CN102324414A - 有基岛预填塑封料先镀后刻引线框结构及其生产方法 - Google Patents
有基岛预填塑封料先镀后刻引线框结构及其生产方法 Download PDFInfo
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- CN102324414A CN102324414A CN201110268360A CN201110268360A CN102324414A CN 102324414 A CN102324414 A CN 102324414A CN 201110268360 A CN201110268360 A CN 201110268360A CN 201110268360 A CN201110268360 A CN 201110268360A CN 102324414 A CN102324414 A CN 102324414A
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- metal substrate
- back side
- pin
- photoresist film
- lead frame
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- 239000000463 material Substances 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 99
- 239000002184 metal Substances 0.000 claims abstract description 99
- 238000005530 etching Methods 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims description 67
- 229920002120 photoresistant polymer Polymers 0.000 claims description 42
- 239000005022 packaging material Substances 0.000 claims description 33
- 238000003384 imaging method Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 238000005253 cladding Methods 0.000 claims description 3
- -1 Step 4 Substances 0.000 claims 1
- 239000002313 adhesive film Substances 0.000 abstract 1
- 239000012528 membrane Substances 0.000 description 16
- 238000005538 encapsulation Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
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- Engineering & Computer Science (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
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CN2011102683606A CN102324414B (zh) | 2011-09-13 | 2011-09-13 | 有基岛预填塑封料先镀后刻引线框结构及其生产方法 |
PCT/CN2012/001159 WO2013037185A1 (en) | 2011-09-13 | 2012-08-28 | Pre-encapsulated plating-then-etching lead frame structure with island and manufacturing method |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013037183A1 (en) * | 2011-09-13 | 2013-03-21 | Jiangsu Changjiang Electronics Technology Co. Ltd | Sequentially etched and plated lead frame structure with island prepacked molding compound and manufacturing method thereof |
WO2013037185A1 (en) * | 2011-09-13 | 2013-03-21 | Jiangsu Changjiang Electronics Technology Co. Ltd | Pre-encapsulated plating-then-etching lead frame structure with island and manufacturing method |
CN109065459A (zh) * | 2018-07-27 | 2018-12-21 | 大连德豪光电科技有限公司 | 焊盘的制作方法 |
CN110429036A (zh) * | 2019-06-19 | 2019-11-08 | 惠州市志金电子科技有限公司 | 接触式身份识别卡的封装工艺及接触式身份识别卡 |
CN113555328A (zh) * | 2021-04-02 | 2021-10-26 | 江苏尊阳电子科技有限公司 | 一种背面先蚀的封装结构的封装工艺 |
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JP2003318329A (ja) * | 2002-04-19 | 2003-11-07 | Dainippon Printing Co Ltd | パッケージ基板の製造方法及びそれにより製造されたパッケージ基板並びにそれを用いた半導体パッケージ |
CN101814482A (zh) * | 2010-04-30 | 2010-08-25 | 江苏长电科技股份有限公司 | 有基岛引线框结构及其生产方法 |
CN101958257A (zh) * | 2010-09-04 | 2011-01-26 | 江苏长电科技股份有限公司 | 双面图形芯片直接置放先镀后刻模组封装方法 |
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TWI264099B (en) * | 2001-07-09 | 2006-10-11 | Sumitomo Metal Mining Co | Lead frame and manufacturing method therefor |
TWI245429B (en) * | 2003-12-23 | 2005-12-11 | Siliconware Precision Industries Co Ltd | Photosensitive semiconductor device, method for fabricating the same and lead frame thereof |
KR101204092B1 (ko) * | 2008-05-16 | 2012-11-22 | 삼성테크윈 주식회사 | 리드 프레임 및 이를 구비한 반도체 패키지와 그 제조방법 |
CN102324414B (zh) * | 2011-09-13 | 2013-06-26 | 江苏长电科技股份有限公司 | 有基岛预填塑封料先镀后刻引线框结构及其生产方法 |
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- 2011-09-13 CN CN2011102683606A patent/CN102324414B/zh active Active
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003318329A (ja) * | 2002-04-19 | 2003-11-07 | Dainippon Printing Co Ltd | パッケージ基板の製造方法及びそれにより製造されたパッケージ基板並びにそれを用いた半導体パッケージ |
CN101814482A (zh) * | 2010-04-30 | 2010-08-25 | 江苏长电科技股份有限公司 | 有基岛引线框结构及其生产方法 |
CN101958257A (zh) * | 2010-09-04 | 2011-01-26 | 江苏长电科技股份有限公司 | 双面图形芯片直接置放先镀后刻模组封装方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013037183A1 (en) * | 2011-09-13 | 2013-03-21 | Jiangsu Changjiang Electronics Technology Co. Ltd | Sequentially etched and plated lead frame structure with island prepacked molding compound and manufacturing method thereof |
WO2013037185A1 (en) * | 2011-09-13 | 2013-03-21 | Jiangsu Changjiang Electronics Technology Co. Ltd | Pre-encapsulated plating-then-etching lead frame structure with island and manufacturing method |
CN109065459A (zh) * | 2018-07-27 | 2018-12-21 | 大连德豪光电科技有限公司 | 焊盘的制作方法 |
CN110429036A (zh) * | 2019-06-19 | 2019-11-08 | 惠州市志金电子科技有限公司 | 接触式身份识别卡的封装工艺及接触式身份识别卡 |
CN113555328A (zh) * | 2021-04-02 | 2021-10-26 | 江苏尊阳电子科技有限公司 | 一种背面先蚀的封装结构的封装工艺 |
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