CN102347262B - Electronic component conveying device and mounting machine - Google Patents

Electronic component conveying device and mounting machine Download PDF

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Publication number
CN102347262B
CN102347262B CN201110186575.3A CN201110186575A CN102347262B CN 102347262 B CN102347262 B CN 102347262B CN 201110186575 A CN201110186575 A CN 201110186575A CN 102347262 B CN102347262 B CN 102347262B
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China
Prior art keywords
accommodation device
wafer
wafer accommodation
supplying apparatus
guide rail
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CN201110186575.3A
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CN102347262A (en
Inventor
小木曾武
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Yamaha Motor Co Ltd
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Yamaha Motor Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides an electronic component conveying device and a mounting machine. The electronic component conveying device comprises a wafer holding device capable of moving relative to the ground; a component supply device arranged on the ground and capable of being connected with the wafer holding device; a guide rail arranged on one side of the component supply device and the wafer holding device; and a guide member arranged on the other side of the component supply device and the wafer holding device. The wafer holding device is guided along the guide rail when connected with the component supply device or separated from the component supply device. The wafer holding device moves along a specific direction so as to be connected with the component supply device or separated from the component supply device. The end of one side of the specific direction toward the component supply device is equipped with a support part for supporting the wafer holding device with respect to the ground. When the wafer holding device is connected with the component supply device, the support part of the wafer holding device is off the ground through the guide rail and the guide member.

Description

Electronic component conveying device and fitting machine
Technical field
The present invention relates to a kind ofly possess wafer accommodation device that can be mobile on the ground and be arranged on ground and can be linked to the electronic component conveying device of component supplying apparatus of described wafer accommodation device and the fitting machine that possesses this electronic component conveying device.
Background technology
All the time, as possessing, take in liquid crystal panel transportation vehicle that can be mobile on the ground and be arranged on ground and can be linked to the conveyance shifting apparatus of the liquid crystal panel manufacturing installation of described transportation vehicle, for example known device that has (Japan) JP 2003-176021 communique (hereinafter referred to as patent documentation 1) to record.
In this patent documentation 1, disclose a kind of for transportation vehicle being linked to the structure of liquid crystal panel manufacturing installation.The liquid crystal panel manufacturing installation that the document 1 is recorded possesses: the pair of guide rails that guides the movement of transportation vehicle when linking; And for locating a pair of trepanning of transportation vehicle.On the other hand, transportation vehicle possesses a pair of guide block in the position corresponding with described pair of guide rails, and possesses a pair of alignment pin in the position corresponding with described a pair of trepanning.; when transportation vehicle and the link of liquid crystal panel manufacturing installation; along with transportation vehicle is moved to liquid crystal panel manufacturing installation; the a pair of guide block of transportation vehicle is directed along the pair of guide rails of liquid crystal panel manufacturing installation; while further making transportation vehicle move, a pair of trepanning that a pair of alignment pin of transportation vehicle inserts liquid crystal panel manufacturing installation is to complete link.And the position relationship of the transportation vehicle under connecting state and liquid crystal panel manufacturing installation is determined by described trepanning and described alignment pin.In addition, the conveyance shifting apparatus that this patent documentation 1 is recorded is to make, in the situation that the good not alignment pin of the smooth degree on ground also can insert trepanning, to consider and make the size of trepanning have (play) more than needed with respect to alignment pin.
On the other hand,, possess with respect to ground wafer accommodation device and be arranged on ground and can be linked to the electronic component conveying device of component supplying apparatus of described wafer accommodation device known movably all the time.In this electronic component conveying device, at wafer accommodation device, be linked under the state of component supplying apparatus, from wafer accommodation device, wafer be transplanted on to component supplying apparatus.In component supplying apparatus, wafer remains under the state of posture of appointment, to supplying with for installing mechanism electronic component being installed on substrate the electronic component that forms described wafer.
In addition, for this electronic component conveying device, as the link structure of wafer accommodation device and component supplying apparatus, also can consider that applicable transportation vehicle as described in Patent Document 1 and the link of liquid crystal panel manufacturing installation construct.But, in the link structure that patent documentation 1 is recorded, owing to making to determine that the size of trepanning of the position relationship of transportation vehicle and liquid crystal panel manufacturing installation has (play) more than needed with respect to alignment pin, therefore in the situation that the smooth degree on ground is good not, the relative position relation of the transportation vehicle in connecting state and liquid crystal panel manufacturing installation is parallel deviate sometimes.Therefore the link structure of, this patent documentation 1 being recorded also can produce same problem while being applicable to existing electronic component conveying device.; in the situation that the smooth degree on ground is good not; the relative position relation parallel deviate of wafer accommodation device and component supplying apparatus, when sending wafer from wafer accommodation device to component supplying apparatus sidesway, wafer is transferred under the state tilting with respect to component supplying apparatus.In this case, exist component supplying apparatus and wafer in handover process to interfere, or can not keep with correct posture the problem of wafer in component supplying apparatus.
Summary of the invention
Even if the object of the present invention is to provide a kind of in the situation that the smooth degree on ground is good not, also can under connecting state, keep more abreast electronic component conveying device and the fitting machine of the relative position relation of wafer accommodation device and component supplying apparatus.
The electronic component conveying device of one aspect of the present invention comprises: wafer accommodation device, take in the wafer that comprises electronic component and removable with respect to ground; Component supplying apparatus, is arranged on described ground and can be linked to described wafer accommodation device; Guide rail, is arranged among described component supplying apparatus and described wafer accommodation device; and guide member, be arranged on another among described component supplying apparatus and described wafer accommodation device, described wafer accommodation device links with respect to described component supplying apparatus or is directed along described guide rail when separated, wherein, described wafer accommodation device, by moving and link or separation with respect to this component supplying apparatus along specific direction with respect to described component supplying apparatus, and towards the end of component supplying apparatus one side, possesses the support that can support this wafer accommodation device with respect to described ground at described specific direction, described guide rail and described guide member are linked under the state of described component supplying apparatus at described wafer accommodation device, make the described support of described wafer accommodation device leave described ground, described component supplying apparatus and described wafer accommodation device at least one of them comprises stopper, when described wafer accommodation device is moved along the link direction that this wafer accommodation device is linked with respect to described component supplying apparatus, this stopper moves and to moving with the direction of described link direction quadrature to described link direction at this wafer accommodation device of position limitation of the support built on stilts of the described component supplying apparatus side of described wafer accommodation device, described stopper has is located at the jut of described guide rail and the abutting part of the concavity of being located at described wafer accommodation device and described jut being guided, by described jut being connected to the medial end of described abutting part, limiting described wafer accommodation device moves to described link direction.
Accompanying drawing explanation
Fig. 1 means the integrally-built front view of the fitting machine (state that does not link wafer accommodation device) of an embodiment of the invention.
Fig. 2 means the vertical view of the overall structure (state that does not link wafer accommodation device) of the fitting machine of an embodiment of the invention.
Fig. 3 means the integrally-built front view of the fitting machine (state that links wafer accommodation device) of an embodiment of the invention.
Fig. 4 means the vertical view of the overall structure (state that links wafer accommodation device) of the fitting machine of an embodiment of the invention.
Fig. 5 is the stereogram of the primary structure key element of the summary fitting machine that represents an embodiment of the invention.
Fig. 6 means the stereogram of the guide rail on the base station of the fitting machine that is arranged on an embodiment of the invention.
Fig. 7 means the stereogram of wafer accommodation device of the fitting machine of an embodiment of the invention.
Fig. 8 means the stereogram of sidepiece of wafer accommodation device of the fitting machine of an embodiment of the invention.
Fig. 9 means the cutaway view of supporting device of wafer accommodation device of the fitting machine of an embodiment of the invention.
Figure 10 means the block diagram of control system of the fitting machine of an embodiment of the invention.
Figure 11 means the cutaway view of base station inside of the fitting machine of an embodiment of the invention.
Figure 12 is for the upward view of link action (before link) of wafer accommodation device of the fitting machine of an embodiment of the invention is described.
Figure 13 is the phantom observed from the side for the link action (before link) of wafer accommodation device of fitting machine of an embodiment of the invention is described.
Figure 14 is the phantom observed from the side for the link action (link process) of wafer accommodation device of fitting machine of an embodiment of the invention is described.
Figure 15 is for the upward view of link action (after linking) of wafer accommodation device of the fitting machine of an embodiment of the invention is described.
