CN102347293A - Chip packaging structure with good heat radiation performance - Google Patents
Chip packaging structure with good heat radiation performance Download PDFInfo
- Publication number
- CN102347293A CN102347293A CN2011102918601A CN201110291860A CN102347293A CN 102347293 A CN102347293 A CN 102347293A CN 2011102918601 A CN2011102918601 A CN 2011102918601A CN 201110291860 A CN201110291860 A CN 201110291860A CN 102347293 A CN102347293 A CN 102347293A
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- CN
- China
- Prior art keywords
- chip
- heat
- packaging structure
- radiation performance
- excellent radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a chip packaging structure with a good heat radiation performance. The chip packaging structure mainly comprises a substrate, a chip, a pin body, sealing glue and a heat abstractor. The structure is characterized in that: the chip is arranged above the substrate and is completely located in the sealing glue; the chip is electrically connected with one end of the pin body through a lead and the other end of the pin body stretches out of the sealing glue to be connected with an externally-arranged circuit board; the heat abstractor is arranged above the chip, one end of the heat abstractor is contacted with the upper surface of the chip and the other end stretches out of the sealing glue to radiate heat. The invention discloses the chip packaging structure with the good heat radiation performance, and the heat abstractor which is internally arranged in the chip packaging structure can be used for effectively transferring and dissipating the heat energy released by the chip in the sealing glue so that the efficient operation of the chip is ensured; and meanwhile, the chip packaging structure provided by the invention is simple in process implementing and low in cost and is suitable for the production in batches.
Description
Technical field
The present invention relates to a kind of chip-packaging structure, relate in particular to a kind of chip-packaging structure of effective raising chip cooling performance, belong to the chip encapsulation technology field.
Background technology
Chip encapsulation technology wraps up chip exactly, contacts with extraneous to avoid chip, prevents a kind of technology of the infringement of outer bound pair chip.Airborne impurity and bad air, so steam all can corrode the precision circuit on the chip, and then cause electric property to descend.Different encapsulation technologies is widely different in manufacturing process and process aspect, and crucial effects is also played to the performance of memory chip self performance in the encapsulation back.Along with the develop rapidly of photoelectricity, little electric manufacturing process technology, electronic product all the time towards littler, gentlier, more cheap direction develops, so the packing forms of chip component also constantly is improved.
In the existing chip encapsulating structure, chip is wrapped in the injection molding body mostly, mainly carries out heat transmission through the metal and the external world that is connected with chip, and heat-sinking capability is limited, influences the stability of chip operation.
Summary of the invention
To the demand, the invention provides a kind of chip-packaging structure of excellent radiation performance, the heat that this encapsulating structure chips is discharged can effectively distribute through the heat abstractor that is provided with on it, has guaranteed the normal operation of chip; Simultaneously, this heat abstractor does not influence the encapsulation performance and the electrical connection properties of chip.
The present invention is a kind of chip-packaging structure of excellent radiation performance; This chip-packaging structure mainly comprises substrate, chip, pin body, adhesive body and heat abstractor; It is characterized in that; Described chip is arranged on the substrate top; And be in adhesive body inside fully; Be electrical connected through lead and the generation of pin body one end; The other end of described pin body stretches out adhesive body; Link to each other with external circuit board; Described heat abstractor is arranged on the chip top; One end contacts with chip upper surface, and the other end stretches out adhesive body and dispels the heat outward.
In the present invention's one preferred embodiment, described heat abstractor is made up of outer heating panel, heat conducting bar and heat-conducting seat.
In the present invention's one preferred embodiment, described heat-conducting seat contacts with chip upper surface, and its contact area is 2-3 a times of heat conducting bar cross-sectional area.
In the present invention's one preferred embodiment, adopt heat-conducting glue to be connected between described heat-conducting seat and the chip upper surface.
In the present invention's one preferred embodiment, the size of the quantity of described heat-conducting seat and chip and heat radiation thereof require relevant, are generally 2-4.
