CN102447019A - Sealing compound technology for light-emitting diode and housing structure manufactured by same - Google Patents
Sealing compound technology for light-emitting diode and housing structure manufactured by same Download PDFInfo
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- CN102447019A CN102447019A CN2010105088307A CN201010508830A CN102447019A CN 102447019 A CN102447019 A CN 102447019A CN 2010105088307 A CN2010105088307 A CN 2010105088307A CN 201010508830 A CN201010508830 A CN 201010508830A CN 102447019 A CN102447019 A CN 102447019A
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- adhesive layer
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- emitting diode
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Abstract
The invention provides a sealing compound technology for a light-emitting diode and a housing structure manufactured by the technology; the sealing compound technology comprises the following steps of: firstly setting a first sealing compound layer, then uniformly setting fluorescent powder on the surface of the first sealing compound layer, setting a second sealing compound layer on the fluorescent powder so as to completely cover the first sealing compound layer so that the fluorescent powder is set between the two sealing compound layers so as to ensure the setting positions of the two sealing compound layers, finally heating the members, carrying out punch forming on the members to form a whole body, and cutting the whole body into the needed housing structure.
Description
Technical field
The invention belongs to the manufacturing technology field of light-emitting diode, particularly utilize the two-period form sealing, make the technology and the structure of a case with mold forming to guarantee the position that is provided with of phosphor powder.
Background technology
Existing light emitting diode construction; As shown in Figure 1, mainly have a pedestal 60, this pedestal 60 includes support, is the positive/negative plate of certain interval and the leg of below relatively; On this positive/negative plate, be provided with a wafer; And pull on gold thread, and coat with epoxy resin sealing 70 again, be filled with a phosphor powder 80 and mix in this sealing 70.The light of launching when wafer is beaten at this phosphor powder of this sealing 70 after 80s, because of the different formulations of this phosphor powder 80 produces different color and lusters.
Sealing 70 envelopes that contain this phosphor powder 80 are located at the top of this pedestal 60, need treat its coagulation forming gradually, can form a complete light-emitting diode; And this sealing 70 solidify gradually during this period of time in; Weight that itself had based on this phosphor powder 80 and/or be the kinetic energy that this sealing 70 is produced when covering; Can cause this phosphor powder 80 to sink towards the below gradually one after another moves; And this phosphor powder 80 can't be evenly distributed in this sealing 70; Or even cause settlement shape more or less to distribute, and cause the luminous flux of light-emitting diode to reduce, shortcomings such as every light-emitting diode colour temperature inequality, color saturation difference with colour system, be the technological bottleneck of existing sealing.
As shown in Figure 2 again; The light-emitting diode that people's design surface adhesion-type is also arranged, yet, in this kind light emitting diode construction; The problem that also exists the phosphor powder 80 ' in the sealing 70 ' to distribute uniformly; Thereby shortcomings such as the luminous flux that makes light-emitting diode reduces, every light-emitting diode colour temperature inequality with colour system, color saturation difference all are bottlenecks that industrial circle faces, and have to be overcome.
Summary of the invention
Because the disappearance of aforementioned prior art, a purpose of the present invention is to provide a kind of light-emitting diode sealing adhesive process to reach the casing structure of being made with this technology, in order to keep the position that is provided with of phosphor powder.
For reaching above-mentioned purpose, the casing structure that the present invention provides a kind of light-emitting diode sealing adhesive process and makes with this technology.This light-emitting diode sealing adhesive process comprises the following steps: to be provided with one first adhesive layer; The surface of one phosphor powder in this first adhesive layer is set, and makes its even distribution; One second adhesive layer is set in this phosphor powder top, and this second adhesive layer covers this first adhesive layer fully, this phosphor powder is located between this first adhesive layer and this second adhesive layer; Heat and this first adhesive layer of punch forming, this phosphor powder and this second adhesive layer and become one, also can select this first adhesive layer of hot press and this second adhesive layer; And cut this first adhesive layer, this phosphor powder and this second adhesive layer that becomes one, to form the case of a light-emitting diode.
