CN102388090A - 光学器件及其制造方法 - Google Patents
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Abstract
本发明的光学器件包括安装在支架上的发光元件或光接收元件和通过用可氢化硅烷化反应固化的硅氧烷组合物密封该元件而在支架上一体化成为单一制品的固化的硅氧烷材料，其特征在于，固化的硅氧烷材料的表面已用一个分子中具有至少三个与硅键合的氢原子的有机基聚硅氧烷处理。该光学器件因抑制密封安装在支架上的发光元件或光接收元件并由此在支架上一体化成为单个构件的固化的硅氧烷材料表面的粘性而可抵抗尘垢的粘附。
Description
技术领域
本发明涉及一种光学器件，其中固化的硅氧烷材料在其中与安装在支架上的发光元件或光接收元件一体化成为单一制品。本发明进一步涉及一种制造该光学器件的方法。
背景技术
已知通过用可固化的硅氧烷组合物密封安装在支架上的发光元件(例如LED芯片)，以得到支架与固化的硅氧烷材料一体化成为单一制品而提供的光学器件。在用于制造该光学器件的方法的实例中，将具有与安装在支架的LED芯片的位置相对的凹腔的模具涂覆非常薄的脱模薄膜；然后将可固化的硅氧烷组合物填入凹腔中；并随后使承载LED芯片的支架压向模具并使组合物固化(参照日本未审专利申请公开2005-305954，2006-148147和2008-227119)。
为了在前述方法中令人满意地松驰LED芯片上的应力，优选使用提供凝胶或低硬度橡胶形式的固化材料的可固化的硅氧烷组合物。然而，此处的问题是，所得固化的硅氧烷材料的表面相当粘性，这导致尘垢粘附并因此产生有缺陷的外观。
本发明的一个目的是提供一种抵抗尘垢粘附的光学器件，这是由于抑制了通过密封安装在支架上的发光元件或光接收元件而在其中一体化成为单一制品的固化的硅氧烷材料表面的粘性导致的。本发明的另一目的是提供一种制造该光学器件的有效方法。
发明内容
本发明的光学器件包括安装在支架上的发光元件或光接收元件和通过用可氢化硅烷化反应固化的硅氧烷组合物密封该元件而在支架上一体化成为单一制品的固化的硅氧烷材料。
该有机基聚硅氧烷优选为分子两端均由三甲基甲硅烷氧基封端的甲基氢聚硅氧烷、分子两端均由三甲基甲硅烷氧基封端的二甲基硅氧烷和甲基氢硅氧烷的共聚物、或包含由式SiO4/2表示的单元和由式H(CH3)2SiO1/2表示的单元的聚硅氧烷。
另外，该固化的硅氧烷材料优选具有凸透镜的形状。
本发明的用于制造光学器件的方法包括通过填充可氢化硅烷化反应固化的硅氧烷组合物到模具中的脱模薄膜上而制造具有与其成为一体的固化的硅氧烷材料的光学器件，其中模具有与安装在支架上的发光元件或光接收元件相对布置的空腔并且模具与脱模薄膜紧密接触，其中脱模薄膜变形成空腔的形状，并随后通过使支架压向模而使组合物成形，所述方法的特征在于，预先涂覆一个分子中具有至少三个与硅键合的氢原子的有机基聚硅氧烷到要与组合物接触的脱模薄膜的表面上。
在该方法中的脱模薄膜优选为氟树脂薄膜、聚酯树脂薄膜或聚烯烃树脂薄膜。
在该方法中的有机基聚硅氧烷优选为分子两端均由三甲基甲硅烷氧基封端的甲基氢聚硅氧烷、分子两端均由三甲基甲硅烷氧基封端的二甲基硅氧烷和甲基氢硅氧烷的共聚物、或包含由式SiO4/2表示的单元和由式H(CH3)2SiO1/2表示的单元的聚硅氧烷。另外，该有机基聚硅氧烷的涂覆率优选为0.01-10g/m2。
发明效果
本发明的光学器件的特征在于抵抗尘垢的粘附，这是由于抑制了通过密封安装在支架上的发光元件或光接收元件而在其中一体化成为单一制品的固化的硅氧烷材料表面的粘性导致的。本发明的制造方法的特征在于能够有效地制造该光学器件。
附图简述
图1为显示形成固化的硅氧烷材料前的光学器件的部分截面图。
