CN102332420B - Ultrathin umbrella-flow-type non-contact silicon wafer sucking disc - Google Patents
Ultrathin umbrella-flow-type non-contact silicon wafer sucking disc Download PDFInfo
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- CN102332420B CN102332420B CN 201110136694 CN201110136694A CN102332420B CN 102332420 B CN102332420 B CN 102332420B CN 201110136694 CN201110136694 CN 201110136694 CN 201110136694 A CN201110136694 A CN 201110136694A CN 102332420 B CN102332420 B CN 102332420B
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Abstract
The invention relates to a solar cell or semiconductor wafer adsorbing device and particularly relates to an ultrathin umbrella-flow-type non-contact silicon wafer sucking disc, which comprises a sucking disc body and a spray nozzle. A cylindrical hole, a circular chamber and an umbrella air flow chamber are sequentially arranged on the sucking disc body along a central axis. A transverse cylinder and a longitudinal cylinder which are perpendicular to each other form a T-shaped structure of the spray nozzle. A circular step is arranged at the connected part of the transverse cylinder and the longitudinal cylinder. The longitudinal cylinder is in interference fit with the cylindrical hole of the sucking disc body. A principle that umbrella air flows generate a vacuum is used to clamp and deliver silicon wafers, in the adsorbing process, the edge of the sucking disc is used as a static-pressure support, not only can a workpiece be adsorbed, but also the workpiece is ensured not to be in contact with the sucking disc and the wafers can be prevented from rotating, vibrating and the like.
Description
Technical field
The present invention relates to solar battery sheet or semiconductor crystal wafer sheet adsorption device, specifically refer to a kind of Ultrathin umbrella-flow-type non-contact silicon wafer adsorbent equipment.
Background technology
The clamping of silicon chip and conveying are important steps in solar silicon wafers and the production process of semiconductor, affect largely the q﹠r of silicon chip.In the prior art, mainly adopt contact vacuum cup technology to carry out clamping and the conveying of silicon chip.Namely by vacuum suction the silicon chip lower surface is close to transfer robot, has guaranteed the stability of silicon chip transport process.Yet, easily cause the silicon chip unbalance stress with direct contact of sucker, cause easily the problems such as silicon warp, distortion.In addition, adopt the contact method of clamping, with causing inevitably pollution and the scuffing of silicon chip surface, badly influence the silicon chip surface quality, reduced production efficiency and the stock utilization of silicon processing.Especially for having the chip manufacturing proces of nano-precision, the easier further increase that causes percent defective of contact vacuum suction technology.
At present, the someone proposes eddy current type noncontact clamping principle (US Patent No. 6099056).Compare with the bernoulli principle device, adopt this technology can in equivalent gas situation, obtain larger absorption affinity.Yet the introducing of eddy-currents has but caused the generation of silicon chip surface shearing force.Under the traction of shearing force, be held silicon chip and be forced to rotate motion, thereby cause silicon chip to play pendulum.When situation is serious, even vibration-generating in the vertical direction, bump with miscellaneous part, thereby have influence on effective enforcement of this scheme.
Summary of the invention
The technical problem to be solved in the present invention is that the defective for prior art exists provides a kind of Ultrathin umbrella-flow-type non-contact silicon wafer sucking disc, realizes noncontact clamping and the conveying of silicon chip, and can avoid silicon slice rotating.
Technical scheme of the present invention is, a kind of Ultrathin umbrella-flow-type non-contact silicon wafer sucking disc, comprise sucker body and nozzle, it is characterized in that, described sucker body is provided with cylindrical hole, circular cavity and umbrella air flow chamber successively along central axis, the circular cavity radius is greater than the cylindrical hole radius, and the end face radius of umbrella air flow chamber is greater than the circular cavity radius, and there is annular groove on circular cavity top with the air inlet hole link; Described nozzle consists of T-shaped structure by mutually perpendicular horizontal cylinder and vertical cylinder, laterally cylinder both sides upper surface respectively is provided with spherical concave surface and two spherical concave surfaces relatively vertically cylinder axis is for being symmetrical arranged, and laterally cylinder is provided with step cutting pattern with vertical cylinder connection position; The vertical cylinder of nozzle places in the sucker body cylindrical hole, and vertical cylinder and sucker body cylindrical hole interference fit, described step cutting pattern is arranged in circular cavity, laterally cylinder places in the umbrella air flow chamber, the circular cavity of sucker body communicates with spherical concave surface, and is laterally gapped between cylinder and the umbrella air flow chamber.