In this embodiment, this first adhesive layer and this second adhesive layer are silica gel or other equivalent adhesive layers.Wherein, in the step that this first adhesive layer is set, the silica gel of coating liquid state treats that this silica gel solidifies to form first adhesive layer of a diaphragm type in a model.Again; Be provided with in the step of this second adhesive layer above this phosphor powder; The silica gel of coating liquid state treats that this silica gel solidifies to form second adhesive layer of a diaphragm type, covers the surface that has this phosphor powder to this first adhesive layer with this second adhesive layer again in a model; Or be provided with in the step of this second adhesive layer above this phosphor powder, the liquid silica gel of coating has the surface of this phosphor powder at this first adhesive layer.In addition, heat and stamping forming step in, the lateral surface ring of this case suppress a catoptric arrangement, be provided with directing light projecting direction angle.
For reaching above-mentioned purpose, the casing structure that aforementioned light-emitting diode sealing adhesive process is made comprises: one first adhesive layer; One phosphor powder evenly is laid in a surface of this first adhesive layer; And one second adhesive layer, cover this first adhesive layer, this phosphor powder is folded between this first adhesive layer and this second adhesive layer.And this first adhesive layer and this second adhesive layer are silica gel or other equivalent adhesive layers.Moreover anchor ring has more a catoptric arrangement in second adhesive layer outside of this case, is provided with directing light projecting direction angle.
Compared to prior art; The mode that the present invention is provided with this first adhesive layer and this second adhesive layer segmentation; And guarantee that this phosphor powder is able to be evenly distributed between this two adhesive layer; Again this film punching press of two layers is formed case shape structure, be beneficial to take at any time to seal in the technology of light-emitting diode establish.Therefore, use the present invention and can keep the position of phosphor powder not receive the factor of moulding and float movingly partially, therefore make the luminous flux raising of light-emitting diode, every light-emitting diode colour temperature evenly reach color saturation boost with colour system.
Description of drawings
Fig. 1 is first kind of existing light emitting diode construction sketch map.
Fig. 2 is second kind of existing light emitting diode construction sketch map.
Fig. 3 is the block flow diagram of preferred embodiment of the present invention.
Fig. 4 a to Fig. 4 g is the process schematic representation of corresponding each step of preferred embodiment of the present invention.
Fig. 5 a to Fig. 5 e is the process schematic representation of corresponding aforementioned each step of another preferred embodiment of the present invention.
Description of reference numerals: 20-case; The 21-catoptric arrangement; 30-first adhesive layer; 31-second adhesive layer; The 40-phosphor powder; 50,51-mould; The 52-embossing; The 60-pedestal; 70,70 '-sealing; 80,80 '-phosphor powder; 100,200,300,400,500-step.
Embodiment
Understand content of the present invention for your auditor can be known, sincerely graphic with the description collocation, explain as after.
See also Fig. 3, be the process block diagram of preferred embodiment of the present invention.Shown in figure, light-emitting diode sealing adhesive process of the present invention comprises the following steps: step 100, and one first adhesive layer is set; Step 200 is provided with the surface of a phosphor powder at this first adhesive layer, and makes its even distribution; Step 300 is provided with one second adhesive layer above this phosphor powder, and this second adhesive layer covers this first adhesive layer fully, and this phosphor powder is folded between this first adhesive layer and this second adhesive layer; Step 400 is heated and this first adhesive layer of punch forming, this phosphor powder and this second adhesive layer and become one; And step 500, cut this first adhesive layer, this phosphor powder and this second adhesive layer that become one, to form the case of a light-emitting diode.
Please consult Fig. 4 a to Fig. 4 g more in the lump, be the process schematic representation of corresponding each step of preferred embodiment of the present invention.Shown in figure; Its corresponding above-mentioned first step 100 is when being provided with one first adhesive layer 30, shown in Fig. 4 a; This first adhesive layer 30 use as: the formed film of silica gel (Silicon); Its manufacture is coated on the silica gel of liquid state in one model, treat that this silica gel solidifies after, and form first adhesive layer 30 of a diaphragm type.It should be noted that this first adhesive layer 30 can obtain an even curface through repairing the program that flattens when carrying out the liquid-state silicon gel coating.
Then; Shown in Fig. 4 b,, the surface of a phosphor powder 40 at this first adhesive layer 30 is set to should second step 200; And make its even distribution; Shown in Fig. 5 b, belong to this technical field at the technology on this first adhesive layer 30 surfaces and equipment and have common knowledge the knowledgeable and can understand easily in order to this phosphor powder 40 evenly to be set, so repeat no more in this.
