CN102361540A - Circuit board processing method - Google Patents
Circuit board processing method Download PDFInfo
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- CN102361540A CN102361540A CN2011103202961A CN201110320296A CN102361540A CN 102361540 A CN102361540 A CN 102361540A CN 2011103202961 A CN2011103202961 A CN 2011103202961A CN 201110320296 A CN201110320296 A CN 201110320296A CN 102361540 A CN102361540 A CN 102361540A
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- cutting platform
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Abstract
The invention relates to a circuit board processing method, which comprises the following steps of: providing a cutting platform with a gas path, providing medium layers, overlapping the medium layers on the surface of the cutting platform, providing a circuit board, pressing the circuit board on the medium layer, providing a vacuumizing device, vacuumizing gas among the cutting platform and the medium layers so that a vacuum environment is formed from the cutting platform to the circuit board, and realizing adsorption and fixation among the circuit board and various medium layers. According to the method disclosed by the invention, the circuit board is fixed in a vacuum adsorption manner; a locating hole is not used; the problems of high cost, poor cutting effect and complex circuit design resulted from the arrangement of the locating hole can be effectively solved; and the locating effect is increased.
Description
Technical field
The present invention relates to a kind ofly realize between components and parts being electrically connected and the function element of signal processing, relate in particular to a kind of processing method of circuit board.
Background technology
(Printed Circuit Board almost is the basis of any electronic product PCB) to circuit board, appears in the various electronic equipments, and generally speaking, if in certain equipment, electronic devices and components are arranged, they also all are the circuit board surfaces that is installed in different sizes so.
Except fixing various components and parts, the main effect of circuit board provides the connecting circuit between each components and parts.Along with electronic equipment becomes increasingly complex, the components and parts that need are more and more, and the circuit and the components and parts on PCB surface are also more and more intensive.
Circuit board itself is to be made by the heat insulation material of insulation, is provided with conducting wire and function components and parts on its surface, and wherein the conducting wire mainly is the circuit pattern that adopts the Copper Foil material to be processed to form.When circuit board was processed to form the conducting wire, at first, Copper Foil was to be formed on circuit board surface through technologies such as deposition or plating, covers the layer structure on entire circuit plate surface.Secondly, this copper layer is carried out forming circuit pattern behind the selective etch.In this processing process, mostly the profile of circuit pattern is to form the etched profile of confession through mode of printing, so just obtain the name of circuit board.This conducting wire forms conductive pattern and is known as lead (conductor pattern) or claims wiring, and is used to provide the circuit connection that PCB goes up components and parts.
For the function components and parts are fixed on above the PCB, need their pin directly to be welded on the conducting wire.To the most basic single face circuit board, its components and parts all concentrate on wherein one side, and lead then all concentrates on another side.So, need hole,, realize conducting to run through the two opposite sides surface of circuit board at circuit board surface.Based on this, the positive and negative of PCB is called as components and parts face (Component Side) and solder side (Solder Side) respectively.
In the circuit board course of processing, as being carried out, multilayer circuit board need circuit board effectively be located in the technical processs such as excision forming, and prior art is through location hole being set at circuit board surface, running through location hole with screw or reference column etc. again and position.
Please consult Fig. 1 and Fig. 2 simultaneously, wherein Fig. 1 is a kind of and more approaching circuit board plane sketch map of the present invention of prior art, and Fig. 2 is the side sectional view that circuit board shown in Figure 1 is positioned.The conducting channel 82 that this circuit board 80 comprises substrate 81 and is laid in these substrate 81 surfaces.Non-wiring zone at this substrate 81 is provided with a plurality of location holes 83.
When this circuit board 80 is added man-hour, at first, the localization tool (figure does not show) of a tool placing platform 90 is provided, this placing platform 90 comprises a plurality of through holes 93.Then, this circuit board 80 is placed in placing platform 90 surfaces of this localization tool, and this location hole 83 through hole 93 with this placing platform 90 is corresponding one by one respectively.Then, provide a screw 91 to run through this location hole 83 and this through hole 93 simultaneously, navigate to this localization tool 90, realize effective location this circuit board 80.
