CN102361740B - Mold for injection molding, injection molding method, and injection molded article - Google Patents
Mold for injection molding, injection molding method, and injection molded article Download PDFInfo
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- CN102361740B CN102361740B CN201080013258.5A CN201080013258A CN102361740B CN 102361740 B CN102361740 B CN 102361740B CN 201080013258 A CN201080013258 A CN 201080013258A CN 102361740 B CN102361740 B CN 102361740B
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- injection molding
- mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2628—Moulds with mould parts forming holes in or through the moulded article, e.g. for bearing cages
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Disclosed is a mold for injection molding, which enables the formation of a plurality of through holes, while effectively suppressing the formation of burrs. Specifically disclosed is a mold (2) for injection molding, which comprises a fixed mold (40) and a movable mold (50) and forms a cavity (51) between the fixed mold (40) and the movable mold (50). The mold (2) for injection molding has a plurality of rod-like pins (63, 64) which are provided on the movable mold (50), and the front end of each pin is brought into contact with the fixed mold (40) within the cavity (51) when the two molds are clamped together. The mold (2) for injection molding is also provided with an elastic pressing member (65) which is arranged outside the cavity (51) for the purpose of pressing the plurality of pins (63, 64) towards the fixed mold (40) all at once when the two molds are clamped together.
Description
Technical field
The present invention relates to injection molding forming mould, injection molding method and injection molding forming product.
Background technology
In the past, as the method forming resin products, injection molding forming was widely used.When the resin with through hole being formed utilizing this injection molding forming, being generally erect in the side of the mould being divided into two to be provided with pin, abutting with the cavity surface of opposite side mould when matched moulds, utilize this pin to form through hole.
At this moment, the front end of opposite side mould and pin, in order to not make opposite side mould sustain damage owing to contacting, does not make to abut closely, even if when matched moulds, has the minim gap of about 20 μm yet.For general formed products and forming process, resin enters this small gap hardly, does not occur burr in through-hole section, even if or occur it being also the size of the no problem degree as goods.
But for the special even surface of special requirement high-precision optical mirror plane, optical spherical surface, optical aspherical surface or freeform optics surface etc., or microchip is had like this to the resin of fine structure, even then small burr also affects its function and performance.Particularly improve the mobility of resin and realize the high manufacturing process copied, such as using the thermal cycle forming process more than near the heat distortion temperature temperature of die surface being brought up to injecting molded resin, improving the gas assist formation method making the carbonic acid gas of resin plasticization and the use nitrogen of mould cavity pressure, or when the low adiabatic metal of thermal conductivity being used for mould and makes resin be difficult to the adiabatic forming process etc. cooled off, even above-mentioned small gap, resin also easily enters, and easily produces burr in through-hole section.
So there is such motion: arrange helical spring at the cardinal extremity of pin, by making this pin suitably press to opposite side mould, the opposite side mould when matched moulds not being sustained damage, the front end of pin being abutted with opposite side mould and does not have the method (such as with reference to patent document 1) in gap.
Patent document 1:(Japan) JP 2004-114334 publication
But in the method that above-mentioned patent document 1 is recorded, due to helical spring must be configured respectively at the cardinal extremity of each pin, thus the quantity of the pin that can press and size limit by helical spring size, be difficult to form multiple through hole, particularly multiple small through hole.And in this structure, helical spring is easy relative tilt for mould, so be difficult to evenly press multiple pin, likely there is gap and produce large burr in local.
When arranging helical spring structure respectively to each pin, likely making pressing force produce deviation because each helical spring deterioration waits, and then being difficult to as described above maintain uniform pressing.
To this, not pin cardinal extremity but the opposite side die side that pin abuts arrange helical spring method be considered.
But the such elastomeric element of helical spring can not tolerate the injection-molded pressure of resin and also not have necessary heat resistance, so can not be configured in die cavity.So have to arrange as to contacting the structure that departure direction can slide using with the abutting part of pin in opposite side mould, make helical spring from the inside of opposite side mould to press this abutting part, but in this structure, resin enters the gap of slipper, produce burr.
Disclose in the 3rd embodiment of patent document 1: utilize common force application part to the form of opposite side mold compresses it the integration of multiple pin.But the shortcoming of the method is, the machining accuracy of integrated pin self must be high, and insert the relative positional accuracy also necessary height of embedded hole with mould.
Summary of the invention
The present invention develops in view of the foregoing, and problem is to provide a kind of injection molding forming mould, injection molding method and the injection molding forming product with this, can effectively suppress to produce burr, and forms multiple through hole.
