CN102339747A - 零标的形成方法 - Google Patents
零标的形成方法 Download PDFInfo
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- CN102339747A CN102339747A CN2010102335660A CN201010233566A CN102339747A CN 102339747 A CN102339747 A CN 102339747A CN 2010102335660 A CN2010102335660 A CN 2010102335660A CN 201010233566 A CN201010233566 A CN 201010233566A CN 102339747 A CN102339747 A CN 102339747A
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- dielectric layer
- zero standard
- silicon
- formation method
- silicon substrate
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- Drying Of Semiconductors (AREA)
- Formation Of Insulating Films (AREA)
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CN2010102335660A CN102339747A (zh) | 2010-07-22 | 2010-07-22 | 零标的形成方法 |
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CN2010102335660A CN102339747A (zh) | 2010-07-22 | 2010-07-22 | 零标的形成方法 |
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CN102339747A true CN102339747A (zh) | 2012-02-01 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104281020A (zh) * | 2013-07-08 | 2015-01-14 | 无锡华润上华科技有限公司 | 一种改善光刻对位能力的方法 |
CN107993954A (zh) * | 2017-11-23 | 2018-05-04 | 长江存储科技有限责任公司 | 硬掩膜刻蚀的底部缺陷的检验方法 |
CN112216604A (zh) * | 2020-10-10 | 2021-01-12 | 上海威固信息技术股份有限公司 | 一种存储芯片的高安全性封装方法及装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060183293A1 (en) * | 2005-02-15 | 2006-08-17 | Oki Electric Industry Co., Ltd. | Method of forming alignment mark and method of manufacturing semiconductor device |
CN101373757A (zh) * | 2007-08-23 | 2009-02-25 | 和舰科技(苏州)有限公司 | 一种对准标记及其形成方法 |
US20090233413A1 (en) * | 2008-03-11 | 2009-09-17 | Oki Semiconductor Co., Ltd. | Method for fabricating semiconductor device |
CN101567302A (zh) * | 2008-04-23 | 2009-10-28 | 力晶半导体股份有限公司 | 对准标记及其形成方法、半导体的对准方法 |
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2010
- 2010-07-22 CN CN2010102335660A patent/CN102339747A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060183293A1 (en) * | 2005-02-15 | 2006-08-17 | Oki Electric Industry Co., Ltd. | Method of forming alignment mark and method of manufacturing semiconductor device |
CN101373757A (zh) * | 2007-08-23 | 2009-02-25 | 和舰科技(苏州)有限公司 | 一种对准标记及其形成方法 |
US20090233413A1 (en) * | 2008-03-11 | 2009-09-17 | Oki Semiconductor Co., Ltd. | Method for fabricating semiconductor device |
CN101567302A (zh) * | 2008-04-23 | 2009-10-28 | 力晶半导体股份有限公司 | 对准标记及其形成方法、半导体的对准方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104281020A (zh) * | 2013-07-08 | 2015-01-14 | 无锡华润上华科技有限公司 | 一种改善光刻对位能力的方法 |
CN107993954A (zh) * | 2017-11-23 | 2018-05-04 | 长江存储科技有限责任公司 | 硬掩膜刻蚀的底部缺陷的检验方法 |
CN107993954B (zh) * | 2017-11-23 | 2020-03-13 | 长江存储科技有限责任公司 | 硬掩膜刻蚀的底部缺陷的检验方法 |
CN112216604A (zh) * | 2020-10-10 | 2021-01-12 | 上海威固信息技术股份有限公司 | 一种存储芯片的高安全性封装方法及装置 |
CN112216604B (zh) * | 2020-10-10 | 2021-04-02 | 上海威固信息技术股份有限公司 | 一种存储芯片的提高安全性的封装方法及装置 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140108 |
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Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
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Effective date of registration: 20140108 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Applicant before: Shanghai Huahong NEC Electronics Co., Ltd. |
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Application publication date: 20120201 |