CN102399415B - Prepreg composition, film and substrate prepared by using prepreg composition - Google Patents
Prepreg composition, film and substrate prepared by using prepreg composition Download PDFInfo
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- CN102399415B CN102399415B CN201010284456.7A CN201010284456A CN102399415B CN 102399415 B CN102399415 B CN 102399415B CN 201010284456 A CN201010284456 A CN 201010284456A CN 102399415 B CN102399415 B CN 102399415B
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- RLMIZQMEMKVYIZ-UHFFFAOYSA-N Nc1nc(N)nc(NOP(O)(O)=O)n1 Chemical compound Nc1nc(N)nc(NOP(O)(O)=O)n1 RLMIZQMEMKVYIZ-UHFFFAOYSA-N 0.000 description 1
Abstract
The invention discloses a prepreg composition. The prepreg composition comprises the following components: (A) epoxy resin, (B) hardening agent, (C) accelerant, (D) phosphorus-containing flame retardant and (E) filler, wherein the (A) epoxy resin comprises (A-1) phosphorus-containing epoxy resin, phosphorus and silicon-containing epoxy resin or mixed epoxy resin of the both, (A-2) dicyclopentadiene type epoxy resin and (A-3) epoxy resin with oxazolidone ring. The invention also relates to a film and a substrate prepared by using the prepreg composition.
Description
Technical field
The present invention relates to a kind of prepreg composition, espespecially a kind of in order to make the prepreg composition with equilibrium response.
Background technology
By impregnation film, (prepreg, PP), or utilizes the abundant pressing of hot pressing program containing plural films such as Copper Foil film (copper clad laminate, Copper clad laminate, CCL) or Copper Foils to printed circuit board (PCB); And this impregnation film is that glasscloth be impregnated in an epoxy resin adhesive liquid, and the subsequent technique such as is dried and forms a kind of slim film.Along with the execution of environmental protection act (as RoHS, WEEE), lead-free solder technique replaces the technique that has lead solder, and will assemble temperature, has improved 30 to 40 degree, and its thermotolerance to substrate requires significantly to promote.
Due to the new line of environmental consciousness in recent years, many consumer electronics product are not used the copper clad laminate that contains halogen gradually, and use halogen-free copper foil base plate instead.Halogen-free copper foil base plate is added with phosphorus containing components to compensate fire-retardant effect more, traditionally, the interpolation of phosphorated material can be applied phosphorous material in main resin or stiffening agent resinous principle structure, or additionally to add the mode of P contained compound in resin formula, to increase fire-retardant effect.
In addition, substrate has been widely used in various fields, and therefore, the characteristic of substrate, character must meet all size, the for example glass transition temperature of substrate (Tg), thermotolerance/fire-retardant characteristic and water-absorbent, and this substrate also must possess and has good processibility.Therefore, how to prepare the resin combination of prepreg, so that the film/substrate of made has comprehensively and the characteristic of balance, be research staff's primary and foremost purpose.
This case contriver is because the disappearance of above-mentioned conventional technology when actual using, and accumulation individual is engaged in related industries exploitation practice experience for many years, studies intensively, and finally proposes a kind of reasonable in design and effectively improve the structure of the problems referred to above.
Summary of the invention
Main purpose of the present invention, is to provide a kind of prepreg composition, and it can be used for making the film/substrate with balance of properties, for example, reduce Tg and the Dk/Df of made substrate; And made substrate has better resistance to combustion/flame retardant resistance, meanwhile, substrate also has quite good processibility.
In order to achieve the above object, the invention provides a kind of prepreg composition, it comprises component (A): epoxy resin, and described epoxy resin comprises: component (A-1): phosphorous epoxy resin, phosphorous and containing epoxy silicone or both blending epoxies; Component (A-2): dicyclopentadiene (Dicyclopentadiene) type epoxy resin; The epoxy resin of component (A-3): Ju oxazolidine ketone (oxazolidone) ring; Component (B): stiffening agent; Component (C): promotor; Component (D): phosphonium flame retardant and component (E): stopping composition.
The present invention also provides a kind of this glasscloth be impregnated in above-mentioned prepreg composition, and through solidifying, after drying and other steps, and the film forming.
The present invention more provides a kind of and utilizes above-mentioned film via the substrate of the made printed circuit board (PCB) of process for pressing.