First content of the present invention is injection molding forming mould, and it possesses fixed mould and moveable die, is formed with the die cavity of resin by injection between this fixed mould and this moveable die, wherein,
Comprise:
Mould, it is any one mould of described fixed mould and described moveable die, has multiple insertion embedded hole; Bar-shaped multiple pins, it inserts described insertion embedded hole and in described die cavity, makes leading section abut with another mould when matched moulds;
Pressing component, it is configured in outside described die cavity, when described matched moulds, described multiple pin is pressed from another die side described in the base end part side direction of described multiple pin in the lump.
In this injection molding forming mould,
The material of described pressing component is preferably elastomer (elastic resin, rubber etc.), or parallel spring or be filled with the buffer unit of gas or liquid.At this, elastic resin and rubber be not only in the term of elastomer of the present invention, even if but play the also involved broad term such as the resin being necessary pressing force in the present invention as not generally being classified into elastic resin and use.
In this injection molding forming mould,
Be preferred at least one of thermal cycle forming process, gas assist formation method and adiabatic forming process.
In this injection molding forming mould,
The pressing force that described pressing component gives described multiple pin is preferably 2 ~ 55MPa, is more preferably 2 ~ 15MPa.
In this injection molding forming mould,
Described pressing component is the plate-like elastic parts that the base end part end face of the multiple pins being arranged on a described mould is configured towards another mold compresses described.
In this injection molding forming mould,
Another mould described is preferably formed by soft or brittle materials.
Second content of the present invention is injection molding method, wherein,
Use injection molding forming mould of the present invention,
Moulding material is filled to copy the shape of this die cavity in described die cavity.
3rd content of the present invention is resinous injection molding forming product, wherein,
Injection molding forming mould of the present invention is used to form,
There is at least one of optical mirror plane, optical spherical surface, optical aspherical surface, freeform optics surface and fine structure.
In these injection molding forming product,
Preferably there are the microchip injection molding forming product of trickle stream within the scope of width and the degree of depth 10 ~ 200 μm.
According to the present invention, owing to the pressing component pressing multiple pin being in the lump configured in outside die cavity, so the deviation of multiple pin pressing force separately can be reduced, and can also reduce and worsen by pressing component the pressing force deviation caused, can suppress because resin enters the large burr produced between the leading section of pin and another mould.
Therefore, at the high-precision special even surface of forming requirements with there is the formed products of fine structure, using when improving the mobility of resin when realizing the high forming process copied, effectively can both suppress to produce large burr, and forming multiple through hole.
Accompanying drawing explanation
Fig. 1 is the top view of the present embodiment microchip;
Fig. 2 is Fig. 1 microchip (a) III-III sectional view, (b) IV-IV sectional view;
Fig. 3 is the top view of the resin-made substrate being formed with stream groove;
Fig. 4 is the sectional view of injection molding forming mould of the present invention;
Fig. 5 is the upward view of fixed mould in injection molding forming mould of the present invention;
Fig. 6 is the top view of moveable die in injection molding forming mould of the present invention;
Fig. 7 is the sectional view representing pin holding member one example;
Fig. 8 is the sectional view representing other examples of pin holding member.
Detailed description of the invention
Hereinafter, with reference to the accompanying drawings of embodiments of the invention.
Fig. 1 is the top view of injection molding forming product one embodiment of the present invention and microchip 1, Fig. 2 (a) is the III-III sectional view of Fig. 1, Fig. 2 (b) is the IV-IV sectional view of Fig. 1, and Fig. 3 is the top view of the aftermentioned resin-made substrate 10 that microchip 1 possesses.
Microchip 1 has the fine structures such as trickle stream 15,16 described later, the chemical reaction carrying out the liquid samples such as nucleic acid, protein, blood therein be separated, analysis etc.
As shown in FIG. 1 to 3, this microchip 1 possesses resin-made substrate 10,20 that is laminated and the two panels rectangular plate-like that the outside of belly 10A, 20A of inner side are bonded to each other each other.
Wherein, the linearity stream groove 12,13 shown in Fig. 2 (a), Fig. 3 is formed with at the outside of belly 10A of resin-made substrate 10.And as shown in Figure 3, be formed with the through hole 14 of the thickness direction of through resin-made substrate 10 respectively at the both ends of these stream grooves 12,13.In the present embodiment, stream groove 12 and stream groove 13 are mutually orthogonal formation, but also can not be formed orthogonal.And as shown in Fig. 2 (b), Fig. 3, when seeing from above, be formed respectively at the through through hole 18 of thickness direction near the bight, two positions being in diagonal angle of resin-made substrate 10.