Yet, utilize this screw 91 to run through this location hole 83 and this through hole 93 simultaneously, navigate to localization tool 90, because need boring, contraposition etc., can increase technology difficulty, and limit because of the processing technology precision, how accurately contraposition becomes new challenge.In addition; If desired these circuit board 80 surfaces are provided with intensive conducting wire, even cut this circuit board 80, but the existence of this location hole 83; Will certainly let wiring precision and cutting technique requirement higher; And complicated more, at the location hole place crackle or burr appear easily, and raise the cost and reduce yield.
The present invention then provides a kind of processing method of new circuit board in order to improve and to address the above problem.
Summary of the invention
The technical problem that the present invention will solve provides the good circuit board processing method of a kind of locating effect.
A kind of circuit board processing method is provided, and it may further comprise the steps: the Cutting platform of tool air flue is provided, dielectric layer is provided; And be stacked at this Cutting platform surface, and circuit board is provided, be pressed on this dielectric layer; One vacuum extractor is provided; Extract the gas between this Cutting platform, this dielectric layer, make to form vacuum environment between said Cutting platform to the circuit board, realize that absorption is fixing between circuit board and each dielectric layer.
As above-mentioned process modifications, this Cutting platform comprises first surface and the second surface that is oppositely arranged, and this air flue runs through this first surface to this second surface.
As above-mentioned process modifications, this Cutting platform also comprises a plurality of air slots and gas port, and this air slot connects each other, and this gas port and this air slot are interconnected.
As above-mentioned process modifications, this gas port one end extends to this second surface, and the end that this second surface should gas port closes in this vacuum extractor team is provided with.
As above-mentioned process modifications, this Cutting platform also comprises seal washer, and the part air slot is arranged on this first surface side, and the sealing packing ring surrounds the air slot setting of this first surface side.
As above-mentioned process modifications, the extension profile of sealing packing ring is greater than the extension profile of this dielectric layer.
As above-mentioned process modifications, this dielectric layer comprises a bakelite plate, and it is located between this Cutting platform and this circuit board.
As above-mentioned process modifications, this dielectric layer also comprises a soft pad, and this soft pad is located between this bakelite plate and this circuit board.
As above-mentioned process modifications, this dielectric layer also comprises cardboard, and this cardboard is located between this soft pad and this circuit board.
As above-mentioned process modifications, also comprise providing dog screw to fix this circuit board, this cardboard, this soft pad, this bakelite plate in the step of this Cutting platform.
Compared with prior art, the present invention has the following advantages: utilize the mode fixing circuit board of vacuum suction, avoid in the central area of circuit board location hole being set; Enlarge the wiring region area, reduce wiring density, make wires design be more prone to; Improve the product yield, reduce cost.
Description of drawings
Fig. 1 is the floor map with the more approaching a kind of circuit board of the present invention.
Fig. 2 is the side sectional view of among Fig. 1 circuit board being located.
Fig. 3 is a circuit board processing method schematic flow sheet of the present invention.
Fig. 4 is the package assembly sketch map of circuit board processing structure shown in Figure 3.
Fig. 5 is the side schematic view of cutting processing equipment shown in Figure 4.
Fig. 6 is the floor map of cutting processing equipment shown in Figure 5.
Embodiment
Specify embodiment of the present invention below in conjunction with accompanying drawing.
Circuit board can be divided into single sided board, double sided board and multi-layer sheet according to its wiring level.The single face circuit board is to have only single surface to be provided with the printed board of conductive pattern.The general paper phenol base copper-clad that adopts is made, and also often adopts epoxy paper substrate or epoxy glass fabric copper-clad plate.
