CN102324410A - Electronic component and heat radiation system - Google Patents
Electronic component and heat radiation system Download PDFInfo
- Publication number
- CN102324410A CN102324410A CN201110321068A CN201110321068A CN102324410A CN 102324410 A CN102324410 A CN 102324410A CN 201110321068 A CN201110321068 A CN 201110321068A CN 201110321068 A CN201110321068 A CN 201110321068A CN 102324410 A CN102324410 A CN 102324410A
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- electronic component
- heating part
- radiator
- core heating
- fixing hole
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Abstract
The invention provides an electronic component including a core heating part biased from the middle position of the electronic component. A fixed hole used for fixedly connecting the electronic component with a heat radiator is formed on the side edge of the electronic component biased from the middle position and close to the core heating part. The invention also provides a heat radiation system corresponding to the electronic component. According to the electronic component and the heat radiation system, because the fixed hole is not in the middle of the side edge of the electronic component but formed in a position close to the core heating part, the core heating part and the heat radiator in the invention can more closely contact/approach each other so that the heat resistance between the core heating part and the heat radiator is smaller and better heat radiation effect is obtained.
Description
[technical field]
The present invention relates to electronic technology field, need do the electronic component and the cooling system thereof of radiating treatment when particularly relating to a kind of work.
[background technology]
Electronic product has spread all over our various fields in life of working, and electronic product has a total characteristic can when energising work, generate heat exactly, so a lot of electronic products has all designed cooling system.Modal heat-generating electronic elements is exactly an IC chip, and is packaged with power model (Power Module) of a plurality of chips or circuit etc.
In order to improve the radiating effect of electronic component, generally through fixing at electronical elements surface or pasting metal heat sink, metal heat sink plays the effect of heat conduction and heat radiation.If the heating position of metal heat sink and electronic component is not close to, will cause radiating effect not good enough.The bad meeting of dispelling the heat causes the reduction of the reliability of electronic component, power grade and finally causes electronic component to increase in the failure rate of practical application.
[summary of the invention]
Based on this, thereby be necessary to provide a kind of convenience to contact electronic component and the cooling system thereof that reaches better radiating effect with radiator.
A kind of electronic component, it comprises the core heating part that departs from said electronic component centre position.Be provided with in the middle of departing from the side of said electronic component and near the position of said core heating part and be used for fixing hole that said electronic component is fixedly connected with radiator.
A kind of electronic element radiating system, it comprises electronic component and radiator, and the retaining element that the above two are fixed together, said electronic component comprises the core heating part that departs from said electronic component centre position.Be provided with in the middle of departing from the side of said electronic component and near the position of said core heating part and be used for fixing hole that said electronic component is fixedly connected with said radiator.
In one preferred embodiment, said electronic component also comprises the packaging body that is used to wrap up said core heating part, and said fixing hole is opened on the said packaging body, and said packaging body is provided with the radiating surface that is connected with said radiator.
In one preferred embodiment, the above radiating surface counterpart of said core heating part and said packaging body is copper or aluminium.
In one preferred embodiment, said fixing hole has two, and is separately positioned on two relative sides of electronic component.
In one preferred embodiment, said electronic component also comprises less important heating part, and said less important heating part is a drive circuit, and said core heating part is the power semiconductor by said driving circuit drives.
In one preferred embodiment, said fixing hole is semicircle breach or through hole.
Above-mentioned electronic component and cooling system thereof; Because fixing hole is not the centre at the electronic component side; And being arranged on more position near the core heating part, conventional art relatively, the core heating part among the present invention can contact with radiator more closely/near; Thereby make that the thermal resistance between it is littler, radiating effect is better.
[description of drawings]
Fig. 1 is the structural representation of conditional electronic element;
Fig. 2 A is the theoretic structural representation at another visual angle of electronic component shown in Figure 1;
Fig. 2 B is the actual structural representation at another visual angle of electronic component shown in Figure 1;
Fig. 3 is the cooling system that the electronic component shown in Fig. 2 B combines with radiator;
Fig. 4 is the electronic component structure sketch map of a preferred embodiment;
Fig. 5 is the cooling system that electronic component shown in Figure 4 combines with radiator.
[embodiment]
In order to let electronic component can reach better radiating effect, the electronic component that the present invention provides a kind of heating part to be close to radiator.This electronic component comprises the core heating part; Said core heating part departs from said electronic component centre position, is provided with in the middle of departing from the side of said electronic component and near the position of said core heating part to be used for fixing hole that said electronic component is fixedly connected with radiator.Following illustrative example explanation.