The present invention has following useful effect: utilize phosphorous epoxy resin, phosphorous and containing epoxy silicone or both blending epoxies, to coordinate other epoxy resin be main resin, and use stiffening agent and the phosphonium flame retardant of suitable molecular weight, to form composition epoxy resin glue, and then promote flame resistivity, low water absorbable and the thermotolerance of using the made film of this glue, and its made substrate has the substrate physical property compared with balance.
For enabling further to understand feature of the present invention and technology contents, refer to following relevant detailed description of the present invention, yet it only provides reference and explanation use, is not used for the present invention to be limited.
Embodiment
The invention provides a kind of prepreg composition, it comprises: component (A): epoxy resin, component (B): stiffening agent, component (C): promotor, component (D): phosphonium flame retardant; And component (E): stopping composition; Prepreg composition of the present invention is a kind of laminating material that can be used as printed circuit board (PCB), and improves resistance to combustion and the flame-retarding characteristic of made substrate.In addition, the present invention further proposes the proportion of composing of prepreg composition, to reach the satisfactory prod characteristic of the high glass transition temperature (Tg) of made substrate, high flame retardancy, high heat resistance and high working property; Moreover the present invention more adds the stopping composition of suitable proportion, to produce the film with better resistance to combustion and heat-resistant quality.
The composition of above-mentioned each component will be described in detail below; Component of the present invention (A): epoxy resin at least comprises that component (A-1) is to component (A-3), wherein, component (A-1) is phosphorous epoxy resin, phosphorous and containing epoxy silicone or both blending epoxies; This phosphorous epoxy resin system is connected to the made person of epoxy resin by following (formula 1), (formula 2) or (formula 3) valency respectively:
The epoxy resin that the epoxy resin with (formula 1) is a kind of side chain type, in this specific embodiment, this epoxy resin is phenol aldehyde type epoxy resin, cresols epoxy resin (o-cresolnovolac epoxy resin for example, CNE), and organic ring-type phosphatization price is connected to this cresols epoxy resin, and by the compound shown in (formula 1): 9, mix-10-phosphine phenanthrene-10-oxide compound (9 of 10-dihydro-9-oxy, 10-dihydro-9-oxa-10-Phosphaphenanthrene-10-oxide, DOPO) be directed in the structure of cresols epoxy resin, to form the phosphorus-containing phenolic aldehyde type epoxy resin of above-mentioned side chain type, in other words, in this specific embodiment, this phosphorous epoxy resin be by cresols epoxy resin (CNE) utilize 9,10-dihydro-9-oxy assorted-phosphorated material that 10-phosphorus phenanthrene-10-oxide compound (DOPO) carries out modification, therefore, hereinafter phosphorous epoxy resin is called for short to it with DOPO-CNE.
Yet epoxy resin of the present invention can be any epoxy resin, diepoxidess such as dihydroxyphenyl propane (bisphenolA), Bisphenol F (bisphenolF), bisphenol S (bisphenolS), bis-phenol (biphenol); And many epoxy resin or its mixture such as phenolic resin varnish (phenolformaldehyde novolac epoxy, PNE) epoxy resin, BNE.
In addition, the epoxy resin with (formula 2) is a kind of side chain type epoxy resin, in this specific embodiment, this epoxy resin is phenol aldehyde type epoxy resin, cresols epoxy resin (o-cresol novolac epoxy resin for example, CNE), and organic ring-type phosphatization price is connected to this cresols epoxy resin, and by the compound 10-shown in (formula 2) (2, 5-dihydroxy phenyl)-(10-(2 for 10H-9-oxa--10-phosphine phenanthrene-10-oxide compound, 5-dihydroxyphenyl)-10h-9oxa-10-phosphaphenanthrene-10-oxide, DOPO-HQ) be directed in the structure of cresols epoxy resin, in other words, in this specific embodiment, this phosphorous epoxy resin can be the phosphorated material that utilizes DOPO-HQ to carry out modification cresols epoxy resin (CNE), therefore, hereinafter phosphorous epoxy resin is called for short to it with DOPO-HQ-CNE.