And as shown in Fig. 2 (a), Fig. 2 (b), Fig. 3, in the back side 10B of resin-made substrate 10, around each through hole 14, be provided with cylindric jut 31, around each through hole 18, be provided with cylindric jut 32.These juts 31,32 encirclement through hole 14,18 is also outstanding to resin-made substrate 10 thickness direction.Wherein, pipe, the nozzle of jut 31 and analytical equipment (not shown) are chimeric, carry out the importing of sample etc., discharge, and jut 32 such as to position at the use when microchip 1 is arranged to analytical equipment.This jut 31,32 can have cylindric shape, also can have other shapes such as polygon shape.The size of jut 31 can coincidence tube, the setting arbitrarily of jet size ground.
On the other hand, as shown in Fig. 2 (a), resin-made substrate 20 is parts of surface smoothing, engages with the outside of belly 10A (forming the face of stream groove 12,13) of resin-made substrate 10.Resin-made substrate 20 has the function of the lid (cover) as stream groove 12,13 and through hole 14 by this joint, and is formed between the stream groove 12 of resin-made substrate 10 and to form trickle stream 16 between trickle stream 15 and stream groove 13, form opening portion 17 by through hole 14.
And as shown in Fig. 2 (b), resin-made substrate 20 is formed to the through through hole 21 of thickness direction in each position that the through hole 18 with resin-made substrate 10 is corresponding.This through hole 21 carries out each substrate together with through hole 18 location when resin-made substrate 10 and resin-made substrate 20 are engaged uses.And through hole 21 is communicated with through hole 18 with the joint of resin-made substrate 20 by resin-made substrate 10, utilizes this through hole 18 and forms locating hole 19.When microchip 1 is arranged to not shown analytical equipment, this locating hole 19 uses as location.
At this, the shape of trickle stream 15,16 (stream groove 12,13) wants the use amount that can reduce analyzing samples, reagent, consider the making precision, replicability, somatotype etc. of shaping dies, preferable width and the degree of depth are all the shapes within the scope of 10 μm ~ 200 μm, there is no particular limitation, as long as determine just can according to the purposes of microchip.The width of trickle stream 15,16 (stream groove 12,13) can be all identical with the degree of depth, also can be different.In the present embodiment, the shape in trickle stream 15,16 cross section is rectangle, but this shape is an example, also can be that circle waits other shapes.
As mentioned above, because the through hole 14 of resin-made substrate 10 is connected with stream groove 12,13, so the opening portion 17 formed by this through hole 14 is connected with trickle stream 15,16.This opening portion 17 is the holes for carrying out gel, sample, the importing of buffer solution, preservation, discharge, be connected with the pipe set by analytical equipment (not shown), nozzle, via this pipe, nozzle and gel, sample, buffer solution etc. are imported to trickle stream 15,16, or discharge from trickle stream 15,16.
It is circular that the shape of opening portion 17 (through hole 14) and locating hole 19 (through hole 18) does not limit, and also can be other various shapes such as rectangle.And opening portion 17 (through hole 14) and locating hole 19 (through hole 18) as long as internal diameter meet analytical method and analytical equipment just can, such as preferably about 1 ~ 4mm.
As long as the shape of above resin-made substrate 10,20 shape of easy to handle shape and easily analysis, then also can be any shape, but the shapes such as such as preferred square, rectangle, circle.The preferred 10mm of size of resin-made substrate 10,20 is square ~ the square left and right of 200mm, more preferably 10mm square ~ 100mm is square.Be formed with the plate thickness of the resin-made substrate 10 of stream groove 12,13, consider formability and preferably about 0.2mm ~ 5mm, more preferably 0.5mm ~ 2mm.
As the plate thickness of resin-made substrate 20 that lid (cover) plays a role, consider formability and preferred about 0.2mm ~ 5mm, more preferably 0.5mm ~ 2mm.But as the present embodiment when resin-made substrate 20 does not form stream groove, may not be the parts of tabular as resin-made substrate 20, and use film (sheet component).At this moment, the thickness of film preferably 30 μm ~ 300 μm, more preferably 50 μm ~ 150 μm.
Resin-made substrate 10,20 utilizes injection moulding method described later to be shaped, and moulding material uses resin.Good, high, the opposing UV of the transparency of preferred formability (replicability, somatotype) and visible ray as this resin and autofluorescence is low, such as, can use thermoplastic resin.