Figure 16 is the phantom observed from the side for the link action (after linking) of wafer accommodation device of fitting machine of an embodiment of the invention is described.
Embodiment
Below with reference to Fig. 1 to Figure 11, the structure of the fitting machine of an embodiment of the invention is described.In addition,, for specific direction relation, XYZ rectangular axes are shown in the drawings aptly.X-direction is the direction parallel with horizontal plane, Y direction be on horizontal plane with the direction of X-direction quadrature, Z-direction be respectively with the direction of X-axis and Y-axis quadrature.
Fitting machine is so-called compound fitting machine, and it can take out bare chip and (assembling) is installed and to printed circuit board (PCB) P, go up from the wafer W through crystal grain cutting, and the potted element of being supplied with by component supplying apparatus 300 etc. is installed on printed circuit board (PCB) P.
As shown in Figures 1 to 4, fitting machine comprises the fitting machine main body 100 that is fixedly installed with respect to ground F and is removable and can be linked to wafer (wafer) accommodation device 200 of fitting machine main body 100 with respect to ground F.In addition, fitting machine main body 100(is except aftermentioned installation portion 4) be an example of " component supplying apparatus " of the present invention, wafer accommodation device 200 and fitting machine main body 100(are except aftermentioned installation portion 4) be an example of " electronic component conveying device " of the present invention.
As shown in Figures 1 to 4, this fitting machine main body 100 comprises: base station 1; For printed circuit board (PCB) P being moved into or is taken out of the conveyer belt 2 of the installation exercise position of appointment; And for supplying with the chip component supply unit 3 of chip component.In addition, as shown in Fig. 1, Fig. 3 and Fig. 5, fitting machine main body 100 comprises: installation portion 4, for installation elements on printed circuit board (PCB) P (bare chip or chip component); Wafer holding table 5, the wafer W that supporting is extracted out from wafer accommodation device 200; Withdrawing device 6 takes out bare chip and is delivered to installation portion 4 from the wafer W by 5 supportings of wafer holding table; Pushing-up device 7 pushes away this bare chip when utilizing withdrawing device 6 to take out bare chip from below; And the movable camera 8 of position of components identification use, before moving, the taking-up that utilizes withdrawing device 6 to carry out bare chip takes this bare chip.In addition, bare chip is an example of " electronic component " of the present invention.
Base station 1 for example consists of metal firm parts, supporting conveyor 2, chip component supply unit 3, installation portion 4, wafer holding table 5 etc.Base station 1 is fixedly installed with respect to ground F by a plurality of legs 11.In addition, as depicted in figs. 1 and 2, base station 1 mainly have the 1b of first and respectively the two ends (directions X two ends) of the 1b of Cong Gai first to the outstanding second portion of the nearly body side (downside of Fig. 2) of fitting machine main body 100 to 1c, accordingly, base station 1 possesses at its nearly body side central portion the linking part 1a that the observation overlooked is concavity.Fitting machine main body 100, under the state of described linking part 1a that wafer accommodation device 200 is embedded to base station 1 along Y-direction (being equivalent to specific direction of the present invention), can be fixed this wafer accommodation device 200.Below, the moving direction (Y1 direction) of the wafer accommodation device 200 during by link is called link direction, and the moving direction of the wafer accommodation device 200 during by separation (Y2 direction) is called detaching direction.
Overlook and observe the linking part 1a be concavity and have from wafer accommodation device 200 directions and observe and the front wall portion 12 of vis-a-vis and the pair of sidewalls portion 13 relative with the two sides of wafer accommodation device 200 respectively.
In addition, in pair of sidewalls portion 13, be respectively arranged with guide rail 14 and guide rail 15.Guide rail 14 and guide rail 15 are linked at wafer accommodation device 200 under the state of fitting machine main body 100, the part of the front side (fitting machine main body 100 sides) of supporting wafer accommodation device 200.
As shown in Fig. 1 and Fig. 6, guide rail 14 is from side wall portion 13 outstanding block parts to the inside.Guide rail 14 extends to form along Y-direction.Among the upper surface of guide rail 14, the upper surface 14a of the part of nearly body side (detaching direction (the Y2 direction of Fig. 6) side) is the inclined plane raising along with trend link direction (the Y1 direction of Fig. 6), and the upper surface 14b of the part of rear side (link direction (Y1 direction) side) is horizontal plane.In addition, guide rail 14 comprises as from its lower surface jut 14c of outstanding stopper downwards.In addition, in the side of the nearly body side (Y2 direction side) of guide rail 14, be provided with screw 14d.Similarly, the size of guide rail 15 and position etc. form accordingly with guide rail 14, have upper surface 15a, upper surface 15, jut 15c and the screw 15d that horizontal plane forms that inclined plane forms.
Conveyer belt 2 comprises: the conveyer belt main body of extending along the directions X of conveyance printed circuit board (PCB) P and lifting printed circuit board (PCB) P the not shown detent mechanism to its location in this conveyer belt main body.Conveyer belt 2 to the left with flat-hand position conveyance printed circuit board (PCB) P on directions X almost, is fixed on the installation exercise position of appointment by printed circuit board (PCB) P location from the right side of Fig. 1 to Fig. 4.In present embodiment, on the conveyance path at the conveyer belt 2 and position (position of the printed circuit board (PCB) P of Fig. 2 and Fig. 4) that separates appointed interval on directions X is made as respectively to installation exercise position.In addition, in the following description, the position of the conveyance direction upstream side of printed circuit board (PCB) P among installation exercise position is called to the first job position S1, the position in downstream is called to the second job position S2.
Chip component supply unit 3 is arranged on the two ends of the nearly body side of fitting machine main body 100.Chip component supply unit 3 arranges for supplying with the chip components such as transistor, resistance, capacitor.In chip component supply unit 3 such as along component supplying apparatus 300 such as conveyer belt 2 spread configuration belt feeders.Each belt feeder comprises: be wound with the spool that keeps the band of the chip components such as transistor with appointed interval; The holding member that keeps spool; And extract band out and chip component is passed out to the element delivering mechanism etc. of the component feeding position of belt feeder front end from spool.Belt feeder is being installed under the state of chip component supply unit 3, carries out the action of sending of chip component with 100 interlocks of fitting machine main body.That is, make the installation portion 4 of fitting machine main body 100 at component feeding position pick-up chip element, and be accompanied by this and pick up next chip component is passed out to component feeding position.In addition, replace belt feeder, chip component supply unit 3 also can arrange the pallet (not shown) of the large-scale potted elements such as mounting semiconductor packages.In this case, by installation portion 4, directly from this pallet, pick up potted element.
Installation portion 4 is that bare chip or chip component are installed to the device on printed circuit board (PCB) P, the driver element that is included on the top position of conveyer belt 2 respectively in (XY direction) in the horizontal direction two head units (being called the first head unit 41, the second head unit 42) movably and drives respectively them.In addition, installation portion 4 is examples of " installing mechanism " of the present invention.
The upstream side region that comprises the first job position S1 that the first head unit 41 is mainly usingd on base station 1 is as movable area and only can in this region, move, on the other hand, the region, downstream that comprises the second job position S2 that the second head unit 42 is mainly usingd on base station 1 is as movable area and only can in this region, move.These first head units 41 and the second head unit 42 have following structure (structure of the second head unit 42 is in parenthetic explanation).
As depicted in figs. 1 and 2, first head unit 41(the second head unit 42) possessing two elements arranging in X-direction installs with head 41a and a video camera 41b(two elements installations head 42a and video camera 42b).
First head unit 41(the second head unit 42) by these elements, install and use head 41a(42a) absorption is by component supplying apparatus 300(belt feeder) chip component supplied with to be installed to printed circuit board (PCB) P upper, and install and use head 41a(42a by element) adsorb the bare chip being taken out by withdrawing device 6 and be installed on printed circuit board (PCB) P from wafer W.Accordingly, the chip component such as transistor, capacitor and bare chip (bare chip) the two be installed on printed circuit board (PCB) P.In addition, first head unit 41(the second head unit 42), before printed circuit board (PCB) P installation elements, utilize video camera 41b(42b) take printed circuit board (PCB) P upper with Datum identifier (not shown).This picture signal is from video camera 41b(42b) to 110 outputs of aftermentioned control device, the position deviation based on this image recognition printed circuit board (PCB) P, when mounted enforcing location drift correction.
The first head unit 41 and 42 driver element comprise: support unit 43 and 44 supports movably respectively the first head unit 41 and the second head unit 42 on directions X; Fixed guide 45 and 46, is arranged at the end face 100a of fitting machine main body 100 and supports movably in the Y direction independently support unit 43 and 44; For making the first head unit 41 and the second head unit 42 with respect to support unit 43 and 44 travel mechanism (not shown) that mobile linear motor forms on directions X; And for making support unit 43 and 44 respectively along fixed guide 45 and 46 travel mechanism (not shown) that mobile linear motor forms in the Y direction independently.
In addition, as shown in Figure 2 and Figure 4, on base station 1 and in the movable area separately of the first head unit 41 and the second head unit 42, be provided with fixed cameras 9a and the 9b that component recognition is used. Fixed cameras 9a and 9b are such as being the video camera that possesses the capturing elements such as CCD, CMOS.Fixed cameras 9a and 9b take by the element installation of the first head unit 41, with the element of head 41a and the second head unit 42, the element with head 42a absorption are installed from downside, and its image signal output is arrived to control device 110 described later.
Wafer accommodation device 200 is accommodated the many pieces of wafer W through crystal grain cutting as shown in Fig. 4 and Fig. 7.This wafer accommodation device 200 comprises: with upper and lower multilayer, accommodate the roughly shelf 201 of circular bracket Wh that keeps wafer W; The main body 202 that liftably keeps the case shape of shelf 201; The base plate 203 of support body 202; And be arranged on four castors 204 on base plate 203.In main body 202, be provided with the driver elements such as motor that lifting drives shelf 201.Wafer accommodation device 200 is arranged on the wafer W of hope by lifting shelf 201 the discrepancy height and position of the appointment that can come in and go out with respect to wafer holding table 5.
Each bare chip that is housed in each wafer W in wafer accommodation device 200 sticks on film-form wafer thin slice with (face up) state that faces up (circuit forms the state that face (with respect to the installed surface of printed circuit board (PCB) P) makes progress), via this wafer thin slice, by bracket Wh, is kept.
In addition, castor 204 is installed respectively a pair of in the end of the link direction side of wafer accommodation device 200 and the end of detaching direction side.Accordingly, wafer accommodation device 200 is supported on ground F movably by 4.
In addition, in present embodiment, as shown in Figure 7 and Figure 8, near the sidepiece of the side on the directions X of main body 202 and be provided with the deflector roll 205 of the wheel shape corresponding with guide rail 14 end of link direction (Y1 direction) side, near the sidepiece of the opposite side on the directions X of main body 202 and be provided with the deflector roll 206 of the wheel shape corresponding with guide rail 15 end of link direction (Y1 direction) side.Deflector roll 205 and 206 with respect to the sidepiece from main body 202 outstanding fixed block 207 and 208 side laterally, is rotatably installed around the axle parallel with directions X respectively.These deflector rolls 205 and 206, when making wafer accommodation device 200 mobile along link direction (Y1 direction), ride over respectively on guide rail 14 and 15.Accordingly, wafer accommodation device 200 is under the connecting state with fitting machine main body 100, the part of the link direction of wafer accommodation device 200 (Y1 direction) side is supported on pair of guide rails 14 and 15 via a pair of deflector roll 205 and 206, and a pair of castor 204 built on stilts F of the link direction of wafer accommodation device 200 (Y1 direction) side.In addition, deflector roll 205 and 206 is examples for " guide member " of the present invention and " rotor ".
Described deflector roll 206 is directly installed on fixed block 208, and on the other hand, deflector roll 205 is arranged on can be in the upper mobile moveable block 209 of above-below direction (Z direction) with respect to fixed block 207.This moveable block 209 forms the L word shape that covers the upper surface of fixed block 207 and the side of X1 direction side.In the side of moveable block 209, be formed with a pair of slotted hole 209a extending along the vertical direction, in the side of the X1 of fixed block 207 direction side, be formed with screw (not shown).And bolt 210 inserts described slotted hole 209a from the outside of moveable block 209, and along with this bolt 210 screws togather in the described screw that inserts fixed block 207, by this bolt 210, described moveable block 209 is fastening with fixed block 207.Moveable block 209 can slotted hole 209a length be limited and move up at upper and lower.Like this, among a pair of deflector roll 205 and 206, a deflector roll 205 can regulate height and position with respect to another deflector roll 206.
In addition, as shown in Fig. 2, Fig. 7 and Fig. 8, the sidepiece of the side on the directions X of main body 202 and be provided with outstanding laterally flat butt parts 211 in the position of the nearly body side (detaching direction (Y2 direction) side) of deflector roll 205.The end face that butt parts 211 have by its link direction (Y1 direction) side forms and overlooks and observe the abutting part 211a that is the linearity (with reference to Fig. 2) extending along directions X.This abutting part 211a under the state of the upper surface 14b that link direction (Y1 direction) is mobile, deflector roll 205 rides over guide rail 14, is connected to the jut 14c(of guide rail 14 with reference to Fig. 1, Fig. 6 at wafer accommodation device 200) further mobile to link direction (Y1 direction) to limit wafer accommodation device 200.In addition, the jut 14c of guide rail 14 and abutting part 211a are examples of " stopper " of the present invention.
In addition, as shown in Figure 8, on butt parts 211, be fixed with plate member 212.In this plate member 212, form bolt-inserting hole, inserting bolt 213 rotatably in this bolt-inserting hole.This bolt-inserting hole and bolt 213 are set to when linking and the screw 14d of guide rail 14 coincide.
In addition, as shown in Figure 2 and Figure 7, the sidepiece of the opposite side on the directions X of main body 202 and be provided with outstanding laterally flat butt parts 214 in the position of the nearly body side (detaching direction (Y2 direction) side) of deflector roll 206.The end face that butt parts 214 have by its link direction (Y1 direction) side forms and overlooks and observe the abutting part 214a that is concavity (nick shaped).This abutting part 214a is at wafer accommodation device 200 under the state of the upper surface 15b that link direction (Y1 direction) is mobile, deflector roll 206 rides over guide rail 15, and the sunk part of described concavity (nick shaped) is connected to the jut 15c(of guide rail 15 with reference to Fig. 1) further mobile to link direction (Y1 direction) to limit wafer accommodation device 200.In addition, the jut 15c of guide rail 15 and abutting part 214a are examples of " stopper " of the present invention.
In addition,, as shown in the line E of Fig. 2, the position of the position of Y-direction of the sunk part of the described recess shapes (nick shaped) of abutting part 214a and the Y-direction of the abutting part 211a of butt parts 211 equates.In addition, the position of the Y-direction of the jut 14c of guide rail 14 and the jut 15c of guide rail 15 also equates.Accordingly, at abutting part 211a and abutting part 214a, be connected to respectively under the state of the jut 14c of guide rail 14 and the jut 15c of guide rail 15, wafer accommodation device 200 was limited with respect to the departing from of direction of rotation of overlooking of fitting machine main body 100.
In addition, the gap width of butt parts 214 (width D of the directions X shown in Fig. 2) is and the diameter of the jut 15c of guide rail 5 size about equally.Accordingly, under connecting state, with respect to fitting machine main body 100, the movement (departing from) on horizontal (directions X) is inhibited wafer accommodation device 200.
In addition, on butt parts 214, be fixed with plate member 215.In plate member 215, form bolt-inserting hole, inserting bolt 216 rotatably in this bolt-inserting hole.This bolt-inserting hole and bolt 216 are set to when linking and the screw 15d of guide rail 15 coincide.Namely, when linking, the bolt of plate member 212 213 is screwed togather and inserts the screw 14d of guide rail 14 and pass through this bolt 213 binding parts 212 and guide rails 14, and the described bolt 216 of plate member 215 is screwed togather to the screw 15d of insertion guide rail 15 and pass through this bolt 216 binding parts 215 and guide rails 15, thereby wafer accommodation device 200 and fitting machine main body 100 can be interfixed under maintenance connecting state.
In addition, as shown in Figure 7, at the rear side (detaching direction (Y2 direction) side) of wafer accommodation device 200, be provided with the supporting device 220 that is different from castor 204 and can supports wafer accommodation device 200 with respect to ground F.Supporting device 220 is provided with one at the central portion of directions X.Supporting device 220 under connecting state (thereby deflector roll 205 and 206 rides over the state of the castor built on stilts F of the link direction side that makes wafer accommodation device 200 on guide rail 14 and 15), the height and position of the rear section of adjustable wafer accommodation device 200.
