CN102340933A - 电路板的制作方法 - Google Patents
电路板的制作方法 Download PDFInfo
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- CN102340933A CN102340933A CN2010102352717A CN201010235271A CN102340933A CN 102340933 A CN102340933 A CN 102340933A CN 2010102352717 A CN2010102352717 A CN 2010102352717A CN 201010235271 A CN201010235271 A CN 201010235271A CN 102340933 A CN102340933 A CN 102340933A
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- conductive layer
- circuit board
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
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Priority Applications (1)
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CN 201010235271 CN102340933B (zh) | 2010-07-23 | 2010-07-23 | 电路板的制作方法 |
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CN 201010235271 CN102340933B (zh) | 2010-07-23 | 2010-07-23 | 电路板的制作方法 |
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CN102340933A true CN102340933A (zh) | 2012-02-01 |
CN102340933B CN102340933B (zh) | 2013-10-09 |
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CN 201010235271 Active CN102340933B (zh) | 2010-07-23 | 2010-07-23 | 电路板的制作方法 |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106604570A (zh) * | 2016-12-21 | 2017-04-26 | 深圳市景旺电子股份有限公司 | 一种柔性分层板及其制作方法 |
CN108200737A (zh) * | 2017-12-22 | 2018-06-22 | 深圳市景旺电子股份有限公司 | 一种高频混压hdi板的制作方法 |
CN111010808A (zh) * | 2019-12-31 | 2020-04-14 | 生益电子股份有限公司 | 一种pcb的制作方法 |
CN111031690A (zh) * | 2019-12-31 | 2020-04-17 | 生益电子股份有限公司 | 一种pcb的制作方法 |
CN112584622A (zh) * | 2019-09-27 | 2021-03-30 | 睿明科技股份有限公司 | 薄型线路制作方法 |
CN112911837A (zh) * | 2021-01-21 | 2021-06-04 | 盐城维信电子有限公司 | 一种柔性电路板内外层同步加工方法 |
CN113038718A (zh) * | 2021-01-27 | 2021-06-25 | 红板(江西)有限公司 | 超薄pcb板压合工艺 |
CN113873786A (zh) * | 2020-06-30 | 2021-12-31 | 深南电路股份有限公司 | 一种电路板的加工方法及电路板 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030011434A (ko) * | 2001-08-02 | 2003-02-11 | 주식회사 디에이피 | 다층 인쇄회로기판의 숨겨진 레이저 비아홀 제조방법 |
US20070221404A1 (en) * | 2005-10-06 | 2007-09-27 | Endicott Interconnect Technologies, Inc. | Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate |
CN101287339A (zh) * | 2007-04-13 | 2008-10-15 | 富葵精密组件(深圳)有限公司 | 制作具有断差结构的电路板的方法 |
CN101494957A (zh) * | 2008-01-23 | 2009-07-29 | 富葵精密组件(深圳)有限公司 | 多层电路板制作方法及用于制作多层电路板的基板 |
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2010
- 2010-07-23 CN CN 201010235271 patent/CN102340933B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030011434A (ko) * | 2001-08-02 | 2003-02-11 | 주식회사 디에이피 | 다층 인쇄회로기판의 숨겨진 레이저 비아홀 제조방법 |
US20070221404A1 (en) * | 2005-10-06 | 2007-09-27 | Endicott Interconnect Technologies, Inc. | Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate |
CN101287339A (zh) * | 2007-04-13 | 2008-10-15 | 富葵精密组件(深圳)有限公司 | 制作具有断差结构的电路板的方法 |
CN101494957A (zh) * | 2008-01-23 | 2009-07-29 | 富葵精密组件(深圳)有限公司 | 多层电路板制作方法及用于制作多层电路板的基板 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106604570A (zh) * | 2016-12-21 | 2017-04-26 | 深圳市景旺电子股份有限公司 | 一种柔性分层板及其制作方法 |
CN108200737A (zh) * | 2017-12-22 | 2018-06-22 | 深圳市景旺电子股份有限公司 | 一种高频混压hdi板的制作方法 |
CN108200737B (zh) * | 2017-12-22 | 2019-11-22 | 深圳市景旺电子股份有限公司 | 一种高频混压hdi板的制作方法 |
CN112584622A (zh) * | 2019-09-27 | 2021-03-30 | 睿明科技股份有限公司 | 薄型线路制作方法 |
CN111010808A (zh) * | 2019-12-31 | 2020-04-14 | 生益电子股份有限公司 | 一种pcb的制作方法 |
CN111031690A (zh) * | 2019-12-31 | 2020-04-17 | 生益电子股份有限公司 | 一种pcb的制作方法 |
CN113873786A (zh) * | 2020-06-30 | 2021-12-31 | 深南电路股份有限公司 | 一种电路板的加工方法及电路板 |
CN113873786B (zh) * | 2020-06-30 | 2023-12-29 | 深南电路股份有限公司 | 一种电路板的加工方法及电路板 |
CN112911837A (zh) * | 2021-01-21 | 2021-06-04 | 盐城维信电子有限公司 | 一种柔性电路板内外层同步加工方法 |
CN113038718A (zh) * | 2021-01-27 | 2021-06-25 | 红板(江西)有限公司 | 超薄pcb板压合工艺 |
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CN102340933B (zh) | 2013-10-09 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant before: Honsentech Co., Ltd. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170315 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Shenzhen Baoan District city Songgang street Chuanyan Luzhen Yan Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |