000 comprise forced draft fan and ventilating fan, this forced draft fan and ventilating fan all can use forced draft fan and the ventilating fan of 3 to 5 horsepowers, and its pressure uses variable resistance (manually) and inverter (automatically) to be adjusted to 1000mpa to 4000mpa.The pressure differential of etching steam supply pipe 2000 and suction pipe 3000 is about 500mpa to 1000mpa.
Figure 14 is the side sectional view of Figure 13, represents the process simultaneously carrying out being formed nanometer indenture to plural glass substrate.And Figure 15 is the side view identical with Figure 14, but indicates the inscape of increase further.
Namely, figure is shown with glass substrate-conveying to the loading part 700 in the interval be exposed in etching steam with spray etching steam and by the uninstalling portion 800 between glass substrate-conveying to cleaning area after forming nanometer indenture, and to represent between the air-tight section that is necessary to arrange and cuts off suction gas 701, can not outside be leaked to make etching steam only be ejected into glass substrate.And, preferably, paste the diaphragm of series of polymers at the back side of glass substrate, to avoid the impact being subject to etching steam.So, can boost productivity, produce in a large number.
The glass substrate completing nanometer indenture forming step cleans as follows.
In the distilled water of about 45 ± 5 DEG C, implement the single-steeping of 5 minutes to 10 minutes, to peel off diaphragm, in new distilled water, then implement the double-steeping of 5 minutes 10 minutes, with diluted strong composition.Then, clean identically with the above embodiments one.
Constructed in accordance is formed with a micron glass substrate 200 for indenture 500 to nanometer indenture 550, eliminate the total reflection on the critical surface of glass substrate 200, and cause to distribute arbituarily and penetrate, the shape of the depression of indenture plays the effect of concavees lens, and the light that luminous element can be sent is extracted into outside glass substrate 200 expeditiously.Interest field of the present invention is not limited to embodiment described above, and defines according to the record of claims, and obviously, the technical staff that this area has usual knowledge can carry out various change and improvement within scope described in detail in the claims.
Claims (6)
1. can extract a manufacture method for the glass substrate of light expeditiously, it is characterized in that, comprising:
Shelter on the glass substrate and possess the step that lateral length and vertical extension are the mask of the mesh of several μm to tens of μm;
Mixing can be several μm by the average grain diameter of fluoride ion etch and coat the step on described mask to the metal dust of tens of μm of sizes and the slurry of adhesive with silk screen printing;
At 50 DEG C ~ 200 DEG C, dry step is carried out to applied described slurry;
After removing described mask, described slurry can not be pasted on and also can not be ejected into step on the glass substrate being coated with described slurry by the heat-curing resin that fluorine particle etches;
At 50 DEG C ~ 200 DEG C, dry step is carried out to described heat-curing resin;
Etch being coated with described slurry and heat-curing resin and carrying out dry glass substrate, etch with the glass part being close to the position that the metal dust that is pressurized to glass substrate and described metal powder particles are pressurizeed to being contained in described slurry, to form average diameter for several μm to an etching step of the micron indenture of tens of μm of sizes; And
After terminating a described etching step, to the second etching step that glass substrate etches, to form average diameter for several nm is to the nanometer indenture of tens of nm size in the micron indenture being formed at glass substrate, form micron indenture on the glass substrate thus and form nanometer indenture on described micron indenture face.
2. the manufacture method can extracting the glass substrate of light expeditiously according to claim 1, is characterized in that, the etching degree of described second etch compare described in the etching degree that once etches more weak.
3. the manufacture method can extracting the glass substrate of light expeditiously according to claim 2, it is characterized in that, described metal dust is formed by one of them in Ag, Fe, Cu, Al, and described heat-curing resin is formed by some in epoxy resin or polyester.
4. one kind can be extracted the manufacture method of the glass substrate of light expeditiously, it is characterized in that, from the solution surface interval comprising fluorine ion, the glass substrate not having specifically created mask is set, and spray to the surface of glass substrate the etching steam comprising fluorine ion evaporated from described solution surface, to form average diameter for several nm is to the nanometer indenture of hundreds of nm size.