图2为显示在填充可氢化硅烷化反应固化的硅氧烷组合物前的状态的部分截面图。
图3为显示在填充可氢化硅烷化反应固化的硅氧烷组合物后的状态的部分截面图。
图4为显示成形的可氢化硅烷化反应固化的硅氧烷组合物的部分截面图。
图5为显示已与固化的硅氧烷材料一体化成为单一制品的光学器件的部分截面图。
图6为显示已与固化的硅氧烷材料一体化成为单一制品的另一光学器件的部分截面图。
图7为显示已与固化的硅氧烷材料一体化成为单一制品的另一光学器件的部分截面图。
说明书中使用的参考数字：
1 支架
2 LED芯片
3 接合线
4 模具
5 脱模薄膜
6 可氢化硅烷化反应固化的硅氧烷组合物
7 固化的硅氧烷材料
发明详述
本发明的光学器件含有安装在支架上的发光元件或光接收元件以及含有通过使用可氢化硅烷化反应固化的硅氧烷组合物密封所述元件而在其中一体化成为单一制品的固化的硅氧烷材料。发光元件可例举发光二极管(LED)芯片。LED芯片合适地为通过液相成长法或MOCVD法在基板上形成作为发光层的半导体(如InN AlN、GaN、ZnSe、SiC、GaP、GaAs、GaAlAs GaAlN、AlInGaP、InGaN、AlInGaN等)而提供的LED芯片。
支架可例举为陶瓷基板、硅基板和金属基板以及有机树脂基板，例如聚酰亚胺树脂、环氧树脂、BT树脂等的有机树脂基板。除了安装在支架上的发光元件或光接收元件，支架尤其也可具有电路、使该电路电连接至LED芯片的接合线(例如金或铝线)和电路的外部引线。图5-7中所示的光学器件布有多个LED芯片，但可通过切割或***支架而制作独立的光学器件。
当使用可氢化硅烷化反应固化的硅氧烷组合物密封发光元件或光接收元件时，固化的硅氧烷材料形成为一体制品，并且固化的硅氧烷材料优选粘附到支架和发光元件或光接收元件上。该固化的硅氧烷材料可为透明的固化材料或可为例如含有荧光物质的固化材料。对该固化的硅氧烷材料的形状没有特别限制，和可例举为凸透镜形状、截顶圆锥体形状和截顶四角锥形状，其中优选凸透镜形状。
形成该固化的硅氧烷材料的可氢化硅烷化反应固化的硅氧烷组合物通常包含一个分子中具有至少两个烯基的有机基聚硅氧烷、一个分子中具有至少两个与硅键合的氢原子的有机基聚硅氧烷和氢化硅烷化反应催化剂；其优选为透明流体；并可根据需要加入无机填料、荧光物质等。对该可固化的硅氧烷组合物的粘度没有特别限制，但该组合物优选为25℃下在0.1-200Pa·s范围内的流体，更优选为25℃下在0.1-30Pa·s范围内的流体。例如，这种可固化的硅氧烷组合物一般可在市场上以SE1896FR购自Dow Corning Toray Co.，Ltd。
当通过用可氢化硅烷化反应固化的硅氧烷组合物密封发光元件或光接收元件而在本发明的光学器件中形成固化的硅氧烷材料时，使用一个分子中具有至少三个与硅键合的氢原子的有机基聚硅氧烷进行处理导致固化的硅氧烷材料表面的交联密度增加并抑制该表面的粘性，因此将防止尘垢的粘附。该有机基聚硅氧烷应一个分子中具有至少三个与硅键合的氢原子，但除此之外并无特别限制。该有机基聚硅氧烷中与硅键合的基团可具体例举为取代或未取代的一价烃基，例如：烷基，如甲基、乙基、丙基、异丙基、丁基、异丁基、叔丁基、戊基、己基、环己基、庚基、辛基、壬基、癸基等；链烯基，如乙烯基、烯丙基、异丙烯基、丁烯基、异丁烯基、己烯基、环己烯基等；芳基，如苯基、甲苯基、二甲苯基、萘基等；芳烷基，如苯甲基、苯乙基等；和卤素取代的烷基，如3-氯丙基、3，3，3-三氟丙基等；其中优选不含脂族不饱和碳-碳键的一价烃基。
对该有机基聚硅氧烷的分子结构没有限制，和其分子结构可例举直链、部分支化的直链、支链、树枝状、网状和环状。其在25℃下的粘度优选为1-1,000mPa·s，更优选为1-500mPa·s，特别优选为1-100mPa·s。