Afterwards; Shown in Fig. 4 c,, one second adhesive layer 31 is set above this phosphor powder 40 to should the 3rd step 300; And this second adhesive layer 31 covers this first adhesive layer 30 fully, and this phosphor powder 40 is folded between this first adhesive layer 30 and this second adhesive layer 31.It should be noted; Among this first embodiment; This second adhesive layer 31 is same use as: the formed film of silica gel (Silicon), its manufacture is coated on the silica gel of liquid state in one model, treat that this silica gel solidifies after; And form second adhesive layer 31 of a diaphragm type, and this formed second adhesive layer 31 is covered the surface that this first adhesive layer 30 has this phosphor powder 40 fully.Certainly, these second adhesive layer, 31 same programs of repairing through pressing are to obtain an even curface.Moreover; Shown in the arrow shown in Fig. 4 d; In this step, can heat earlier and pressing this first adhesive layer 30 and this second adhesive layer 31; Be integral and both are mutually combined, and fashionable at this second adhesive layer 31 and these first adhesive layer, 30 mutual sinters, and fixing evenly distribution this phosphor powder 40 therebetween the position is set.
Then; Shown in Fig. 4 e; To should the 4th step 400, heat and this first adhesive layer 30 of punch forming, this phosphor powder 40 and this second adhesive layer 31 and become one, aforementioned first adhesive layer 30 and second adhesive layer 31 that is folded with this phosphor powder 40; Be arranged on two molds 50, carry out punch forming between 51, as be configured as predetermined lens (lens) structure.
At last, shown in Fig. 4 f,, cut this first adhesive layer 30, this phosphor powder 40 and this second adhesive layer 31 that become one, with the case 20 that forms a light-emitting diode to should the 5th step 500.For example the cylindrical casing shown in Fig. 4 f 20 promptly comprises first adhesive layer (30) and second adhesive layer (31) that are folded with this phosphor powder (40).It should be noted, shown in Fig. 4 g, may be molded to difform case 20, the circular arc case 20 shown in Fig. 4 g when using 50,51 on difform mould; In other words; As change employed mould 50,51 shapes of institute's punch forming, or change the shape when cutting, and be able to process case 20 like conical, prominent particle shape or shape such as square; This is for having common knowledge the knowledgeable in the affiliated technical field according to the implementer according to this of the notion institute of present embodiment; So repeat no more at this, and not superfluous one by one in the drawings painting, so that the various cases 20 of establishing wafer in order to envelope in the light-emitting diode technology to be provided.
Please consulting Fig. 3 in the lump again and Fig. 5 a to 5f schemes, is the process schematic representation of corresponding aforementioned each step of another preferred embodiment of the present invention.Shown in figure, have identical or similar part and repeat no more in the present embodiment with among the last embodiment, and with the components identical symbolic representation and omit detailed explanation.Change the structure of this second adhesive layer in the present embodiment, thus slightly different on implementing procedure.
Identical with last embodiment, this first step 100 and is provided with one first adhesive layer 30 shown in Fig. 5 a.
This second step 200 is provided with a phosphor powder 40 equally on this first adhesive layer 30 shown in Fig. 5 b, make this phosphor powder 40 be evenly distributed on a surface of this first adhesive layer 30.
The 3rd step 300 is shown in this Fig. 5 c; This second adhesive layer 31 that is adopted in this step is liquid silica gel; Mode in order to even coating is arranged on the surface 40 that this first adhesive layer 30 has this phosphor powder, and this second adhesive layer complete packet is covered on this first adhesive layer 30; After treating that this second adhesive layer 31 solidifies, this phosphor powder 40 can be folded between this first adhesive layer 30 and this second adhesive layer 31 equally equably.It should be noted that after this second adhesive layer 31 solidified, the program that still must pass through the pressing finishing was to obtain an even curface.
The 4th step 400 with aforementioned this first adhesive layer 30 that is combined into one, this phosphor powder 40 and this second adhesive layer 31, put between two molds 50 and 51 shown in this Fig. 5 d, heats and punch forming.
At last, the 5th step 500 with this first adhesive layer 30 after this punch forming, this phosphor powder 40 and this second adhesive layer 31, and can cut the case 20 that forms a light-emitting diode with it equally shown in this Fig. 5 e.
It should be noted; This case 20 can form a catoptric arrangement 21 at the periphery of its lateral surface, for directing light projecting direction angle when punch forming; And its angle can be set to 30 degree, 60 degree or an angle of 90 degrees etc. according to actual needs, makes the light that projects become the angle of proper range.In addition, because these mould 50 inner faces have suitable embossing 52, when punch forming, form textured catoptric arrangement 21 on these second adhesive layer, 31 surfaces.