As shown in Figure 1, it is the structural representation of conditional electronic element 10.Electronic component 10 comprises the packaging body 100 that is used to wrap up integrated circuit, the power semiconductor part 120 that the integrated circuit in the packaging body 100 includes driving circuit section 110 (chip for driving and passive device) and driven by driving circuit section 110.Electronic component 10 is when work; Heat almost is that power semiconductor part 120 produces all; 110 of driving circuit section produce less heat; So all can do special heat dissipation design usually, strengthen heat radiation through the polymeric material of ceramic substrate, DBC (Direct Bonding copper) substrate, IMS (aluminium base) or high heat conduction such as power semiconductor part 120 to power semiconductor part 120.
Please consult Fig. 2 A simultaneously, be the theoretic structural representation at electronic component shown in Figure 1 10 another visual angles.Have a radiating surface 102 on the packaging body 100, be used for the heat that internal integrated circuit produces is outwards distributed.The centre on the limit, two opposite sides on the packaging body 100 also offers fixing hole 130 respectively, and fixing hole 130 can be semicircle breach or through hole.Fixing hole 130 is used for through retaining elements such as screw or rivets electronic component 10 and radiator (fin) being linked together; Make radiating surface 102 contact with radiator (during practice, also can fill the silica gel material that is used for heat conduction between radiating surface 102 and the radiator).
In theory, when producing electronic component 10, all can radiating surface 102 be designed to a plane, so that better the contact arranged with radiator.But in the manufacture process of electronic component 10, encapsulation process is at high temperature plastic packaging material to be solidified.Please consult Fig. 2 B simultaneously; Because the CTE (thermal coefficient of expansion) of electronic component 10 internal materials does not match that (as: CTE of copper product is about 17ppm/ ℃; The CTE of ceramic material is about 7ppm/ ℃, and the CTE of plastic packaging material material is about 15ppm/ ℃), under the variation of high low temperature; Finally can cause the radiating surface 102 of electronic component 10 that warpage takes place, form a convex surface.(warpage degree of radiating surface 102 is to understand for ease and warpage degree has been magnified among Fig. 2 B).
See also Fig. 3, the cooling system that combines with radiator 140 for the electronic component 10 shown in Fig. 2 B.Electronic component 10 is fixed together with radiator 140 through the screw 150 that passes fixing hole 130, is filled with Heat Conduction Material 160 between electronic component 10 and the radiator 140.Yet the core heating part in the packaging body 100---power semiconductor part 120 is not the centre that is distributed in the packaging body 100 usually, but is partial to a certain side.Situation as shown in Figure 3; Because the radiating surface 102 of electronic component 10 is convex surfaces; And fixing hole 130 is opened in the centre of packaging body 100 sides again; Will cause power semiconductor part 120 nearer like this, and power semiconductor part 120 is far away away from the partial distance radiator 140 of fixing hole 130 near the partial distance radiator 140 of fixing hole 130.Be that part on the corresponding radiating surface 102 of power semiconductor part 120 can not well contact with radiator 140.Power semiconductor part 120 discrete heat devices 140 are far away more, and thermal resistance is just big more, and so just makes that whole radiating efficiency is lower.The bad meeting of heat radiation cause electronic component 10 reliability, power grade reduction and finally cause electronic component 10 to increase in the failure rate of practical application.
To cause the bad problem of dispelling the heat in order solving, to contact the electronic component that reaches better radiating effect with radiator thereby proposed a kind of convenience owing to electronical elements surface is protruding.
As shown in Figure 4, it is electronic component 20 structural representations of a preferred embodiment.Electronic component 20 comprises square packaging body 200, is provided with first circuit part 210 and second circuit part 220 in the packaging body 200.Wherein, First circuit part 210 is less important heating part; Second circuit part 220 is the core heating part; And the centre position that first circuit part 210 and second circuit part 220 all depart from packaging body 200, promptly as shown in Figure 4, first circuit part 210 and second circuit part 220 are respectively near the limit, two opposite sides of packaging body 200.The centre position on the limit, other two opposite sides on the part of the packaging body 200 that second circuit part 220 is corresponding offers fixing hole 230 respectively, in the middle of promptly fixing hole 230 is arranged on and departs from two relative sides of packaging body 200 and near the position of second circuit part 220.Fixing hole 230 is used for through retaining elements such as screw or rivets electronic component 20 and radiator (fin) being linked together.
Please consult Fig. 5 simultaneously, it is the cooling system that electronic component 20 shown in Figure 4 combines with radiator 240.Electronic component 20 is fixed together with radiator 240 through the screw 250 that passes fixing hole 230, is filled with Heat Conduction Material 260 between electronic component 20 and the radiator 240.Electronic component 20 is provided with a radiating surface 202, and this radiating surface 202 links to each other with radiator 140.
