CN102339728A - Manufacture process system and cleaning method - Google Patents
Manufacture process system and cleaning method Download PDFInfo
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- CN102339728A CN102339728A CN2010102291408A CN201010229140A CN102339728A CN 102339728 A CN102339728 A CN 102339728A CN 2010102291408 A CN2010102291408 A CN 2010102291408A CN 201010229140 A CN201010229140 A CN 201010229140A CN 102339728 A CN102339728 A CN 102339728A
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- chemical solution
- key component
- manufacture craft
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Abstract
The invention discloses a manufacture process system and a cleaning method. The manufacture process system comprises a production machine, a concentration-measuring device and a compensation device, wherein the production machine is suitable for processing wafers by a chemical solution; the concentration-measuring device is used for measuring the concentration of at least one key ingredient of the chemical solution which processes the wafers; and the compensation device is used for supplying a compensation solution with a compensation dosage for the production machine when the concentration of the key ingredient measured by the concentration-measuring device is lower than a fixed value, wherein the compensation solution contains the same ingredients as the key ingredient.
Description
Technical field
The invention relates to a kind of manufacture craft system and cleaning method.
Background technology
In semiconductor fabrication process, the cleanliness factor of wafer is to influence manufacture craft yield element quality and the very important factor of reliability.In the process that wafer is cleaned, use chemical solution to clean through regular meeting.Prescription in the chemical solution may be because of consuming or volatilization and along with the time of using changes gradually, so that manufacture craft permission (process window) diminishes thereupon.Usually, must keep clean quality through the chemical solution that often more renews, and then the condition of process for stabilizing.Yet this kind way not only must expend quite high material cost, nor enough environmental protection.Therefore, the concentration of suitable chemical concentrations solution and to take into account the environmental protection aspect be to need the problem of research at present badly is provided.
Summary of the invention
The present invention proposes a kind of manufacture craft system, and it can be used for cleaning wafer, promotes the permission of manufacture craft.
The present invention proposes a kind of manufacture craft system, and it can be used for cleaning wafer, prolongs the time that chemical solution upgrades, and reduces the use amount of chemical solution, reduces cost.
The present invention proposes a kind of cleaning method, and it promotes the permission of manufacture craft.
The present invention proposes a kind of cleaning method, and it can prolong the time that chemical solution upgrades, and reduces the use amount of chemical solution, reduces cost.
The present invention proposes a kind of manufacture craft system, comprises producing board, concentration measurement apparatus and compensation arrangement.Produce board, be suitable for using chemical solution to handle wafer.Concentration measurement apparatus was handled the concentration of at least one key component in the above-mentioned chemical solution of above-mentioned wafer in order to mensuration.Compensation arrangement when being lower than certain value in order to the concentration of the above-mentioned key component measured at above-mentioned concentration measurement apparatus, provides in additional liquid to the above-mentioned production board with a compensation rate, and wherein above-mentioned additional liquid has the composition identical with above-mentioned key component.
Said according to one embodiment of the invention, above-mentioned chemical solution comprises the glue at quarter that delusters, and above-mentioned key component comprises water.
Said according to one embodiment of the invention, above-mentioned chemical solution comprises cleaning fluid, and above-mentioned key component comprises NH
4OH or H
2O
2Or its two.
Said according to one embodiment of the invention, above-mentioned manufacture craft system more comprises a filter, crosses the impurity in the above-mentioned chemical solution of above-mentioned wafer in order to filtration treatment.
Said according to one embodiment of the invention, above-mentioned manufacture craft system more comprises a reflux, carries back above-mentioned production board in order to the above-mentioned chemical solution after will filtering.
Said according to one embodiment of the invention, above-mentioned concentration measurement apparatus is arranged at and is suitable for measuring in the above-mentioned reflux or the concentration of the above-mentioned key component in the above-mentioned chemical solution in this production board.
Said according to one embodiment of the invention, above-mentioned production board comprises a treatment trough, and above-mentioned reflux comprises water jacket, transfer pipeline and power set.It is peripheral that water jacket is arranged at above-mentioned treatment trough.Power set are in order to provide power this chemical solution.Transfer pipeline is communicated with above-mentioned water jacket, in order to the chemical solution in the water jacket is carried back above-mentioned treatment trough.
Said according to one embodiment of the invention, above-mentioned concentration measurement apparatus is arranged at the concentration that is suitable for measuring the above-mentioned key component in the above-mentioned chemical solution in treatment trough, above-mentioned water jacket or the above-mentioned transfer pipeline.