Particularly, as shown in Fig. 7 and Fig. 9, supporting device 220 comprises: the first shank 221, comprises the grounding parts 221a that is contacted with ground F; The second shank 222, is linked to the first shank 221; Handle 223, makes the second shank 222 rotations for user; And framework 224, be fixed on the bottom 202a of main body 202 and support the second shank 222.
The second shank 222 one comprise insert framework 224 top 222a, be positioned at the 222b of body portion of framework 224 and to the outstanding bottom 222c in more below of the bottom 202a of main body 202.Top 222a is fixed in handle 223, and the rotation by handle 223 makes the second shank 222 integral-rotations.In addition, at the outer surface of the top 222a of the second shank 222, be formed with pin thread, and be formed with the negative thread corresponding with the pin thread of the top 222a of the second shank 222 at the top of framework 224 224a.Accordingly, user passes through rotating handles 223, thereby can make the second shank 222 integral body with respect to framework 224 lifting on above-below direction (Z direction).In addition, to the second shank 222 is declined direction rotation handle 223 time, because the lower surface of the 222b of body portion of the second shank 222 is connected to the upper surface of the bottom 224b of framework 224, handle 223(the second shank 222) can not rotate again.Therefore, user can reproduce the lower position of the second shank 222 easily.
In addition, at the bottom 222c of the second shank 222, form negative thread, and at the outer surface formation of the first shank 221 pin thread corresponding with the negative thread of the bottom 222c of the second shank 222.Accordingly, user, by rotation the first shank 221, can make the first shank 221 with respect to bottom 222c lifting on above-below direction of the second shank 222.In addition, on the pin thread of the first shank 221, be screwed with nut 225.By nut 225 being tightened against to the second shank 222 sides, prevent that the first shank 221 is with respect to the bottom 222c rotation of the second shank 222.Accordingly, unscrewing under the state of nut 225, adjustable the first shank 221 is with respect to the outstanding length of the bottom 222c of the second shank 222, and in adjusting afterwards by fastening nut 225, the outstanding length of the first shank 221 can be fixed on to the length of adjusting.
In addition, as shown in Figure 7, in the nearly body side of the 222b of body portion of the second shank 222, be provided with the pluggable pin 226 towards the 222b of body portion.Pin 226 is installed on the pin support unit 227 of the bottom 224b that is fixed on framework 224.And, on the 222b of body portion of the second shank 222, be provided with pin insertion hole 222d.At the second shank 222, be positioned under the state of lower position, by pin 226 being inserted to the pin insertion hole 222d of the 222b of body portion, can prevent the rotation (rotation of handle 223) of the second shank 222.In addition, from pin insertion hole 222d, extract the state of pin 226, by rotating handles 223, can make the second shank 222 increase together with the first shank 221.
In addition, as depicted in figs. 1 and 2, wafer holding table 5 possesses the 5a of discrepancy mechanism of wafer W.The 5a of this discrepancy mechanism is for respect to wafer holding table 5, in front and back, (Y-direction) upper removable, front end possesses the arm that bracket holds the 5b of mechanism.The 5a of mechanism that comes in and goes out is arranged under the state of wafer receiving position (position of body side (Y2 direction side) recently) at wafer holding table 5, can be by the wafer W(bracket Wh being arranged in the shelf 201 of the height and position of coming in and going out) from wafer accommodation device 200, be retracted to wafer holding table 5, and the bracket Wh on wafer holding table 5 is accommodated to (putting back to) after taking out and wafer element is installed and arrive in shelf 201.
Wafer holding table 5 has circular open portion at central portion, can be to keep the overlapping mode of the peristome of bracket Wh of wafer W and the peristome of wafer holding table 5 to keep bracket Wh.Accordingly, on wafer holding table 5, maintain wafer W(bracket Wh) state under, can by pushing-up device 7 described later, push away bare chip from the below of wafer holding table 5.
Wafer holding table 5 takes out the job position (position of the most inboard (Y1 direction side) at element; With reference to Fig. 2) and be linked between near the wafer receiving position wafer accommodation device 200 of described linking part 1a, can on base station 1, move along Y-direction.Particularly, wafer holding table 5 is supported movably by a pair of fixed guide 51 extend arranging along Y direction on base station 1, and the driver element by appointment moves along fixed guide 51.Driver element comprises the ball-screw 52 that extends in parallel and screw togather the nut portion of inserting wafer holding table 5 with fixed guide 51; And for rotariling actuate the drive motor 53 of ball-screw 52.In addition, as shown in Figure 1, wafer holding table 5, by the lower position of conveyer belt 2, takes out between job position and wafer receiving position and moves at element.
Pushing-up device 7, by pushing away from downside among the wafer W being arranged on the wafer holding table 5 that element takes out job position as the bare chip that takes out object, makes this bare chip peel off and lifting from wafer thin slice.
As shown in Figure 5, this pushing-up device 7 comprises: the portion 71 of above cutting somebody's hair, is set up the upper push-rod (being called the first upper push-rod 71a, the second upper push-rod 71b) of a pair of path of distribution (not shown) in possessing respectively; Fixed guide 72, on base station 1 along the portion 71 of cutting somebody's hair on directions X supports movably; And driver element, for cutting somebody's hair on making, portion 71 moves along fixed guide 72.This driver element comprises: extend in parallel and screw togather the ball-screw of cutting somebody's hair in insertion outside the figure of portion 71 with fixed guide 72; And for rotarily actuate this ball-screw on the portion's drive motor (not shown) of cutting somebody's hair.Thus, pushing-up device 7 is removable on directions X, for the wafer W being only bearing on can mobile in the Y direction wafer holding table 5, above cut somebody's hair portion 71 can on push away bare chip arbitrarily.
On cut somebody's hair the first upper push-rod 71a and the second upper push-rod 71b of portion 71 extend along the vertical direction, by not shown actuator (cylinder etc.) respectively lifting drive.; peristome inner side at wafer holding table 5 disposes under the state of these the first upper push-rod 71a or the second upper push-rod 71b; the first upper push-rod 71a or the second upper push-rod 71b by rising be urged to almost with wafer thin slice under the position of side contacts; thereafter after being positioned the directions X position of the bare chip of wishing, upper distribution by drive motor (not shown) thus from the first upper push-rod 71a or the second upper push-rod 71b, drive upward and push away bare chip.In addition, the first upper push-rod 71a and the second upper push-rod 71b can change according to the size etc. as above pushing away the element of object the thickness of upper distribution etc.For example, the upper distribution that diameter differs from one another is arranged on the first upper push-rod 71a and the second upper push-rod 71b, thereby can uses the first upper push-rod 71a or the second upper push-rod 71b according to differentiations such as the sizes of element.
The first upper push-rod 71a and the second upper push-rod 71b can be urged to by lifting the height and position of two gears., when moving between near the wafer receiving position that makes wafer holding table 5 element takes out job position and wafer accommodation device 200, can be for avoiding the lower position with the interference of wafer holding table 5, and at wafer holding table 5, be positioned under the state of element taking-up job position, near the lifting between position of readiness that above pushes away in the peristome inner side of bracket Wh the lower surface of wafer W drives, upper distribution can be built in the first upper push-rod 71a in position of readiness or the second upper push-rod 71b position and the upper surface of wafer holding table 5 more above element between push position lifting drive.
The bare chip that withdrawing device 6 absorption above push away by pushing-up device 7 also consigns to the first head unit 41 and the second head unit 42.
This withdrawing device 6 moves in (XY direction) in the top position of element taking-up job position in the horizontal direction by the driver element of appointment.This driver element has following structure.
That is, at element, taking out job position is provided with: a pair of overhead fixed guide 61 that separates appointed interval setting and extend parallel to each other in Y direction in X-direction; Two ends are bearing in respectively on fixed guide 61 and the frame parts 62 extending along X-direction movably; Be arranged on the position that approaches fixed guide 61 a pair of ball screw 63 that extends and screw togather respectively the nut part (diagram is omitted) that inserts frame parts 62 two ends along Y direction; And the pair of frames drive motor 64 that rotarilys actuate ball screw 63.
