CN102403299A - Circuit board structure and fabricating method for same - Google Patents
Circuit board structure and fabricating method for same Download PDFInfo
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- CN102403299A CN102403299A CN2010102816938A CN201010281693A CN102403299A CN 102403299 A CN102403299 A CN 102403299A CN 2010102816938 A CN2010102816938 A CN 2010102816938A CN 201010281693 A CN201010281693 A CN 201010281693A CN 102403299 A CN102403299 A CN 102403299A
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- weldering
- protuberance
- solder mask
- thumb
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Abstract
The invention discloses a circuit board structure and a fabricating method for the same. The circuit board structure comprises a layered body with at least one surface, protrusions and a solder mask layer, a circuit layer with a plurality of solder finger pads is arranged on each surface, the solder mask layer is arranged on the layered body, the circuit layers, the solder finger pads and the protrusions and provided with a plurality of openings enabling the solder finger pads to be exposed out of the openings correspondingly, and the protrusions extending out of the solder finger pads are formed between each two optional adjacent solder finger pads so that the exposed surfaces of the solder mask layer corresponding to the protrusions are level to other exposed surfaces.
Description
Technical field
Relevant a kind of semiconductor device of the present invention and method for making thereof refer to a kind of board structure of circuit and method for making thereof especially.
Background technology
Flourish along with electronic industry, electronic product multi-functional, the high performance trend of also marching toward gradually.And in order to satisfy the package requirements of the high degree of integration of semiconductor package part (integration) and microminiaturized (miniaturization); Much more more for master, passive device and circuit carry and connect; Conductor package substrate also develops into multilayer circuit board (multi-layerboard) by double-layer circuit board gradually; Thereby use interlayer interconnection technique (interlayer connection) to enlarge the configuration area that can supply utilize on the conductor package substrate down in limited space; And cooperate the integrated circuit (integrated circuit) of elevated track density to need, and it is compact and improve the purpose of electrical functionality to reach packaging part.
United States Patent (USP) discloses the semiconductor subassembly that piles up a plurality of wafers on a kind of base plate for packaging No. 2008/0303131 and No. 2009/0068790, and respectively this wafer is through electrically connecting like the conducting element of conducting resinl and the weldering thumb pad on the base plate for packaging.On the other hand; Because for to make the outermost layer of base plate for packaging can make full use of wiring space; Around outermost weldering thumb pad, still be laid with circuit; So must be covered in simultaneously with the solder mask (solder mask layer) like green lacquer on the part surface of this circuit and weldering thumb pad, and in this solder mask, be formed with the solder mask perforate of exposed parts weldering thumb pad, not influenced and oxidation by the air of external environment and aqueous vapor in order to protect the outermost line layer and to weld the thumb pad part surface through this solder mask.Yet, shown in Figure 1A and 1B, when base plate for packaging surface produces depression 120, when for example between the adjacent lines or the surface of the solder mask between the adjacent weldering thumb pad produces depression, make conducting resinl flow to recess easily, and cause because of the bridge joint short circuit.
See also the cross-sectional schematic of base plate for packaging vertical view shown in Figure 1A and the 1B and covering solder mask thereof; At least one surface of this base plate for packaging 10 is provided with line layer 11; And this line layer 11 has a plurality of weldering thumb pads 110; In addition, respectively this weldering thumb pad 110 has distinctly extended circuit 112, and establishes circuit 112a between at least one pair of adjacent two weldering thumb pad 110a, 110b; Shown in Figure 1B, on this base plate for packaging 10 and line layer 11, be coated with solder mask 12.
But, the above-mentioned base plate for packaging that is coated with solder mask 12 10, these base plate for packaging 10 lip-deep respectively spacings between this circuit 112 vary (like line segment D
1And D
2), after this solder mask 12 is covered on this base plate for packaging 10, and this solder mask 12 is after being heating and curing, this solder mask 12 internal solvent volatilization, surface (the line segment D that causes this solder mask 12 to expose
1) produce and cave in 120; Especially the big more situation of spacing between this circuit 112; The depression 120 that is produced after these solder mask 12 its surface compressed is obvious more; Thereby the surface irregularity that exposes of this solder mask 12, and be unfavorable for follow-uply encapsulating or make easily conducting resinl to flow to recess, and cause because of the bridge joint short circuit.
Reflect this, United States Patent (USP) the 6th, 692, No. 988 exposure are a kind of to slow down the base plate for packaging that the solder mask surface produces depression.
