CN102456644A - Liquid-cooled heat dissipation system - Google Patents
Liquid-cooled heat dissipation system Download PDFInfo
- Publication number
- CN102456644A CN102456644A CN2010105304880A CN201010530488A CN102456644A CN 102456644 A CN102456644 A CN 102456644A CN 2010105304880 A CN2010105304880 A CN 2010105304880A CN 201010530488 A CN201010530488 A CN 201010530488A CN 102456644 A CN102456644 A CN 102456644A
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- Prior art keywords
- liquid
- heat absorbing
- absorbing element
- water inlet
- radiating system
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A liquid-cooled heat dissipation system is disclosed, which comprises a heat absorption component, a drive pump, a heat dissipation component, as well as a water inlet tube and a water outlet tube for connecting the heat absorption component, the drive pump and the heat dissipation component, wherein a sealed chamber for holding a cooling liquid is disposed in the heat absorption component; a heating area attached with an electronic component is formed in the centre of the bottom of the heat absorption component; and a water inlet connected with the water inlet tube and facing the heating area, and a plurality of water outlets connected with the water outlet tube and located around the water inlet are disposed on the top of the heat absorption component.
Description
Technical field
The present invention relates to a kind of liquid-cooled radiating system, be meant a kind of liquid-cooled radiating system that is used for cooling electronic components especially.
Background technology
The liquid-cooled radiating system principle is to utilize the circulating electronic component of liquid, and the transfer of heat that produces like central processing unit etc. and then is distributed heat to heat dissipation element.
Usually, this liquid-cooled radiating system comprises a driving pump, is used to absorb a heat absorbing element, a heat dissipation element, an oral siphon and an outlet pipe of heat that electronic component produces.Be respectively equipped with the delivery port that the water inlet and that is connected with oral siphon is connected with outlet pipe on this heat absorbing element.Said oral siphon and outlet pipe connect driving pump, heat absorbing element and heat dissipation element successively, thereby form the liquid circulation path of a sealing.Be provided with the cavity of receiving fluids in this heat absorbing element, during use, heat absorbing element absorbs the heat that electronic component produces; And with the liquid heat in it, outlet pipe flows to heat dissipation element in the effect lower edge of driving pump to be heated liquid, with behind the heat transferred heat dissipation element that carries and cool off; Through heat dissipation element heat is dispersed in the surrounding environment, simultaneously, cooling liquid flows back in the heat absorbing element along oral siphon; So back and forth follow bad, thereby realize purpose to electronic element radiating.
In this liquid-cooled radiating system, the area of the heating region of heat absorbing element (being the contact area of heat absorbing element and electronic component) is less, makes heat concentrate on this heating region easily; And water inlet and delivery port lay respectively at this heating region directly over and arranged on left and right sides; This liquid injects heat absorbing element via oral siphon and water inlet, and the heating region of flowing through, and then flows back to outlet pipe by delivery port; In the process of heat absorbing element of wherein flowing through; The liquid major part makes other subregion of heating region form the dead angle of stream via from the beeline between water inlet to the delivery port, thereby reduces the heat exchanger effectiveness between interior liquid of heat absorbing element and the electronic component; Even the electronic building brick that causes being positioned at the heating region below produces overheated phenomenon, influences the radiating efficiency of this liquid-cooled radiating system.
Summary of the invention
In view of this, the invention reside in a kind of liquid-cooled radiating system that has than high cooling efficiency is provided.
A kind of liquid-cooled radiating system; Comprise heat absorbing element, driving pump, heat dissipation element, reach oral siphon and outlet pipe that said heat absorbing element, driving pump and heat dissipation element are connected; Be provided with the hermetic cavity chamber that is used to hold cooling liquid in this heat absorbing element; The central authorities of the bottom of this heat absorbing element are formed for the heating region that is sticked with electronic component, the top of this heat absorption assembly be provided be connected with oral siphon and with this heating region over against a water inlet and be connected with outlet pipe and be positioned at this water inlet a plurality of delivery ports on every side.