The second guide rail (diagram is omitted) that is provided with the first guide rail (diagram is omitted) that is fixed on its nearly body side and extends along X-direction and is fixed on its rear side and extends along X-direction on frame parts 62.On the first guide rail, support movably withdrawing device 6, on the second guide rail, support movably video camera 8.And, in frame parts 62, possess: the ball screw (diagram is omitted) that extends and screw togather the nut part (diagram is omitted) that inserts withdrawing device 6 along X-direction; Rotarily actuate the drive motor 65 of this ball screw; Along X-direction, extend and screw togather the ball screw (diagram is omitted) of the nut part (diagram is omitted) that inserts video camera 8; And the drive motor 66 that rotarilys actuate this ball screw.That is, by each framework drive motor 64 that turns round, frame parts 62 is moved along fixed guide 61, the movement that is accompanied by this frame parts 62 is moved withdrawing device 6 and video camera 8 integratedly in Y direction.
In addition, by running drive motor 65, at the nearly body side position of Y-direction of frame parts 62, withdrawing device 6 is moved on directions X, and in the Y-direction rearward position of frame parts 62, video camera 8 is moved by running drive motor 66 on directions X.The top position that withdrawing device 6 and video camera 8 take out job position at element accordingly can be distinguished independently in the horizontal direction in (XY direction) mobile.
The movable area of withdrawing device 6 in XY direction and the first head unit 41 and the movable area of the second head unit 42 in XY direction partly repeat.Accordingly, as described later, can realize from withdrawing device 6 to the first head unit 41 and the second head unit 42 payment bare chips.In addition, as shown in Figure 1, withdrawing device 6, video camera 8 and above-mentioned their driver element are positioned at the below of the first head unit 41 and the second head unit 42 and their driver element.Therefore,, although each movable area of the movable area such as withdrawing device 6 and the first head unit 41 and the second head unit 42 part repetition as described above, withdrawing device 6 can not interfered mutually with the first head unit 41 and the second head unit 42.
Withdrawing device 6 possesses a pair of wafer head (being called the first wafer head 6a, the second wafer head 6b).
As shown in Figure 5, the first wafer head 6a and the second wafer head 6b are respectively the drum type head of a pair of nozzle 6e that possesses upper downward-extension.Specifically, on the frame parts 6c of withdrawing device 6, be provided with on directions X with appointed interval arrange and driving by the drive motor outside figure respectively with respect to liftable two the bracket component 6d of this frame parts 6c, in the inner side of these bracket components 6d, be provided with described the first wafer head 6a and the second wafer head 6b, and this first wafer head 6a and the second wafer head 6b are respectively can be around the state lower support of the axle rotation parallel with directions X in each bracket component 6d.
Each a pair of nozzle 6e of the first wafer head 6a and the second wafer head 6b is arranged on upper and lower diametical position, its be set to a nozzle 6e towards under time another nozzle 6e towards directly over.And, by being separately positioned on the drive motor 6f in the outside of two stands parts 6d, rotarily actuate the first wafer head 6a and the second wafer head 6b(, reversion drives up and down), the position of described a pair of nozzle 6e is changed alternately.And by the driving of not shown described drive motor, bracket component 6d is with respect to frame parts 6c lifting, the first wafer head 6a integral elevating that comprises nozzle 6e.The second wafer head 6b too.
In addition, the interval (interval of X-direction) between the first wafer head 6a and the nozzle 6e of the second wafer head 6b and the element that is equipped on the first head unit 41 are installed by the interval of head 41a and the same intervals that is spaced apart that is equipped on head 42a for the element installation of the second head unit 42.Accordingly, can from two wafer heads (the first wafer head 6a and the second wafer head 6b), to two of the first head unit 41 elements, install with two elements of head 41a or the second head unit 42 and install with head 42a and pay two bare chips simultaneously.
Video camera 8 is such as being the video camera that possesses the capturing elements such as CCD, CMOS.Video camera 8, take out bare chip from wafer W before, is taken as the bare chip that takes out object, and by its image signal output to control device 110.In addition,, when withdrawing device 6 is paid element to head unit, withdrawing device 6 moves to the position that approaches conveyer belt 2 most.
Figure 10 is with the control system of this fitting machine main body 100 of block representation.As shown in figure 10, this fitting machine main body 100 possesses the control device 110 that CPU, various memory, HDD etc. form.On this control device 110, be electrically connected with respectively (each lifting that comprises drive motor 53, framework drive motor 64, drive motor 65, drive motor 66, drive motor 6f, other drive motors and upper push-rod 71a, 71b drives solenoid with the control valve in the air circuit of cylinder), video camera 8, fixed cameras 9a, the 9b etc. such as each above-mentioned drive motor, accordingly by the action of control device 110 each portions of Comprehensive Control.In addition, on this control device 110, be electrically connected with the input unit outside figure, various information is inputted in the operation of operator based on this input unit, and also inputs the output signal that comes from the position detection unit such as encoder outside the figure being built in each drive motor.In addition, under connecting state, wafer accommodation device 200 is electrically connected to by cable 200a with control device 110, for motor of the shelf 201 of lifting wafer accommodation device 200 etc., also by control device 110, controls.
Functional imperative as this control device 110 comprises: axle control part 111, control the driving of above-mentioned each drive motor, the driving solenoid of each control valve; Image processing part 112, implements the processing of appointment to coming from the picture signal of each video camera (fixed cameras 9a, 9b, video camera 41b, 42b etc.); I/O handling part 113, controls and to come from the input of signal of the transducer outside figure and the output of various control signals etc.; Communication control unit 114, control is communicated by letter with external device (ED); Storage part 115, various programs, the various data such as storage installation procedure; And main operational part 116, above-mentioned each portion of Comprehensive Control also carries out various calculation process.
And this control device 110 is according to each drive motor of predetermined program control etc., thereby control conveyer belt 2, wafer holding table 5, withdrawing device 6, pushing-up device 7, the first head unit 41 and the second head unit 42 etc.Accordingly, carry out wafer W with respect to the discrepancy of wafer accommodation device 200, from wafer W, take out bare chip and utilize the first head unit 41 and a series of actions (element installation action) such as the second head unit 42 installation elements.
Control device 110 is mainly accommodated in the inside of base station 1.Here, in present embodiment, a part for control device 110 is accommodated in second portion 1c.Particularly, as shown in figure 11, the control cabinet 117 that above-mentioned image processing part 112, communication control unit 114, storage part 115 and main operational part 116 are integrated is accommodated in a second portion 1c.In addition, in the outer setting of another second portion 1c, have main switch 118(only in Figure 11, to illustrate), in the inside of another second portion 1c, taken in main circuit breaker 119.In addition, control cabinet 117 is examples of " electronic equipment " of the present invention.
In addition, in the inside of the 1b of first, take in above-mentioned axle control part 111 and I/O handling part 113.In addition, the various devices such as power transformation depressor 120, transformer 121, vacuum source 122 are also accommodated in the 1b of first.
Below, to utilizing the control of the element installation action of this control device 110 to describe.In addition the state that, is linked to fitting machine main body 100 with wafer accommodation device 200 carries out the following description.
First, control device 110, by controlling conveyer belt 2, is moved into printed circuit board (PCB) P in fitting machine main body 100.Then, control device 110 is by controlling conveyer belt 2, fixed printed circuit board P under the state that is arranged at the first job position S1 and the second job position S2.
Afterwards, control device 110, by controlling wafer holding table 5, is extracted wafer W out from wafer accommodation device 200.Particularly, by driving drive motor 53 to make wafer holding table 5 move to wafer receiving position.Then, by the 5a of mechanism that comes in and goes out by wafer W(bracket Wh) from wafer accommodation device 200, be retracted to wafer holding table 5.Then, the wafer W of extraction is fixed on wafer holding table 5.Afterwards, by controlling wafer holding table 5, be arranged on element and take out job position.
Wafer W is arranged on element and takes out after job position, and control device 110, by controlling video camera 8, carries out as the shooting of taking out the bare chip of object.
Then, the shooting results of control device 110 based on video camera 8, control pushing-up device 7, withdrawing device 6 and wafer holding table 5, make the upper distribution of the portion of cutting somebody's hair 71, the nozzle 6e of withdrawing device 6 and move to the same position in XY plane as the bare chip that takes out object.