Such as preferably use as thermoplastic resin: Merlon, polymethyl methacrylate, polystyrene, polyacrylonitrile, polyvinyl chloride, PETG, nylon 6, nylon66 fiber, polyvinyl acetate, polyvinylidene chloride, polypropylene, polyisoprene, polyethylene, dimethyl silicone polymer, cyclic polyolefin etc.Particularly preferably use polymethyl methacrylate, cyclic polyolefin.Identical material can be used for resin-made substrate 10 and resin-made substrate 20, also can use different materials.
For the resin-made substrate 20 not being formed with stream groove, except thermoplastic resin, also heat-curing resin, uv curing resin etc. can be used.Then preferably dimethyl silicone polymer is used as heat-curing resin.
Possess the microchip 1 of above structure, add thermal bonding by two resin-made substrates 10,20 are pressed and formed.As at this moment add thermal binding process and engagement device, existing known device can be used.
The injection molding forming mould (hereinafter referred to as molding die) used when then illustrating and the resin-made substrate of microchip 1 is carried out injection molding forming.
At this, the molding die 2 that the injection molding forming of resin-made substrate 10 uses only is described, the molding die that the injection molding forming for resin-made substrate 20 uses then omits the description.Resin-made substrate 20, owing to being only the shape being formed with through hole 21 at flat board, just can form so pass through use with the molding die possessing same structure for the aftermentioned molding die 2 forming through hole 14,18 at resin-made substrate 10.
Fig. 4 is the sectional view of molding die 2, and Fig. 5 is the upward view of aftermentioned fixed mould 40, and Fig. 6 is the top view of aftermentioned moveable die 50.
As shown in Figure 4, molding die 2 possesses: fixed mould 40, moveable die 50 and pin holding member 60.
As shown in Figure 4, Figure 5, fixed mould 40 is formed the substantially planar of a circle larger than resin-made substrate 10, and 40a is formed with the protuberance 41 for the formation of stream groove 12,13 and through hole 14 part below relative with moveable die 50.This protuberance 41 is formed the anti-shape corresponding with stream groove 12,13 and through hole 14 part, be formed upset shape when seeing above stream groove 12,13 and through hole 14 in detail, and to be formed with the degree of depth of stream groove 12,13 are identical height.
In the present embodiment, fixed mould 40 is suitable for eletroforming and is formed on not shown main mould, after utilizing galvanoplastic to make the metals such as nickel, nickel-cobalt alloy, Ni-Co-P alloy, copper separate out on the surface of main mould in detail, this metal is peeled off formation from main mould.Thus, fixed mould 40 utilizes above-mentioned eletroforming and is formed by the soft such as nickel, copper or brittle materials.At this, said soft or brittle materials are the materials (hardness=HRC 58 ~ 60 of SKH51) lower than SKH51 hardness.
As shown in Fig. 4, Fig. 6, moveable die 50 is formed larger than resin-made substrate 10 one substantially planar enclosed in the same manner as fixed mould 40, and above relative with fixed mould 40 50a, except stream groove 12,13 and through hole 14,18, form the die cavity 51 of the anti-shape corresponding with the shape of resin-made substrate 10.This die cavity 51 has the recess 52,53 with this jut 31,32 corresponding anti-shapes with jut 31,32 corresponding each position.Be formed with the insertion embedded hole 54,55 for inserting pin 63,64 described later with the roughly the same footpath of through hole 14,18 in the bottom surface of recess 52,53, this insertion embedded hole 54,55 is through at the thickness direction of moveable die 50.
The resin injection mouth 56 for the resin of moulding material is injected in die cavity 51 is formed in the side of moveable die 50.Moveable die 50 is formed by eletroforming in the same manner as above-mentioned fixed mould 40.
As shown in Figure 4, sell holding member 60 to possess: cover 61, base member 62, bar-shaped multiple pins 63,64 and elastomeric element 65.
Wherein, the substantially planar with fixed mould 40 and moveable die 50 same shape is formed when cover 61 is seen from above.Below cover 61, being formed with recess 61a, 61b of opening downwards with the recess 52 of moveable die 50,53 corresponding positions, being through with insertion embedded hole 61c, 61d for inserting chimeric pin 63,64 in the insertion embedded hole 54 of the bottom surface of this recess 61a, 61b and moveable die 50,55 corresponding positions to thickness direction.
Base member 62 is formed substantially planar in the same manner as cover 61, is formed with the recess 62a for accommodating elastomeric element 65 (pressing component) above.Recess 62a is formed the region below recess 61a, 61b that cover 61 is all.As long as and recess 62a be formed reach all recess 61a, 61b below region, then also can be any shape.Base member 62 is fixed with this cover 61 on circumferential edges part with under the state abutted below cover 61.Cover can be also one with moveable die.