Below the invention will be further described.
The horizontal cylinder outer surface of described nozzle places the sucker body outside.
During Ultrathin umbrella-flow-type non-contact silicon wafer sucking disc work of the present invention, the compressed air that will have certain pressure is introduced circular cylindrical cavity, because this cavity is over against the sphere of nozzle below, air-flow sprays at a high speed along sucker umbrella body after the spherical structure reflection of nozzle, thereby cause sucker T prefix top to produce vacuum phenomenon, under vacuum action, workpiece is picked up.After workpiece was picked up, the distance of workpiece and sucker reduced, and caused from the inner outwards gas flow resistance increment of ejection of sucker, and the pressure of sucker cavity and body edges raises, and produces repulsion, stops workpiece to contact with sucker.Under repulsion and suction maintenance balance, workpiece will be raised in maintenance certain interval situation with sucker.
Compared with prior art, the present invention adopts umbrella air-flow generation vacuum principle to carry out clamping and the conveying of silicon chip.In adsorption process, the sucker edge supports as static pressure, and both adsorbable workpiece can guarantee again workpiece and sucker noncontact, and can also avoid the generation of the problems such as wafer rotation, vibration.In addition, air-flow is introduced path and is located at sucker body radial direction, saves the space; It is simple to have manufacturing process, and air consumption is little, adsorbs the advantages such as firm.
Description of drawings
Fig. 1 is the front view of a kind of embodiment of sucker body of the present invention;
Fig. 2 is A-A face cutaway view among Fig. 1;
Fig. 3 is the structural representation of a kind of embodiment of nozzle of the present invention;
Fig. 4 is the structural front view of the whole a kind of embodiment of sucker of the present invention;
Fig. 5 is B-B face cutaway view among Fig. 4.
Embodiment
A kind of Ultrathin umbrella-flow-type non-contact silicon wafer sucking disc comprises sucker body and nozzle.
As shown in Figure 1 and Figure 2, described sucker body is provided with cylindrical hole 1, circular cavity 2 and umbrella air flow chamber 3 successively along central axis, circular cavity 2 radiuses are greater than cylindrical hole 1 radius, and the end face radius of umbrella air flow chamber 3 is greater than circular cavity 2 radiuses, and circular cavity 2 tops have annular groove to be communicated with air inlet duct 8.
As shown in Figure 3, described nozzle consists of T-shaped structure by mutually perpendicular horizontal cylinder 5 and vertical cylinder 4, laterally cylinder 5 both sides upper surfaces respectively are provided with spherical concave surface 6 and two spherical concave surfaces 6 relatively vertically cylinder 4 axis are for being symmetrical arranged, and laterally cylinder 5 is provided with step cutting pattern 7 with vertical cylinder 4 connecting portions.
Such as Fig. 4, shown in Figure 5, the vertical cylinder 4 of nozzle places in the sucker body cylindrical hole 1, and vertical cylinder 4 and sucker body cylindrical hole 1 interference fit, described step cutting pattern 7 is arranged in circular cavity 2, laterally cylinder 5 places in the umbrella air flow chamber 3, the circular cavity 2 of sucker body communicates with spherical concave surface 6, and is laterally gapped between cylinder 5 and the umbrella air flow chamber 3.
Claims (2)
1. Ultrathin umbrella-flow-type non-contact silicon wafer sucking disc, comprise sucker body and nozzle, it is characterized in that, described sucker body is provided with cylindrical hole (1), circular cavity (2) and umbrella air flow chamber (3) successively along central axis, circular cavity (2) radius is greater than cylindrical hole (1) radius, the end face radius of umbrella air flow chamber (3) is greater than circular cavity (2) radius, and circular cavity (2) top has annular groove to be communicated with air inlet duct (8); Described nozzle consists of T-shaped structure by mutually perpendicular horizontal cylinder (5) and vertical cylinder (4), laterally cylinder (5) both sides upper surface respectively is provided with spherical concave surface (6) and two spherical concave surfaces (6) relatively vertically cylinder (4) axis is for being symmetrical arranged, and laterally cylinder (5) is provided with step cutting pattern (7) with vertical cylinder (4) connecting portion; The vertical cylinder of nozzle (4) places in the sucker body cylindrical hole (1), and vertical cylinder (4) and sucker body cylindrical hole (1) interference fit, described step cutting pattern (7) is arranged in circular cavity (2), laterally cylinder (5) places in the umbrella air flow chamber (3), the circular cavity of sucker body (2) communicates with spherical concave surface (6), and is laterally gapped between cylinder (5) and the umbrella air flow chamber (3).