And control device 110 makes distribution on this rise (driving) from the first upper push-rod 71a or the second upper push-rod 71b according to the size of element etc., thereby pushes away this bare chip from its downside.Now, make the front end face of upper push-rod 71a or 71b produce negative pressure and adsorb the wafer thin slice that keeps being pasted with bare chip, from the front end face central portion of upper push-rod 71a or 71b, push to distribution.On the other hand, the first wafer head 6a or the second wafer head 6b are declined, the negative pressure of the leading section by nozzle 6e makes to adsorb because above pushing away the bare chip of peeling off from wafer thin slice.Accordingly, from wafer W, take out bare chip.
Then, control device 110 is paid bare chip from withdrawing device 6 to head unit.Particularly, control device 110 makes withdrawing device 6 move to the element delivery position (approaching the position of conveyer belt 2 most) of appointment by controlling withdrawing device 6, and makes the first head unit 41(or the second head unit 42 by controlling installation portion 4) move to element delivery position.Accordingly at element delivery position, withdrawing device 6 setting up and down and the first head unit 41(or the second head unit 42).
At withdrawing device 6 and first head unit 41(the second head unit 42) be arranged in element delivery position moving process before, control device 110 makes the first wafer head 6a and the second wafer head 6b rotation, make to be accordingly adsorbed in the bare chip reversion (being reversed to ventricumbent state) of each nozzle 6e, and install and use head 42a by each element of the first head unit 41 is installed with each element of head 41a(or the second head unit 42) decline, thereby the element by the first head unit 41 is installed the element installation head 42a with head 41a(or the second head unit 42) adsorb described bare chip.Accordingly, from withdrawing device 6 to the first head unit 41(or the second head unit 42) pay bare chip.
Then, control device 110 is fixed cameras 9b while making the first head unit 41 move to fixed cameras 9a(the second head unit 42) top, fixed cameras is taken and be adsorbed in the bare chip of head for each element installation, and with respect to each element, the absorption deviation with head is installed based on its view data computing bare chip.
Then, control device 110 is by first head unit 41(the second head unit 42) video camera 41b(42b), identification be fixed on move with the printed circuit board (PCB) P on 2 with Datum identifier (not shown).Accordingly, control device 110 identification printed circuit board (PCB) P are with respect to the position deviation of conveyer belt 2.
And control device 110, according to the position deviation of the absorption deviation of bare chip and printed circuit board (PCB) P, makes first head unit 41(the second head unit 42) move to the revised position of printed circuit board (PCB) P top.Then, in the installation site of appointment, make element install with head and decline, thereby bare chip is installed on printed circuit board (PCB) P.
Repeat above-mentioned action, during the installation of all bare chips, control device 110 is by controlling conveyer belt 2, thereby removes the fixing of printed circuit board (PCB) P.And control device 110, by controlling conveyer belt 2, is taken out of printed circuit board (PCB) P outside fitting machine main body 100.
Then with reference to Figure 12 to Figure 16, the link action to wafer accommodation device 200 with respect to fitting machine main body 100 describes.
First, as shown in Figure 12 and Figure 13, user makes wafer accommodation device 200 mobile to link direction (Y1 direction), thereby embeds the linking part 1a of fitting machine main body 100.In addition, now, make the grounding parts 221a built on stilts F of supporting device 220.
While so wafer accommodation device 200 being embedded to linking part 1a, first, deflector roll 205 and 206 rides over respectively on the inclined plane (upper surface 14a) of guide rail 14 and the inclined plane (upper surface 15a) of guide rail 15.Then, when user further makes wafer accommodation device 200 mobile to link direction (Y1 direction), deflector roll 205 and 206 rides over respectively on horizontal plane (upper surface 14b) and horizontal plane (upper surface 15b).At deflector roll, ride under the state of horizontal plane, as shown in figure 14, due to the degree of the height of deflector roll up-wards inclination face, main body 202, base plate 203 and castor 204 that therefore deflector roll is installed also rise.Accordingly, the link direction of wafer accommodation device 200 (Y1 direction) castor 204 of side becomes the state of built on stilts F.Under this state, the castor of the rear section of wafer accommodation device 200 still keeps in touch in the state of ground F.
And while further making wafer accommodation device 200 mobile to link direction (Y1 direction), the abutting part 211a of butt parts 211 and the abutting part 214a of butt parts 214 are connected to respectively the jut 14c of guide rail 14 and the jut 15c of guide rail 15.Accordingly, wafer accommodation device 200 cannot be further mobile to link direction (Y1 direction) again.Under this state, during from top view, the short transverse of left and right has in the situation of inclination, thereby by regulating the height and position of moveable block 209 to regulate the height and position of deflector roll 205.
Then,, by the handle 223 of rotation support mechanism 220, the second shank 222 and the first shank 221 are declined.Rotating handles 223 is until cannot rotate time, as shown in Figure 15 and Figure 16, the first shank 221 is connected to a pair of castor 204 built on stilts F of the rear side (detaching direction side) of ground F and wafer accommodation device 200.Accordingly, the rear section of wafer accommodation device 200 is supported mechanism's 220 supportings.
Under this state, by unscrewing nut 225, and make the first shank 221 with respect to the second shank 222 rotations, thereby regulate the outstanding length of the first shank 221.And, regulating the outstanding length of the first shank 221 so that under the state that wafer accommodation device 200 disappears with respect to the inclination of the fore-and-aft direction of fitting machine main body 100, fastening nut 225.Accordingly, wafer accommodation device 200 under with respect to the parallel state of fitting machine main body 100 by deflector roll 205,206 and supporting device 220 these three-point supports.Under this state, as shown in figure 16, four whole built on stilts F of castor 204.
And after adjustment finishes, bolt 213 is screwed togather to the screw 14d that inserts guide rail 14, and bolt 216 is screwed togather to the screw 15d that inserts guide rail 15, wafer accommodation device 200 is fixed in fitting machine main body 100.Accordingly, wafer accommodation device 200 completes with the link of fitting machine main body 100, carries out the conveyance of paying the wafer W such as wafer W to fitting machine main body 100 from wafer accommodation device 200 under this state.
In addition, medium in the installation action process of fitting machine, in order to safeguard fitting machine main body 100, during temporary transient separated wafer accommodation device 200, first, bolt 213 is taken out from the screw 14d of guide rail 14, and bolt 216 is taken out from the screw 15d of guide rail 15.Then, by rotating handles 223, thereby make supporting device 220 increase and make castor 204 be contacted with ground F.Afterwards, by making wafer accommodation device 200 to detaching direction (Y2 direction) thus mobile make wafer accommodation device 200 from 100 separation of fitting machine main body.
After the maintenance of fitting machine main body 100 finishes, again wafer accommodation device 200 is linked to fitting machine main body 100.In this case, make wafer accommodation device 200 mobile until cannot be after link direction (Y1 direction) is mobile to link direction (Y1 direction), rotating handles 223 be until cannot rotate so that supporting device 220 declines again.Like this, because the outstanding length of the first shank 221 becomes the outstanding length of initial adjustment, so wafer accommodation device 200 becomes parastate naturally with fitting machine main body 100.; in the fitting machine of present embodiment; when first link, carry out after the adjustment of wafer accommodation device 200 and the relative position of fitting machine main body 100; when later for the second time link without adjusting operation, the relative position that just can make wafer accommodation device 200 and fitting machine main body 100 is state parallel to each other.
As mentioned above, the fitting machine of present embodiment is when fitting machine main body 100 links with wafer accommodation device 200, and the deflector roll 205,206 being arranged in wafer accommodation device 200 rides over respectively on the guide rail 14,15 being arranged in fitting machine main body 100 so that the castor 204 built on stilts F of fitting machine main body 100 sides of wafer accommodation device 200.That is, the relative position relation of the fitting machine main body under connecting state 100 and wafer accommodation device 200 do not rely on the smooth degree of ground F but determined by guide rail 14,15 and deflector roll 205,206.Therefore, by the position of suitable setting guide rail 14,15 and deflector roll 205,206, even in the situation that the smooth degree of ground F is good not, also can suppress the state of fitting machine main body under connecting state 100 and the relative position relation parallel deviate of wafer accommodation device 200.That is, component supplying apparatus can be remained on to more parallel state with the relative position relation of wafer accommodation device.Therefore,, when sending wafer W from wafer accommodation device 200 to fitting machine main body 100 sidesways, can suppress wafer W and be transferred under the state tilting with respect to fitting machine main body 100.Consequently can suppress fitting machine main body 100 in handover process and interfere with wafer W, or cannot keep wafer W with correct posture in fitting machine main body 100.
