CN102391651A - Formula of organic silicon rubber for light-emitting diode (LED) chip packaging - Google Patents
Formula of organic silicon rubber for light-emitting diode (LED) chip packaging Download PDFInfo
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- CN102391651A CN102391651A CN 201110302611 CN201110302611A CN102391651A CN 102391651 A CN102391651 A CN 102391651A CN 201110302611 CN201110302611 CN 201110302611 CN 201110302611 A CN201110302611 A CN 201110302611A CN 102391651 A CN102391651 A CN 102391651A
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Abstract
The invention discloses a formula of organic silicon rubber for light-emitting diode (LED) chip packaging. According to the formula, the organic silicon rubber mainly comprises 45 to 85 percent of vinyl silicon oil, 35 to 65 percent of methyl hydrogen-containing silicon oil, 0.3 to 0.7 percent of platinum catalyst, 0.2 to 0.45 percent of catalysis inhibitor, and 1.2 to 1.8 percent of functional filler. The invention discloses the formula of the organic silicon rubber for LED packaging; the components in the formula are reasonable, the sources of the raw materials are rich, and the prepared organic silicon rubber can fully meet the packaging requirements of LED chips with different power, and has high hardness, light transmission, cold and heat resistance, and toughness; meanwhile, a vulcanization process in the process for preparing the organic silicon rubber is smooth, gelling time is easy to control, harmful substances are not breeded, and the organic silicon rubber is a more environment-friendly organic material.
Description
Technical field
The present invention relates to a kind of prescription of led chip encapsulation materials, relate in particular to the prescription of a kind of led chip encapsulation, belong to led chip encapsulation technology field with organo-silicone rubber.
Background technology
Chip encapsulation technology wraps up chip exactly, contacts with extraneous to avoid chip, prevents a kind of Technology of the infringement of outer bound pair chip.Airborne impurity and bad air, so water vapour all can corrode the precision circuit on the chip, and then cause electric property to descend.Different encapsulation technologies is widely different in manufacturing process and process aspect, and crucial effects is also played to the performance of memory chip self performance in the encapsulation back.Along with the develop rapidly of photoelectricity, little electric manufacturing process technology, electronic product all the time towards littler, gentlier, more cheap direction develops, so the packing forms of chip component also constantly is improved.
At present; It is the organic materials of main body that general led chip packaged material adopts transparent epoxy resin mostly; This material has higher viscosity and strong hardness; But the performance at aspects such as thermal diffusivity, thermal shock property, light transmission and toughness is relatively poor, can't satisfy the performance requriements of power-type LED chip, influences the work-ing life of LED.Lot of domestic and international enterprise all is devoted to develop a kind of LED packaged material with HS, high transmission rate, H.T., strong heat radiation, has carried out deep research around the organo-silicone rubber material, and has obtained bigger progress.
Summary of the invention
To the demand; The invention provides the prescription of a kind of led chip encapsulation with organo-silicone rubber, this system component is reasonable, and raw material sources are abundant; Preparation technology is easy; The organo-silicone rubber intensity that makes is high, good toughness, has good transmittance and cold-and-heat resistent impact property, the work-ing life of effectively having improved LED.
The present invention is the prescription of a kind of led chip encapsulation with organo-silicone rubber; This prescription staple comprises: vinyl silicone oil, Methyl Hydrogen Polysiloxane Fluid, platinum catalyst, catalytic inhibitor and functional filler, its percentage composition proportioning is following: vinyl silicone oil 45%-85%, Methyl Hydrogen Polysiloxane Fluid 35%-65%, platinum catalyst 0.3%-0.7%, catalytic inhibitor 0.2%-0.45% and functional filler 1.2%-1.8%.
In the present invention's one preferred embodiment, described percentage composition proportioning is following: vinyl silicone oil 55%-75%, Methyl Hydrogen Polysiloxane Fluid 40%-55%, platinum catalyst 0.35%-0.6%, catalytic inhibitor 0.25%-0.40% and functional filler 1.4%-1.6%.
In the present invention's one preferred embodiment, described catalytic inhibitor staple is the organic cpds that contains N, S, P.
In the present invention's one preferred embodiment, it is the activity of platinum catalyst in the restriction sulfidation that described catalytic inhibitor mainly acts on.
In the present invention's one preferred embodiment, but described functional filler accelerated cure process and prevent that sulfur product is clamminess.
In the present invention's one preferred embodiment, described functional filler mainly comprises heat conductive filler, thermo-stabilizer, fire retardant etc.
The present invention has disclosed the prescription of a kind of led chip encapsulation with organo-silicone rubber; This system component is reasonable; Raw material sources are abundant, and the organo-silicone rubber that makes can fully satisfy the encapsulation requirement of the led chip of various power, has higher strong hardness, light transmission, cold-and-heat resistent property and toughness; Simultaneously, the sulfuration process is smooth in the preparation process of organo-silicone rubber, and gel time is easy to control, and can not grow objectionable impurities, is a kind of organic materials of comparatively environmental protection.