(formula 3)
The epoxy resin similarly, with (formula 3) is that the compound (DOPO-NQ) shown in (formula 3) is directed in the structure of cresols epoxy resin; In other words, in this specific embodiment, this phosphorous epoxy resin can be the phosphorated material that utilizes DOPO-NQ to carry out modification cresols epoxy resin (CNE), therefore, hereinafter phosphorous epoxy resin is called for short to it with DOPO-NQ-CNE.
On the other hand, phosphorous in this component (A-1) and be that to be connected to epoxy resin made by the price of mixing of the mixture of the mixture of (formula 1) and silicon, (formula 2) and silicon or (formula 3) and silicon respectively containing epoxy silicone; For example, having (formula 1) is the phosphorous material that cresols epoxy resin (CNE) utilizes DOPO-Si to carry out modification with the epoxy resin of the mixture of silicon, therefore, hereinafter this phosphorous epoxy silicone that contains is called for short to it with DOPO-Si-CNE; And (formula 2) all can same concept represent it with mixture or (formula 3) of silicon with the mixture of silicon, do not repeat them here.
Accordingly, component (A-1) for phosphorous epoxy resin, phosphorous containing epoxy silicone or both mixing so that prepreg finished product to be provided, the flame retardancy of made film for example.
Component (A-2) is expressed as a kind of dicyclopentadiene (Dicyclopentadiene) type epoxy resin.In this specific embodiment, it can be down the compound shown in (formula 4) (Dicyclopentadiene Epoxy Resin, DNE):
Component (A-2) can be used for providing prepreg finished product to have low water absorbable, low specific inductivity (Dk) (claims again the consume factor with the lost factor, dissipation factor, Df), make the specific inductivity (Dk) of made substrate and the application that the lost factor (Df) meets the high frequency substrates such as communication.
Component (A-3) is expressed as the epoxy resin of a kind of Ju oxazolidine ketone (oxazolidone) ring.In this specific embodiment, it can be down the compound (oxazolidone epoxy resin shown in (formula 5), Oxazolidone Epoxy Resin):
Component (A-3) can be used for providing prepreg finished product have tool toughness and with the associativity of metallics.
Moreover this component (A) more can comprise component (A-4): naphthalene is epoxy resin; For example the naphthalene of component (A-4) is that epoxy resin can be as follows the compound shown in (formula 6) (alkylnaphthalene epoxy resin, Naphthalene alkyl Epoxy Resin):
Resin structure shown in component (A-4) has flame retardancy, and the difficulty combustion characteristic of the composition of prepreg can be further provided, and reduce aforementioned phosphorous resin and hereinafter described in the consumption of phosphonium flame retardant, can reach the effect reducing costs.
In addition, the stiffening agent shown in component (B) can be butylene styrene dicarboxylic anhydride polymkeric substance, has the resin of benzoxazine ring or both mixing, in this specific embodiment, butylene styrene dicarboxylic anhydride polymkeric substance can be vinylbenzene MALEIC ANHYDRIDE (SMA), it utilizes vinylbenzene (Styrene) and MALEIC ANHYDRIDE (Maleic anhydride, claim again maleic anhydride) with 3: 1, 4: 1, 6: 1, made (the corresponding SMAEF30 of difference of ratio of 8: 1, SMAEF40, SMAEF60, and SMAEF80), and above-mentioned stiffening agent has following characteristic: its weight average molecular weight (Mw) is approximately between 9000-15000, its number average molecular weight (Mn) is approximately between 3000-8000, residual benzene ethene is less than 0.2%, residual chlorine is less than 20ppm, residual MALEIC ANHYDRIDE is less than 0.01%, and kish is (as sodium, iron, magnesium) be less than 10ppm.
Again, the stiffening agent shown in component (B) can be the resin with benzoxazine ring, benzoxazine ring resin (Benzoxazine Resin, Bz) for example, and it is shown below:
Wherein, R can be S, CH
2,
Accordingly, the stiffening agent shown in component (B) can be the stiffening agent of above-mentioned single kind or both mixing, uses to provide and improves Tg, flame retardancy, reduction specific inductivity and the lost factor of prepreg finished product and reduce water-intake rate etc.
In addition, the promotor of component (C) can be in order to accelerate to control the setting time of glue, for example add 2-ethyl-4-methylimidazole (2E4MI), glyoxal ethyline (2-methylimidazole, 2-MI) or 2-PI etc., it can increase the speed of reaction of epoxy resin and stiffening agent.