该有机基聚硅氧烷可例举为分子两端均由三甲基甲硅烷氧基封端的甲基氢聚硅氧烷；分子两端均由三甲基甲硅烷氧基封端的二甲基硅氧烷和甲基氢硅氧烷的共聚物；分子两端均由二甲基氢甲硅烷氧基封端的甲基氢聚硅氧烷；分子两端均由二甲基氢甲硅烷氧基封端的二甲基硅氧烷和甲基氢硅氧烷的共聚物；环状甲基氢硅氧烷；二甲基硅氧烷和甲基氢硅氧烷的环状共聚物；包含由式(CH3)3SiO1/2表示的硅氧烷单元、由式H(CH3)2SiO1/2表示的硅氧烷单元和由式SiO4/2表示的硅氧烷单元的共聚物；包含由式H(CH3)2SiO1/2表示的硅氧烷单元和由式SiO4/2表示的硅氧烷单元的共聚物；包含由式(CH3)3SiO1/2表示的硅氧烷单元、由式H(CH3)2SiO1/2表示的硅氧烷单元、由式(CH3)2SiO2/2表示的硅氧烷单元和由式SiO4/2表示的硅氧烷单元的共聚物；和上述两种或更多种的混合物。特别优选分子两端均由三甲基甲硅烷氧基封端的甲基氢聚硅氧烷、分子两端均由三甲基甲硅烷氧基封端的二甲基硅氧烷和甲基氢硅氧烷的共聚物、或包含由式SiO4/2表示的单元和由式H(CH3)2SiO1/2表示的单元的聚硅氧烷。
用于制造该光学器件的方法的实例包括通过填充可氢化硅烷化反应固化的硅氧烷组合物到模具中的脱模薄膜上而制造具有与其成为一体的固化硅氧烷材料的光学器件，其中模具有与安装在支架上的发光元件或光接收元件相对布置的空腔且模具与脱模薄膜紧密接触，其中脱模薄膜已变形成空腔的形状，并随后通过使支架压向模而使组合物成形。本发明的方法的特征在于，预先涂覆一个分子中具有至少三个与硅键合的氢原子的有机基聚硅氧烷到上述方法中将接触可固化的硅氧烷组合物的脱模薄膜的表面上。
本发明的方法使用可在用可氢化硅烷化反应固化的硅氧烷组合物密封安装在支架上的发光元件或光接收元件的同时使固化的硅氧烷材料成形的成形器件。可将通常使用的成形器件用作该成形器件。为了使脱模薄膜与空腔紧密接触，优选在模具中具有吸气机构的成形器件。该吸气机构的功能为在成形期间使脱模薄膜与空腔紧密接触，并在成形之后通过吹气功能使脱模薄膜从模具剥落并有利于移除成形制品。
将参考附图描述本发明的方法。图1为显示形成固化的硅氧烷材料前的光学器件的部分截面图。在图1中，例如，LED芯片2通过小片接合剂安装在支架1上，该LED芯片2通过接合线3与在支架1表面上形成的外部引线或电路(均未显示在图中)电连接。
图2为显示在填充可氢化硅烷化反应固化的硅氧烷组合物前的状态的部分截面图。将布有LED芯片2的支架1置于与模具4中空腔位置相对的位置。然后使已涂有一个分子中含有至少三个与硅键合的氢的有机基聚硅氧烷的脱模薄膜5送入支架1与模具4之间，并通过置于模具4中的吸气机构(未显示在图中)而与模腔紧密接触。图3为显示就在将可氢化硅烷化反应固化的硅氧烷组合物6引入脱模薄膜5覆盖的模具4中之后的状态的部分截面图。
图4为显示成形的可氢化硅烷化反应固化的硅氧烷组合物的部分截面图。通过使支架1压向模具4，脱模薄膜5可被夹在中间，并能可靠地封闭密封区域的周边并可防止组合物的泄漏。
该脱模薄膜6为可通过例如吸气容易地与模具紧密接触并显示足以承受可氢化硅烷化反应固化的硅氧烷组合物的固化温度的耐热性的脱模薄膜。该性质的脱模薄膜可例举：氟树脂薄膜，如聚四氟乙烯树脂(PTFE)薄膜、乙烯-四氟乙烯共聚物树脂(ETFE)薄膜、四氟乙烯-全氟丙烯共聚物树脂(FEP)薄膜、聚偏二氟乙烯树脂(PBDF)薄膜等；聚酯树脂薄膜，如聚对苯二甲酸乙二醇酯树脂(PET)薄膜等；和无氟聚烯烃树脂薄膜，如聚丙烯树脂(PP)薄膜、环烯烃共聚物树脂(COC)薄膜等。对该脱模薄膜的厚度没有特别限制，但优选约0.01mm-0.2mm。
