CN102417956A - Copper strip annealing anti-sticking agent - Google Patents
Copper strip annealing anti-sticking agent Download PDFInfo
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- CN102417956A CN102417956A CN2011104198554A CN201110419855A CN102417956A CN 102417956 A CN102417956 A CN 102417956A CN 2011104198554 A CN2011104198554 A CN 2011104198554A CN 201110419855 A CN201110419855 A CN 201110419855A CN 102417956 A CN102417956 A CN 102417956A
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- copper strips
- annealing
- wilkinite
- release agent
- sticking agent
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Abstract
The invention discloses a copper strip annealing anti-sticking agent, and belongs to the technical field of metal surface spraying treatment. The anti-sticking agent contains the following components in percentage by weight: 1 to 3 percent of bentonite and the balance of water. The copper strip annealing anti-sticking agent is reasonable in compatibility; and the problem of annealing sticking in a copper strip bell-type furnace is well solved by adopting separate on-line spraying of the bentonite or composite on-line spraying of the bentonite and ceramic particles, adopting an aqueous system in an emulsified liquid lubricating rolling system and adopting a mineral oil system in a full oil lubricating rolling system. Through the copper strip annealing anti-sticking agent, the process flow is shortened, namely the original process flow of 'uncoiling, rolling, curling, uncoiling, degreasing, washing, spraying of the anti-sticking agent, curling and annealing' is shortened to the process flow of 'uncoiling, rolling, spraying of the anti-sticking agent, curling and annealing'; and compared with the conventional technology, the technology using the copper strip annealing anti-sticking agent has the advantages of reducing the production link and reducing the production cost by over 20 percent.
Description
Technical field
The invention belongs to metallic surface spray treatment technical field, be specifically related to copper strips annealing release agent.
Background technology
Copper and copper alloy band have a wide range of applications, and it is produced and adopts the mode of calendering to process.Because rolling processing causes flow of metal, metal inside produces bigger stress, thus the thermal treatment of will annealing in the course of processing, metal at a certain temperature (high temperature) recrystallize to eliminate stress.
Present copper processing industry, the copper strips heat treated mode of annealing mainly is divided into air cushion furnace annealing or bell jar furnace annealing.Air cushion furnace annealing is meant that copper strips is at rare gas element (N
2) or reducing gas (H
2) protection on-line continuous annealing down, uncoiling of copper strips, process annealing, a rolling.The bell jar furnace annealing is to go into the intensification under atmosphere protection of bell jar stove, constant temperature, cooling annealing to the copper strips package.
Air cushion furnace annealing is respond well, and because the annealing of copper strips single line, the high temperature bond phenomenon can not take place in copper strips, but the air cushion furnace cost is high, is that the less copper strips processing enterprise of general investment is difficult to bear; So some device fabrication merchants have developed some easy continuous annealing furnaces; The annealing device that has kept the air cushion furnace core; Equipment manufacturing cost significantly descends, but because equipment is simple, factors such as the size of body of heater, stopping property cause power consumption to rise; Although compare air cushion furnace decline has by a relatively large margin been arranged from cost, but still expensive.In some manufacturers that produces low and middle-grade relatively copper strips,, adopt the bell jar furnace annealing in order to practice thrift cost more; Because the bell jar furnace interior does not have continuous passage with the external world; Heat lost less, and every stove multireel copper strips of can annealing, production cost has had very big decline.
The mode of bell jar furnace annealing is exactly that copper strips becomes convolution code to go into intensification, constant temperature in the stove, lower the temperature, come out of the stove; Copper strips and copper strips under annealing temperature (260~600 ℃) bond; Especially the relatively low fine copper band (for example C10200) of fusing point bonds more serious; Uncoiling formed the copper strips distortion easily after such result caused annealing, and the template that has a strong impact on copper strips also is the microcosmic planeness of copper strips, causes the defective of product.In order to address this problem, traditional mode is to curl copper strips again to reduce the curling tension force of copper strips through coil opening machine before the annealing, just reduces the tightness between the copper strips.This method is more effective for the heavy copper strips of rouleau, but volume is very difficult to operation after heavily surpassing 3 tons, and the limit phenomenon produces physical deformation and influences template because last curled portion branch collapses.
