CN102447077A - Organic light-emitting diode encapsulation structure and manufacturing method thereof - Google Patents
Organic light-emitting diode encapsulation structure and manufacturing method thereof Download PDFInfo
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- CN102447077A CN102447077A CN2011104442089A CN201110444208A CN102447077A CN 102447077 A CN102447077 A CN 102447077A CN 2011104442089 A CN2011104442089 A CN 2011104442089A CN 201110444208 A CN201110444208 A CN 201110444208A CN 102447077 A CN102447077 A CN 102447077A
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Abstract
A manufacturing method of an organic light-emitting diode encapsulation structure comprises the following steps of: forming an organic light-emitting component on a substrate; forming a retaining wall on the substrate, wherein the retaining wall is arranged on the periphery of the organic light-emitting component in a surrounding manner and is made of one of groups formed by calcium metal, magnesium metal, aluminum metal, carton, zinc metal, chromium metal, tin metal, lead metal and copper metal; forming a packaging plastic material on a cover plate; and bonding the cover plate with the substrate by using the packaging plastic material and then solidifying the packaging plastic material, wherein the packaging plastic material is arranged on the periphery of the organic light-emitting component in a surrounding manner, and the packaging plastic material and the retaining wall are positioned between the cover plate and the substrate to seal the organic light-emitting component.
Description
Technical field
The invention relates to a kind of organic light-emitting diode packaging structure and manufacturing approach thereof, particularly relevant for a kind of organic light-emitting diode packaging structure and manufacturing approach thereof that blocks aqueous vapor and oxygen.
Background technology
Flat-panel screens is because thin thickness and in light weight is used in various electronic products, widely as amusement and signal display interface at present.And in these flat-panel screens; Organic Light Emitting Diode has advantages such as self-luminous, the restriction of no visual angle, power saving, high reaction speed and full-colorization; Make Organic Light Emitting Diode that great application potential arranged, be expected to become the illumination of follow-on flat-panel screens and planar light source.
But it is because most assembly (for example luminescent layer) of Organic Light Emitting Diode is organically, so responsive especially to the oxygen and the aqueous vapor of any trace in the space.Oxygen and aqueous vapor can be disturbed and the composition material, particularly its luminous power of deterioration luminescent layer, and the operating period of having reduced display quality and panel.
Taiwan letters patent book number I313887 discloses a kind of situation that reduces oxygen and aqueous vapor to the luminescent layer deterioration of organic light-emitting diode packaging structure 10; In case before this; As shown in Figure 1, this organic light-emitting diode packaging structure 10 comprises two thin plates, a preceding thin plate 11 and a back thin plate 12 in the face of the beholder; Airtight by preceding thin plate 11, back thin plate 12 and packaging adhesive material 14, definition has confined space 17 between the three; One contains the array of a plurality of organic luminescent assemblies 13, and this organic luminescent assembly 13 can be launched light, through preceding thin plate 11; Reach a plurality of potholes 16 that a plurality of absorbents 15 are positioned at this preceding thin plate 11, on the obverse inner face that those potholes 16 are positioned at confined space 17 contacts, and be distributed between those organic luminescent assemblies 13.
But the structure that TWI313887 disclosed; Oxygen property is poor because packaging adhesive material 14 blocks water; And absorbent 15 is positioned at confined space 17; Therefore absorbent 15 can't absorb water oxygen the very first time when water oxygen passes through packaging adhesive material 14, and after absorbent 15 can only wait water oxygen to get into confined space 17, absorbent 15 just can absorb water oxygen.This moment, water oxygen possibly disturb and deterioration organic luminescent assembly 13, therefore can't significantly prolong the Organic Light Emitting Diode life-span.Moreover because absorbent 15 is positioned at the cause of a plurality of potholes 16 of preceding thin plate 11, thin plate 11 is thicker before therefore causing.
Therefore, just having to provide a kind of organic light-emitting diode packaging structure and manufacturing approach thereof, can solve aforesaid problem.