Component (D): the flame retardancy of the substrate that phosphonium flame retardant can be used for providing made, and phosphonium flame retardant can be following compound or its mixture shown in various, but not as limit:
(Aromatic polyphosphate, aromatic series poly phosphate)
(Melamine polyphosphate, trimeric cyanamide polyphosphate)
(Diethyl phosphinic acid, aluninium salt, phosphonic acids diethyl aluminum salt)
(ring-type phenoxy phosphazene)
Composition of the present invention more includes component (E): stopping composition, this component (E) wherein: stopping composition can be smelting quartz (Fuse silica, commercially available prod model: MEGASIL 525), it can reduce specific inductivity and the lost factor of made substrate; Or can be pure aluminium silicate (Aluminum silicate), its can prevent prepreg finished product be heated after through hole produce and break; Or be spherical silica (silica), it can increase the boring of prepreg finished product, to reduce drill point abrasion; Or (commercially available prod model: SiltechG2-C), and its Mohs' hardness is less than 5, can increase equally the boring of prepreg finished product, to reduce drill point abrasion for particle diameter is about the silicon-dioxide of 2 μ m.
The embodiment's of group more than below the prepreg composition for above-mentioned being carried out, to illustrate by the proportion of composing allotment of this prepreg composition, reach best film/substrate properties.
Table one
SMA in the component (B) of the main demonstration of table one different molecular weight size adds the impact for made substrate properties; Wherein the molecular weight of SMAEF30 is minimum, and the molecular weight of SMAEF 80 is maximum.And SMA molecular weight is larger as shown in Table 1, the Tg of made substrate is lower, and the Dk/Df of made substrate is lower.
Table two
Table two is main shows that the component (A) of different structure, different compositions is for the impact of made substrate properties; And the phosphorous epoxy resin of different structure or phosphorous and can make Tg, Dk/Df, the thermotolerance of made substrate produce different effects containing epoxy silicone as shown in Table 2, but the made substrate of the experimental example of table two all meets product specification.
Table three
Table three is main shows that the component (D) of different structure is for the impact of made substrate properties; And the phosphonium flame retardant of different structure can make T g, Dk/Df, the thermotolerance of made substrate produce different effects as shown in Table 3, but the made substrate of the experimental example of table three all meets product specification.
Table four
The main impacts of component (A-2) to (A-4) for made substrate properties that show different compositions of table four; And the different components (A-2) to (A-4) that form can make Dk/Df, thermotolerance, the punch press processibility of made substrate produce different effects as shown in Table 4.
Table five
The main components (E) that show different compositions of table five: stopping composition is for the impact of the characteristic of made substrate; And the components (E) that difference forms as shown in Table 5: stopping composition can make the Dk/Df of made substrate produce different effects, but the made substrate of the experimental example of table five all meets product specification.
Table six
The main composition that shows the preferred embodiment of the present invention of table six; And by the effect of table six, can select the molecular weight, phosphorous/containing the advantage of epoxy silicone, phosphorus fire retardant, can to obtain the substrate physical property compared with balance of SMA resin.
Table seven
The main resin that shows different proportion of composing of the present invention of table seven, wherein, the EP/OH equivalent mol ratio (ratio of Epoxy molar equivalent and OH molar equivalent) of experiment 1 is 0.9, and the EP/OH equivalent mol ratio of experiment 19 is 0.6, and the EP/OH equivalent mol ratio of experiment 20 is 1.2; And from experimental data, the resin of Different Weight ratio, it has close result.Above-mentioned molar equivalent is the ratio of resin solid weight and resin epoxy amount (or OH equivalent), the account form of EP/OH equivalent mol ratio is (component A)/(component B), therefore, according to the data of above-described embodiment 1～embodiment 20, EP/OH equivalent mol ratio is approximately between 0.6 to 1.2.
Table eight
Table eight is main shows that the present invention adds the component (E) of different ratios: stopping composition, wherein component (E) addition causes thermotolerance better more, and Dk value is also higher, but the resin of the disclosed ratio of above-mentioned experiment 21-24 (0-85phr (parts per hundreds of rubber (orresin), every hundred parts of resins)) all can be produced the film that meets product requirement.