In order to address this problem, some manufacturers adopt copper strips before curling, to smear the antiseized branch that is connected into, and mostly this antiseized composition is silicon-dioxide, and concrete operation is with SiO
2Be dispersed in water or the organic solvent (methyl alcohol, ethanol etc.), be sprayed onto the surface of copper strips, production technique is: uncoiling-rolling-curl; Uncoiling-degreasing again-washing-spraying release agent-curl-annealing.From the technology boiling range, in order to spray release agent, increased this procedure of degreasing, the boiling range of production is elongated, decrease in efficiency, covert increase cost.If in the operation of rolling, spray release agent, the back that takes place again to anneal is cleaned clean and is caused surface quality to descend.
Summary of the invention
Problem to the prior art existence; The objective of the invention is to design the technical scheme that a kind of copper strips annealing release agent is provided; This copper strips annealing release agent can prevent copper strips bell jar furnace annealing adhesion problem effectively, and has shortened the technology boiling range of copper strips bell jar furnace annealing.
Described copper strips annealing release agent is characterized in that containing the component of following weight per-cent:
Wilkinite 1~3%
Water surplus.
Described copper strips annealing release agent is characterized in that containing the component of following weight per-cent:
Wilkinite 1~3%
Ceramic particle 0.5~2%
Water surplus.
Described copper strips annealing release agent is characterized in that containing the component of following weight per-cent:
Wilkinite 1.5~2.5%
Ceramic particle 1~1.5%
Water surplus.
Described copper strips annealing release agent is characterized in that described ceramic particle is SiO
2, Al
2O
3, ZrO
2, TiO
2Mixture with one or more arbitrary proportions among the SiC.
Described copper strips annealing release agent is characterized in that containing the component of following weight per-cent:
Wilkinite 1~6%
Lower alcohol 0.3~1.5%
The MO surplus.
Described copper strips annealing release agent is characterized in that containing the component of following weight per-cent:
Wilkinite 1~6%
Lower alcohol 0.3~1.5%
Ceramic particle 0.5~2%
The MO surplus.
Described copper strips annealing release agent is characterized in that containing the component of following weight per-cent:
Wilkinite 2~4%
Lower alcohol 0.6~1%
Ceramic particle 1~1.5%
The MO surplus.
Described copper strips annealing release agent is characterized in that described lower alcohol is methyl alcohol, ethanol, Virahol, terepthaloyl moietie, Ucar 35 or USP Kosher.
Described copper strips annealing release agent is characterized in that described MO is boiling range less than 300 ℃ MO, kerosene or white oil.
Described copper strips annealing release agent is characterized in that described ceramic particle is SiO
2, Al
2O
3, ZrO
2, TiO
2Mixture with one or more arbitrary proportions among the SiC.
Ceramic particle particle diameter among the present invention is 0.1~2 μ m.
The copper strips annealing release agent that is made up of wilkinite and water among the present invention is suitable for adopting the rolling copper strips of emulsion lubrication, more than the thickness 0.5mm of copper strips; Copper strips annealing release agent by wilkinite, ceramic particle and water constitute is suitable for adopting the rolling copper strips of emulsion lubrication, below the thickness 0.5mm of copper strips; Copper strips annealing release agent by wilkinite, lower alcohol and MO constitute is suitable for adopting the rolling copper strips of full oil lubrication, more than the thickness 0.5mm of copper strips; Copper strips annealing release agent by wilkinite, lower alcohol, ceramic particle and MO constitute is suitable for adopting the rolling copper strips of full oil lubrication, below the thickness 0.5mm of copper strips.