See also Fig. 2 A and 2B, for the base plate for packaging vertical view of No. the 6th, 692,988, above-mentioned United States Patent (USP) case and cover the cross-sectional schematic of solder mask.Shown in Fig. 2 A; Be to be provided with line layer 11 at least one surface of a base plate for packaging 10; And this line layer 11 has a plurality of weldering thumb pads 110; In addition, respectively 110 of this weldering thumb pads have not extended circuit 112, and between two adjacent circuit 112a, 112b, are provided with at least one line simulator road (dummy traces) 112c.Shown in Fig. 2 B, on this base plate for packaging 10 and line layer 11, be coated with solder mask 12; Thereby can keep preferable planarization with the exposed surface that makes this solder mask 12 through solder mask 12 bed hedgehoppings of these line simulator roads 112c with corresponding covering.
But; Under the requirement of high-density wiring, though between these circuits 112 can through this line simulator road 112c will this corresponding covering solder mask 12 bed hedgehoppings, the spacings between these weldering thumb pads 110 are dwindled; But can't make this line simulator road 112c pass between the two adjacent weldering thumb pads 110; Cause the solder mask 12 between these weldering thumb pads 110 to be easy to generate depression, the spacing of adding between these adjacent weldering thumb pads 110 is too small, thereby makes conducting resinl 113 flow to recess easily; Shown in Fig. 2 C, and cause situation because of the bridge joint short circuit.
Therefore, how a kind of board structure of circuit and method for making thereof being provided, can avoiding outside electric connection structure to produce the situation of short circuit because of bridge joint, and can be applied to the product of thin space, is an important topic in fact.
Summary of the invention
In view of the disadvantages of above-mentioned prior art, the present invention provides a kind of board structure of circuit, comprising: the stratiform body; Line layer is formed at this stratiform body surface, and this line layer has a plurality of weldering thumb pads and connect the conductive trace of this weldering thumb pad, wherein, wantonly two adjacent weldering thumb pads one of them is extended with protuberance to adjacent weldering thumb pad at least; And solder mask, be formed on this stratiform body, conductive trace, weldering thumb pad and the protuberance, and this solder mask has a plurality of openings, to expose the respectively part surface of this weldering thumb pad.
The present invention further provides a kind of method for making of board structure of circuit, comprising: a stratiform body is provided; Form line layer through the patterning manufacturing approach at this stratiform body surface, this line layer has a plurality of weldering thumb pads and connects the conductive trace of this weldering thumb pad, wherein, any two adjacent weldering thumb pads one of them is extended with protuberance to adjacent weldering thumb pad at least; And on this stratiform body, conductive trace, weldering thumb pad and protuberance, cover solder mask, and make a plurality of openings of formation in this solder mask, to expose the respectively part surface of this weldering thumb pad.
According to above-mentioned board structure of circuit and method for making thereof, this stratiform body can be the wiring board with internal layer circuit.
In addition, in one embodiment, this two adjacent weldering thumb pad all is extended with protuberance, and this protuberance is staggered corresponding.These protuberances are for staggered corresponding.In addition, board structure of circuit of the present invention and method for making thereof be the restricting projection external form not, but this protuberance can be rectangle, triangle, semicircle or oval usually.
By on can know; Board structure of circuit of the present invention and method for making thereof are to make at least one weldering thumb pad be extended with protuberance on the stratiform body surface between the in office two adjacent weldering thumb pads, thereby make the solder mask surface of follow-up formation keep smooth; Because of producing, the solder mask surface caves in after avoiding conducting element to be formed at the weldering thumb pad; Cause the conducting element bridge joint and the situation of short circuit can guarantee that more layer reinforced structure quality optionally is good, and then can be applied to the product of thin space.
Description of drawings
Figure 1A to 1B is the cross-sectional schematic of existing base plate for packaging vertical view and covering solder mask thereof, and wherein, Figure 1B is the cutaway view of the 1B-1B hatching of Figure 1A;
Fig. 2 A to 2B is a United States Patent (USP) the 6th, 692, the vertical view of No. 988 base plate for packaging and cross-sectional schematic thereof, and wherein, Fig. 2 B is that the 2B-2B hatching of Fig. 2 A is at line segment D
3Cutaway view;
The cutaway view of the 2C-2C hatching generation conducting resinl bridge joint of Fig. 2 C displayed map 2A; And
Fig. 3 A to 4B is the sketch map of board structure of circuit of the present invention and method for making thereof, and wherein, Fig. 3 A is the cutaway view of Fig. 3 B-1 at the 3A-3A hatching; Fig. 3 B-1 to 3B-4 is the embodiment vertical view of different protuberance external forms; And Fig. 4 B is the vertical view of Fig. 4 A.