本发明方法的特征在于，涂覆一个分子中具有至少三个与硅键合的氢的有机基聚硅氧烷到将与可氢化硅烷化反应固化的硅氧烷组合物接触的脱模薄膜的侧上。该有机基聚硅氧烷如之前描述。对该有机基聚硅氧烷的涂覆率没有特别限制，但优选提供0.01-10g/m2的量，而更优选提供0.01-5g/m2的量，特别优选提供0.01-2g/m2的量。
对可氢化硅烷化反应固化的硅氧烷组合物的固化条件没有特别限制，但例如在优选50-200℃下、特别是100-150℃下进行加热约0.5-60分钟、特别是约1-30分钟。根据需要，可在150-200℃下进行二次固化(后固化)约0.5-4小时。
图5为显示具有成为一体的凸透镜状硅氧烷的本发明的光学器件的部分截面图。虽然图5中安装多个LED芯片，但可通过用(例如)切割锯、激光等切割支架而将光学器件单个化。
实施例
通过实施例详细描述本发明的光学器件和用于制造该光学器件的本发明的方法。在实施例中的粘度为在25℃下的值。
[实践例1]
使用来自TOWA的FFT 1005作为压模机。使用夹子将其上安装有256个发光二极管(LED)芯片的氧化铝电路基板固定在该压模机的上部模具中。然后将已使用分子两端均由三甲基甲硅烷氧封端并具有20mPa·s粘度和1.56重量％与硅键合氢含量的甲基氢聚硅氧烷以0.05g/m2的涂覆率涂覆的0.05mm厚聚烯烃树脂薄膜引入到具有如图2所示的凹腔的模具上，并通过存于下部模具中的吸气机构使薄膜与下部模具紧密接触。随后将1.5g具有400mPa·s粘度的可氢化硅烷化反应固化的硅氧烷凝胶组合物(商品名：SE1896FR，Dow Corning TorayCo.，Ltd.的产品)填入凹腔中。
该可氢化硅烷化反应固化的凝胶组合物能够在140℃下加热5分钟时形成具有约60的如JIS K 2220中所规定的1/4-针入度的固化凝胶。封闭上部和下部模具，其中各个凹腔与安装在支架上的各个LED芯片相对，并在140℃下进行压模5分钟。然后打开模具并移出一体化成为具有硅氧烷凸透镜的单一制品的光学器件。该光学器件的硅氧烷透镜表面坚硬并呈现极低粘性，且也不经历指纹转移。
[实践例2]
如实践例1制造光学器件，但在此情况下，实践例1中的脱模薄膜表面处理使用0.05g/m2的涂覆率和具有平均单元式[H(CH3)2SiO1/2]1.6(SiO4/2)1.0、25mPa·s的粘度和0.97重量％的与硅键合的氢含量的硅氧烷树脂进行。
[实践例3]
如实践例1制造光学器件，但在此情况下，实践例1中的脱模薄膜表面处理使用1.00g/m2的涂覆率和具有平均单元式[H(CH3)2SiO1/2]1.6(SiO4/2)1.0、25mPa·s的粘度和0.97重量％的与硅键合的氢含量的硅氧烷树脂进行。该光学器件的硅氧烷透镜表面坚硬并呈现极低粘性，且不经历指纹转移。
[实践例4]
如实践例1制造光学器件，但在此情况下，实践例1中的脱模薄膜表面处理使用0.05g/m2的涂覆率和分子两端均由三甲基甲硅烷氧基封端并具有63mPa·s的粘度和0.70重量％的与硅键合的氢含量的二甲基硅氧烷和甲基氢硅氧烷的共聚物进行。该光学器件的硅氧烷透镜表面坚硬并呈现极低粘性，且不经历指纹转移。
[实践例5]
如实践例1制造光学器件，但在此情况下，实践例1中的脱模薄膜表面处理使用1.00g/m2的涂覆率和分子两端均由三甲基甲硅烷氧基封端并具有63mPa·s的粘度和0.70重量％的与硅键合的氢含量的二甲基硅氧烷和甲基氢硅氧烷的共聚物进行。该光学器件的硅氧烷透镜表面坚硬并呈现极低粘性，且不经历指纹转移。
[对比例1]
如实践例1制造光学器件，但在此情况下，省略实践例1中使用分子两端均由三甲基甲硅烷氧基封端并具有20mPa·s的粘度和1.56重量％的与硅键合的氢含量的甲基氢聚硅氧烷的脱模薄膜表面处理。该光学器件的硅氧烷透镜表面为强粘性并经历指纹转移。