In sum; This case 20 utilizes these two adhesive layers, 30,31 folders to establish this phosphor powder 40; Keep the position of this phosphor powder 40 not receive the factor of moulding and float moving partially according to this; The luminous flux of light-emitting diode is improved, every light-emitting diode colour temperature with colour system evenly reaches color saturation boost, is case 20 structures of the present invention advantages in use.
More than shown in be merely the preferred embodiments of the present invention, only be illustrative for the purpose of the present invention, and nonrestrictive.Understand the common knowledge personnel of this professional skill field tool, in spirit that claim of the present invention limited and scope, can carry out many changes, revise it, even equivalent change, but all will fall in protection scope of the present invention.
Claims (9)
1. a light-emitting diode sealing adhesive process is characterized in that, comprises the following steps:
One first adhesive layer is set;
The surface of one phosphor powder at this first adhesive layer is set, and makes its even distribution;
One second adhesive layer is set above this phosphor powder, and this second adhesive layer covers this first adhesive layer fully, this phosphor powder is folded between this first adhesive layer and this second adhesive layer;
Heat and this first adhesive layer of punch forming, this phosphor powder and this second adhesive layer and become one; And
Cut this first adhesive layer, this phosphor powder and this second adhesive layer that become one, to form the case of a light-emitting diode.
2. light-emitting diode sealing adhesive process as claimed in claim 1 is characterized in that, this first adhesive layer and this second adhesive layer are silica gel.
3. light-emitting diode sealing adhesive process as claimed in claim 1 is characterized in that, in the step that this first adhesive layer is set, the silica gel of coating liquid state treats that this silica gel solidifies to form first adhesive layer of a diaphragm type in a model.
4. light-emitting diode sealing adhesive process as claimed in claim 1; It is characterized in that; Be provided with in the step of this second adhesive layer above this phosphor powder; The silica gel of coating liquid state treats that this silica gel solidifies to form second adhesive layer of a diaphragm type, covers the surface that has this phosphor powder to this first adhesive layer with this second adhesive layer again in a model.
5. light-emitting diode sealing adhesive process as claimed in claim 1 is characterized in that, is being provided with in the step of this second adhesive layer above this phosphor powder, and the liquid silica gel of coating has the surface of this phosphor powder at this first adhesive layer.
6. light-emitting diode sealing adhesive process as claimed in claim 1 is characterized in that, heat and stamping forming step in, the lateral surface ring of this case suppress a catoptric arrangement, be provided with directing light projecting direction angle.
7. the casing structure of a light-emitting diode is characterized in that, comprising:
One first adhesive layer;
One phosphor powder evenly is laid in a surface of this first adhesive layer; And
One second adhesive layer covers this first adhesive layer, and this phosphor powder is folded between this first adhesive layer and this second adhesive layer.
8. the casing structure of light-emitting diode as claimed in claim 7 is characterized in that, this first adhesive layer and this second adhesive layer are silica gel.
9. the casing structure of light-emitting diode as claimed in claim 7 is characterized in that, anchor ring has more a catoptric arrangement in second adhesive layer outside of this case, is provided with directing light projecting direction angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105088307A CN102447019A (en) | 2010-10-12 | 2010-10-12 | Sealing compound technology for light-emitting diode and housing structure manufactured by same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105088307A CN102447019A (en) | 2010-10-12 | 2010-10-12 | Sealing compound technology for light-emitting diode and housing structure manufactured by same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102447019A true CN102447019A (en) | 2012-05-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105088307A Pending CN102447019A (en) | 2010-10-12 | 2010-10-12 | Sealing compound technology for light-emitting diode and housing structure manufactured by same |
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| CN (1) | CN102447019A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040046502A1 (en) * | 2002-06-14 | 2004-03-11 | Tseng-Lu Chien | Environment proof treatment for electro-luminescent (EL) element(s) |
| CN102054922A (en) * | 2009-11-06 | 2011-05-11 | 馨意科技股份有限公司 | Light-emitting diode sealing encloser and manufacturing method thereof |
-
2010
- 2010-10-12 CN CN2010105088307A patent/CN102447019A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040046502A1 (en) * | 2002-06-14 | 2004-03-11 | Tseng-Lu Chien | Environment proof treatment for electro-luminescent (EL) element(s) |
| CN102054922A (en) * | 2009-11-06 | 2011-05-11 | 馨意科技股份有限公司 | Light-emitting diode sealing encloser and manufacturing method thereof |
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Application publication date: 20120509 |