Compared to prior art; The heat absorption assembly of said liquid-cooled radiating system comprises a plurality of delivery ports, and water inlet is positioned at the top of heating region center, during work; The liquid that is cooled at the heat dissipation element place is in water inlet is back to heat absorbing element the time; Can be flowed to the peripheral region of heating region by the rapid heating of the heating region of heat absorbing element, flow to heat dissipation element via delivery port again, therefore; Flow to the dead angle of the more even smooth and easy and minimizing stream of the flow path of delivery port after cooling liquid is heated in this heat absorbing element; Cooling liquid can at utmost carry out heat exchange with heating region, has avoided being positioned at the overheated possibility of electronic component of heating region below effectively, promotes the radiating efficiency of this liquid-cooled radiating system simultaneously.
With reference to the accompanying drawings, in conjunction with specific embodiment the present invention is done further description.
Description of drawings
Fig. 1 is the three-dimensional assembly diagram of liquid-cooled radiating system in one embodiment of the invention.
Fig. 2 is the three-dimensional assembly diagram of heat absorbing element among Fig. 1.
Fig. 3 is the exploded view of heat absorbing element among Fig. 2.
Fig. 4 be among Fig. 2 heat absorbing element along the cutaway view of IV-IV line.
The main element symbol description
| Liquid-cooled radiating system | ?100 |
| Heat dissipation element | ?20 |
| Water tank | ?21 |
| Outlet | ?211 |
| Inlet | ?212 |
| Pipeline | ?22 |
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23 |
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24 |
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30 |
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31 |
| Heating region | 310 |
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32 |
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33 |
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34 |
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341 |
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342 |
| The |
343 |
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345 |
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346 |
| Chamber | 348 |
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35 |
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36 |
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37 |
| Through |
370 |
| Threaded |
371 |
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372 |
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373 |
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374 |
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38 |
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39 |
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40 |
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60 |
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70 |
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71 |
| First mouth of |
710 |
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72 |
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73 |
| Second mouth of pipe | 730 |
| Electronic component | 80 |
Embodiment
Please with reference to Fig. 1; Be depicted as the liquid-cooled radiating system 100 in one embodiment of the invention, an oral siphon 60 and an outlet pipe 70 that this liquid-cooled radiating system 100 comprises a heat dissipation element 20, a heat absorbing element 30, a driving pump 40, heat absorbing element 30 is connected with heat dissipation element 20.
This heat absorbing element 30 and heat-generating electronic elements 80 (Fig. 4) closely contact like central processing unit, the heat that is produced with timely absorption electronic component 80.Please consult Fig. 2 and Fig. 3 simultaneously, this heat absorbing element 30 comprises a base plate 31, a radiator 32, a sealing ring 33, a lid 34 and three connectors 35.
This base plate 31 by heat conductivility material preferably, is made of such as copper usually.This lid 34 comprises a circular roof 341, from the periphery of roof 341 to a sidewall 342 that extends below and from four outwards outstanding location divisions 343 of this sidewall 342.This roof 341 is provided with two delivery ports 346 that are positioned at the water inlet 345 at middle part and lay respectively at these water inlet 345 both sides.Said water inlet 345 and delivery port 346 are arranged on the same straight line, and the inner peripheral of said water inlet 345 and delivery port 346 is respectively equipped with internal thread, to connect said connector 35 respectively.This radiator 32 comprises some fin that are arranged side by side, and said radiator 32 is fixedly welded on the upper surface of base plate 31.During use, this heat absorbing element 30 through base plate 31 and radiator 32 over against zone and electronic component 80 be sticked and form heating region 310.This lid 34 covers on the base plate 31; Wherein, The water inlet 345 of this lid 34 be positioned at this heating region 310 directly over; The bottom of the sidewall 342 of lid 34 contacts with the upper surface of base plate 31, and plurality of fixed part 36 is screwed together in the base plate 31 after wearing the location division 343 of lid 34 respectively, thereby this lid 34 is interconnected to form said heat absorbing element 30 with base plate 31.Please consult Fig. 4 simultaneously, sealing ring 33 is located in bottom and the junction between the base plate 31 of the sidewall 342 of lid 34, the gap when being connected with base plate 31 to eliminate lid 34, thereby between lid 34 and base plate 31 formation one hermetic cavity chamber 348.Be used to fill cooling liquid in the chamber 348, like pure water, this radiator 32 is contained in this chamber 348.