2. described Ultrathin umbrella-flow-type non-contact silicon wafer sucking disc according to claim 1 is characterized in that, the horizontal cylinder of described nozzle (5) outer surface places the sucker body outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110136694 CN102332420B (en) | 2011-05-25 | 2011-05-25 | Ultrathin umbrella-flow-type non-contact silicon wafer sucking disc |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110136694 CN102332420B (en) | 2011-05-25 | 2011-05-25 | Ultrathin umbrella-flow-type non-contact silicon wafer sucking disc |
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| CN102332420A CN102332420A (en) | 2012-01-25 |
| CN102332420B true CN102332420B (en) | 2013-01-02 |
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| CN 201110136694 Active CN102332420B (en) | 2011-05-25 | 2011-05-25 | Ultrathin umbrella-flow-type non-contact silicon wafer sucking disc |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105332992B (en) * | 2014-07-30 | 2018-01-12 | 睿励科学仪器（上海）有限公司 | Vacuum cup |
| JP6489471B2 (en) * | 2014-11-27 | 2019-03-27 | パナソニックＩｐマネジメント株式会社 | Adsorption heating head |
| CN105855602B (en) * | 2016-05-24 | 2018-01-09 | 大连理工大学 | A kind of fluid pressure branch fastener and support meanss for aircraft skin mirror image milling |
| CN107825454A (en) * | 2017-12-15 | 2018-03-23 | 无锡思锐电子设备科技有限公司 | A kind of Contactless sucking disk |
| CN112490171B (en) * | 2020-11-20 | 2023-12-19 | 浙江大学 | Disc non-contact adsorption device based on near-field sound suspension principle |
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| EP1715514A1 (en) * | 2004-02-09 | 2006-10-25 | Koganei Corporation | Non-contact carrier device |
| CN101308805A (en) * | 2008-06-27 | 2008-11-19 | 浙江大学 | Non-contact silicon chip clamping device |
| CN101510521A (en) * | 2009-03-23 | 2009-08-19 | 浙江大学 | Device for clamping volution type non-contact silicon chip |
| CN101678968A (en) * | 2007-05-25 | 2010-03-24 | 康宁股份有限公司 | Be used to carry the device and the system of glass board |
| DE102009051565A1 (en) * | 2009-10-22 | 2011-04-28 | Alexander Borowski | Intake gripper device for flat substrates |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58141536A (en) * | 1982-02-17 | 1983-08-22 | Sanyo Electric Co Ltd | Attracting head of semiconductor wafer |
| JP3383739B2 (en) * | 1996-06-11 | 2003-03-04 | 株式会社コガネイ | Work holding device |
| JP2003245885A (en) * | 2002-02-25 | 2003-09-02 | Koganei Corp | Carrier apparatus |
| JP5405911B2 (en) * | 2009-06-12 | 2014-02-05 | リンテック株式会社 | Transport device |
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- 2011-05-25 CN CN 201110136694 patent/CN102332420B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1715514A1 (en) * | 2004-02-09 | 2006-10-25 | Koganei Corporation | Non-contact carrier device |
| CN101678968A (en) * | 2007-05-25 | 2010-03-24 | 康宁股份有限公司 | Be used to carry the device and the system of glass board |
| CN101308805A (en) * | 2008-06-27 | 2008-11-19 | 浙江大学 | Non-contact silicon chip clamping device |
| CN101510521A (en) * | 2009-03-23 | 2009-08-19 | 浙江大学 | Device for clamping volution type non-contact silicon chip |
| DE102009051565A1 (en) * | 2009-10-22 | 2011-04-28 | Alexander Borowski | Intake gripper device for flat substrates |
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| JP特开2003-245885A 2003.09.02 |
| JP特开2010-287783A 2010.12.24 |
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