The printing figures of single face circuit board is fairly simple, generally adopts the method transition diagram of silk screen process, etches printed board then, also has to adopt photochemical method to produce.
Double-sided PCB is the printed board that relative both side surface is provided with conductive pattern.Obviously, the area of double-sided PCB is bigger one times than single sided board, is suitable for than single sided board complicated circuitry more.Double-sided PCB adopts the manufacturing of epoxy glass fabric copper coated foil plate usually.It is mainly used in the higher communication electronic equipment of performance requirement, high grade instrument and meter and electronic computer etc.The production technology of double-sided PCB generally is divided into several kinds of bus bar method, plug-hole method, masking method and graphic plating one etching methods etc.
Multilayer circuit board is that the printed board that conductive pattern and insulation material layer are pressed into more than three layers or three layers is arranged.It is actually uses the multi-disc double-sided PCB, and pressing is affixed after folder between the per two adjacent double-sided PCBs is established a layer insulating forms.Its number of plies all is an even number usually, and comprises outermost two-layer.From the angle of technology, can accomplish nearly 100 layers pcb board, but the motherboard of present computer all is 4～8 layers a structure.
Multilayer circuit board generally adopts the epoxy glass fabric copper clad laminate.In order to improve the reliability of plated-through hole, should select for use as far as possible resistant to elevated temperatures, the substrate size good stability, particularly the thickness direction thermal coefficient of expansion is less, and the new material that reaches unanimity with the copper coating thermal coefficient of expansion.Make multilayer circuit board; Earlier make the inner conductor figure, then according to designing requirement, multi-disc inner conductor graphics overlay with the Copper Foil etching method; Be placed in the special-purpose hot-press equipment; Through hot pressing, bonding process, just processed the laminated sheet that covers Copper Foil with internal layer conductive pattern, the manufacturing process of following process operation and two-sided hole metallization printed board is basic identical.
No matter be single face circuit board, double-sided PCB or multilayer circuit board, it all need cut to circuit board in the course of processing.
Please combine to consult Fig. 3 and shown in Figure 4, wherein Fig. 3 is the sketch map of circuit board processing method of the present invention, and Fig. 4 is the locating structure texture edge sketch map in the circuit board course of processing shown in Figure 3.
Provide a circuit board 15 and to be processed to cut process equipment 11.11 pairs of these circuit boards 15 of this cutting processing equipment position cutting processing.When adopting 11 pairs of these circuit boards 15 of this cutting processing equipment to add man-hour, its processing locating structure structure is as shown in Figure 4.
This cutting processing equipment 11 comprises cutting platform 110, a seal washer 114 and a vacuum extractor 115.This Cutting platform 110 comprises a plurality of air slot 111, a plurality of gas port that runs through each other 113, and is concrete like Fig. 5 and shown in Figure 6.
This Cutting platform 110 is plane placing platform, and it comprises first surface 1101 and second surface 1102 that two relative spacings are provided with.This first surface 1101 is placed in horizontal direction in order to carry circuit board to be processed 15, and these first surface 1101 surperficial tools are smooth, that is, it is consistent with horizontal plane that its surface is tending towards.This second surface 1102 is the plane of surfacing equally, and it is parallel to this first plane 1101 and is provided with.
These a plurality of air slots were laid in this Cutting platform 110 in 111 minutes, and part air slot 111 is arranged on the first surface side of this Cutting platform 110, and is exposed in the air, and these a plurality of air slots 111 run through directly or indirectly connection each other each other in length and breadth.In these Cutting platform 110 inside, part air slot 111 embeds and is arranged in this Cutting platform 110.These gas port 113 1 ends and this second surface 1102 flush; The other end then extends to this Cutting platform 110 inside; And be interconnected with this air slot 111, thus, realize gas circulations to these second surface 1102 directions from this first surface 1101 through this air slot 111, this gas port 113.