Pin 63,64 is for the formation of the through hole 14,18 of resin-made substrate 10, be formed on one end and there is the with the level cylindric of flange part 63a, 64a, while flange part 63a, 64a are accommodated recess 61a, 61b of cover 61, be inserted into insertion embedded hole 61c, 61d of cover 61.The ratio pin 63 that pin 64 is formed grows the part of protuberance 41 height of fixed mould 40.These pin 63,64 tegmentum parts 61 and base member 62 are also clamped flange part 63a, 64a via elastomeric element 65, are retained the state erect and arrange.
Elastomeric element 65 is pressing components of the present invention, is formed tabular, the whole surface of recess 62a of the base member 62 that is laid in.Like this, elastomeric element 65 is arranged on the base end part of this pin 63,64 outside die cavity 51 and supports all pins 63,64, utilizes its elastic force that all pins 63,64 are pressed to each leading section in the lump.
As long as any one of the material elastomer of elastomeric element 65 (resin, rubber), or parallel spring or be filled with gas or liquid buffer unit just can, also they can be combined.Thus, be only that the area portions in this pin 63,64 cardinal extremity face is just enough for pressing the space of each pin 63,64.As elastomeric element (pressing component) from helical spring is arranged on the existing different of each pin cardinal extremity, the quantity of the pin that can press and size not limit by helical spring size, even multiple small pin 63,64, also can reliably press.And by elastomeric element 65 is set to above-mentioned, this elastomeric element 65 is configured to stable state, different from existing helical spring, can opposing mold be prevented and tilt, and press this pin 63,64, so multiple pin 63,64 can be pressed equably owing to elastomeric element 65 can be adjacent to the whole face in pin 63,64 cardinal extremity face.Thereby, it is possible to the situation effectively suppressing to occur gap partly between pin 63,64 and fixed mould 40 and produce burr.
As elastomer (resin, rubber), such as preferably use: the thermoplastic elastomer (TPE) etc. of fluorubber, silicon rubber, fluorosioloxane rubber, lactoprene, ethylene-propylene rubber, polyurethane rubber, acrylic compounds, polyurethanes, phenylethylene etc., be more preferably the fluorubber, silicon rubber, fluorosioloxane rubber etc. that use heat resisting temperature high.
This elastomeric element 65 is to the pressing force of pin 63,64, and during size, injection molding forming according to pin 63,64 (through hole 14,18), the temperature etc. of moulding material and mould suitably adjusts, but is the pressing force of more than 2MPa substantially.As long as the upper limit of pressing force with the pressing force that can produce elastomeric element 65 self, fixed mould 40 and pin 63,64 and be not damaged degree just can, be more preferably set in the scope of 2 ~ 55MPa.And then with pressing force be 2 ~ 15MPa as well.Pressing component is selected from the performance rubber hardness of this scope pressing force and the material of compression ratio just can.
The injection molding method of the resin-made substrate 10 using molding die 2 is then described.
First, chimeric to insertion embedded hole 54,55 insertion of moveable die 50 corresponding respectively for the pin 63,64 being erect setting by pin holding member 60, make moveable die 50 below with under the state abutted above cover 61, moveable die 50 and pin holding member 60 are fixed.Like this, pin 63,64 just becomes through moveable die 50 and erects the state that is arranged in the die cavity 51 of this moveable die 50, and the part in this die cavity 51 becomes and the through hole 14 of resin-made substrate 10,18 corresponding anti-shapes.
Then fixed mould 40 and moveable die 50 are combined into one (matched moulds).At this, pin holding member makes the 50a above of the moveable die 50 be fixed consistent with the mutual circumferential edges of 40a below fixed mould 40 while make the 50a above of moveable die 50 abut with 40a below fixed mould 40, and these fixed moulds 40 and moveable die 50 are fixed.At this moment, also parting compound can be coated with by 40a in the die cavity 51 of moveable die 50 and below fixed mould 40.
At this moment, the leading section of pin 63,64 utilizes the pressing force from elastomeric element 65 and abuts with fixed mould 40 in die cavity 51.Be exactly that the leading section of pin 63 abuts below with the protuberance 41 of fixed mould 40, and the leading section of pin 64 abuts with 40a below fixed mould 40 specifically.At this moment, do not abut with recess 61a, 61b bottom surface of cover 61 above flange part 63a, 64a of pin 63,64, utilize the pressing force of elastomeric element 65 that pin 63,64 is reliably abutted with fixed mould 40.
