CN102454878B - Light-emitting diode module - Google Patents
Light-emitting diode module Download PDFInfo
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- CN102454878B CN102454878B CN201010513336.XA CN201010513336A CN102454878B CN 102454878 B CN102454878 B CN 102454878B CN 201010513336 A CN201010513336 A CN 201010513336A CN 102454878 B CN102454878 B CN 102454878B
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- emitting diode
- luminescence unit
- circuit layer
- diode module
- light emitting
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Abstract
The invention relates to a light-emitting diode module, which comprises a circuit board, a first circuit layer, a plurality of electrode pins, a substrate and a plurality of luminous units, wherein the first circuit layer is formed on the circuit board and is electrically connected with an external power supply; the plurality of electrode pins are formed on the circuit board; the substrate is connected with the circuit board; the plurality of luminous units are arranged on the substrate and are electrically connected with the first circuit layer through the plurality of electrode pins respectively to adjust a connecting mode of the plurality of electrode pins and the first circuit layer; therefore, a connecting mode among the plurality of luminous units is adjusted.
Description
Technical field
The present invention relates to a kind of lighting device, relate in particular to a kind of light emitting diode module.
Background technology
At present, light emitting diode (Light Emitting Diode, L ED) is low in energy consumption because having, the life-span is long, volume is little and brightness is high etc., and characteristic has been widely applied to a lot of fields.
Usually, light emitting diode module comprises circuit board and is arranged on the multiple luminescence units on this circuit board.On this circuit board, be formed with circuit layer, the plurality of luminescence unit is arranged on the precalculated position of this circuit board, and is mutually electrically connected by circuit layer, and draws two electrodes and be electrically connected with external power source.Because circuit layer is arranged on the precalculated position of circuit board, it is change of location and annexation each other arbitrarily, and therefore, the electrical connection between the plurality of luminescence unit is also relatively fixing, as, series, parallel or series-parallel connection.When need to change between the plurality of luminescence unit annexation time, need to change circuit board, and the plurality of luminescence unit of layout again.So multiple luminescence unit annexations that this kind of light emitting diode module comprises are fixed, and cannot carry out as required independent assortment.
Summary of the invention
Light emitting diode module that below can independent assortment by the connected mode that a kind of luminescence unit is described with embodiment.
A kind of light emitting diode module, it comprises circuit board, the first circuit layer, multiple electrode pin, substrate and multiple luminescence unit.This first circuit layer is formed on this circuit board, and this first circuit layer is electrically connected with external power source.The plurality of electrode pin is formed on this circuit board.This substrate is connected with this circuit board.The plurality of luminescence unit is arranged on this substrate, the plurality of luminescence unit is electrically connected with the first circuit layer by the plurality of electrode pin respectively, adjust the connected mode of the plurality of electrode pin and this first circuit layer, thereby adjust the connected mode between the plurality of luminescence unit.
With respect to prior art, described light emitting diode module can be by changing the connected mode between the plurality of electrode pin and the first circuit layer, thereby freely adjust the connected mode between the plurality of luminescence unit, and without again changing circuit board, and reinstall luminescence unit.This light emitting diode module can freely be adjusted the connected mode of the plurality of luminescence unit, simple in structure, and circuit board can reuse.
Brief description of the drawings
Fig. 1 is the diagram of bowing of the light emitting diode module of the embodiment of the present invention.
Fig. 2 is the first circuit connection diagram of the light emitting diode module of Fig. 1.
Fig. 3 is the equivalent circuit diagram that in Fig. 2, circuit connects.
Fig. 4 is the second circuit connection diagram of the light emitting diode module of Fig. 1.
Fig. 5 is the equivalent circuit diagram that in Fig. 4, circuit connects.
Main element symbol description
Light emitting diode module 100
Circuit board 12
The first circuit layer 13
The second interface 132
Electrode pin 14
First pair of electrode pin 141
Second pair of electrode pin 142
The 3rd pair of electrode pin 143
Substrate 15
Second circuit layer 16
Luminescence unit 17
The first luminescence unit 171
The second luminescence unit 172
The 3rd luminescence unit 173
Detailed description of the invention
Below in conjunction with accompanying drawing, the embodiment of the present invention is described in further detail.
Refer to Fig. 1, the embodiment of the present invention provides a kind of light emitting diode module 100, and it comprises circuit board 12, is formed on the first circuit layer 13, multiple electrode pin 14, substrate 15 and multiple luminescence unit 17 on this circuit board 12.
In the present embodiment, one end of this circuit board 12 is formed with the first circuit layer 13, and draws first interface 131 and the second interface 132, and wherein, first interface 131 is anode, and the second interface 132 is negative electrode.This first circuit layer 13 is for being electrically connected with external power source.