Summary of the invention
The present invention provides a kind of manufacturing approach of organic light-emitting diode packaging structure, comprises the following steps: to form an organic luminescent assembly on a substrate; Form a barricade on this substrate; Wherein this barricade is located on around this organic luminescent assembly, and the material of this barricade is selected from wherein one of group that calcium metal, magnesium metal, aluminum metal, carbon, zinc metal, chromium metal, tin metal, lead metal and copper metal constituted; Form a packaging adhesive material on a cover plate; And by this packaging adhesive material with this cover plate and this substrate gluing; And then with this packaging adhesive material curing; Wherein this packaging adhesive material is located on around this organic luminescent assembly, and this packaging adhesive material and this barricade are all between this cover plate and this substrate, to seal this organic luminescent assembly.Can be mixed with an absorbent in this packaging adhesive material.
The present invention provides a kind of organic light-emitting diode packaging structure in addition, comprising: a substrate; One organic luminescent assembly, it is arranged on this substrate; One packaging adhesive material, it is arranged on this substrate, and is located on around this organic luminescent assembly; One barricade; It also is located on around this organic luminescent assembly; And be arranged at a side of this packaging adhesive material, the material of this barricade be selected from group that calcium metal, magnesium metal, aluminum metal, carbon, zinc metal, chromium metal, tin metal, lead metal and copper metal constituted wherein at least one; And a cover plate, it is arranged on this organic luminescent assembly, and by this packaging adhesive material with this cover plate and this substrate gluing, this packaging adhesive material and this metal barricade are all between this cover plate and this substrate, to seal this organic luminescent assembly by this.
The present invention provides a kind of organic light-emitting diode packaging structure in addition, comprising: a substrate; One organic luminescent assembly, it is arranged on this substrate; One packaging adhesive material, it is arranged on this substrate, and is located on around this organic luminescent assembly; One absorbent; It is to be mixed in this packaging adhesive material, the material of this absorbent be be selected from group that calcium metal, magnesium metal, aluminum metal, carbon, zinc metal, chromium metal, tin metal, lead metal, copper metal, calcium compound, magnesium compound, aluminium compound, carbon compound, zinc compound, chromium compound, tin compound, lead compound and copper compound constituted wherein at least one; And a cover plate, it is arranged on this organic luminescent assembly, and with this cover plate and this substrate gluing, this packaging adhesive material is between this cover plate and this substrate, to seal this organic luminescent assembly by this by this packaging adhesive material.
Compared to prior art, can know that absorbent palpus waits water oxygen to get in the organic light-emitting diode packaging structure after, absorb water oxygen again.The present invention is because this barricade is arranged at a side of this packaging adhesive material; And this absorbent is positioned at packaging adhesive material; Therefore can absorb water oxygen earlier at this barricade of the very first time and the absorbent of water oxygen during through packaging adhesive material; Block water oxygen gets in the organic light-emitting diode packaging structure effectively, avoids water oxygen to disturb and the deterioration organic luminescent assembly, and then significantly prolongs lifetime of LED.
In order to let above and other objects of the present invention, characteristic and the advantage can be more obvious, hereinafter will cooperate appended diagram, elaborate as follows.
Description of drawings
Fig. 1 is the generalized section of structure of the Organic Light Emitting Diode of prior art.
Fig. 2 a is the generalized section of manufacturing approach of the Organic Light Emitting Diode of ㄧ embodiment of the present invention to Fig. 2 c.
Fig. 3 is the generalized section of structure of the Organic Light Emitting Diode of the second embodiment of the present invention.
Fig. 4 is the generalized section of structure of the Organic Light Emitting Diode of the third embodiment of the present invention.
Fig. 5 is the generalized section of structure of the Organic Light Emitting Diode of the fourth embodiment of the present invention.
Fig. 6 is the generalized section of structure of the Organic Light Emitting Diode of the fifth embodiment of the present invention.
Among the figure: 10,110,210,310,410,510 organic light-emitting diode packaging structures; Thin plate before 11,12 back thin plates, 13,113 organic illuminating elements, 14,114,214,314 packaging adhesive materials; 15,119,519 absorbents, 16 potholes, 17 confined spaces, 111 cover plates; 112 substrates, 118,218,318,320,418 barricades, 130 anode layers, 140 cathode layers; 150 organic semiconductor layers, 152 red light emitting layers, 154 green light emitting layers, 156 blue light-emitting layers.