Sealing packing ring 114 is one in order to sealing this Cutting platform fringe region, and avoids the soft hollow spacer of gas leak, and it can be an elastomeric material.Sealing packing ring 114 folded this first surface 1101 sides that are located at, the outer ledge of sealing packing ring 114 surrounds these air slot 111 regions.
The second surface 1102 that this vacuum extractor 115 closes on this Cutting platform 110 is provided with, and the bleeding point of its end is corresponding to the port of this gas port 113.
Form the gas communication circulation air flue from first surface 1101 to this vacuum extractor 115 of this Cutting platform 110 thus, that is, gas via behind this air slot 111 and this gas port 113, gets into this vacuum extractor 115 successively from these first surface 1101 outsides.When 115 work of this vacuum extractor, its can Automatic Extraction gas from this first surface 1101 to this second surface 1102.
When adopting 11 pairs of these circuit boards of this cutting processing equipment to process the location, its processing locating structure structure is specifically as shown in Figure 4.This processing locating structure 1 comprises cutting processing equipment 11, bakelite plate 21, soft pad 23, cardboard 25, dog screw 27 and circuit board 15 to be processed.
The extension profile of the seal washer 114 of this cutting processing equipment 11 is a bit larger tham the extension profile of this bakelite plate 21.This bakelite plate 21, this soft pad 23, these cardboard 25 surfaces are provided with a plurality of location holes (indicating).This bakelite plate 21, this soft pad 23, this cardboard 25 stack gradually between the first surface that is located in this circuit board 15 and this Cutting platform 110; That is to say; To these circuit board 15 directions, this Cutting platform 110, this bakelite plate 21, this soft pad 23, this cardboard 25 and this circuit board 15 order successively are provided with from this Cutting platform 110.
This bakelite plate 21 is a kind of insulation type wood materials that adopt phenolic resins to be processed into, and it is used to satisfy the location of different model product.Simultaneously, have higher coefficient of friction between this bakelite plate 21 and this Cutting platform 110, therefore,, also can not produce between this bakelite plate 21 and this Cutting platform 110 and slide and the influence location, realize effectively location even if because under the pressing effect.In addition, because the material of this bakelite plate 21 is different from Cutting platform 110, its hardness is weaker than Cutting platform 110 itself, and the buffer protection of cutting operation also can be provided, and prevents the cutting tool operate miss, touches this Cutting platform 110 after cutting this circuit board 15.
This soft pad 23 is fitted in this bakelite plate 21 surfaces, is used to remedy the nonflatness of this bakelite plate 12, for adjacent two layer medium up and down compression stroke is provided simultaneously; Avoid in the pressing process; Because the excessive stress that causes of pressure is concentrated, remedy the on-plane surface buffering, play the anti-function of cutting simultaneously.
This cardboard 25 is pressed on said soft pad 23 surfaces, further promotes flatness, effectively protects soft pad 23, this bakelite plate 21 and this Cutting platform 110.
This dog screw 27 is fixed with first surface 1101 threaded engagement of this Cutting platform 110 after running through the location hole of this circuit board 15, this cardboard 25, this soft pad 23, this bakelite plate 21 successively.The aperture of this location hole is a bit larger tham the diameter of this dog screw 27, so, when this assembling should be processed locating structure 1, there is the gap between the inwall of this dog screw 27 and this location hole, simultaneously, also make things convenient for running through of this dog screw 27.
When adopting 11 pairs of these circuit boards 15 of this cutting processing equipment to add man-hour, its procedure of processing is following:
Step S1 provides the Cutting platform 110 of this tool air flue;
This Cutting platform 110 comprises first surface 1101, second surface 1102 and the air flue that is oppositely arranged.This air flue runs through the first surface 1101 and the second surface 1102 of this Cutting platform.This air flue is to be connected and formed by the air slot 111 of this first surface 1101, this gas port 113.
Step S2 provides this bakelite plate 21 to be stacked at this Cutting platform 110;
This bakelite plate 21 is located at this first surface 1101 sides, and with the first surface 1101 tight butt settings of this Cutting platform 110.