Then moulding material and resin is filled.Be exactly that the resin being heated to set point of temperature is injected filling from resin injection mouth 56 with the injection-molded pressure of regulation in die cavity 51 specifically.And after the cool time of regulation, the resin solidified is taken out from molding die 2, obtains the shape being replicated die cavity 51 grade thus, and utilize pin 63,64 and be formed with the resin-made substrate 10 of through hole 14,18.
When carrying out above-mentioned injection molding forming, also can use at least one of forming process below: the thermal cycle forming process that the temperature of at least one of fixed mould 40 and moveable die 50 is elevated repeatedly, continue in die cavity 51 to moulding material inject the gases at high pressure such as carbonic acid gas, nitrogen gas assist formation method, arrange for the adiabatic forming process of heat insulation layer adiabatic in die cavity 51 at least one of fixed mould 40 and moveable die 50.The mobility that can improve resin by using them realizes high copying.And as these forming processes, existing known technology can be used.
According to above molding die 2, the multiple pins 63,64 leading section being abutted in die cavity 51 when moveable die 50 this moveable die 50 ground through is provided with at matched moulds with fixed mould 40, the elastomeric element 65 that this all pins 63,64 is pressed to each leading section is provided with at the base end part of pin 63,64, therefore, utilize this elastomeric element 65 and all pins 63,64 can be pressed simultaneously, the leading section of these pins 63,64 is abutted with fixed mould 40.Thereby, it is possible to suppress resin enter between the leading section of pin 63,64 and fixed mould 40 and produce large burr.
The material of elastomeric element 65 is elastomer (resin, rubber), or parallel spring or be filled with the buffer unit of gas or liquid, be only that the area portions in this pin 63,64 cardinal extremity face is just enough for the space of each pin 63,64 of pressing.Thus, as elastomeric element (pressing component) from helical spring is arranged on the existing different of each pin cardinal extremity, even multiple small pin 63,64, also can reliably press.
And by elastomeric element 65 is set to above-mentioned, this elastomeric element 65 is configured to stable state, different from existing helical spring, can opposing mold be prevented and tilt, and press this pin 63,64, so multiple pin 63,64 can be pressed equably owing to elastomeric element 65 can be adjacent to the whole face in pin 63,64 cardinal extremity face.Thereby, it is possible to the situation effectively suppressing to occur gap partly between pin 63,64 and fixed mould 40 and produce burr.
Therefore, at the high-precision special even surface of forming requirements with there is the formed products of fine structure, using when improving the mobility of resin when realizing the high forming process copied, effectively can both suppress to produce large burr, and multiple through hole 14,18 shaping.
Because pin 63,64 is moderately pressed by elastomeric element 65, even so the fixed mould 40 formed by soft or brittle materials, also can not sustain damage due to the abutting of pin 63,64.Even and if when mold clamping force and mold temperature have variation, also the change of the pressing force with this variation can be absorbed by the elastic deformation of elastomeric element 65, make pin 63,64 reliably abut with fixed mould 40.
Owing to utilizing elastomeric element 65 that pin 63,64 can be made reliably to abut with fixed mould 40, so do not need the length dimension managing pin 63,64 accurately.Therefore, it is possible to reduction cost of manufacture, and the short time just can make.
The present invention should not be limited to interpretation as the above embodiments, certainly can have suitable change and improvement.
Such as in the above-described embodiments, lift the microchip 1 with fine structure as the injection molding forming product using molding die 2 to be shaped to be illustrated, but also can be optical mirror plane, optical spherical surface, optical aspherical surface, the freeform optics surface with optical lens etc. as this injection molding forming product, also can be have at least one of they and fine structure.
Die cavity 51 is illustrated as being formed on moveable die 50, as long as but to be formed between fixed mould 40 and moveable die 50 just can, such as also can be formed in fixed mould 40.
Pin 63,64 utilizes moveable die 50 and pin holding member 60 fix and are illustrated as being arranged on moveable die 50 side, but also can be arranged on fixed mould 40 side.
Elastomeric element 65 as pressing all pins 63,64 be illustrated, as long as but press plural pin 63,64 just can, such as shown in Figure 7, also can press this pin 63,64 to every two pins 63,64 by different multiple elastomeric elements 65.And also as shown in Figure 8, elastomeric element 65 can be arranged to and carry out pushpin 63,64 via plate member 66, the damage being caused elastomeric element 65 by the contact with pin 63,64 can be prevented like this.
It is cylindric that pin 63,64 does not limit, such as, also can be the taper that footpath diminishes towards leading section.Injection molding forming product can be made so more easily to carry out from pin 63,64 somatotype.Pin 63,64 also can flat column.