工业实用性
本发明的光学器件因抑制密封安装在支架上的发光元件或光接收元件并由此在支架上成为一体的固化硅氧烷材料表面的粘性而可抵抗尘垢粘附，因此相当适合作为可靠性(例如耐热性等)重要的光学器件。
Claims (7)
1.一种光学器件，其包括安装在支架上的发光元件或光接收元件和通过用可氢化硅烷化反应固化的硅氧烷组合物密封该元件而在所述支架上一体化成为单一制品的固化的硅氧烷材料，该光学器件的特征在于固化的硅氧烷材料的表面已用一个分子中具有至少三个与硅键合的氢原子的有机基聚硅氧烷处理。
2.权利要求1的光学器件，其中有机基聚硅氧烷为分子两端均由三甲基甲硅烷氧基封端的甲基氢聚硅氧烷、分子两端均由三甲基甲硅烷氧基封端的二甲基硅氧烷和甲基氢硅氧烷的共聚物、或包含由式SiO4/2表示的单元和由式H(CH3)2SiO1/2表示的单元的聚硅氧烷。
3.权利要求1的光学器件，其中固化的硅氧烷材料具有凸透镜的形状。
4.一种制造光学器件的方法，所述光学器件具有通过填充可氢化硅烷化反应固化的硅氧烷组合物到模具中的脱模薄膜上而与其成为一体的固化的硅氧烷材料，其中所述模具有与安装在支架上的发光元件或光接收元件相对布置的空腔并且所述模具与脱模薄膜紧密接触，其中脱模薄膜变形成空腔的形状，和随后通过使支架压向模具而使组合物成形，该制造光学器件的方法的特征在于，预先涂覆一个分子中具有至少三个与硅键合的氢原子的有机基聚硅氧烷到要与组合物接触的脱模薄膜的表面上。
5.权利要求4的制造光学器件的方法，其中脱模薄膜为氟树脂薄膜、聚酯树脂薄膜或聚烯烃树脂薄膜。
6.权利要求4的制造光学器件的方法，其中有机基聚硅氧烷为分子两端均由三甲基甲硅烷氧基封端的甲基氢聚硅氧烷、分子两端均由三甲基甲硅烷氧基封端的二甲基硅氧烷和甲基氢硅氧烷的共聚物、或包含由式SiO4/2表示的单元和由式H(CH3)2SiO1/2表示的单元的聚硅氧烷。
7.权利要求4的制造光学器件的方法，其中有机基聚硅氧烷的涂覆率为0.01-10g/m2。
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| JP2009095611A JP2010245477A (ja) | 2009-04-10 | 2009-04-10 | 光デバイス及びその製造方法 |
| JP2009-095611 | 2009-04-10 | ||
| PCT/JP2010/056495 WO2010117076A2 (en) | 2009-04-10 | 2010-04-06 | Optical device and method of producing the same |
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| TWI441361B (zh) * | 2010-12-31 | 2014-06-11 | Interlight Optotech Corp | 發光二極體封裝結構及其製造方法 |
| JP5543386B2 (ja) * | 2011-01-21 | 2014-07-09 | スタンレー電気株式会社 | 発光装置、その製造方法及び照明装置 |
| JP2013084949A (ja) * | 2011-09-30 | 2013-05-09 | Sumitomo Bakelite Co Ltd | 封止半導体およびその製造方法 |
| US9444024B2 (en) * | 2011-11-10 | 2016-09-13 | Cree, Inc. | Methods of forming optical conversion material caps |