The other end of this circuit board 12 is provided with multiple electrode pins 14.In the present embodiment, the plurality of electrode pin 14 comprises 141, one second pairs of electrode pins 142 of one first pair of electrode pin, and one the 3rd pair of electrode pin 143.Every pair of electrode pin includes an anode pin and a negative electrode pin.The plurality of electrode pin 14 is electrically connected with first interface 131 and second interface 132 of this first circuit layer 13 by wire, is electrically connected with external power source thereby realize.
This substrate 15 is tabular, and it is for carrying the plurality of luminescence unit 17.In the present embodiment, this substrate 15 is made up of metal material, copper as good in thermal conductivity, and the dissipation of heat of its generation of can quickly this luminescence unit 17 being worked is to air.Certainly, this substrate 15 also can be made up of the material of heat conduction and insulation, and one-body molded with this circuit board 12.
The plurality of luminescence unit 17 is arranged on this substrate 15.In the present embodiment, the plurality of luminescence unit 17 comprises one first luminescence unit 171, one second luminescence units 172, and one the 3rd luminescence unit 173.Each luminescence unit 17 is a light emitting diode.Certainly, each luminescence unit 17 can be also the lighting unit being interconnected to form by multiple light emitting diodes.And quantity, the arrangement mode of luminescence unit 17 also can be adjusted as required.In the present embodiment, this substrate 15 is made of metal, and each luminescence unit 17 is electrically connected with the plurality of electrode pin 14 respectively by routing mode.
In the present embodiment, this light emitting diode module 100 further comprises second circuit layer 16, and this second circuit layer 16 is formed on this substrate 15.The electrode of the plurality of luminescence unit 17 is drawn by this second circuit layer 16 respectively, and is electrically connected with the plurality of electrode pin 14 respectively.The plurality of electrode pin 14 is electrically connected with first interface 131 and second interface 132 of this first circuit layer 13 by wire, is electrically connected with external power source thereby realize.This light emitting diode module 100 can be by changing between the plurality of electrode pin 14, and connected mode between the plurality of electrode pin 14 and first interface 131 and the second interface 132, thereby adjust the connected mode of the plurality of luminescence unit 17.
Please also refer to Fig. 2, a kind of circuit connecting mode of this light emitting diode module 100 that the embodiment of the present invention provides.Particularly, the anode of 141, the second pairs of electrode pins 142 of this first pair of electrode pin and the 3rd pair of electrode pin 143 is mutually electrically connected and is electrically connected with the first interface 131 of this first circuit layer 13.This first pair of electrode pin 141, the negative electrode of second pair of electrode pin 142 and the 3rd pair of electrode pin 143 is mutually electrically connected and is electrically connected with the second interface 132 of this first circuit layer 13, thereby realize this first luminescence unit 171, the second luminescence unit 172 and the 3rd luminescence unit 173 are parallel with one another, please also refer to Fig. 3, an equivalent circuit diagram of this light emitting diode module 100.
Refer to Fig. 4, the another kind of circuit connecting mode of this light emitting diode module 100 that the embodiment of the present invention provides.The anode of this first pair of electrode pin 141 is connected with the cathodic electricity of second pair of electrode pin 142, and is electrically connected with the second interface 132 of this first circuit layer 13.The negative electrode of this first pair of electrode pin 141 is connected with the cathodic electricity of the 3rd pair of electrode pin 143.The anode of this second pair of electrode pin 142 is electrically connected with the anode of the 3rd pair of electrode pin 143, and is electrically connected with the first interface 131 of this first circuit layer 13.Therefore, realized this first luminescence unit 171 and the second luminescence unit 172 forms after series circuit, more in parallel with the 3rd luminescence unit 173, thus a series and parallel circuit formed.Please also refer to Fig. 5, another equivalent circuit diagram of this light emitting diode module 100.
Be understandable that, in the present embodiment, this first luminescence unit 171, the annexation of the second luminescence unit 172 and the 3rd luminescence unit 173 is not limited to shown in above-described embodiment, can be by changing this first pair of electrode pin 141, annexation between the second pair of electrode pin 142 and the 3rd pair of electrode pin 143 and this first interface 131 and the second interface 132, thereby the annexation between can the plurality of luminescence unit 17.
This light emitting diode module 100 can be by changing between the plurality of electrode pin 14, and connected mode between the plurality of electrode pin 14 and first interface 131 and the second interface 132, thereby freely adjust the connected mode between the plurality of luminescence unit 17, and without again changing circuit board, and reinstall luminescence unit 17.This light emitting diode module 100 can freely be adjusted the connected mode of the plurality of luminescence unit 17, simple in structure, and circuit board 12 can reuse.
Be understandable that, those skilled in the art also can do other and change in spirit of the present invention, as long as it does not depart from technique effect of the present invention and all can.The variation that these do according to spirit of the present invention, within all should being included in the present invention's scope required for protection.