Each connector 35 comprises a screw 37, a nut 39 and a sealing ring 38.This screw 37 comprises a threaded shank cylindraceous 371, be located on an annular projection 372 at these threaded shank 371 middle parts and be positioned at the head 373 on threaded shank 371 tops.The central authorities of this screw 37 be provided with one radially run through this head 373 and threaded shank 371 through hole 370.This threaded shank 371 is provided with first external screw thread in the outer surface of the bottom part of projection below 372; The internal thread of water inlet 345 and delivery port 346 matees each other on said first external screw thread and the lid 34, and this threaded shank 371 is provided with second external screw thread in the outer surface of the head portion of projection more than 372.Each nut 39 is the annular bar shape, and the inner circumferential surface of this nut 39 is provided with the internal thread that second external screw thread with screw 37 is complementary.The height of this nut 39 is greater than the height of the head portion of threaded shank 371; And the internal diameter of nut 39 is greater than the external diameter of head 373; During assembling; Said screw 37 is screwed together in the water inlet 345 and delivery port 346 of heat absorbing element 30 through the bottom part of threaded shank 371 respectively; Its projection 372 is conflicted with the upper surface of the roof 341 of lid 34 respectively, and said nut 39 is screwed together in the head portion of corresponding threaded shank 371 respectively, formation one annular space 374 between the outer surface of the inner surface on the top of each nut 39 and the head 371 of corresponding screw 37.Sealing circle 38 is located between nut 39 and the screw 37, the gap that produces when being connected with nut 39 to eliminate this screw 37.The thickness of the tube wall of the width of this annular space 374 and said oral siphon 60 and outlet pipe 70 about equally.
This heat dissipation element 20 comprises a water tank 21, the plurality of conduits 22 that is communicated with this water tank 21, be fixedly welded on some fin 23 of said pipeline 22 outer surfaces and be positioned at two radiator fans 24 of said fin 23 tops.One side of this water tank 21 is provided with an outlet 211 and one inlet 212, and said pipeline 22 is communicated with the opposite side of this water tank 21.
Please consult Fig. 1 once more; This oral siphon 60 is the lengthwise shape; The one of which end inserts through the tight fit mode in the annular space 374 of corresponding connector 35, is connected with the water inlet 345 of heat absorbing element 30 through this connector 35, and the other end is connected with the outlet 211 of heat dissipation element 20.This driving pump 40 is located on this oral siphon 60.This outlet pipe 70 comprises first body 71, a water knockout drum 72 and two second bodys 73 of a lengthwise.This water knockout drum 70 roughly is " Y " font, and it comprises one first mouth of pipe 710 and two second mouths of pipe 730 that lay respectively at this " Y " word least significant end.This first body 71 is connected between the inlet 212 of first mouth of pipe 710 and water tank 21 of water knockout drum 72; One end of each second body 73 connects with the water knockout drum 72 1 second corresponding mouths of pipe 730; The other end inserts in the annular space 374 of corresponding connector 35 through the tight fit mode, is connected with the delivery port 346 of heat absorbing element 30 through connector 35.These outlet pipe 70 integral body also are " Y " font.