Embodiment
The present invention is further illustrated below by way of for embodiment.
As embodiments of the invention 1,2 and comparative example, according to following condition, use and be provided with the molding die 2 of elastomeric element 65 and the molding die of elastomeric element is not set, respectively resin-made substrate 10 injection molding forming of microchip 1.
< resin-made substrate >
Resin-made substrate 10 is following shapes
Size: 50mm is square
Thickness: 1.5mm
The stream degree of depth of groove 12,13 and width: 50 μm
The internal diameter of through hole 14,18: 2mm
< elastomeric element >
As embodiment 1 elastomeric element 65 and use: material is fluorubber, thickness is 2mm, compression ratio is 50%, to the pressing force of pin 63,64 are 40MPa.As embodiment 2 elastomeric element 65 and use: material is fluorubber, thickness is 2mm, compression ratio is 10%, to the pressing force of pin 63,64 are 4MPa.The ProductName F201 of the fluorubber particularly NOK Corp. used in embodiment 1,2, the fluorubber of rubber hardness A70.
< injection molding forming >
Use the propylene (Delpet: society of Asahi Chemical Industry system, the login trade mark of Chemical Co., Ltd of Asahi Chemical Industry) of transparent resin material as moulding material, utilize thermal cycle forming process to carry out injection molding forming.
< evaluates >
For the resin-made substrate 10 (embodiment 1,2) using the molding die 2 being provided with elastomeric element 65 to form and the resin-made substrate (comparative example) using the molding die not being provided with elastomeric element 65 to form, confirm the generation of burr respectively with the opening portion of microscopic examination through hole 14,18.And the pin of comparative example is the use of the pin there being more than the 5 μm such length in gap during mould matched moulds between the front end and mould of pin.
The consequently resin-made substrate 10 of embodiment 1,2, does not all produce burr in the opening portion of any through hole 14,18.On the other hand, the resin-made substrate of comparative example, all produces the burr of about 100 μm in the opening portion of any through hole.
Can confirm according to above result, use is provided with the molding die 2 of elastomeric element 65 and generation burr can be suppressed to form multiple through hole 14,18.
Symbol description
1 microchip (injection molding forming product) 2 molding dies (injection molding forming mould)
10,20 resin-made substrates (injection molding forming product) 40 fixed moulds
50 moveable die 51 die cavitys 54,55 insert embedded hole 63,64 and sell
65 elastomeric elements (pressing component)
Claims (14)
1. an injection molding forming mould, possesses fixed mould and moveable die, is formed with the die cavity of resin by injection, it is characterized in that, comprising between this fixed mould and this moveable die:
Mould, it is any one mould of described fixed mould and described moveable die, has multiple insertion embedded hole; Pin holding member;
Described pin holding member has cover, base member, bar-shaped multiple pins, the pressing component that are formed respectively,
The position that described cover is corresponding with described mould is in its lower section formed with the first recess of opening downwards, the position corresponding with the insertion embedded hole of described mould in the bottom surface of this first recess is through with the insertion embedded hole for inserting chimeric described multiple pin to thickness direction
Described base member is formed with the second recess for accommodating described pressing component above, described second recess is formed the region below described first recess that described cover is all, fix with described cover with under the state abutted below described cover on its circumferential edges part
Described multiple pin is by described cover and described base member and clamp via described pressing component, inserts described insertion embedded hole and in described die cavity, make leading section abut with another mould when matched moulds,
A described pressing component is made up of elastomeric element, be laid in the whole surface of the second recess of described base member, when described matched moulds, described multiple pin is pressed from another die side described in the base end part side direction of described multiple pin in the lump, and be configured in outside described die cavity.
2. injection molding forming mould as claimed in claim 1, is characterized in that,
The material of described pressing component is elastomer, or parallel spring, or is filled with the buffer unit of gas or liquid.
3. injection molding forming mould as claimed in claim 1 or 2, is characterized in that,
The pressing force that described pressing component gives described multiple pin is 2 ~ 55MPa.
4. injection molding forming mould as claimed in claim 1 or 2, is characterized in that,
The pressing force that described pressing component gives described multiple pin is 2 ~ 15MPa.
5. injection molding forming mould as claimed in claim 1 or 2, is characterized in that,
It is at least one of thermal cycle forming process, gas assist formation method and adiabatic forming process.
6. injection molding forming mould as claimed in claim 1 or 2, is characterized in that,
Described pressing component is formed as tabular.