Said according to one embodiment of the invention, above-mentioned compensation arrangement is delivered in the above-mentioned production board via above-mentioned transfer pipeline in order to above-mentioned additional liquid is delivered in the above-mentioned water jacket again.
Said according to one embodiment of the invention, above-mentioned reflux also comprises a temperature controller, is arranged at around the above-mentioned transfer pipeline, in order to control the temperature of above-mentioned chemical solution.
The present invention also proposes a kind of cleaning method; The method uses chemical solution to handle wafer; This said method comprises to be measured in the manufacture craft or the concentration of at least one key component in the above-mentioned chemical solution after the manufacture craft, when the concentration of above-mentioned key component is lower than certain value, adds one and replenishes liquid; It contains the composition identical with aforementioned key component, makes above-mentioned key component concentration in the above-mentioned chemical solution reach above-mentioned definite value or more than the above-mentioned definite value.
Said according to one embodiment of the invention, above-mentioned chemical solution comprises the glue at quarter that delusters, and above-mentioned key component comprises water.
Said according to one embodiment of the invention, above-mentioned chemical solution comprises cleaning fluid, and above-mentioned key component comprises NH
4OH or H
2O
2Or its two.
Said according to one embodiment of the invention, above-mentioned cleaning method more is included in and carries out manufacture craft after a period of time, upgrades above-mentioned chemical solution.
Said according to the embodiment of the invention, above-mentioned manufacture craft system can be used for cleaning wafer, promotes the permission of manufacture craft.
Said according to the embodiment of the invention, above-mentioned manufacture craft system can be used for cleaning wafer, prolongs the time that chemical solution upgrades, and reduces the use amount of chemical solution, reduces cost.
Said according to the embodiment of the invention, above-mentioned cleaning manufacture craft can promote the permission of manufacture craft.
Said according to the embodiment of the invention, above-mentioned cleaning manufacture craft can prolong the time that chemical solution upgrades, and reduces the use amount of chemical solution, reduces cost.
For let state feature and advantage on the present invention can be more obviously understandable, hereinafter is special lifts embodiment, and cooperates appended graphic elaborating as follows.
Description of drawings
Fig. 1 is the sketch map of a kind of manufacture craft system according to the embodiment of the invention illustrated.
[main element symbol description]
2: wafer
10: produce board
12: treatment trough
20: concentration measurement apparatus
30: compensation arrangement
40: filter
50: reflux
52: water jacket
54: transfer pipeline
60: temperature controller
100: the manufacture craft system
Embodiment
Fig. 1 is the sketch map of a kind of manufacture craft system according to the embodiment of the invention illustrated.
Please with reference to Fig. 1, manufacture craft system 100 comprises production board 10, concentration measurement apparatus 20 and compensation arrangement 30.
Produce board 10, be suitable for using chemical solution to handle wafer 2.In one embodiment, producing board 10 is the wet scrubbing station, and it comprises treatment trough 12,, treatment trough 12 for example is the overflow inside groove.The manufacture craft system can also comprise filter 40, reflux 50 and temperature controller 60.
Reflux 50 is produced in the board 10 in order to filtered chemical solution is carried back.In an example embodiment, reflux 50 comprises water jacket 52, transfer pipeline 54 and power set 56.Water jacket 52 is arranged at treatment trough 12 peripheries, in order to carry the chemical solution that overflows from treatment trough 12.Transfer pipeline 54 is communicated with water jacket 52, sees through power set 56 in order to the chemical solution with water jacket 52 and carries back treatment trough 12, with the cycling and reutilization chemical solution.Power set 56 for example are pumps.
Processing described herein the chemical solution of wafer 2 can be the chemical solution in the treatment trough 12, the chemical solution in the water jacket 52, or the chemical solution in the transfer pipeline 54.Concentration measurement apparatus 20 for example is a densimeter.The key component that concentration measurement apparatus 20 is measured is meant in the chemical solution to have important sex composition for handled wafer.When have important sex composition for handled wafer is a kind of, and then key component then is a kind of.When have important sex composition for handled wafer is two kinds, and then key component can be a kind of or two kinds.The rest may be inferred.