During work; This heat absorbing element 30 contacts with electronic component 80 through heating region 310 and absorbs heat; Heat is via base plate 31 and be positioned at that radiator 32 on the base plate 31 passes to the cooling liquid of chamber 348 and with this cooling liquid heating; Heated liquid enters in two second bodys 73 of outlet pipe 70 at two delivery ports 346 of the effect lower edge of driving pump 40 heat absorbing element 30; And get into the back from two second mouths of pipe of water knockout drum 72 730 and converge at first mouth of pipe 710, flow into first body 71 of outlet pipes 70 from first mouth of pipe 710 of water knockout drum 72, flow to heat dissipation element 20 via first body 71 again; At heat dissipation element 20 places; When being heated liquid and in pipeline 22, flowing the heat transferred fin that carries 23 backs are cooled off; Through fin 23 heat is rejected heat in the surrounding air, said radiator fan 24 turns round and produces air-flow, to quicken the radiating efficiency of fin 23; Simultaneously, the liquid of cooling flows to oral siphon 60 from the outlet 211 of heat dissipation element 20 at heat dissipation element 20 places, is back in the heat absorbing element 30 via oral siphon 60; So back and forth follow bad, thereby realize purpose to electronic component 80 heat radiations.
Because this heat absorbing element 30 comprises two delivery ports 346 that are positioned at water inlet 345 both sides; And the heating region 310 of water inlet 345 and heat absorbing element 30 over against; Therefore, shown in arrow among Fig. 4, directly impact this heating region 310 downwards via water inlet 345 at heat dissipation element 20 cooled liquid; By flow to again after the rapid heating peripheral region of heating region 310, promptly flow to 346 of two delivery ports over against the zone, and flow to heat dissipation element 20 rapidly from two delivery ports 346.Therefore; The flow path that flows to delivery port 346 after cooling liquid is heated in this heat absorbing element 30 is more smooth and easy; The heating region 310 that cooling liquid directly impacts this heat absorbing element 30 can make cooling liquid at utmost carry out heat exchange with the electronic component that is positioned at base plate 31 belows 80; Avoid the overheated possibility of electronic component 80 effectively, and the heat distribution on can the base plate 31 of more balanced heat absorbing element 30, promoted the radiating efficiency of this liquid-cooled radiating system 100.Because this outlet pipe 70 is " Y " font; Liquid gets into outlet pipes 70 from two delivery ports 70 two second bodys 73 that are heated from heat absorbing element 30 outflows; And flow to heat dissipation element 20 after in outlet pipe 70, converging; Be heated the flowing velocity of liquid in outlet pipe 70 thereby increase to a certain extent, and then increase the circulation rate of cooling liquid in this liquid-cooled radiating system 100, promote the integral heat sink efficient of this liquid-cooled radiating system 100.
In the above-described embodiments; The quantity of heat absorbing element 30 upper water-out mouths 346 is two, and the quantity of outlet pipe 70 is one, yet; During practical implementation; The quantity of this delivery port 346 can also be a plurality of for three, four or other, be distributed in equably this water inlet 345 around, the quantity of second body 73 increases accordingly in this outlet pipe 70 or the outlet pipe 70 simultaneously.
Claims (10)
1. liquid-cooled radiating system; Comprise heat absorbing element, driving pump, heat dissipation element, reach oral siphon and outlet pipe that said heat absorbing element, driving pump and heat dissipation element are connected; Be provided with the hermetic cavity chamber that is used to hold cooling liquid in this heat absorbing element; The central authorities of the bottom of this heat absorbing element are formed for the heating region that is sticked with electronic component, it is characterized in that: the top of this heat absorbing element be provided be connected with oral siphon and with this heating region over against a water inlet and be connected with outlet pipe and be positioned at this water inlet a plurality of delivery ports on every side.
2. liquid-cooled radiating system as claimed in claim 1 is characterized in that: this heat absorbing element comprises base plate and covers at the lid on the base plate, and this heating region is formed on the base plate, and said delivery port and water inlet are located on the lid respectively.
3. liquid-cooled radiating system as claimed in claim 1 is characterized in that: the quantity of said delivery port is two, and is positioned at the relative both sides of water inlet.
4. liquid-cooled radiating system as claimed in claim 3 is characterized in that: this outlet pipe is " Y " font, comprises first body that is connected with heat dissipation element and two second bodys that are connected with the delivery port of heat absorbing element respectively.
5. liquid-cooled radiating system as claimed in claim 4 is characterized in that: this outlet pipe also comprises a water knockout drum, and this water knockout drum comprises respectively and first body and two second three mouths of pipe that body is connected.