7. injection molding forming mould as claimed in claim 1 or 2, is characterized in that,
Another mould described is formed by soft or brittle materials.
8. an injection molding method, uses the injection molding forming mould described in claim 1 or 2, it is characterized in that,
Moulding material is filled to copy the shape of this die cavity in described die cavity.
9. resinous injection molding forming product, use the injection molding forming mould described in claim 1 or 2 to form, it is characterized in that,
There is at least one of optical mirror plane, optical spherical surface, optical aspherical surface, freeform optics surface and fine structure.
10. injection molding forming product as claimed in claim 9, is characterized in that,
It is the microchip resin forming product with trickle stream within the scope of width and the degree of depth 10 ~ 200 μm.
11. injection molding forming moulds as claimed in claim 1 or 2, is characterized in that,
Pin containing different length in described multiple pin.
12. injection molding forming moulds as claimed in claim 1 or 2, is characterized in that,
Another mould described is formed by the material of soft or high fragility,
The pressing force that described pressing component gives described multiple pin is 2 ~ 55MPa.
13. injection molding methods as claimed in claim 8, is characterized in that,
By copying the shape of described die cavity, at least one in optical mirror plane, optical spherical surface, freeform optics surface and fine structure is at least formed to injection molding forming product,
The pressing force utilizing described pressing component to give described multiple pin is 2 ~ 55MPa.
14. injection molding methods as claimed in claim 8, is characterized in that,
The front end of described multiple pin is after pressing another mould described, and described resin injection is in described die cavity.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-078119 | 2009-03-27 | ||
| JP2009078119 | 2009-03-27 | ||
| PCT/JP2010/053224 WO2010110014A1 (en) | 2009-03-27 | 2010-03-01 | Mold for injection molding, injection molding method, and injection molded article |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102361740A CN102361740A (en) | 2012-02-22 |
| CN102361740B true CN102361740B (en) | 2015-04-29 |
Family
ID=42780707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080013258.5A Expired - Fee Related CN102361740B (en) | 2009-03-27 | 2010-03-01 | Mold for injection molding, injection molding method, and injection molded article |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5578169B2 (en) |
| CN (1) | CN102361740B (en) |
| TW (1) | TW201102252A (en) |
| WO (1) | WO2010110014A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9238322B2 (en) | 2010-10-29 | 2016-01-19 | Wako Pure Chemical Industries, Ltd. | Microchip, molding die for microchip, and manufacturing apparatus for manufacturing microchip |
| EP2687348A4 (en) * | 2011-03-17 | 2014-10-15 | Konica Minolta Inc | Method for producing resin molding die, resin molding die, resin molding die set, method for producing microchip substrate, and method for producing microchip using said die |
| JP6686539B2 (en) * | 2016-03-04 | 2020-04-22 | 住友ベークライト株式会社 | Injection molding die and injection molding method using the same |
| JP6785730B2 (en) * | 2017-08-01 | 2020-11-18 | Ｔｏｗａ株式会社 | Molding equipment and manufacturing method of resin molded products |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH025537A (en) * | 1988-06-24 | 1990-01-10 | Hitachi Ltd | Resin sealing die |
| JP3394516B2 (en) * | 2000-10-06 | 2003-04-07 | エヌイーシーセミコンダクターズ九州株式会社 | Resin sealing mold |
| JP2003251660A (en) * | 2002-03-05 | 2003-09-09 | Fuji Photo Film Co Ltd | Method for manufacturing porous body |
| JP2004114334A (en) * | 2002-09-24 | 2004-04-15 | Ono Sangyo Kk | Mold assembly and molding method |
| CN100519132C (en) * | 2005-05-24 | 2009-07-29 | 株式会社村田制作所 | Method of manufacturing insert-molded article and apparatus thereof |
| US7722792B2 (en) * | 2007-02-05 | 2010-05-25 | Canon Kabushiki Kaisha | Injection mold and partial compression molding method |
-
2010
- 2010-03-01 CN CN201080013258.5A patent/CN102361740B/en not_active Expired - Fee Related
- 2010-03-01 WO PCT/JP2010/053224 patent/WO2010110014A1/en active Application Filing
- 2010-03-01 JP JP2011505940A patent/JP5578169B2/en not_active Expired - Fee Related
- 2010-03-24 TW TW99108707A patent/TW201102252A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP5578169B2 (en) | 2014-08-27 |
| JPWO2010110014A1 (en) | 2012-09-27 |
| TW201102252A (en) | 2011-01-16 |
| CN102361740A (en) | 2012-02-22 |
| WO2010110014A1 (en) | 2010-09-30 |
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