The main element symbol description
10 base plate for packaging
11 line layers
110,110a, 110b weld thumb pad
112,112a, 122b circuit
112c line simulator road
113 conducting resinls
12 solder masks
120 depressions
20 stratiform bodies
The 20a surface
21 line layers
210 weldering thumb pads
211a, 211b, 211c, 211d protuberance
212 conductive traces
22 solder masks
220 openings
Embodiment
Below through particular specific embodiment execution mode of the present invention is described, those skilled in the art can understand other advantages of the present invention and effect easily by the content that this specification disclosed.
Notice; The appended graphic structure that illustrates of this specification, ratio, size etc.;,, be not all in order to limit the enforceable qualifications of the present invention for those skilled in the art's understanding and reading only in order to cooperate the content that specification disclosed; Event is the technical essential meaning of tool not; The adjustment of the modification of any structure, the change of proportionate relationship or size not influencing under effect that the present invention can produce and the purpose that can reach, all should still drop on disclosed technology contents and get in the scope that can contain.
See also Fig. 3 A to 4B, be the method for making of a kind of board structure of circuit that the present invention disclosed.
Shown in Fig. 3 A and 3B-1, at first, a stratiform body 20 is provided, this stratiform body 20 can be the wiring board with internal layer circuit, and this wiring board can be base plate for packaging.Form line layer 21 through the patterning manufacturing approach at this stratiform body 20 surperficial 20a, this line layer 21 has a plurality of weldering thumb pads 210 and connects the conductive trace 212 of this weldering thumb pad 210, and this conductive trace 212 can electrically connect with the internal layer circuit of stratiform body 20.In addition, shown in Fig. 3 B-1, wantonly two adjacent weldering thumb pads 210 one of them is extended with protuberance 211a to adjacent weldering thumb pad 210 at least.Perhaps, this two adjacent weldering thumb pad 210 all is extended with protuberance 211b, 211c and 211d shown in Fig. 3 B-2 to 3B-4, and this protuberance 211b, 211c and 211d are staggered corresponding.In addition, this protuberance can be any external form, and for example wherein, this protuberance 211a (or 211b) is a rectangle, shown in Fig. 3 B-1 and 3B-2; Or this protuberance 211c is triangle, shown in Fig. 3 B-3; Or this protuberance 211d is semicircle or oval, shown in Fig. 3 B-4.
Shown in Fig. 4 A and 4B; Go up covering solder mask 22 at this stratiform body 20, conductive trace 212, weldering thumb pad 210 and protuberance 211a (211b, 211c or 211d); And make and form a plurality of openings 220 in this solder mask 22; The part surface correspondence of this weldering thumb pad 210 exposes to respectively this opening 220 to expose respectively, and these protuberances 211a (211b, 211c or 211d) is between two adjacent weldering thumb pads 210, thereby makes this protuberance 211a (211b, 211c or 211d) with these solder mask 22 bed hedgehoppings; Exposed surface and other exposed surface to make this solder mask 22 corresponding these protuberances 211a (211b, 211c or 211d) keep smooth; Thereby the exposed surface of avoiding this solder mask 22 produces depression, and causes in the follow-up manufacturing approach situation because of the short circuit of conducting resinl bridge joint, and then can be applied to the product of thin space.
The present invention further provides a kind of board structure of circuit, comprising: stratiform body 20; Line layer 21; Be formed at this stratiform body 20 surperficial 20a; And this line layer 21 has a plurality of weldering thumb pads 210 and connects the conductive trace 212 of this weldering thumb pad 210; Wherein, wantonly two adjacent weldering thumb pads 210 one of them is extended with protuberance 211a (211b, 211c or 211d) to adjacent weldering thumb pad 210 at least; And solder mask 22, be formed on this stratiform body 20, conductive trace 212, weldering thumb pad 210 and the protuberance 211a (211b, 211c or 211d), and this solder mask 22 has a plurality of openings 220, to expose the respectively part surface of this weldering thumb pad 210.
According to above-mentioned board structure of circuit, this stratiform body 20 can be the wiring board with internal layer circuit, and this wiring board can be base plate for packaging.In addition, the conductive trace of this line layer can electrically connect with the internal layer circuit of stratiform body.
In one embodiment, this two adjacent weldering thumb pad 210 all is extended with protuberance 211b, 211c or 211d, and this protuberance 211b, 211c or 211d are for staggered corresponding, shown in Fig. 3 B-2 to 3B-4.In addition, this protuberance can be rectangle, triangle, semicircle or oval, but not as limit.