6. liquid-cooled radiating system as claimed in claim 1 is characterized in that: this outlet pipe comprises and first body that is connected with heat dissipation element and a plurality of second bodys that are connected with the delivery port of heat absorbing element respectively.
7. liquid-cooled radiating system as claimed in claim 1; It is characterized in that: said water inlet and delivery port place are provided with some internal threads respectively; This heat absorbing element also comprises and said water inlet and the corresponding connector of delivery port; Each connector comprises and is screwed together in corresponding water inlet and the screw in the delivery port and is positioned at the peripheral nut of this screw that the central authorities of this screw are formed with through hole, forms the annular space that the tube wall that can infeed water pipe and outlet pipe is tightly fixed between said screw and the nut.
8. liquid-cooled radiating system as claimed in claim 1 is characterized in that: be provided with a radiator in the heating region top in the chamber of this heat absorbing element.
9. liquid-cooled radiating system as claimed in claim 8 is characterized in that: this radiator comprises some fin that are arranged side by side.
10. liquid-cooled radiating system as claimed in claim 1; It is characterized in that: this heat dissipation element comprises a water tank, is positioned at water tank one side plurality of conduits and is positioned at the peripheral some fin of this pipeline; One side of this water tank is provided with outlet and the inlet that is connected with oral siphon and outlet pipe respectively, and the opposite side of said pipeline and water tank is interconnected.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010530488.0A CN102456644B (en) | 2010-11-03 | Liquid-cooled radiating system | |
| US12/978,523 US20120103575A1 (en) | 2010-11-03 | 2010-12-24 | Cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010530488.0A CN102456644B (en) | 2010-11-03 | Liquid-cooled radiating system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102456644A true CN102456644A (en) | 2012-05-16 |
| CN102456644B CN102456644B (en) | 2016-12-14 |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103796492A (en) * | 2014-01-25 | 2014-05-14 | 清华大学 | Heat collecting end |
| TWI467124B (en) * | 2012-05-24 | 2015-01-01 | Univ Nat Taipei Technology | Liquid cooling heat sink |
| CN104779226A (en) * | 2015-04-28 | 2015-07-15 | 天津商业大学 | Liquid-cooled high heating flux device radiator with flow guide channels |
| CN104866043A (en) * | 2014-02-21 | 2015-08-26 | 北京市鑫全盛商贸有限公司 | Water-cooled radiator |
| CN105764306A (en) * | 2016-04-08 | 2016-07-13 | 华为技术有限公司 | Blind-mate manifold branch system and liquid-cooled system |
| CN105932368A (en) * | 2016-05-10 | 2016-09-07 | 济南陆枋志合信息技术有限公司 | Lithium battery pack |
| CN107084376A (en) * | 2017-06-29 | 2017-08-22 | 湖南明和光电设备有限公司 | A kind of cold combination cooling system of liquid cold wind |
| CN108364922A (en) * | 2018-01-31 | 2018-08-03 | 北京比特大陆科技有限公司 | Liquid cooling heat radiation system |
| CN109798795A (en) * | 2018-11-28 | 2019-05-24 | 北京空间飞行器总体设计部 | A kind of double liquid storage device plate loop circuit heat pipes |
| CN114138082A (en) * | 2020-09-03 | 2022-03-04 | 北京图森智途科技有限公司 | Heat dissipation system and server system |
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| US20050056404A1 (en) * | 2003-09-12 | 2005-03-17 | Lee Hsieh Kun | Integrated liquid cooling system for electrical components |
| US20070039719A1 (en) * | 2003-11-07 | 2007-02-22 | Eriksen Andre S | Cooling system for a computer system |
