CN102338974A - Photoelectric navigation module - Google Patents

Photoelectric navigation module Download PDF

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Publication number
CN102338974A
CN102338974A CN2010102348567A CN201010234856A CN102338974A CN 102338974 A CN102338974 A CN 102338974A CN 2010102348567 A CN2010102348567 A CN 2010102348567A CN 201010234856 A CN201010234856 A CN 201010234856A CN 102338974 A CN102338974 A CN 102338974A
Authority
CN
China
Prior art keywords
filter glass
optical axis
glass touch
lens
touch panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010102348567A
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Chinese (zh)
Inventor
王庆平
徐青
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN XITAI MICROELECTRONICS TECHNOLOGY Co Ltd
Original Assignee
KUNSHAN XITAI MICROELECTRONICS TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNSHAN XITAI MICROELECTRONICS TECHNOLOGY Co Ltd filed Critical KUNSHAN XITAI MICROELECTRONICS TECHNOLOGY Co Ltd
Priority to CN2010102348567A priority Critical patent/CN102338974A/en
Publication of CN102338974A publication Critical patent/CN102338974A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a photoelectric navigation module, which mainly comprises a filter glass touch board, a main body support, an imaging lens, a light guide lens, a light-emitting diode (LED) light source, an imaging chip and a circuit board, wherein the imaging chip is electrically connected with the circuit board; the imaging lens is positioned between the filter glass touch board and the imaging chip; an optical axis of the imaging lens is respectively over against the filter glass touch board and the imaging chip; an angle of 30 to 60 degrees is formed between an optical axis of the light guide lens and the optical axis of the imaging lens; and the intersection point of the optical axes of the light guide lens and the imaging lens is positioned on the filter glass touch board; light rays sent by the LED light source can be refracted to the filter glass touch board through the light guide lens; and the filter glass touch board can only be transmitted by light rays of an infrared band. The photoelectric navigation module can be resistant to high temperature and is more economical and more convenient when being packaged, and the cost is greatly reduced.