Step S3 provides this soft pad 23 to be stacked at this bakelite plate 21 surfaces, makes these bakelite plate 21 butts be located between this first surface 1101 and this soft pad 23;
Step S4 provides this cardboard 25 to be pressed on this soft pad 23 surfaces, makes that these soft pad 23 butts are located between this bakelite plate 21 and this cardboard 25;
Step S5 provides circuit board 15, and closely butt is pressed on this cardboard 25 surfaces, forms processing locating structure 1.
Step S6 provides this dog screw 27 fixing these circuit boards 15, this cardboard 25, this soft pad 23, this bakelite plate 21 in this Cutting platform 110;
In this step; This circuit board 15, this cardboard 25, this soft pad 23, these bakelite plate 21 surfaces all are provided with location hole; This dog screw 27 runs through this location hole; Be fixed this circuit board 15, this cardboard 25, this soft pad 23, this bakelite plate 21 in this Cutting platform 110, form processing locating structure 1.
Step S7 provides this vacuum extractor 115, and this processing locating structure 1 is vacuumized.
In this step, the second surface 1102 that this vacuum extractor 115 closes on this Cutting platform 110 is provided with, and the corresponding gas port 113 with this Cutting platform 110 of the aspirating hole of this vacuum extractor 115 is provided with.When these vacuum extractor 115 work; It can Automatic Extraction should process locating structure 1 gas inside to outside; Make between this circuit board 15, this cardboard 25, this soft pad 23, this bakelite plate 21 and this Cutting platform 110 all closely butt; Fixed relative to one another, combine closely into overall structure.
Thus, form to accomplish the overall fixed structure, follow-up circuit board 15 after fixing carries out cutting processing technology to this.
In above-mentioned steps, the F that can exert pressure among the step S7, the feasible effect that vacuumizes is better; Generally, vacuumize be by vacuum extractor 115 from this processing locating structure 1, promptly the bottom surface of the structure after the stack of each element in the above-mentioned steps is extracted; Make the air between each layer extract out, utilize vacuum adsorption principle, each layer is close together; And, carry out the following process of this circuit board 115 again by this circuit board 15 of the location of the frictional force between this bakelite plate 21 and this Cutting platform 110.Certainly; In the actual course of processing, this vacuum extractor 115 is not limited to be arranged on second surface 1102 sides, and it can also be arranged on the side; Be intended to extract out this circuit board 15 and other dielectric layers; Like the air between bakelite plate 21, soft pad 24 and the cardboard 25 etc., form vacuum environment, realize that efficacy of adsorption is all in the invention aim of this case.
Compared to prior art, the central area of this circuit board 15 need not be provided with extra location hole, and relies on the vacuum suction pattern to realize the location; Enlarge the surface wiring area of circuit board 15, reduce wiring density, make circuit board wiring technology be more prone to; Improve yield, reduce cost.
In the above-mentioned processing method, this cardboard 25 is used for further improving the flatness on composition surface, inessential element.In addition, these bakelite plate 21 preferred ether amine plates; This soft pad 23 can be soft plastic board, perhaps silica gel plate.
The above is merely preferred embodiments of the present invention; Protection scope of the present invention is not exceeded with above-mentioned execution mode; As long as the equivalence that those of ordinary skills do according to disclosed content is modified or changed, all should include in the protection range of putting down in writing in claims.
Claims (10)
1. circuit board processing method, it is characterized in that: this method may further comprise the steps:
The Cutting platform of tool air flue is provided;
Dielectric layer is provided, and is stacked at this Cutting platform surface;
Circuit board is provided, is pressed on this dielectric layer;
One vacuum extractor is provided, extracts the gas between this Cutting platform, this dielectric layer, make to form vacuum environment between said Cutting platform to the circuit board, realize that absorption is fixing between circuit board and each dielectric layer.