In sum, according to the above embodiments, the preferred group of the each component of prepreg composition of the present invention is proportional as follows: component (A-1) in component (A): the proportion of composing of phosphorous epoxy resin (weight percent) is approximately between 27-37%; In component (A) component (A-2) to the proportion of composing (weight percent) of the summation of component (A-4) approximately between 18-24%; In component (B), there is the proportion of composing (weight percent) of resin (Bz) of benzoxazine ring approximately between 29-42%; In component (B), the proportion of composing (weight percent) of butylene styrene dicarboxylic anhydride polymkeric substance (SMA) is 10-14%; Component (D): the minimum amount of phosphonium flame retardant is about 25phr; And component (E): the consumption of stopping composition is about 0-85phr.
The present invention further proposes a kind of above-mentioned prepreg composition manufacture method of film and film of made moulding of using.The method is the above-mentioned prepreg composition of application, and it comprises component (A): epoxy resin, and it comprises described epoxy resin: component (A-1): phosphorous epoxy resin, phosphorous and containing epoxy silicone or both blending epoxies; Component (A-2): dicyclopentadiene (Dicyclopentadiene) type epoxy resin; The epoxy resin of component (A-3): Ju oxazolidine ketone (oxazolidone) ring; Component (B): stiffening agent; Component (C): promotor; Component (D): phosphonium flame retardant and component (E): stopping composition.One glasscloth is flooded to (dipping) in the glue of above-mentioned prepreg composition, to make the impregnation film (PP) of better resistance to combustion, heat-resistant quality and high tenacity or to contain Copper Foil film (Copper clad laminate, CCL) or other films, and above-mentioned film can be applied the substrate of making use in printed circuit board, and this substrate can have quite good reactivity when by process for pressing.
In sum, the present invention has following all advantage:
1, the present invention utilizes phosphorous epoxy resin, phosphorous and containing epoxy silicone or both blending epoxies, to coordinate other epoxy resin be main resin, and use the vinylbenzene MALEIC ANHYDRIDE of suitable molecular weight, to form the glue of composition epoxy resin, to promote flame resistivity, low water absorbable and the thermotolerance of using the made film of this glue, and its made substrate has the substrate physical property compared with balance.
2, on the other hand, in composition of the present invention, adopt stopping composition, further to improve made film/substrate in the application of high frequency.
The foregoing is only preferred possible embodiments of the present invention, non-so limit to interest field of the present invention, therefore such as use the equivalence techniques that specification sheets of the present invention and diagramatic content are done to change, be all contained in scope of the present invention.
Claims (8)
1. a prepreg composition, is characterized in that, comprising:
Component (A): epoxy resin, described epoxy resin comprises:
Component (A-1): phosphorous epoxy resin, phosphorous and containing epoxy silicone or both blending epoxies;
Component (A-2): dicyclopentadiene type epoxy resin;
The epoxy resin of component (A-3): Ju oxazolidine ketone ring; With
Component (A-4): naphthalene is epoxy resin;
Component (B): stiffening agent, comprise butylene styrene dicarboxylic anhydride polymkeric substance, benzoxazine ring resin or both mixing, wherein, benzoxazine ring resin comprises:
Wherein, R can be S, CH2,
Or
；
Component (C): promotor;
Component (D): phosphonium flame retardant; And
Component (E): stopping composition,
Component (A-1) wherein: the weight percent of phosphorous epoxy resin is between 27-37%, component (A-2) between 18-24%, has the weight percent of resin of benzoxazine ring between 29-42% to the weight percent of the summation of component (A-4) in component (B); In component (B), the weight percent of butylene styrene dicarboxylic anhydride polymkeric substance is 10-14%; The minimum amount of component (D) is 25phr; And the consumption of component (E) is 0-85phr, phr represents every hundred parts of resins, and it is benchmark that described weight percent be take the weight sum of component (A-1), component (A-2) to (A-4) and component (B).
2. prepreg composition as claimed in claim 1, is characterized in that, it is made that the phosphorous epoxy resin in this component (A-1) is (formula 1) below inciting somebody to action respectively, (formula 2) or (formula 3) valency is connected to epoxy resin,
3. prepreg composition as claimed in claim 2, it is characterized in that phosphorous in this component (A-1) and be respectively (formula 1) to be connected to epoxy resin made person with mixture or (formula 3) of silicon with the price of mixing of silicon with mixture, (formula 2) of silicon containing epoxy silicone.