Description

Photoconduction model plane group
Technical field
The present invention relates to a kind of camera module, relate in particular to a kind of photoconductive model plane group.
Background technology
The market share at smart mobile phone continues under the condition of enlarged; Application is enriched, is controlled conveniently, the creative smart mobile phone that makes is favored by the consumer more and more; Under keen competition and cost pressure; The solution of controlling that cost performance is higher helps market competition, photoelectricity navigation (Optical Finger Navigation; OFN) be a kind of solution of controlling, be different from the touch-control control solution that most in the past intelligent mobile phones adopt, present most intelligent mobile phone factory has begun to adopt successively OFN to control solution, and because of its superiority of effectiveness is obvious, cost is half the less than the latter's.
Existing photoconductive model plane group adopts image optics camera lens and the incorporate plastic cement camera lens of leaded light optical lens, and the one, mould very complicacy causes the camera lens unit price high; The 2nd, plastic cement camera lens non-refractory, module and terminal mainboard can not directly weld, and need the electron device switching, cause the module cost high.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides a kind of photoconductive model plane group, this photoconduction model plane group uses the wafer scale optical lens as leaded light camera lens and imaging lens, and is not only high temperature resistant, easy to use, and greatly reduces cost.
The present invention for the technical scheme that solves its technical matters and adopt is: a kind of photoconductive model plane group; Mainly comprise filter glass touch panel, main body rack, imaging lens, leaded light camera lens, led light source, imager chip and wiring board; Imager chip and wiring board electrically connect; Said imaging lens is between filter glass touch panel and imager chip, and the optical axis of this imaging lens is respectively over against filter glass touch panel and imager chip; The optical axis of said leaded light camera lens becomes 30~60 ° of angles with the optical axis of said imaging lens, and the intersection point of the optical axis of the optical axis of this leaded light camera lens and imaging lens is positioned on the filter glass touch panel; The light that said led light source sends can be refracted on the said filter glass touch panel through said light guiding lens; Said filter glass touch panel only can make the light of infrared band see through.The light that led light source sends passes through leaded light camera lens collimation uniform irradiation to the filter glass touch panel; Because the filter glass touch panel only makes the light of infrared band see through; Therefore have only the light of infrared band to see through the filter glass touch panel; The light of its all band is then by the shielding of filter glass touch panel, if user's finger touches filter glass touch panel, the light that then sees through the infrared band of filter glass touch panel is blocked by finger emission takes place to overflow; And seeing through the filter glass touch panel once more, the infrared band light that sees through the filter glass touch panel runs into imaging lens and on imager chip, forms images.Moving all of all directions will be through the fingerprint image on the imager chip by the imager chip record on the filter glass touch panel for user's finger, thereby realizes navigating.
As optimal way of the present invention, the optical axis of said leaded light camera lens becomes 45 with the optical axis of said imaging lens.
As further improvement of the present invention, said imaging lens and leaded light camera lens are the wafer scale optical lens.Thereby can replace the plastic cement camera lens, and can anti-high temperature more than 200 ℃.
As optimal way of the present invention, the intersection point of the optical axis of said leaded light camera lens and the optical axis of imaging lens is positioned at the center of filter glass touch panel.
The invention has the beneficial effects as follows: make the optical axis of leaded light camera lens become a certain angle with the optical axis of imaging lens; Available wafer scale optical lens replaces the plastic cement camera lens to do leaded light camera lens and imaging lens; Can not only be high temperature resistant, and greatly reduce cost, also more economical during encapsulation, convenient.
Description of drawings
Fig. 1 is a photoconductive model plane group structural representation according to the invention;
Fig. 2 is a photoconductive model plane group front view according to the invention;
Fig. 3 is a photoconductive model plane group side view according to the invention;
Fig. 4 is a photoconductive model plane group rear view according to the invention.
Embodiment
A kind of photoconductive model plane group; Mainly comprise filter glass touch panel 1, main body rack 2, imaging lens 3, leaded light camera lens 4, led light source 5, imager chip 6 and wiring board 7; Imager chip 6 electrically connects with wiring board 7; Said imaging lens 3 is between filter glass touch panel 1 and imager chip 6, and the optical axis of this imaging lens 3 is respectively over against filter glass touch panel 1 and imager chip 6; The optical axis of said leaded light camera lens 4 becomes 30~60 ° of angles with the optical axis of said imaging lens 3, and the intersection point of the optical axis of the optical axis of this leaded light camera lens 4 and imaging lens 3 is positioned on the filter glass touch panel 1; The light that said led light source 5 sends can be refracted on the said filter glass touch panel 1 through said light guiding lens 4; Said filter glass touch panel 1 only can make the light of infrared band see through.The light that led light source 5 sends passes through leaded light camera lens 4 collimation uniform irradiations to filter glass touch panel 1; Because filter glass touch panel 1 only makes the light of infrared band see through; Therefore have only the light of infrared band to see through filter glass touch panel 1; The light of its all band is then by 1 shielding of filter glass touch panel, if user's finger touches filter glass touch panel 1, the light that then sees through the infrared band of filter glass touch panel 1 is blocked by finger emission takes place to overflow; And seeing through filter glass touch panel 1 once more, the infrared band light that sees through filter glass touch panel 1 runs into imaging lens 3 and on imager chip 6, forms images.User's finger will be through the fingerprint image on the imager chip 6 by the imager chip record moving all of all directions on the filter glass touch panel, thereby realizes navigating.
As one of optimal way of the present invention, the optical axis of above-mentioned leaded light camera lens 4 becomes 45 with the optical axis of said imaging lens 3.
As one of optimal way of the present invention, above-mentioned imaging lens 3 is the wafer scale optical lens with leaded light camera lens 4.Thereby can replace the plastic cement camera lens, and can anti-high temperature more than 200 ℃.
As one of optimal way of the present invention, the intersection point of the optical axis of the optical axis of above-mentioned leaded light camera lens 4 and imaging lens 3 is positioned at the center of filter glass touch panel 1.