In the present invention's one preferred embodiment, described heat conducting bar one end stretches out adhesive body, and its extension elongation is 0.2-0.5mm.
In the present invention's one preferred embodiment, described outer heating panel thickness is 0.1-0.3mm, and its area of dissipation is 1.5-2. a times of chip area.
In the present invention's one preferred embodiment, described heat-conducting seat and heat conducting bar are all selected the heat conductivility excellent material for use, adopt alloying or split casting technology to prepare, and prepare moulding through welding procedure; Heating panel then adopts the material casting of excellent radiation performance, passes through welding fabrication between itself and the heat conducting bar.
The present invention has disclosed a kind of chip-packaging structure of excellent radiation performance, and the built-in heat abstractor of this chip-packaging structure can effectively conduct the heat that chip discharged in the adhesive body and distribute, and has guaranteed the efficient operation of chip; Simultaneously, this chip-packaging structure process implementing is easy, and cost is low, is applicable to batch process.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is done further detailed explanation:
Fig. 1 is the structural representation of the chip-packaging structure of embodiment of the invention excellent radiation performance;
Fig. 2 is the structural representation of heat abstractor in the chip-packaging structure of embodiment of the invention excellent radiation performance;
The mark of each parts is following in the accompanying drawing: 1, substrate, 2, chip, 3, the pin body, 4, adhesive body, 5, heat abstractor, 6, lead, 7, outer heating panel, 8, heat conducting bar, 9, heat-conducting seat.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is set forth in detail, thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that.
Fig. 1 is the structural representation of the chip-packaging structure of embodiment of the invention excellent radiation performance; Fig. 2 is the structural representation of heat abstractor in the chip-packaging structure of embodiment of the invention excellent radiation performance; This chip-packaging structure mainly comprises substrate 1, chip 2, pin body 3, adhesive body 4 and heat abstractor 5; It is characterized in that; Described chip 2 is arranged on substrate 1 top; And be in adhesive body 4 inside fully, and being electrical connected through lead 6 and the generation of pin body 3 one ends, the other end of described pin body 3 stretches out adhesive body 4; Link to each other with external circuit board; Described heat abstractor 5 is arranged on chip 2 tops, and an end contacts with chip 2 upper surfaces, and the other end stretches out adhesive body 4 outer heat radiations.
The thickness of outer heating panel 7 is 0.1-0.3mm, and its area of dissipation is 1.5-2. a times of chip 2 areas; The material casting that heating panel 7 adopts excellent radiation performance, this material can be; Heating panel adopts casting, passes through welding fabrication between itself and the heat conducting bar.
The present invention has disclosed a kind of chip-packaging structure of excellent radiation performance, is characterized in: the built-in heat abstractor of this chip-packaging structure can effectively conduct the heat that chip discharged in the adhesive body and distribute, and has guaranteed the efficient operation of chip; Simultaneously, this chip-packaging structure process implementing is easy, and cost is low, is applicable to batch process.
The above; It only is the specific embodiment of the present invention; But protection scope of the present invention is not limited thereto; Any those of ordinary skill in the art are in the technical scope that the present invention disclosed; Variation or the replacement that can expect without creative work all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range that claims were limited.
Claims (8)
1. the chip-packaging structure of an excellent radiation performance; This chip-packaging structure mainly comprises substrate, chip, pin body, adhesive body and heat abstractor; It is characterized in that; Described chip is arranged on the substrate top; And be in adhesive body inside fully; Be electrical connected through lead and the generation of pin body one end; The other end of described pin body stretches out adhesive body; Link to each other with external circuit board; Described heat abstractor is arranged on the chip top; One end contacts with chip upper surface, and the other end stretches out adhesive body and dispels the heat outward.
2. the chip-packaging structure of excellent radiation performance according to claim 1 is characterized in that, described heat abstractor is made up of outer heating panel, heat conducting bar and heat-conducting seat.
3. the chip-packaging structure of excellent radiation performance according to claim 2 is characterized in that, described heat-conducting seat contacts with chip upper surface, and its contact area is 2-3 a times of heat conducting bar cross-sectional area.