4. prepreg composition as claimed in claim 3, is characterized in that, the dicyclopentadiene type epoxy resin of this component (A-2) is the compound shown in following (formula 4):
5. prepreg composition as claimed in claim 4, is characterized in that, the epoxy resin of the Ju oxazolidine ketone ring of this component (A-3) is the compound shown in following (formula 5):
6. the prepreg composition as described in claim 1, is characterized in that, the naphthalene of this component (A-4) is that epoxy resin is the compound shown in following (formula 6):
7. a film that glass adhesive plaster be impregnated in to made in the prepreg composition as described in any one in claim 1 to 6.
8. an application rights requires the substrate of the made printed circuit board (PCB) of film described in 7.
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102732029B (en) * | 2012-06-21 | 2014-01-08 | 广东生益科技股份有限公司 | Halogen-free resin composition, bonding sheet and copper-clad laminate |
| CN103554437B (en) * | 2013-09-04 | 2016-08-17 | 东莞联茂电子科技有限公司 | A kind of IC encapsulation halogen-free epoxy resin composition |
| CN103834168B (en) | 2014-02-25 | 2016-09-07 | 广东生益科技股份有限公司 | A kind of halogen-free flame resistance resin composite |
| CN105778414B (en) | 2014-12-26 | 2018-05-29 | 广东生益科技股份有限公司 | A kind of composition epoxy resin and use its prepreg and laminate |
| CN106832764A (en) * | 2015-12-04 | 2017-06-13 | 广东生益科技股份有限公司 | A kind of halogen-free epoxy resin composition and the prepreg containing it, laminate and printed circuit board |
| CN106832226B (en) * | 2015-12-04 | 2019-06-14 | 广东生益科技股份有限公司 | A kind of halogen-free epoxy resin composition and prepreg, laminate and printed circuit board containing it |
| CN106916282B (en) | 2015-12-28 | 2019-07-26 | 广东生益科技股份有限公司 | A kind of composition epoxy resin and prepreg and laminate using it |
| CN109535654B (en) * | 2018-11-21 | 2021-02-09 | 苏州生益科技有限公司 | Phosphorus-containing epoxy resin composition, and prepreg and laminated board prepared from same |
| CN109535388B (en) * | 2018-11-21 | 2021-02-09 | 苏州生益科技有限公司 | Phosphorus-containing epoxy resin composition, and prepreg and laminated board prepared from same |
| CN109535390B (en) * | 2018-11-21 | 2021-01-29 | 常熟生益科技有限公司 | Phosphorus-containing epoxy resin composition, and prepreg and laminated board prepared from same |
| CN113544198A (en) * | 2019-02-15 | 2021-10-22 | 陶氏环球技术有限责任公司 | Epoxy composition |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1989203A (en) * | 2004-06-29 | 2007-06-27 | 旭化成化学株式会社 | Flame-retardant epoxy resin composition |
| CN101044204A (en) * | 2004-11-26 | 2007-09-26 | 株式会社Lg化学 | Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same |
| CN101583646A (en) * | 2006-10-19 | 2009-11-18 | 陶氏环球技术公司 | Curable epoxy resin compositions having improved adhesion to metal substrates and processes for making and using the same |
| CN101602881A (en) * | 2009-05-12 | 2009-12-16 | 东莞联茂电子科技有限公司 | A kind of compositions of thermosetting resin and application |
-
2010
- 2010-09-14 CN CN201010284456.7A patent/CN102399415B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1989203A (en) * | 2004-06-29 | 2007-06-27 | 旭化成化学株式会社 | Flame-retardant epoxy resin composition |
| CN101044204A (en) * | 2004-11-26 | 2007-09-26 | 株式会社Lg化学 | Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same |
| CN101583646A (en) * | 2006-10-19 | 2009-11-18 | 陶氏环球技术公司 | Curable epoxy resin compositions having improved adhesion to metal substrates and processes for making and using the same |
| CN101602881A (en) * | 2009-05-12 | 2009-12-16 | 东莞联茂电子科技有限公司 | A kind of compositions of thermosetting resin and application |
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