Embodiment
Please refer to Fig. 2 a to Fig. 2 c, it shows the manufacturing approach of the organic light-emitting diode packaging structure 110 of the first embodiment of the present invention.
Shown in figure 2a; One substrate 112 (for example glass substrate) is provided; Its definition has a plurality of picture elements zone, and each picture element zone forms an organic luminescent assembly 113, and organic luminescent assembly 113 comprises an anode layer 130 and a cathode layer 140 usually; And an organic semiconductor layer 150, this organic semiconductor layer 150 comprise red light emitting layer 152, green light emitting layer 154 and blue light-emitting layer 156 and place anode layer 130 and cathode layer 140 between.One of them is a transparency electrode at least with cathode layer 140 for above-mentioned anode layer 130, and another person can be metal, metal alloy, transparent metal oxide or above-mentioned mixed layer.
On substrate 112, form a barricade 118 with for example sputtering way, the material of this barricade 118 can be selected from wherein one of group that calcium metal, magnesium metal, aluminum metal, carbon, zinc metal, chromium metal, tin metal, lead metal and copper metal constituted.In the present embodiment, this barricade 118 is that aluminum metal is made, and is located on around this organic luminescent assembly 113; These barricade 118 width are greater than the aluminum metal autoxidation degree of depth; Need greater than 15 microns, these barricade 118 height are greater than these organic luminescent assembly 113 height, need greater than 400 rice how; Wherein Fig. 2 a is only in order to clearly demonstrating present embodiment, and unrestricted the present invention.
Shown in figure 2b, a cover plate 111 (for example glass cover-plate) is provided, with surperficial wire mark one curable material of cover plate 111, to form a packaging adhesive material 114 on cover plate 111.In the present embodiment; Can be mixed with an absorbent 119 in this packaging adhesive material, the material of this absorbent 119 be selected from group that calcium metal, magnesium metal, aluminum metal, carbon, zinc metal, chromium metal, tin metal, lead metal, copper metal, calcium compound, magnesium compound, aluminium compound, carbon compound, zinc compound, chromium compound, tin compound, lead compound and copper compound constituted wherein at least one.This packaging adhesive material 114 can be the mixture of epoxy resin and absorbent 119.
Shown in figure 2c; With this glass cover-plate 111 to glass substrate 112 direction pressings;, and then this packaging adhesive material 114 solidified this cover plate 111 and these substrate 112 gluings by this packaging adhesive material 114 (for example frame glue), wherein this packaging adhesive material 114 is located on around this organic luminescent assembly 113; This barricade 118 is arranged at a side (the for example outside) of this packaging adhesive material 114; And this packaging adhesive material 114 and this barricade 118 are all between this cover plate 111 and this substrate 112, to seal this organic luminescent assembly 113, so to accomplish organic light-emitting diode packaging structure 110 of the present invention.
Compared to prior art, can know that absorbent palpus waits water oxygen to get in the organic light-emitting diode packaging structure after, absorb water oxygen again.The present invention is because this barricade is arranged at a side of this packaging adhesive material; And this absorbent is positioned at packaging adhesive material; Therefore can absorb water oxygen earlier at this barricade of the very first time and the absorbent of water oxygen during through packaging adhesive material; Block water oxygen gets in the organic light-emitting diode packaging structure effectively, avoids water oxygen to disturb and the deterioration organic luminescent assembly, and then significantly prolongs lifetime of LED.
Moreover this barricade can be in order to keeping the gap of this cover plate and this substrate, so organic light-emitting diode packaging structure must not be provided with gap (spacer) in addition between this cover plate and this substrate, so to reduce the processing procedure cost.
In addition, if the composition of this absorbent is the active oxidation aluminium powder, then the mixed volume ratio of this active oxidation aluminium powder and this packaging adhesive material is 1% ~ 10%.
| The mixed volume ratio of active oxidation aluminium powder | The sectional area ratio of packaging adhesive material and active oxidation aluminium powder | Alumina powder reduces diffusion of moisture area ratio |
| Do not have and add | 100%：0% | 0% |
| 10% | 74%：26% | 26% |
| 1% | 94%：6% | 6% |
It is bigger than that the active oxidation aluminium powder reduces diffusion area, and representative stops the aqueous vapor effect better.