Claims (4)

1. photoconductive model plane group; Mainly comprise filter glass touch panel (1), main body rack (2), imaging lens (3), leaded light camera lens (4), led light source (5), imager chip (6) and wiring board (7); Imager chip (6) and wiring board (7) electrically connect; It is characterized in that: said imaging lens (3) is positioned between filter glass touch panel (1) and the imager chip (6), and the optical axis of this imaging lens (3) is respectively over against filter glass touch panel (1) and imager chip (6); The optical axis of said leaded light camera lens (4) becomes 30~60 ° of angles with the optical axis of said imaging lens (3), and the intersection point of the optical axis of the optical axis of this leaded light camera lens (4) and imaging lens (3) is positioned on the filter glass touch panel (1); The light that said led light source (5) sends can be refracted on the said filter glass touch panel (1) through said light guiding lens (4); Said filter glass touch panel (1) only can make the light of infrared band see through.
2. photoconductive model plane group according to claim 1 is characterized in that: the optical axis of said leaded light camera lens (4) becomes 45 with the optical axis of said imaging lens (3).
3. photoconductive model plane group according to claim 1 and 2 is characterized in that: said imaging lens (3) and leaded light camera lens (4) are the wafer scale optical lens.
4. photoconductive model plane group according to claim 3 is characterized in that: the intersection point of the optical axis of the optical axis of said leaded light camera lens (4) and imaging lens (3) is positioned at the center of filter glass touch panel (1).
CN2010102348567A 2010-07-22 2010-07-22 Photoelectric navigation module Pending CN102338974A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010102348567A CN102338974A (en) 2010-07-22 2010-07-22 Photoelectric navigation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010102348567A CN102338974A (en) 2010-07-22 2010-07-22 Photoelectric navigation module

Publications (1)

Publication Number Publication Date
CN102338974A true CN102338974A (en) 2012-02-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010102348567A Pending CN102338974A (en) 2010-07-22 2010-07-22 Photoelectric navigation module

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CN (1) CN102338974A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040084610A1 (en) * 2002-11-01 2004-05-06 Leong Ak Wing Optical navigation sensor with integrated lens
CN1808363A (en) * 2005-01-19 2006-07-26 安捷伦科技有限公司 Optical slide pad
CN1838049A (en) * 2005-03-21 2006-09-27 安捷伦科技有限公司 Compact and low profile optical navigation device
CN101034330A (en) * 2006-03-08 2007-09-12 宏齐科技股份有限公司 Optical navigation device
WO2009116371A1 (en) * 2008-03-19 2009-09-24 コニカミノルタオプト株式会社 Method for producing wafer lens
CN201828752U (en) * 2010-07-22 2011-05-11 昆山西钛微电子科技有限公司 Photoelectric navigation module

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040084610A1 (en) * 2002-11-01 2004-05-06 Leong Ak Wing Optical navigation sensor with integrated lens
CN1808363A (en) * 2005-01-19 2006-07-26 安捷伦科技有限公司 Optical slide pad
CN1838049A (en) * 2005-03-21 2006-09-27 安捷伦科技有限公司 Compact and low profile optical navigation device
CN101034330A (en) * 2006-03-08 2007-09-12 宏齐科技股份有限公司 Optical navigation device
WO2009116371A1 (en) * 2008-03-19 2009-09-24 コニカミノルタオプト株式会社 Method for producing wafer lens
CN201828752U (en) * 2010-07-22 2011-05-11 昆山西钛微电子科技有限公司 Photoelectric navigation module

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JOHN FRAME等: "光学导航传感器技术开启新一代感测应用风潮", 《电子与电脑》 *
REINHARD VOELKEL等: "透视晶圆级摄像头", 《集成电路应用》 *
埃帕克森微电子(上海)有限公司: "光电导航SOC芯片系列", 《中国集成电路》 *

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Application publication date: 20120201