Board structure of circuit of the present invention and method for making thereof; Be that line layer at least one surface of this stratiform body is formed with a plurality of weldering thumb pads, and wantonly two adjacent weldering thumb pads one of them is extended with protuberance to adjacent weldering thumb pad at least, and on this stratiform body, conductive trace, weldering thumb pad and protuberance, cover a solder mask; And a plurality of openings of formation in this solder mask; With order respectively this weldering thumb pad correspondence expose to respectively this opening, thereby make these protuberances between wantonly two adjacent weldering thumb pads, make the exposed surface and the maintenance of other exposed surface of these these protuberances of solder mask correspondence smooth; Because of producing, the solder mask surface caves in after avoiding conducting element to be formed at the weldering thumb pad; Cause the conducting element bridge joint and the situation of short circuit can guarantee that more layer reinforced structure quality optionally is good, and then can be applied to the product of thin space.
The foregoing description is in order to illustrative principle of the present invention and effect thereof, but not is used to limit the present invention.Any those skilled in the art all can make amendment to the foregoing description under spirit of the present invention and category.So rights protection scope of the present invention, should be listed like claims of this patent.
Claims (8)
1. board structure of circuit comprises:
The stratiform body;
Line layer is formed at this stratiform body surface, and this line layer has a plurality of weldering thumb pads and connect the conductive trace of this weldering thumb pad, wherein, wantonly two adjacent weldering thumb pads one of them is extended with protuberance to adjacent weldering thumb pad at least; And
Solder mask is formed on this stratiform body, conductive trace, weldering thumb pad and the protuberance, and this solder mask has a plurality of openings, to expose the respectively part surface of this weldering thumb pad.
2. board structure of circuit according to claim 1, wherein, this stratiform body is the wiring board with internal layer circuit.
3. board structure of circuit according to claim 1, wherein, this two adjacent weldering thumb pad all is extended with protuberance, and this protuberance is staggered corresponding.
4. board structure of circuit according to claim 1, wherein, this protuberance is rectangle, triangle, semicircle or oval.
5. the method for making of a board structure of circuit comprises:
One stratiform body is provided;
Form line layer through the patterning manufacturing approach in this stratiform body surface, this line layer has a plurality of weldering thumb pads and connects the conductive trace of this weldering thumb pad, wherein, wantonly two adjacent weldering thumb pads one of them is extended with protuberance to adjacent weldering thumb pad at least; And
On this stratiform body, conductive trace, weldering thumb pad and protuberance, cover solder mask, and make a plurality of openings of formation in this solder mask, to expose the respectively part surface of this weldering thumb pad.
6. the method for making of board structure of circuit according to claim 5, wherein, this stratiform body is the wiring board with internal layer circuit.
7. the method for making of board structure of circuit according to claim 5, wherein, this two adjacent weldering thumb pad all is extended with protuberance, and this protuberance is staggered corresponding.
8. the method for making of board structure of circuit according to claim 5, wherein, this protuberance is rectangle, triangle, semicircle or oval.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102816938A CN102403299A (en) | 2010-09-13 | 2010-09-13 | Circuit board structure and fabricating method for same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102816938A CN102403299A (en) | 2010-09-13 | 2010-09-13 | Circuit board structure and fabricating method for same |
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| Publication Number | Publication Date |
|---|---|
| CN102403299A true CN102403299A (en) | 2012-04-04 |
Family
ID=45885354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102816938A Pending CN102403299A (en) | 2010-09-13 | 2010-09-13 | Circuit board structure and fabricating method for same |
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| Country | Link |
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| CN (1) | CN102403299A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6692988B2 (en) * | 2001-08-27 | 2004-02-17 | Siliconware Precision Industries Co., Ltd. | Method of fabricating a substrate-based semiconductor package without mold flash |
| CN1708207A (en) * | 2004-06-04 | 2005-12-14 | 英业达股份有限公司 | Method for preventing interwelding pad of circuit board from generating |
| CN101609817A (en) * | 2008-06-19 | 2009-12-23 | 矽品精密工业股份有限公司 | Semiconductor encapsulation device, semiconductor package and method for making thereof |
-
2010
- 2010-09-13 CN CN2010102816938A patent/CN102403299A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6692988B2 (en) * | 2001-08-27 | 2004-02-17 | Siliconware Precision Industries Co., Ltd. | Method of fabricating a substrate-based semiconductor package without mold flash |
| CN1708207A (en) * | 2004-06-04 | 2005-12-14 | 英业达股份有限公司 | Method for preventing interwelding pad of circuit board from generating |
| CN101609817A (en) * | 2008-06-19 | 2009-12-23 | 矽品精密工业股份有限公司 | Semiconductor encapsulation device, semiconductor package and method for making thereof |
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Application publication date: 20120404 |