In addition, owing to making wafer accommodation device 200 with respect to 100 supportings of fitting machine main body by guide rail 14,15 and deflector roll 205,206 with 2, therefore the relative position relation of the wafer accommodation device 200 under connecting state and fitting machine main body 100 (particularly from top view time tilt) can be remained on to parallel state with good precision.
In addition, in present embodiment, as mentioned above, the guide rail 14,15 that takies larger space is set being fixedly installed in the fitting machine main body 100 that ground F and size are larger, and the deflector roll 205,206 that takies less space is set comparing on the wafer accommodation device 200 that this fitting machine main body 100 is less, therefore with when wafer accommodation device 200 sides arrange guide rail, compare, can suppress wafer accommodation device 200 and increase.
In addition, in present embodiment, as mentioned above, in wafer accommodation device 200 sides, be arranged on rotating deflector roll 205,206 on the contact-making surface with guide rail 14,15, along guide rail 14,15 these deflector rolls 205,206 of guiding, therefore can reduce the contact resistance between guide rail and guide member.Therefore, when link or separated fitting machine main body 100 and wafer accommodation device 200, while can make guide rail 14,15 contact wafer accommodation device 200 is moved smoothly with deflector roll 205,206.
In addition, in present embodiment, as mentioned above, the part with fitting machine main body 100 opposition sides at wafer accommodation device 200 is arranged on the supporting device 220 that can support wafer accommodation device 200 under connecting state with respect to ground F, therefore, under the state linking in wafer accommodation device 200 and fitting machine main body 100, can adjust height and positions wafer accommodation device 200 and parts fitting machine main body 100 opposition sides.Accordingly, can not rely on the smooth degree of ground F and determine that wafer accommodation device 200 under connecting state is with respect to the relative position relation (the particularly inclination of fore-and-aft direction) of fitting machine main body 100.Accordingly, even in the situation that the smooth degree of ground F is good not, also can more positively the wafer accommodation device 200 under connecting state be remained on to parallel state with the relative position relation of fitting machine main body 100.
In addition, in present embodiment, as implied above, the stopper (stopper that the stopper that jut 14c and abutting part 211a form and jut 15c and abutting part 214a form) moving to link direction by restriction wafer accommodation device 200 is set, user is only blocked device and stops and irremovable position by making this wafer accommodation device 200 move to wafer accommodation device 200, just can link fitting machine main body 100 and wafer accommodation device 200.Therefore,, by the position of suitable this stopper of setting, the wafer accommodation device 200 that can suppress under connecting state produces relative deviation with respect to fitting machine main body 100.In addition, as mentioned above, due to two stoppers being set, with 200 movements with respect to fitting machine main body 100 of 2 restriction wafer accommodation devices, therefore can be by the relative position relation of the wafer accommodation device under connecting state 200 and fitting machine main body 100, the position relationship keeping parallelism while particularly observing from top.
In addition, in present embodiment, as mentioned above, on the base station 1 of fitting machine main body 100, be arranged under the state that wafer accommodation device 200 links overlooking that wafer accommodation device 200 embeds and observe the linking part 1a that is concavity.By formation like this, the part embedding fitting machine main body 100 due to wafer accommodation device 200 under connecting state, therefore can make the big or small miniaturization of the fitting machine integral body under connecting state.In addition, owing to can dwindling the distance of fitting machine main body under connecting state 100 with wafer accommodation device 200, therefore can successfully from wafer accommodation device 200, to fitting machine main body 100, pay wafer W.
In addition, in present embodiment, as mentioned above, by the second portion 1c of side wall portion 13 of both sides forming the linking part 1a of concavity, take in the control cabinet 117 of fitting machine main body 100, can effectively utilize for embedding the space of second portion 1c of the base station 1 of wafer accommodation device 200 control cabinet 117 is set.
In addition, in present embodiment, as mentioned above, due to side wall portion 13 fixed guides 14,15 of the second portion 1c at base station 1, thereby at firm parts, be that base station 1 arranges guide rail 14,15, therefore can increase while linking for supporting the intensity of the guide rail of wafer accommodation device 200.
In addition, it is all illustration that the execution mode of this disclosure should be considered to all points, and unrestricted.Scope of the present invention also be can't help the explanation of above-mentioned execution mode and is represented, and is represented by claims, further contains the meaning that is equal to claims and all changes in scope.
For example, in above-mentioned execution mode, show in fitting machine main body 100 guide rail 14,15 is set, the example of guide member (deflector roll 205,206) is set at wafer accommodation device 200, but the present invention is not limited to this, also can guide member be set in fitting machine main body 100, at wafer accommodation device 200, guide rail be set.In the situation of this structure, by guide rail, ride on the guide member of fitting machine main body, make the part built on stilts of the fitting machine main body side of wafer accommodation device.
In addition, in above-mentioned execution mode, show the example of deflector roll (rotor) rotation that makes wheel shape on guide rail, but the present invention is not limited to this, can also makes spherical rotor rotate.In addition, if the friction of guide rail and guide member is little, guide member is not set to rotor yet.
In addition, in above-mentioned execution mode, show and be different from the example that castor 204 arranges supporting device 220, but the present invention is not limited to this, also can height regulating mechanism be set from it at the castor of rear side.
In addition, in above-mentioned execution mode, only show the front part of wafer accommodation device 200 (part of link direction side) is ridden over to the example on guide rail, but the present invention is not limited to this.That is, front part not only, rear section (near body side part) also can ride on guide rail.Accordingly, without supporting device 220 is set.
Gather the present invention described above as shown below.
The electronic component conveying device of first aspect present invention comprises: wafer accommodation device, take in the wafer that comprises electronic component and removable with respect to ground, component supplying apparatus, is arranged on described ground and can be linked to described wafer accommodation device, guide rail, is arranged on the side among described component supplying apparatus and described wafer accommodation device, and guide member, be arranged on the opposite side among described component supplying apparatus and described wafer accommodation device, described wafer accommodation device links with respect to described component supplying apparatus or is directed along described guide rail when separated, wherein, thereby described wafer accommodation device is by moving with respect to this component supplying apparatus and link or separation along specific direction with respect to described component supplying apparatus, and towards the end of component supplying apparatus one side, comprise the support that can support this wafer accommodation device with respect to described ground at described specific direction, described guide rail and described guide member are linked under the state of described component supplying apparatus at described wafer accommodation device, make the described support of described wafer accommodation device leave described ground.
In the electronic component conveying device of first aspect present invention, as mentioned above, under the state of component supplying apparatus and the link of wafer accommodation device, the support built on stilts of the component supplying apparatus side of wafer accommodation device, therefore by guide rail and guide member, can not rely on the smooth degree on ground and determine wafer accommodation device under connecting state and the relative position relation of component supplying apparatus.Accordingly, by the position of suitable setting guide rail and guide member, even in the situation that the smooth degree on ground is good not, also can suppress wafer accommodation device under connecting state and the relative position relation parallel deviate of component supplying apparatus.That is, component supplying apparatus can be remained on to more parallel state with the relative position relation of wafer accommodation device.Therefore,, when from wafer accommodation device to component supplying apparatus side shifting wafer, can suppress wafer and be transferred under the state tilting with respect to component supplying apparatus.Consequently can suppress component supplying apparatus and wafer interferometer in handover process, or cannot keep wafer with correct posture in component supplying apparatus.In addition, arrange respectively in the situation of a plurality of guide rails and guide member, can make above wafer accommodation device support with respect to component supplying apparatus with 2, therefore can suppress wafer accommodation device with respect to the relative position relation of component supplying apparatus (tilting of the wafer accommodation device during particularly from top view) parallel deviate with better precision.
In the electronic component conveying device of the invention described above first aspect, comparatively it is desirable to, described component supplying apparatus comprises described guide rail, described wafer accommodation device comprises described guide member, and the both ends at described specific direction comprise the castor that supports movably this wafer accommodation device with respect to described ground as described support, described guide rail is linked under the state of described component supplying apparatus at described wafer accommodation device, by the upper surface that makes described guide member ride over this guide rail, make the described castor that is positioned at the end of described component supplying apparatus side among described castor leave described ground.