Above-mentioned copper strips annealing release agent; Compatibility is reasonable; Adopt independent on-line spray of wilkinite or wilkinite composite ceramics particulate on-line spray; Adopt water-based system in the rolling system of emulsion lubrication respectively, the rolling system of full oil lubrication adopts the MO system, has well solved copper strips bell jar furnace annealing agglutinating problem.And the present invention has shortened the technology boiling range, with original " technology uncoiling-rolling-curl; Uncoiling-degreasing again-washing-spraying release agent-curl-annealing " shorten to " uncoiling-rolling-spraying release agent-curl-annealing ", compare with existing processes, utilize copper strips annealing release agent of the present invention to reduce production link, reduce production costs more than 20%.
Embodiment
Further specify the present invention below in conjunction with Figure of description.The per-cent that the present invention relates to all is weight percentage.
Embodiment 1
Copper strips: C10200,0.5mm is thick; Lubricating fluid: emulsion; Volume is heavy: 4 tons
Experimental technique: blooming mill on-line spray
Evaluation symbol: ◎-nothing bonding zero-slight bonding ▲-bonding
Table 1
Table 1 shows: the copper strips annealing release agent that adopts embodiment 1 is that the copper strips of 0.5mm, emulsion lubrication is handled to thickness, and copper strip surface does not have bonding, and the copper strip surface state is good.
Copper strips annealing release agent prescription adopts wilkinite 2% and water 98% among the embodiment 1, wilkinite 1.5% and water 98.5%, and wilkinite 2.5% and water 97.5%, or wilkinite 3% and water 97% also can reach the technique effect identical with embodiment 1.
If bentonitic content surpasses 3% back viscosity increase among the embodiment 1 sprinkling there is certain influence; In addition, water cut increases, and causes the water cut increase of copper strip surface that annealing is caused adverse influence; If bentonitic content is lower than 1%, the anti-stick effect is not good enough, does not reach the technique effect of embodiment 1.
Embodiment 2
Copper strips: C10200,0.16mm is thick; Lubricating fluid: emulsion; Volume is heavy: 4 tons
Experimental technique: finishing mill on-line spray
Evaluation symbol: ◎-nothing bonding zero-slight bonding ▲-bonding
Table 2
Table 2 shows: the copper strips annealing release agent that adopts embodiment 2 is that the copper strips of 0.16mm, emulsion lubrication is handled to thickness, and copper strip surface does not have bonding, and the copper strip surface state is good.
Copper strips annealing release agent prescription adopts wilkinite 1.5%, SiO among the embodiment 2
20.5% with water 98%, wilkinite 2%, SiO
20.8% with water 97.2%, wilkinite 2.5%, SiO
21% with water 96.5%, wilkinite 3%, SiO
21.5% with water 95.5%, or wilkinite 3%, SiO
22% with water 95%, and SiO in the above-mentioned prescription
2Use SiO instead
2, Al
2O
3, ZrO
2, TiO
2With the mixture of one or more arbitrary proportions among the SiC, the particle diameter of ceramic particle adopts 0.1 μ m, 0.5 μ m, 0.8 μ m, 1 μ m, 1.5 μ m or 2 μ m, also can reach the technique effect identical with embodiment 2.
For thin copper strips, the thick band of warp tension ratio that curls is bigger among the embodiment 2, and the anti-stick poor effect that wilkinite uses is separately added heat-stable ceramic particle and can effectively be improved the anti-stick effect.The particle diameter of ceramic particle is less than 0.1 μ m, and the addition of ceramic particle need add the great talent and produce effect, and increases cost, and particle diameter can produce scuffing greater than 2 μ m for thin copper strips.
Embodiment 3
Copper strips: C10200,0.5mm is thick; Lubricating fluid: full oil; Volume is heavy: 4 tons
Experimental technique: blooming mill on-line spray
Evaluation symbol: ◎-nothing bonding zero-slight bonding ▲-bonding
Table 3
Table 3 shows: the copper strips annealing release agent that adopts embodiment 3 is that the copper strips of 0.5mm, full oil lubrication is handled to thickness, and copper strip surface does not have bonding, and the copper strip surface state is good.