Claims (6)
1. a light emitting diode module, it comprises:
Circuit board;
The first circuit layer, it is formed on this circuit board, and this first circuit layer is electrically connected with external power source;
Multiple electrode pins, it is formed on this circuit board;
Substrate, it is connected with this circuit board;
Second circuit layer, this second circuit layer is formed on this substrate; And
Multiple luminescence units, it is arranged on this substrate, the electrode of the plurality of luminescence unit is drawn by this second circuit layer, and be electrically connected with the first circuit layer by the plurality of electrode pin respectively, adjust the connected mode of the plurality of electrode pin and this first circuit layer, thereby adjust the connected mode between the plurality of luminescence unit.
2. light emitting diode module as claimed in claim 1, is characterized in that, this substrate is made up of metal material.
3. light emitting diode module as claimed in claim 2, is characterized in that, the plurality of luminescence unit is arranged on this substrate, and is electrically connected with the plurality of electrode pin respectively by routing mode.
4. light emitting diode module as claimed in claim 1, is characterized in that, this substrate is made up of heat-conducting insulation material.
5. light emitting diode module as claimed in claim 4, is characterized in that, this substrate and this circuit board are one-body molded.
6. light emitting diode module as claimed in claim 1, is characterized in that, this first circuit layer is drawn two interfaces, adjusts the connected mode of the plurality of electrode pin and these two interfaces, thereby adjusts the connected mode between the plurality of luminescence unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010513336.XA CN102454878B (en) | 2010-10-19 | 2010-10-19 | Light-emitting diode module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010513336.XA CN102454878B (en) | 2010-10-19 | 2010-10-19 | Light-emitting diode module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102454878A CN102454878A (en) | 2012-05-16 |
| CN102454878B true CN102454878B (en) | 2014-07-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010513336.XA Expired - Fee Related CN102454878B (en) | 2010-10-19 | 2010-10-19 | Light-emitting diode module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102454878B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203205419U (en) * | 2012-09-13 | 2013-09-18 | 天津金玛光电有限公司 | Unidirectional HV LED chip |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005129605A (en) * | 2003-10-22 | 2005-05-19 | Ricoh Co Ltd | Wiring board and semiconductor package using it |
| CN200965882Y (en) * | 2006-10-31 | 2007-10-24 | 吴继德 | Multi-chip package LED |
| JP2008211255A (en) * | 2002-04-12 | 2008-09-11 | Seoul Semiconductor Co Ltd | Light-emitting device |
| CN201117657Y (en) * | 2007-08-10 | 2008-09-17 | 深圳市贝晶光电科技有限公司 | Light emitting diode packaging structure |
| CN201134957Y (en) * | 2007-12-07 | 2008-10-15 | 讯凯国际股份有限公司 | LED illuminating device and illuminating module with the same |
| CN201262369Y (en) * | 2008-07-08 | 2009-06-24 | 东贝光电科技股份有限公司 | Illuminating device |
| CN101603636A (en) * | 2008-06-10 | 2009-12-16 | 展晶科技(深圳)有限公司 | Light supply apparatus |
| CN101684915A (en) * | 2008-09-24 | 2010-03-31 | 奇力光电科技股份有限公司 | Light-emitting diode (LED) illuminating lamp |
| CN201585224U (en) * | 2009-09-30 | 2010-09-15 | 吴献桐 | Device with radiating element |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8058669B2 (en) * | 2008-08-28 | 2011-11-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Light-emitting diode integration scheme |
-
2010
- 2010-10-19 CN CN201010513336.XA patent/CN102454878B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008211255A (en) * | 2002-04-12 | 2008-09-11 | Seoul Semiconductor Co Ltd | Light-emitting device |
| JP2005129605A (en) * | 2003-10-22 | 2005-05-19 | Ricoh Co Ltd | Wiring board and semiconductor package using it |
| CN200965882Y (en) * | 2006-10-31 | 2007-10-24 | 吴继德 | Multi-chip package LED |
| CN201117657Y (en) * | 2007-08-10 | 2008-09-17 | 深圳市贝晶光电科技有限公司 | Light emitting diode packaging structure |
| CN201134957Y (en) * | 2007-12-07 | 2008-10-15 | 讯凯国际股份有限公司 | LED illuminating device and illuminating module with the same |
| CN101603636A (en) * | 2008-06-10 | 2009-12-16 | 展晶科技(深圳)有限公司 | Light supply apparatus |
| CN201262369Y (en) * | 2008-07-08 | 2009-06-24 | 东贝光电科技股份有限公司 | Illuminating device |
| CN101684915A (en) * | 2008-09-24 | 2010-03-31 | 奇力光电科技股份有限公司 | Light-emitting diode (LED) illuminating lamp |
| CN201585224U (en) * | 2009-09-30 | 2010-09-15 | 吴献桐 | Device with radiating element |
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| Publication number | Publication date |
|---|---|
| CN102454878A (en) | 2012-05-16 |
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