From Fig. 5, obviously can find out; Because fixing hole 230 is more near second circuit part 220; Conventional art shown in Figure 3 so relatively, the radiator 240 in this execution mode is nearer apart from the part on the radiating surface 202 of second circuit part 220 correspondences, promptly contacts more closely with radiator 240; Thereby make that the thermal resistance between it is littler, radiating effect is better.
In this execution mode, first circuit part 210 and second circuit part 220 are respectively drive circuit (chip for driving and passive device) and by the power semiconductor of driving circuit drives, and both divide in packaging body 200 and are arranged.Above-mentioned centre is not must be the middle, can depart from the position, middle slightly.Said fixing hole 230 also may not be two, and less electronic component only needs a fixing hole 230 to get final product.In addition, in order further to strengthen radiating effect, radiating surface 202 counterparts are provided with heat conductivility preferred metal or alloy materials such as copper or aluminium on said second circuit part 220 as the core heating part and the packaging body 200.
The above embodiment has only expressed several kinds of execution modes of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the present invention's design, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with accompanying claims.
Claims (10)
1. electronic component; It comprises the core heating part that departs from said electronic component centre position, it is characterized in that: be provided with in the middle of departing from the side of said electronic component and near the position of said core heating part and be used for fixing hole that said electronic component is fixedly connected with radiator.
2. electronic component according to claim 1; It is characterized in that; Said electronic component also comprises the packaging body that is used to wrap up said core heating part, and said fixing hole is opened on the said packaging body, and said packaging body is provided with the radiating surface that is connected with said radiator.
3. electronic component according to claim 2 is characterized in that, the above radiating surface counterpart of said core heating part and said packaging body is copper or aluminium.
4. electronic component according to claim 1 is characterized in that said fixing hole has two, and is separately positioned on two relative sides of electronic component.
5. electronic component according to claim 1 is characterized in that said electronic component also comprises less important heating part, and said less important heating part is a drive circuit, and said core heating part is the power semiconductor by said driving circuit drives.
6. electronic component according to claim 1 is characterized in that, said fixing hole is semicircle breach or through hole.
7. electronic element radiating system; It comprises electronic component and radiator; And the retaining element that the above two are fixed together; Said electronic component comprises the core heating part that departs from said electronic component centre position, it is characterized in that: be provided with in the middle of departing from the side of said electronic component and near the position of said core heating part and be used for fixing hole that said electronic component is fixedly connected with said radiator.
8. electronic element radiating according to claim 7 system; It is characterized in that; Said electronic component also comprises the packaging body that is used to wrap up said core heating part, and said fixing hole is opened on the said packaging body, and said packaging body is provided with the radiating surface that is connected with said radiator.
9. electronic element radiating according to claim 7 system is characterized in that said fixing hole has two, and is separately positioned on two relative sides of electronic component.
10. electronic element radiating according to claim 7 system; It is characterized in that; Said electronic component also comprises less important heating part, and said less important heating part is a drive circuit, and said core heating part is the power semiconductor by said driving circuit drives.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110321068A CN102324410A (en) | 2011-10-20 | 2011-10-20 | Electronic component and heat radiation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110321068A CN102324410A (en) | 2011-10-20 | 2011-10-20 | Electronic component and heat radiation system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102324410A true CN102324410A (en) | 2012-01-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110321068A Pending CN102324410A (en) | 2011-10-20 | 2011-10-20 | Electronic component and heat radiation system |
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| Country | Link |
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| CN (1) | CN102324410A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1981003734A1 (en) * | 1980-06-19 | 1981-12-24 | Digital Equipment Corp | Heat pin integrated circuit packaging |
| CN101437362A (en) * | 2007-11-15 | 2009-05-20 | 凌云逻辑公司 | Inverted through circuit board mounting with heat sink |
| CN201986260U (en) * | 2011-03-10 | 2011-09-21 | 沈李豪 | Composite PCB |
| CN202307862U (en) * | 2011-10-20 | 2012-07-04 | 深圳市威怡电气有限公司 | Electronic element and heat radiating system thereof |
-
2011
- 2011-10-20 CN CN201110321068A patent/CN102324410A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1981003734A1 (en) * | 1980-06-19 | 1981-12-24 | Digital Equipment Corp | Heat pin integrated circuit packaging |
| CN101437362A (en) * | 2007-11-15 | 2009-05-20 | 凌云逻辑公司 | Inverted through circuit board mounting with heat sink |
| CN201986260U (en) * | 2011-03-10 | 2011-09-21 | 沈李豪 | Composite PCB |
| CN202307862U (en) * | 2011-10-20 | 2012-07-04 | 深圳市威怡电气有限公司 | Electronic element and heat radiating system thereof |
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Application publication date: 20120118 |