Copper strips annealing release agent prescription adopts wilkinite 1%, ethanol 0.4% and kerosene 98.6% among the embodiment 3; Wilkinite 1.5%, Virahol 0.5% and boiling range are less than 300 ℃ MO 98%; Wilkinite 2%, terepthaloyl moietie 1% and boiling range are less than 300 ℃ MO 97%; Wilkinite 3%, Ucar 35 1.2% and white oil 95.8%, wilkinite 4%, USP Kosher 1.5% and kerosene 94.5%, wilkinite 5%, methyl alcohol 1.5% and kerosene 93.5%; Or wilkinite 5%, terepthaloyl moietie 1% and kerosene 94%, also can reach the technique effect identical with embodiment 3.
If bentonite content is lower than 1% among the embodiment 3, the anti-stick poor effect; Bentonite content surpasses 6%, and it is unfavorable to spraying that viscosity increases.
Embodiment 4
Copper strips: C10200,0.12mm is thick; Lubricating fluid: full oil; Volume is heavy: 4 tons
Experimental technique: finishing mill on-line spray
Evaluation symbol: ◎-nothing bonding zero-slight bonding ▲-bonding
Table 4
Table 4 shows: the copper strips annealing release agent that adopts embodiment 4 is that the copper strips of 0.12mm, full oil lubrication is handled to thickness, and copper strip surface does not have bonding, and the copper strip surface state is good.
Copper strips annealing release agent prescription adopts wilkinite 1%, SiC0.5%, ethanol 0.4% and kerosene 98.1% among the embodiment 4; Wilkinite 1.5%, SiC0.8%, Virahol 0.5% and boiling range are less than 300 ℃ MO 97.2%; Wilkinite 2%, SiC0.6%, terepthaloyl moietie 1% and boiling range are less than 300 ℃ MO 96.4%; Wilkinite 3%, SiC1%, Ucar 35 1.2% and white oil 95%, wilkinite 4%, SiC1.2%, USP Kosher 1.5% and kerosene 93.3%, wilkinite 5%, SiC1.5%, methyl alcohol 1.5% and kerosene 92%; Or wilkinite 5%, SiC1.5%, terepthaloyl moietie 1% and kerosene 92.5%, and SiO in the above-mentioned prescription
2Use SiO instead
2, Al
2O
3, ZrO
2, TiO
2With the mixture of one or more arbitrary proportions among the SiC, the particle diameter of ceramic particle adopts 0.1 μ m, 0.5 μ m, 0.8 μ m, 1 μ m, 1.5 μ m or 2 μ m, also can reach the technique effect identical with embodiment 4.
Prove that through the above embodiments breaking down (more than the thickness 0.5mm) can solve the agglutinating problem with wilkinite separately, but finish rolling (thickness 0.5mm below) must the composite ceramics particulate just can reach the effect of anti-stick.
Claims (10)
1. copper strips annealing release agent is characterized in that containing the component of following weight per-cent:
Wilkinite 1~3%
Water surplus.
2. copper strips as claimed in claim 1 annealing release agent is characterized in that containing the component of following weight per-cent:
Wilkinite 1~3%
Ceramic particle 0.5~2%
Water surplus.
3. copper strips as claimed in claim 2 annealing release agent is characterized in that containing the component of following weight per-cent:
Wilkinite 1.5~2.5%
Ceramic particle 1~1.5%
Water surplus.
4. like claim 2 or 3 described copper strips annealing release agents, it is characterized in that described ceramic particle is SiO
2, Al
2O
3, ZrO
2, TiO
2Mixture with one or more arbitrary proportions among the SiC.
5. copper strips annealing release agent is characterized in that containing the component of following weight per-cent:
Wilkinite 1~6%
Lower alcohol 0.3~1.5%
The MO surplus.
6. copper strips as claimed in claim 5 annealing release agent is characterized in that containing the component of following weight per-cent:
Wilkinite 1~6%
Lower alcohol 0.3~1.5%
Ceramic particle 0.5~2%
The MO surplus.