4. the chip-packaging structure of excellent radiation performance according to claim 3 is characterized in that, adopts heat-conducting glue to be connected between described heat-conducting seat and the chip upper surface.
5. the chip-packaging structure of excellent radiation performance according to claim 3 is characterized in that, the size of the quantity of described heat-conducting seat and chip and heat radiation thereof require relevant, is generally 2-4.
6. the chip-packaging structure of excellent radiation performance according to claim 2 is characterized in that, described heat conducting bar one end stretches out adhesive body, and its extension elongation is 0.2-0.5mm.
7. the chip-packaging structure of excellent radiation performance according to claim 2 is characterized in that, described outer heating panel thickness is 0.1-0.3mm, and its area of dissipation is 1.5-2. a times of chip area.
8. the chip-packaging structure of excellent radiation performance according to claim 2 is characterized in that, described heat-conducting seat and heat conducting bar are all selected the heat conductivility excellent material for use, adopts alloying or split casting technology to prepare, and prepares moulding through welding procedure; Heating panel then adopts the material casting of excellent radiation performance, passes through welding fabrication between itself and the heat conducting bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102918601A CN102347293A (en) | 2011-09-30 | 2011-09-30 | Chip packaging structure with good heat radiation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102918601A CN102347293A (en) | 2011-09-30 | 2011-09-30 | Chip packaging structure with good heat radiation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102347293A true CN102347293A (en) | 2012-02-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN2011102918601A Pending CN102347293A (en) | 2011-09-30 | 2011-09-30 | Chip packaging structure with good heat radiation performance |
Country Status (1)
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| CN (1) | CN102347293A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115132678A (en) * | 2022-08-30 | 2022-09-30 | 北京象帝先计算技术有限公司 | Wafer, wafer manufacturing method, chip manufacturing method, and electronic apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04122053A (en) * | 1990-09-12 | 1992-04-22 | Fujitsu Ltd | Package method of semiconductor chip |
| US5396947A (en) * | 1992-03-03 | 1995-03-14 | Itoh Research & Development Laboratory Co., Ltd | Radiating device |
| CN101276793A (en) * | 2007-03-27 | 2008-10-01 | 夏普株式会社 | Semiconductor device, heat sink, semiconductor chip, interposer substrate, and glass plate |
| CN101752327A (en) * | 2008-12-01 | 2010-06-23 | 矽品精密工业股份有限公司 | Semiconductor packaging piece with heat dissipation structure |
| CN101840895A (en) * | 2010-04-29 | 2010-09-22 | 南通富士通微电子股份有限公司 | High heat dissipation spherical array package structure |
-
2011
- 2011-09-30 CN CN2011102918601A patent/CN102347293A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04122053A (en) * | 1990-09-12 | 1992-04-22 | Fujitsu Ltd | Package method of semiconductor chip |
| US5396947A (en) * | 1992-03-03 | 1995-03-14 | Itoh Research & Development Laboratory Co., Ltd | Radiating device |
| CN101276793A (en) * | 2007-03-27 | 2008-10-01 | 夏普株式会社 | Semiconductor device, heat sink, semiconductor chip, interposer substrate, and glass plate |
| CN101752327A (en) * | 2008-12-01 | 2010-06-23 | 矽品精密工业股份有限公司 | Semiconductor packaging piece with heat dissipation structure |
| CN101840895A (en) * | 2010-04-29 | 2010-09-22 | 南通富士通微电子股份有限公司 | High heat dissipation spherical array package structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115132678A (en) * | 2022-08-30 | 2022-09-30 | 北京象帝先计算技术有限公司 | Wafer, wafer manufacturing method, chip manufacturing method, and electronic apparatus |
| CN115132678B (en) * | 2022-08-30 | 2023-03-14 | 北京象帝先计算技术有限公司 | Wafer, wafer manufacturing method, chip manufacturing method, and electronic apparatus |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120208 |