| CN2919359Y (en) * | 2006-05-26 | 2007-07-04 | 佛山市顺德区汉达精密电子科技有限公司 | Water-cooled computer heat radiating device |
| US20070272392A1 (en) * | 2006-05-23 | 2007-11-29 | Debashis Ghosh | Impingement cooled heat sink with low pressure drop |
| CN101203115A (en) * | 2006-12-13 | 2008-06-18 | 富准精密工业(深圳)有限公司 | Liquid cooling dissipating heat system and heat absorbing element thereof |
| CN101330816A (en) * | 2007-06-21 | 2008-12-24 | 富钧科技股份有限公司 | Liquid cooling type radiating module |
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050056404A1 (en) * | 2003-09-12 | 2005-03-17 | Lee Hsieh Kun | Integrated liquid cooling system for electrical components |
| US20070039719A1 (en) * | 2003-11-07 | 2007-02-22 | Eriksen Andre S | Cooling system for a computer system |
| US20070272392A1 (en) * | 2006-05-23 | 2007-11-29 | Debashis Ghosh | Impingement cooled heat sink with low pressure drop |
| CN2919359Y (en) * | 2006-05-26 | 2007-07-04 | 佛山市顺德区汉达精密电子科技有限公司 | Water-cooled computer heat radiating device |
| CN101203115A (en) * | 2006-12-13 | 2008-06-18 | 富准精密工业(深圳)有限公司 | Liquid cooling dissipating heat system and heat absorbing element thereof |
| CN101330816A (en) * | 2007-06-21 | 2008-12-24 | 富钧科技股份有限公司 | Liquid cooling type radiating module |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI467124B (en) * | 2012-05-24 | 2015-01-01 | Univ Nat Taipei Technology | Liquid cooling heat sink |
| CN103796492A (en) * | 2014-01-25 | 2014-05-14 | 清华大学 | Heat collecting end |
| CN103796492B (en) * | 2014-01-25 | 2017-01-18 | 清华大学 | Heat collecting end using lotus root-shaped cellular material microchannel module |
| CN104866043A (en) * | 2014-02-21 | 2015-08-26 | 北京市鑫全盛商贸有限公司 | Water-cooled radiator |
| CN104866043B (en) * | 2014-02-21 | 2018-05-08 | 北京市鑫全盛商贸有限公司 | Water-filled radiator |
| CN104779226A (en) * | 2015-04-28 | 2015-07-15 | 天津商业大学 | Liquid-cooled high heating flux device radiator with flow guide channels |
| CN104779226B (en) * | 2015-04-28 | 2017-06-30 | 天津商业大学 | Liquid-cooled high heat flux device radiator with flow-guiding channel |
| CN105764306A (en) * | 2016-04-08 | 2016-07-13 | 华为技术有限公司 | Blind-mate manifold branch system and liquid-cooled system |
| CN105764306B (en) * | 2016-04-08 | 2018-03-06 | 华为技术有限公司 | Blindmate manifold system and liquid cooling system |
| CN105932368A (en) * | 2016-05-10 | 2016-09-07 | 济南陆枋志合信息技术有限公司 | Lithium battery pack |
| CN107084376A (en) * | 2017-06-29 | 2017-08-22 | 湖南明和光电设备有限公司 | A kind of cold combination cooling system of liquid cold wind |
| CN108364922A (en) * | 2018-01-31 | 2018-08-03 | 北京比特大陆科技有限公司 | Liquid cooling heat radiation system |
| CN109798795A (en) * | 2018-11-28 | 2019-05-24 | 北京空间飞行器总体设计部 | A kind of double liquid storage device plate loop circuit heat pipes |
| CN109798795B (en) * | 2018-11-28 | 2020-09-25 | 北京空间飞行器总体设计部 | Flat loop heat pipe with double liquid reservoirs |
| CN114138082A (en) * | 2020-09-03 | 2022-03-04 | 北京图森智途科技有限公司 | Heat dissipation system and server system |
Also Published As
| Publication number | Publication date |
|---|---|
| US20120103575A1 (en) | 2012-05-03 |
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Effective date of registration: 20180205 Address after: Haiyun street, Tianjin economic and Technological Development Zone No. 80 Patentee after: Hongfujin Precision Electronics (Tianjin) Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Co-patentee before: Hon Hai Precision Industry Co., Ltd. Patentee before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. |
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Granted publication date: 20161214 Termination date: 20171103 |
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