In a concrete example embodiment, chemical solution for example is the glue at quarter that delusters, and the composition of carving glue that delusters for example is to comprise oxyammonia, MEA, isopropanolamine and water etc., is the commodity EKC that E.I.Du Pont Company produces for example, and key component comprises water.Carve water content in the glue when delustering along with time loss or volatilization and when not enough, the concentration of carving other composition in the glue of delustering is too high relatively, will cause the manufacture craft condition changing, the problem that the manufacture craft permission diminishes.Concentration measurement apparatus 20 can be used for measuring delustering carves the water content in the glue, for example is the densimeter that US business Jetalon produces.The additional liquid that compensation arrangement 30 is provided comprises water or EKC.In one embodiment, the compensation liquid that provided of compensation arrangement 30 only has water.The water yield of being replenished can carve that water content in the glue reaches definite value or more than the definite value so that deluster.In one embodiment, the definite value of the water content in the photoresist liquid is 15%; In another embodiment, the definite value of water content is 17%; In another embodiment, the definite value of water content is 13%.Yet the present invention is not as limit, and the concentration definite value of key component can be set according to the needs of reality in the chemical solution.
In another concrete example embodiment, chemical solution can be to contain NH
4OH and H
2O
2Cleaning fluid, SC1 cleaning fluid for example.The SC1 cleaning fluid consist of NH
4OH: H
2O
2: H
2O=1: 1: 5 cleaning fluid, key component comprises NH
4OH or H
2O
2NH in the SC1 cleaning fluid
4OH or H
2O
2Along with the NH in time loss so that the SC1 cleaning fluid
4OH or H
2O
2When concentration is not enough, will cause the manufacture craft condition changing, and cause the unclear problem of manufacture craft efficient.Concentration measurement apparatus 20 can be used for measuring the NH in the SC1 cleaning fluid
4OH or H
2O
2Content, concentration measurement apparatus 20 for example are the densimeters that US business Jetalon produces.Has NH in the additional liquid that compensation arrangement 30 is provided
4OH or H
2O
2Or its two.Just the compensation liquid that provided of compensation arrangement 30 can be that NH is only arranged
4OH, or NH
4OH, or the NH of high concentration
4OH and H
2O
2) aqueous solution.The NH that is replenished
4OH or H
2O
2Amount can be so that the NH of SC1 cleaning fluid
4OH or H
2O
2Content reaches definite value or more than the definite value.In one embodiment, NH
4The definite value of OH content is 13.5% and H
2O
2The definite value of content is 13.5%.Yet the present invention is not as limit, and the concentration definite value of key component can be set according to the needs of reality in the chemical solution.
The cleaning manufacture craft of the embodiment of the invention; Be with in the manufacture craft of chemical solution processing wafer 2 or after the manufacture craft; Measure the concentration of at least one key component in the chemical solution, when the concentration of key component is lower than certain value, adds one and replenish liquid; This additional liquid contains the composition identical with key component, so that the key component concentration in the chemical solution reaches definite value or more than the definite value.Repeat aforementioned mensuration and add to replenish after the number of steps time of liquid, upgrade chemical solution again.
In sum, the embodiment of the invention is to utilize concentration control apparatus and compensation arrangement and production board to form the loop circuit control system, utilizes the mode of adding key component; The concentration of key component in the compensation chemical solution; Can make the composition of the chemical solution of board keep stable, keep the stability of manufacture craft, promote the permission of manufacture craft; The time that chemical solution upgrades can reach more than 2 times; Not only can reduce the use amount of chemical solution, reach the purpose of environmental protection, also can reduce the cost of manufacture craft.
Though the present invention discloses as above with example embodiment; Right its is not in order to limit the present invention; Has common knowledge the knowledgeable in the technical field under any; Do not breaking away from the spirit and scope of the present invention, when can doing a little change and retouching, so protection scope of the present invention is when looking being as the criterion that the claim scope of enclosing defined.
Claims (14)
1. a manufacture craft system is characterized in that, comprising:
One produces board, is suitable for using a chemical solution to handle a wafer;
One concentration measurement apparatus was handled the concentration of at least one key component in this chemical solution of this wafer in order to mensuration; And
One compensation arrangement, when being lower than certain value in order to the concentration of this key component of measuring at this concentration measurement apparatus, provide one have a compensation rate additional liquid to this production board, wherein should replenish liquid and contain the composition identical with this key component.
2. manufacture craft according to claim 1 system, wherein this chemical solution comprises the glue at quarter that delusters, this key component comprises water.
3. manufacture craft according to claim 1 system, wherein this chemical solution comprises cleaning fluid, this key component comprises NH
4OH or H
2O
2Or its two.
4. manufacture craft according to claim 1 system more comprises a filter, crosses the impurity in this chemical solution of this wafer in order to filtration treatment.
5. based on the described manufacture craft of claim 4 system, more comprise a reflux, carry back this production board in order to this chemical solution after will filtering.