Please refer to Fig. 3, it shows the organic light-emitting diode packaging structure 210 of the second embodiment of the present invention.The organic light-emitting diode packaging structure 210 of second embodiment is similar to the organic light-emitting diode packaging structure 110 of first embodiment substantially, and similarly assembly indicates similar label.The difference of second embodiment and first embodiment is that barricade 218 can only be arranged at the inboard of packaging adhesive material 214, and is not arranged at the outside of packaging adhesive material 214.
Please refer to Fig. 4, it shows the organic light-emitting diode packaging structure 310 of the third embodiment of the present invention.The organic light-emitting diode packaging structure 310 of the 3rd embodiment is similar to the organic light-emitting diode packaging structure 110 of first embodiment substantially, and similarly assembly indicates similar label.The difference of second embodiment and first embodiment is that barricade 318 and another barricade 320 can be arranged at the outside and the inboard of packaging adhesive material 314.
Please refer to Fig. 5, it shows the organic light-emitting diode packaging structure 410 of the fourth embodiment of the present invention.The organic light-emitting diode packaging structure 410 of the 4th embodiment is similar to the organic light-emitting diode packaging structure 110 of first embodiment substantially, and similarly assembly indicates similar label.The difference of the 4th embodiment and first embodiment is only barricade 418 to be set separately, and absorbent is not set.
With reference to figure 6, it shows the organic light-emitting diode packaging structure 510 of the fifth embodiment of the present invention.The organic light-emitting diode packaging structure 510 of the 5th embodiment is similar to the organic light-emitting diode packaging structure 110 of first embodiment substantially, and similarly assembly indicates similar label.The difference of the 5th embodiment and first embodiment is only absorbent 519 to be set separately, and barricade is not set.
In sum, be only notebook invention for presenting the execution mode or the embodiment of the technological means that adopted of dealing with problems, be not the scope that is used for limiting patent working of the present invention.Be that patent claim context all and of the present invention conforms to, or change and modification, be all claim of the present invention and contain according to the equalization that claim of the present invention is done.
Claims (14)
1. an organic light-emitting diode packaging structure is characterized in that, comprising:
One substrate;
One organic illuminating element, it is arranged on this substrate;
One packaging adhesive material, it is arranged on this substrate, and is located on around this organic illuminating element;
One barricade; It is located on around this organic illuminating element; And be arranged at a side of this packaging adhesive material, the material of this barricade be selected from group that calcium metal, magnesium metal, aluminum metal, carbon, zinc metal, chromium metal, tin metal, lead metal and copper metal constituted wherein at least one; And
One cover plate, it is arranged on this organic illuminating element, and by this packaging adhesive material with this cover plate and this substrate gluing, this packaging adhesive material and this metal barricade are all between this cover plate and this substrate, to seal this organic illuminating element.
2. organic light-emitting diode packaging structure according to claim 1 is characterized in that: this barricade is arranged at the inboard of this packaging adhesive material.
3. organic light-emitting diode packaging structure according to claim 1 is characterized in that: this barricade is arranged at the outside of this packaging adhesive material.
4. organic light-emitting diode packaging structure according to claim 2 is characterized in that: comprise that more another barricade is arranged at the outside of this packaging adhesive material.
5. organic light-emitting diode packaging structure according to claim 1 is characterized in that: this barricade is that aluminum metal is made, and its width is greater than the aluminum metal autoxidation degree of depth.
6. organic light-emitting diode packaging structure according to claim 5 is characterized in that: this barricade width is greater than 15 microns.
7. organic light-emitting diode packaging structure according to claim 1 is characterized in that: this wall height is greater than this organic illuminating element height.
8. organic light-emitting diode packaging structure according to claim 7 is characterized in that: this wall height is greater than 400 rice how.
9. organic light-emitting diode packaging structure according to claim 1 is characterized in that: be mixed with an absorbent in this packaging adhesive material.
10. organic light-emitting diode packaging structure according to claim 9 is characterized in that: the material of this absorbent be selected from calcium metal, magnesium metal, aluminum metal, carbon, zinc metal, chromium metal, tin metal, group that lead metal, metallic copper, calcium compound, magnesium compound, aluminium compound, carbon compound, zinc compound, chromium compound, tin compound, lead compound and copper compound constituted wherein at least one.
11. organic light-emitting diode packaging structure according to claim 10 is characterized in that: the composition of this absorbent is the active oxidation aluminium powder, and the mixed volume ratio of this active oxidation aluminium powder and this packaging adhesive material is 1% ~ 10%.
12. an organic light-emitting diode packaging structure is characterized in that, comprising:
One substrate;
One organic illuminating element, it is arranged on this substrate;
One packaging adhesive material, it is arranged on this substrate, and is located on around this organic illuminating element;
One absorbent; It is mixed in this packaging adhesive material, the material of this absorbent be selected from group that calcium metal, magnesium metal, aluminum metal, carbon, zinc metal, chromium metal, tin metal, lead metal, copper metal, calcium compound, magnesium compound, aluminium compound, carbon compound, zinc compound, chromium compound, tin compound, lead compound and copper compound constituted wherein at least one; And
One cover plate, it is arranged on this organic illuminating element, and with this cover plate and this substrate gluing, this packaging adhesive material is between this cover plate and this substrate, to seal this organic illuminating element by this by this packaging adhesive material.
13. the manufacturing approach of an organic light-emitting diode packaging structure is characterized in that, comprises the following steps:
Form an organic illuminating element on a substrate;
Form a barricade on this substrate; Wherein this barricade is located on around this organic light-emitting units, and the material of this barricade is selected from wherein one of group that calcium metal, magnesium metal, aluminum metal, carbon, zinc metal, chromium metal, tin metal, lead metal and copper metal constituted;
Form a packaging adhesive material on a cover plate; And
By this packaging adhesive material with this cover plate and this substrate gluing; And then with this packaging adhesive material curing; Wherein this packaging adhesive material is located on around this organic illuminating element, and this packaging adhesive material and this barricade are all between this cover plate and this substrate, to seal this organic illuminating element.
14. the manufacturing approach of organic light-emitting diode packaging structure according to claim 13; It is characterized in that: be mixed with an absorbent in this packaging adhesive material, the material of this absorbent be selected from group that calcium metal, magnesium metal, aluminum metal, carbon, zinc metal, chromium metal, tin metal, lead metal, copper metal, calcium compound, magnesium compound, aluminium compound, carbon compound, zinc compound, chromium compound, tin compound, lead compound and copper compound constituted wherein at least one.
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| CN104576707A (en) * | 2015-01-28 | 2015-04-29 | 京东方科技集团股份有限公司 | OLED (organic light-emitting diode) panel, method for manufacturing same and display device |
| CN104876175A (en) * | 2014-02-27 | 2015-09-02 | 立景光电股份有限公司 | Micro-electro-mechanical system packaging structure |
| CN104916789A (en) * | 2015-06-30 | 2015-09-16 | 京东方科技集团股份有限公司 | OLED encapsulation method and OLED device |
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| WO2015180393A1 (en) * | 2014-05-28 | 2015-12-03 | 京东方科技集团股份有限公司 | Organic light-emitting display device |
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| US10141537B2 (en) | 2015-01-23 | 2018-11-27 | Boe Technology Group Co., Ltd. | Display panel and manufacturing method therefor, and display apparatus |
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| CN106206959A (en) * | 2015-04-29 | 2016-12-07 | 上海和辉光电有限公司 | A kind of OLED packaging and preparation method |
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| CN106024841B (en) * | 2016-07-14 | 2019-04-05 | 华为技术有限公司 | Active matrix organic light-emitting diode display screen, its packaging method and terminal device |
| CN106848107A (en) * | 2017-04-27 | 2017-06-13 | 上海天马微电子有限公司 | A kind of organic electroluminescence display panel and organic light-emitting display device |
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| CN107546249A (en) * | 2017-08-01 | 2018-01-05 | 武汉华星光电半导体显示技术有限公司 | Flexible oled display panel |
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Application publication date: 20120509 |