| JP2013189493A (ja) * | 2012-03-12 | 2013-09-26 | Asahi Kasei Chemicals Corp | 離型フィルム及びこれを用いた成型方法 |
| EP2837040A4 (en) * | 2012-04-12 | 2015-10-14 | Saint Gobain Performance Plast | METHOD FOR MANUFACTURING A LIGHT EMITTING DEVICE |
| JP2015079926A (ja) * | 2013-09-10 | 2015-04-23 | 旭化成ケミカルズ株式会社 | 光デバイス、およびその製造方法 |
| JP6215769B2 (ja) * | 2014-05-09 | 2017-10-18 | 信越化学工業株式会社 | ウェハーレベル光半導体デバイス用部材の製造方法、及び光半導体デバイスの製造方法 |
| JP2015216206A (ja) * | 2014-05-09 | 2015-12-03 | 信越化学工業株式会社 | ウェハーレベル光半導体デバイス用部材の製造方法、光半導体デバイスの製造方法、及び光半導体デバイス |
| JP2015216192A (ja) * | 2014-05-09 | 2015-12-03 | 信越化学工業株式会社 | ウェハーレベル光半導体デバイス用部材の製造方法、光半導体デバイスの製造方法、及び光半導体デバイス |
| DE102015103335A1 (de) * | 2015-03-06 | 2016-09-08 | Osram Opto Semiconductors Gmbh | Optoelektronische Vorrichtung und Verfahren zur Herstellung einer optoelektronischen Vorrichtung |
| FR3045439A1 (fr) * | 2015-12-18 | 2017-06-23 | Valeo Vision | Procede de fabrication d'un element optique comprenant au moins deux materiaux |
| US10688702B1 (en) * | 2018-05-11 | 2020-06-23 | Facebook Technologies, Llc | Optical assembly fabricated with liquid optical material |
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| KR20120022902A (ko) | 2012-03-12 |
| RU2518118C2 (ru) | 2014-06-10 |
| US20120037951A1 (en) | 2012-02-16 |
| WO2010117076A3 (en) | 2010-12-02 |
| WO2010117076A2 (en) | 2010-10-14 |
| EP2417190A2 (en) | 2012-02-15 |
| RU2011143466A (ru) | 2013-05-20 |
| JP2010245477A (ja) | 2010-10-28 |
| TW201044650A (en) | 2010-12-16 |
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