2. circuit board processing method according to claim 1 is characterized in that: this Cutting platform comprises first surface and the second surface that is oppositely arranged, and this air flue runs through this first surface to this second surface.
3. circuit board processing method according to claim 1 is characterized in that: this Cutting platform also comprises a plurality of air slots and gas port, and this air slot connects each other, and this gas port and this air slot are interconnected.
4. circuit board processing method according to claim 3 is characterized in that: this gas port one end extends to this second surface, and this vacuum extractor is provided with the end of should gas port closing on this second surface.
5. circuit board processing method according to claim 4 is characterized in that: this Cutting platform also comprises seal washer, and the part air slot is arranged on this first surface side, and the sealing packing ring surrounds the air slot setting of this first surface side.
6. circuit board processing method according to claim 5 is characterized in that: the extension profile of sealing packing ring is greater than the extension profile of this dielectric layer.
7. circuit board processing method according to claim 1 is characterized in that: this dielectric layer comprises a bakelite plate, and it is located between this Cutting platform and this circuit board.
8. circuit board processing method according to claim 7 is characterized in that: this dielectric layer also comprises a soft pad, and this soft pad is located between this bakelite plate and this circuit board.
9. circuit board processing method according to claim 8 is characterized in that: this dielectric layer also comprises cardboard, and this cardboard is located between this soft pad and this circuit board.
10. circuit board processing method according to claim 9 is characterized in that: also comprise providing dog screw to fix this circuit board, this cardboard, this soft pad, this bakelite plate in the step of this Cutting platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103202961A CN102361540A (en) | 2011-10-19 | 2011-10-19 | Circuit board processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103202961A CN102361540A (en) | 2011-10-19 | 2011-10-19 | Circuit board processing method |
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| Publication Number | Publication Date |
|---|---|
| CN102361540A true CN102361540A (en) | 2012-02-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103202961A Pending CN102361540A (en) | 2011-10-19 | 2011-10-19 | Circuit board processing method |
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| CN (1) | CN102361540A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104427772A (en) * | 2013-09-10 | 2015-03-18 | 北大方正集团有限公司 | Circuit board molding method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2335340Y (en) * | 1998-04-01 | 1999-08-25 | 大量工业股份有限公司 | Charging/discharging mechanism for printed-circuit board formation machine |
| CN1257402A (en) * | 1998-12-02 | 2000-06-21 | 味之素株式会社 | Vacuum laminating method for adhering film |
-
2011
- 2011-10-19 CN CN2011103202961A patent/CN102361540A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2335340Y (en) * | 1998-04-01 | 1999-08-25 | 大量工业股份有限公司 | Charging/discharging mechanism for printed-circuit board formation machine |
| CN1257402A (en) * | 1998-12-02 | 2000-06-21 | 味之素株式会社 | Vacuum laminating method for adhering film |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104427772A (en) * | 2013-09-10 | 2015-03-18 | 北大方正集团有限公司 | Circuit board molding method |
| CN104427772B (en) * | 2013-09-10 | 2018-03-23 | 北大方正集团有限公司 | Circuit board molding method |
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Address after: 518035 bell industrial estate, West Township, Shenzhen, Baoan District, Guangdong Applicant after: Shenzhen Wuzhu Technology Co., Ltd. Co-applicant after: Dongguan Wuzhu Electronic Technology Co., Ltd. Address before: 518035 bell industrial estate, West Township, Shenzhen, Baoan District, Guangdong Applicant before: Shenzhen City Wuzhou Circuit Group Ltd. Co-applicant before: Dongguan Wuzhu Electronic Technology Co., Ltd. |
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Free format text: CORRECT: APPLICANT; FROM: SHENZHEN CITY WUZHOU CIRCUIT GROUP LTD. TO: SHENZHEN WUZHU TECHNOLOGY CO., LTD. |
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Application publication date: 20120222 |