7. copper strips as claimed in claim 5 annealing release agent is characterized in that containing the component of following weight per-cent:
Wilkinite 2~4%
Lower alcohol 0.6~1%
Ceramic particle 1~1.5%
The MO surplus.
8. like claim 5,6 or 7 described copper strips annealing release agents, it is characterized in that described lower alcohol is methyl alcohol, ethanol, Virahol, terepthaloyl moietie, Ucar 35 or USP Kosher.
9. like claim 5,6 or 7 described copper strips annealing release agents, it is characterized in that described MO is boiling range less than 300 ℃ MO, kerosene or white oil.
10. like claim 6 or 7 described copper strips annealing release agents, it is characterized in that described ceramic particle is SiO
2, Al
2O
3, ZrO
2, TiO
2Mixture with one or more arbitrary proportions among the SiC.
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CN2011104198554A CN102417956A (en) | 2011-12-15 | 2011-12-15 | Copper strip annealing anti-sticking agent |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102560044A (en) * | 2012-02-20 | 2012-07-11 | 徐高磊 | Copper strip surface treatment method and device |
CN103320588A (en) * | 2013-06-03 | 2013-09-25 | 苏州白云信息科技有限公司 | High temperature resistant antitack agent and processing method before metal tape annealing |
CN103387758A (en) * | 2012-05-07 | 2013-11-13 | 胡艳 | High temperature resistant anti-sticking agent |
CN104388649A (en) * | 2014-12-01 | 2015-03-04 | 绍兴市力博电气有限公司 | Anti-adhesive agent for metal surface treatment |
CN105088258A (en) * | 2015-09-16 | 2015-11-25 | 富威科技(吴江)有限公司 | Soft copper foil cleaning production line |
CN113564503A (en) * | 2021-08-01 | 2021-10-29 | 江阴艾力特机械制造有限公司 | Annealing and non-sticking process for ultrathin copper strip |
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CN1053568A (en) * | 1990-01-24 | 1991-08-07 | 浙江大学 | The anti-stick sand coating of zirconium matter whey base cast steel |
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CN1155523A (en) * | 1996-01-22 | 1997-07-30 | 中国兵器工业第五研究所 | Anti-sticking materials for optical glass secondary press heating and production thereof |
CN101658899A (en) * | 2009-09-17 | 2010-03-03 | 上海交通大学 | Magnesium-alloy metal-type casting coating and preparation method thereof |
CN101886017A (en) * | 2010-07-06 | 2010-11-17 | 中国海洋石油总公司 | Bentonite grease |
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2011
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Patent Citations (5)
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CN1053568A (en) * | 1990-01-24 | 1991-08-07 | 浙江大学 | The anti-stick sand coating of zirconium matter whey base cast steel |
CN1124750A (en) * | 1994-02-09 | 1996-06-19 | 曲中辉 | Non-toxic compounded insulation paint |
CN1155523A (en) * | 1996-01-22 | 1997-07-30 | 中国兵器工业第五研究所 | Anti-sticking materials for optical glass secondary press heating and production thereof |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102560044A (en) * | 2012-02-20 | 2012-07-11 | 徐高磊 | Copper strip surface treatment method and device |
CN103387758A (en) * | 2012-05-07 | 2013-11-13 | 胡艳 | High temperature resistant anti-sticking agent |
CN103320588A (en) * | 2013-06-03 | 2013-09-25 | 苏州白云信息科技有限公司 | High temperature resistant antitack agent and processing method before metal tape annealing |
CN104388649A (en) * | 2014-12-01 | 2015-03-04 | 绍兴市力博电气有限公司 | Anti-adhesive agent for metal surface treatment |
CN105088258A (en) * | 2015-09-16 | 2015-11-25 | 富威科技(吴江)有限公司 | Soft copper foil cleaning production line |
CN113564503A (en) * | 2021-08-01 | 2021-10-29 | 江阴艾力特机械制造有限公司 | Annealing and non-sticking process for ultrathin copper strip |
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Application publication date: 20120418 |