5. the manufacture method can extracting the glass substrate of light expeditiously according to claim 4, it is characterized in that, the interval comprised between the solution surface of described fluorine ion and the described glass baseplate surface not having specifically created mask is decided to be several cm, by mutually adjusting the concentration of the solution comprising fluorine ion, the time of uperize, form described nanometer indenture.
6. can extract a manufacturing system for the glass substrate of light expeditiously, it is characterized in that, comprising:
Solution tank, is equipped with the solution comprising fluorine ion;
Etching steam supply pipe, is communicated with the space of described solution tank, is discharged on glass substrate by the etching steam that the solution from described solution tank evaporates;
Etching steam suction pipe, sucks etching steam, to make the etching steam of discharging from described etching steam supply pipe move horizontally on the glass substrate,
The exhaust pressure of described etching steam supply pipe is maintained the suction pressure being greater than described etching steam suction pipe,
Described etching steam is the nanometer indenture of several nm to hundreds of nm size for making the surface of described glass substrate form average diameter.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100105670A KR101277439B1 (en) | 2010-10-28 | 2010-10-28 | High Efficiently Light Extractable Glass Substrate and Manufacturing Method thereof |
| KR10-2010-0105670 | 2010-10-28 | ||
| KR1020100119378A KR101238093B1 (en) | 2010-11-29 | 2010-11-29 | High Efficiently Light Extractable Glass Substrate And Manufacturing Method Thereof |
| KR10-2010-0119378 | 2010-11-29 | ||
| KR10-2011-0006653 | 2011-01-24 | ||
| KR1020110006653A KR101254428B1 (en) | 2011-01-24 | 2011-01-24 | High Efficiently Light Extractable Glass Substrate Manufacturing Method and Manufacturing System |
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| Publication Number | Publication Date |
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| CN102456835A CN102456835A (en) | 2012-05-16 |
| CN102456835B true CN102456835B (en) | 2016-04-27 |
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| CN201110314076.8A Expired - Fee Related CN102456835B (en) | 2010-10-28 | 2011-10-17 | Glass substrate and the manufacture method thereof of light can be extracted expeditiously |
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| US8497155B1 (en) * | 2012-06-05 | 2013-07-30 | Guardian Industries Corp. | Planarized TCO-based anode for OLED devices, and/or methods of making the same |
| CN104183768A (en) * | 2013-05-22 | 2014-12-03 | 海洋王照明科技股份有限公司 | Organic light emitting diode and preparation method thereof |
| CN107994135A (en) * | 2017-12-07 | 2018-05-04 | 武汉华美晨曦光电有限责任公司 | A kind of processing method that film is extracted outside OLED luminescent devices |
| CN109052977A (en) * | 2018-08-13 | 2018-12-21 | 中国人民解放军陆军防化学院 | A kind of construction method of micro-nano defect glass surface |
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| JPH07101753A (en) * | 1993-10-01 | 1995-04-18 | Nippon Sheet Glass Co Ltd | Production of silicate glass article |
| JP4824430B2 (en) * | 2006-02-28 | 2011-11-30 | 富士フイルム株式会社 | Method for producing nanostructure |
| JP2008091685A (en) * | 2006-10-03 | 2008-04-17 | Seiko Epson Corp | Element substrate, and its production process |
| WO2009066624A1 (en) * | 2007-11-19 | 2009-05-28 | Asahi Glass Co., Ltd. | Method for etching glass substrate |
| US20100215862A1 (en) * | 2009-02-26 | 2010-08-26 | Sinue Gomez | Method for forming an opal glass |
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2011
- 2011-10-17 CN CN201110314076.8A patent/CN102456835B/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1519588A (en) * | 2003-01-28 | 2004-08-11 | ������������ʽ���� | Substrate and its mfg. method, microlens, substrate, transmitting panel and rear projector |
| CN1600723A (en) * | 2003-09-26 | 2005-03-30 | 日本板硝子株式会社 | Etched article, mold structure for producing the same and method for production thereof |
| CN101746957A (en) * | 2008-12-19 | 2010-06-23 | 旭硝子株式会社 | Method of glass surface fine processing |
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| TWI452024B (en) | 2014-09-11 |
| CN102456835A (en) | 2012-05-16 |
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