According to this structure, the guide rail that takies larger space is set being fixedly installed on the component supplying apparatus that ground and size are larger, and the guide member that takies less space is set comparing on the wafer accommodation device that this component supplying apparatus is less, therefore compare with the structure that guide rail is set in wafer accommodation device side, can suppress wafer accommodation device and increase.In addition, by making the castor built on stilts of wafer accommodation device, even in the good not situation of the smooth degree on the ground contacting with castor, also can be easy to the relative position relation keeping parallelism of component supplying apparatus and wafer accommodation device.
In the electronic component conveying device of the invention described above first aspect, comparatively it is desirable to the rotor of described guide member for rotating on the contact-making surface with described guide rail.
According to this structure, due to the contact resistance that can reduce between guide rail and guide member, therefore, when link or resolution element feedway and wafer accommodation device, while can make guide rail contact with guide member, wafer accommodation device is successfully moved.
In the electronic component conveying device of the invention described above first aspect, comparatively it is desirable to, described wafer accommodation device comprises supporting device at described specific direction towards the end of the opposition side of described component supplying apparatus one side, and this supporting device can be linked under the state of described component supplying apparatus with respect to this wafer accommodation device of described ground supporting and adjust the height and position of the end of described opposition side at this wafer accommodation device.
According to this structure, under the state of wafer accommodation device and component supplying apparatus link, can adjust height and position wafer accommodation device and part component supplying apparatus opposition side by supporting device.Accordingly, can not rely on the smooth degree on ground and determine that wafer accommodation device under connecting state is with respect to the relative position relation (the particularly inclination of fore-and-aft direction) of component supplying apparatus.Accordingly, even in the situation that the smooth degree on ground is good not, also can keep more abreast wafer accommodation device under connecting state and the relative position relation of component supplying apparatus.
In the electronic component conveying device of the invention described above first aspect, comparatively it is desirable to, at least one in described component supplying apparatus and described wafer accommodation device comprises stopper, when this wafer accommodation device is moved along the link direction that described wafer accommodation device is linked with respect to described component supplying apparatus, this stopper, in the position of the support built on stilts of the described component supplying apparatus side of described wafer accommodation device, limits this wafer accommodation device and moves to described link direction.
According to this structure, user is only by moving until be blocked device and stop and cannot moving wafer accommodation device to link direction, just can make the part built on stilts of the component supplying apparatus side of wafer accommodation device on one side, on one side link component feedway and wafer accommodation device.By the position of suitable this stopper of setting, can keep more abreast wafer accommodation device under connecting state and the relative position relation of component supplying apparatus.In addition, arrange in the situation of a plurality of stoppers, can the movement with respect to component supplying apparatus with 2 above restriction wafer accommodation devices, therefore can be with better precision by the relative position relation of wafer accommodation device and component supplying apparatus (deviation of the direction of rotation of the plane while particularly observing from top) keeping parallelism.
In the electronic component conveying device of the invention described above first aspect, comparatively it is desirable to, described component supplying apparatus comprises base station, and described base station is included under the state that described wafer accommodation device links the linking part that is concavity of overlooking that described wafer accommodation device embeds.
According to this structure, due at least a portion embedded components feedway of wafer accommodation device under connecting state, therefore can make the big or small miniaturization of the electronic component conveying device integral body under connecting state.In addition, owing to can dwindling component supplying apparatus under connecting state and the distance of wafer accommodation device, therefore can successfully carry out to component supplying apparatus, paying wafer from wafer accommodation device.
In the base station setting of said elements feedway, overlook in the structure of observing the linking part be concavity, comparatively it is desirable to, described base station comprises: first, as the wall portion of described linking part and form the front wall portion that described wafer accommodation device is faced; And second portion, form the side wall portion of the described linking part of the both sides be positioned at described front wall portion, in wherein said second portion, take in the Denso product (electrical component) of described component supplying apparatus.
According to this structure, can effectively utilize for embedding the space of second portion of the base station of wafer accommodation device Denso product are set.
In the base station setting of said elements feedway, overlook in the structure of observing the linking part that is concavity, comparatively it is desirable to, described linking part has the front wall portion that described wafer accommodation device faces and the side wall portion that is positioned at the both sides of this front wall portion, in these side wall portions, is fixed with described guide rail or described guide member.
According to this structure, because the parts firm are base station fixed guide or guide member, therefore when linking, for supporting the guide rail of wafer accommodation device or the intensity of guide member, increase.
On the other hand, the fitting machine of second aspect present invention comprises: installing mechanism, for electronic component is installed to substrate; And the electronic component conveying device of the invention described above first aspect, for described installing mechanism is supplied with to described electronic component.
In the fitting machine of second aspect present invention, the electronic component conveying device that comprises the invention described above first aspect, even if thereby in the situation that the smooth degree on ground is good not, also can keep more abreast wafer accommodation device under connecting state and the relative position relation of component supplying apparatus.

Claims (8)

1. an electronic component conveying device, is characterized in that comprising:
Wafer accommodation device, takes in the wafer that comprises electronic component and removable with respect to ground;
Component supplying apparatus, is arranged on described ground and can be linked to described wafer accommodation device;
Guide rail, is arranged among described component supplying apparatus and described wafer accommodation device; And
Guide member, is arranged on another among described component supplying apparatus and described wafer accommodation device, and described wafer accommodation device links with respect to described component supplying apparatus or be directed along described guide rail when separated, wherein,
Described wafer accommodation device, by moving and link or separation with respect to this component supplying apparatus along specific direction with respect to described component supplying apparatus, and towards the end of component supplying apparatus one side, possesses the support that can support this wafer accommodation device with respect to described ground at described specific direction
Described guide rail and described guide member are linked under the state of described component supplying apparatus at described wafer accommodation device, make the described support of described wafer accommodation device leave described ground, described component supplying apparatus and described wafer accommodation device at least one of them comprises stopper, when described wafer accommodation device is moved along the link direction that this wafer accommodation device is linked with respect to described component supplying apparatus, this stopper moves and to moving with the direction of this link direction quadrature to described link direction at this wafer accommodation device of position limitation of the support built on stilts of the described component supplying apparatus side of described wafer accommodation device,
Described stopper has is located at the jut of described guide rail and the abutting part of the concavity of being located at described wafer accommodation device and described jut being guided, by described jut being connected to the medial end of described abutting part, limiting described wafer accommodation device and move to described link direction.
2. electronic component conveying device according to claim 1, is characterized in that:
Described component supplying apparatus possesses described guide rail,
Described wafer accommodation device possesses described guide member, and at the both ends of described specific direction, possess as described support with respect to described ground, support movably the castor of this wafer accommodation device,
Described guide rail, at described wafer accommodation device, be linked under the state of described component supplying apparatus, by the described castor that is positioned at the end of described component supplying apparatus one side among described castor that makes above that makes described guide member ride over this guide rail, leave described ground.
3. electronic component conveying device according to claim 1 and 2, is characterized in that:
The rotor of described guide member for rotating on the contact-making surface with described guide rail.
4. electronic component conveying device according to claim 1 and 2, is characterized in that:
Described wafer accommodation device possesses supporting device at described specific direction towards the end of the opposition side of described component supplying apparatus one side, and this supporting device can be linked under the state of described component supplying apparatus with respect to this wafer accommodation device of described ground supporting and adjust the height and position of the end of described opposition side at this wafer accommodation device.
5. electronic component conveying device according to claim 1 and 2, is characterized in that:
Described component supplying apparatus comprises base station,
Described base station possesses the linking part that is concavity of overlooking that described wafer accommodation device embeds under the state of described wafer accommodation device link.
6. electronic component conveying device according to claim 5, is characterized in that:
Described base station comprises as the wall portion of described linking part and forms the first of the front wall portion that described wafer accommodation device faces; Be positioned at the second portion of side wall portion of described linking part of the both sides of described front wall portion with formation, wherein, in described second portion, take in the Denso product of described component supplying apparatus.
7. electronic component conveying device according to claim 5, is characterized in that:
Described linking part has the front wall portion that described wafer accommodation device faces and the side wall portion that is positioned at the both sides of this front wall portion, and described guide rail or described guide member are fixed in these side wall portions.
8. a fitting machine, is characterized in that comprising:
Installing mechanism, for being installed to substrate by electronic component; And
For supply with the electronic component conveying device as described in claim 1 to 7 any one of described electronic component to described installing mechanism.
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KR101306054B1 (en) 2013-09-09

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