6. manufacture craft according to claim 5 system, wherein this concentration measurement apparatus is arranged at and is suitable for measuring in this reflux or the concentration of this key component in this chemical solution in this production board.
7. manufacture craft according to claim 6 system, wherein this production board comprises that a treatment trough and this reflux comprise:
One water jacket is arranged at this treatment trough periphery;
One transfer pipeline is communicated with this water jacket, in order to this chemical solution of water jacket is carried back this treatment trough; And
One power set are in order to provide power to this chemical solution.
8. manufacture craft according to claim 7 system, wherein this concentration measurement apparatus is arranged at the concentration that is suitable for measuring this key component in this chemical solution in treatment trough, this water jacket or this transfer pipeline.
9. manufacture craft according to claim 7 system, wherein this compensation arrangement was delivered in this water jacket in order to should replenish liquid, was delivered in this production board via this transfer pipeline again.
10. manufacture craft according to claim 7 system, wherein this reflux also comprises a temperature controller, is arranged at around this transfer pipeline, in order to control the temperature of this chemical solution.
11. a cleaning method, this method use a chemical solution to handle a wafer, this method comprises:
Measure in the manufacture craft or the concentration of at least one key component in this chemical solution after the manufacture craft; And
When the concentration of this key component of being measured is lower than certain value, add one and replenish liquid, it contains the composition identical with this key component, makes this key component concentration in this chemical solution reach this definite value or this is more than definite value.
12. cleaning method according to claim 11, wherein this chemical solution comprises the glue at quarter that delusters, and this key component comprises water.
13. cleaning method according to claim 11, wherein this chemical solution comprises cleaning fluid, and this key component comprises NH
4OH or H
2O
2Or its two.
14. based on the described cleaning method of claim 11, more comprise after the number of steps that repeats this chemical solution of aforementioned mensuration and add this additional liquid time, upgrade this chemical solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102291408A CN102339728A (en) | 2010-07-14 | 2010-07-14 | Manufacture process system and cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102291408A CN102339728A (en) | 2010-07-14 | 2010-07-14 | Manufacture process system and cleaning method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102339728A true CN102339728A (en) | 2012-02-01 |
Family
ID=45515386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102291408A Pending CN102339728A (en) | 2010-07-14 | 2010-07-14 | Manufacture process system and cleaning method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102339728A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107871689A (en) * | 2016-09-23 | 2018-04-03 | 株式会社斯库林集团 | Substrate board treatment and substrate processing method using same |
| CN114914167A (en) * | 2022-07-11 | 2022-08-16 | 广州粤芯半导体技术有限公司 | Cleaning solution monitoring method and system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5671760A (en) * | 1993-12-29 | 1997-09-30 | Hirama Rika Kenkyujo Ltd. | Apparatus for controlling resist stripping solution |
| US20050230045A1 (en) * | 2004-04-20 | 2005-10-20 | Hisashi Okuchi | Etching apparatus, a method of controlling an etching solution, and a method of manufacturing a semiconductor device |
| CN101140374A (en) * | 2006-09-08 | 2008-03-12 | 三星电子株式会社 | Etching liquid supply device, etching device and etching method |
| CN101150066A (en) * | 2006-09-20 | 2008-03-26 | 大日本网目版制造株式会社 | Substrate processing apparatus |
-
2010
- 2010-07-14 CN CN2010102291408A patent/CN102339728A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5671760A (en) * | 1993-12-29 | 1997-09-30 | Hirama Rika Kenkyujo Ltd. | Apparatus for controlling resist stripping solution |
| US20050230045A1 (en) * | 2004-04-20 | 2005-10-20 | Hisashi Okuchi | Etching apparatus, a method of controlling an etching solution, and a method of manufacturing a semiconductor device |
| CN101140374A (en) * | 2006-09-08 | 2008-03-12 | 三星电子株式会社 | Etching liquid supply device, etching device and etching method |
| CN101150066A (en) * | 2006-09-20 | 2008-03-26 | 大日本网目版制造株式会社 | Substrate processing apparatus |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107871689A (en) * | 2016-09-23 | 2018-04-03 | 株式会社斯库林集团 | Substrate board treatment and substrate processing method using same |
| CN107871689B (en) * | 2016-09-23 | 2022-05-17 | 株式会社斯库林集团 | Substrate processing apparatus and substrate processing method |
| CN114914167A (en) * | 2022-07-11 | 2022-08-16 | 广州粤芯半导体技术有限公司 | Cleaning solution monitoring method and system |
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Application publication date: 20120201 |