Embodiment
In order to make those skilled in the art person understand technical scheme of the present invention better, and make above-mentioned purpose of the present invention, feature and advantage can be more obviously understandable, below in conjunction with embodiment the present invention done further detailed explanation.
This prescription staple comprises: vinyl silicone oil, Methyl Hydrogen Polysiloxane Fluid, platinum catalyst, catalytic inhibitor and functional filler, its percentage composition proportioning is following: vinyl silicone oil 45%-85%, Methyl Hydrogen Polysiloxane Fluid 35%-65%, platinum catalyst 0.3%-0.7%, catalytic inhibitor 0.2%-0.45% and functional filler 1.2%-1.8%.
Embodiment 1
Its making processes is following:
A) selection, vinyl silicone oil 55%, Methyl Hydrogen Polysiloxane Fluid 43%, platinum catalyst 0.5%, catalytic inhibitor 0.2%, functional filler 1.3%;
B) sub-material preparation is divided into A material and B material with raw material, and is mixed with respectively;
The A material: select vinyl silicone oil, platinum catalyst and catalytic inhibitor for use, wherein, vinyl silicone oil accounts for 75% of its total amount, and the proportioning of platinum catalyst and catalytic inhibitor is 10:1, and the catalytic inhibitor staple is alicyclic nitrogenous compound;
Hybrid mode is: at first, in Reaktionsofen, add vinyl silicone oil and platinum catalyst, controlled temperature fully stirred 0.5-1 hour about 85 ℃; Then, add catalytic inhibitor, decompression is warming up to about 180 ℃, stirs 1-1.5 hour, makes the A material;
The B material is selected vinyl silicone oil, Methyl Hydrogen Polysiloxane Fluid and catalytic inhibitor for use, and wherein, vinyl silicone oil accounts for 25% of its total amount;
Hybrid mode is: at first, in Reaktionsofen, add vinyl silicone oil and Methyl Hydrogen Polysiloxane Fluid, be warming up to 120 ℃, stirred 2-3 hour; Then, add catalytic inhibitor, decompression is warming up to 210 ℃, stirs 1-1.5 hour, makes the B material;
C) batch mixing, with the A material that makes and B material thorough mixing in Reaktionsofen, temperature maintenance stirred 2-3 hour at 85 ℃;
D) vacuum defoamation, temperature are controlled at 10 ℃ respectively, and 20 ℃, 30 ℃, carry out repeatedly deaeration, improve material property;
E) sulfidizing adds functional filler mica powder or potter's clay, and the accelerated cure process also prevents that sulfur product is clamminess, and further improves the intensity and the stability of material;
F) solidify, temperature is controlled at 120 ℃, and the time is 1 hour;
G) finished product packing.
According to the finished product that this method makes, tensile strength is 12kgf/cm2, and refractive index is 1.45, and shrinking percentage is 6.5%, and high low temperature resistance range is 130 ℃--65 ℃.
Embodiment 2
Its making processes is following:
A) selection, vinyl silicone oil 60%, Methyl Hydrogen Polysiloxane Fluid 38%, platinum catalyst 0.4%, catalytic inhibitor 0.25%, functional filler 1.35%;
B) sub-material preparation is divided into A material and B material with raw material, and is mixed with respectively;
The A material: select vinyl silicone oil, platinum catalyst and catalytic inhibitor for use, wherein, vinyl silicone oil accounts for 65% of its total amount, and the proportioning of platinum catalyst and catalytic inhibitor is 10:1, and the catalytic inhibitor staple is alicyclic nitrogenous compound;
Hybrid mode is: at first, in Reaktionsofen, add vinyl silicone oil and platinum catalyst, controlled temperature fully stirred 0.6-1 hour about 75 ℃; Then, add catalytic inhibitor, decompression is warming up to about 160 ℃, stirs 1-1.5 hour, makes the A material;
The B material is selected vinyl silicone oil, Methyl Hydrogen Polysiloxane Fluid and catalytic inhibitor for use, and wherein, vinyl silicone oil accounts for 35% of its total amount;
Hybrid mode is: at first, in Reaktionsofen, add vinyl silicone oil and Methyl Hydrogen Polysiloxane Fluid, be warming up to 140 ℃, stirred 2-3.5 hour; Then, add catalytic inhibitor, decompression is warming up to 200 ℃, stirs 1-1.5 hour, makes the B material;
C) batch mixing, with the A material that makes and B material thorough mixing in Reaktionsofen, temperature maintenance stirred 2-3 hour at 85 ℃;
D) vacuum defoamation, temperature are controlled at 10 ℃ respectively, and 20 ℃, 30 ℃, carry out repeatedly deaeration, improve material property;
E) sulfidizing adds functional filler mica powder or potter's clay, and the accelerated cure process also prevents that sulfur product is clamminess, and further improves the intensity and the stability of material;
F) solidify, temperature is controlled at 120 ℃, and the time is 1 hour;
G) finished product packing.
According to the finished product that this method makes, tensile strength is 12kgf/cm2, and refractive index is 1.39, and shrinking percentage is 5.5%, and high low temperature resistance range is 140 ℃--60 ℃.
The present invention has disclosed the prescription of a kind of led chip encapsulation with organo-silicone rubber; Be characterized in: this system component is reasonable; Raw material sources are abundant; The organo-silicone rubber that makes can fully satisfy the encapsulation requirement of the led chip of various power, has higher strong hardness, light transmission, cold-and-heat resistent property and toughness; Simultaneously, the sulfuration process is smooth in the preparation process of organo-silicone rubber, and gel time is easy to control, and can not grow objectionable impurities, is a kind of organic materials of comparatively environmental protection.
The above; Be merely embodiment of the present invention; But protection scope of the present invention is not limited thereto; Any those of ordinary skill in the art are in the technical scope that the present invention disclosed, and variation or the replacement that can expect without creative work all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claims were limited.
Claims (6)
1. a led chip encapsulates the prescription with organo-silicone rubber; This prescription staple comprises: vinyl silicone oil, Methyl Hydrogen Polysiloxane Fluid, platinum catalyst, catalytic inhibitor and functional filler, its percentage composition proportioning is following: vinyl silicone oil 45%-85%, Methyl Hydrogen Polysiloxane Fluid 35%-65%, platinum catalyst 0.3%-0.7%, catalytic inhibitor 0.2%-0.45% and functional filler 1.2%-1.8%.
2. led chip encapsulation according to claim 1 is with the prescription of organo-silicone rubber; It is characterized in that described percentage composition proportioning is following: vinyl silicone oil 55%-75%, Methyl Hydrogen Polysiloxane Fluid 40%-55%, platinum catalyst 0.35%-0.6%, catalytic inhibitor 0.25%-0.40% and functional filler 1.4%-1.6%.
3. led chip encapsulation according to claim 1 is characterized in that with the prescription of organo-silicone rubber described catalytic inhibitor staple is the organic cpds that contains N, S, P.
4. led chip encapsulation according to claim 3 is characterized in that with the prescription of organo-silicone rubber it is the activity of platinum catalyst in the restriction sulfidation that described catalytic inhibitor mainly acts on.
5. led chip according to claim 1 encapsulation is characterized in that with the prescription of organo-silicone rubber, but described functional filler accelerated cure process and prevent that sulfur product is clamminess.
6. led chip encapsulation according to claim 5 is characterized in that with the prescription of organo-silicone rubber described functional filler mainly comprises heat conductive filler, thermo-stabilizer, fire retardant etc.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102391652A (en) * | 2011-10-10 | 2012-03-28 | 常熟市广大电器有限公司 | Preparation process for organic silicon rubber for light-emitting diode (LED) chip packaging |
| CN103059576A (en) * | 2012-12-30 | 2013-04-24 | 深圳市鸿富诚屏蔽材料有限公司 | High-heat-conductivity flexible silica gel gasket and preparation method thereof |
| CN103408945A (en) * | 2013-02-18 | 2013-11-27 | 永信新材料有限公司 | Light emitting diode (LED) component as well as polysiloxane composition and substrate formula applied to same |
| CN103531693A (en) * | 2013-09-29 | 2014-01-22 | 杭州杭科光电股份有限公司 | Preparation method for COB (chip on board) area light source with large irritation angle |
| CN104004358A (en) * | 2014-04-14 | 2014-08-27 | 江苏嘉娜泰有机硅有限公司 | High refractive index power type LED packaging organosilicon |
| CN104130578A (en) * | 2014-08-12 | 2014-11-05 | 铜陵国鑫光源技术开发有限公司 | High-performance LED (light-emitting diode) encapsulating material and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102391652A (en) * | 2011-10-10 | 2012-03-28 | 常熟市广大电器有限公司 | Preparation process for organic silicon rubber for light-emitting diode (LED) chip packaging |
| CN103059576A (en) * | 2012-12-30 | 2013-04-24 | 深圳市鸿富诚屏蔽材料有限公司 | High-heat-conductivity flexible silica gel gasket and preparation method thereof |
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| CN103408945B (en) * | 2013-02-18 | 2016-01-20 | 永信新材料有限公司 | Can be applicable to the polysiloxane composition of light-emitting diode, pedestal formula and light-emitting diode thereof |
| CN103531693A (en) * | 2013-09-29 | 2014-01-22 | 杭州杭科光电股份有限公司 | Preparation method for COB (chip on board) area light source with large irritation angle |
| CN103531693B (en) * | 2013-09-29 | 2016-10-05 | 杭州杭科光电股份有限公司 | A kind of preparation method of the COB area light source of big lighting angle |
| CN104004358A (en) * | 2014-04-14 | 2014-08-27 | 江苏嘉娜泰有机硅有限公司 | High refractive index power type LED packaging organosilicon |
| CN104130578A (en) * | 2014-08-12 | 2014-11-05 | 铜陵国鑫光源技术开发有限公司 | High-performance LED (light-emitting diode) encapsulating material and preparation method thereof |
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Application publication date: 20120328 |