CN102315580B - Method for manufacturing connector - Google Patents
Method for manufacturing connector Download PDFInfo
- Publication number
- CN102315580B CN102315580B CN 201010216702 CN201010216702A CN102315580B CN 102315580 B CN102315580 B CN 102315580B CN 201010216702 CN201010216702 CN 201010216702 CN 201010216702 A CN201010216702 A CN 201010216702A CN 102315580 B CN102315580 B CN 102315580B
- Authority
- CN
- China
- Prior art keywords
- contact part
- arm contact
- protruding arm
- hole
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 37
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000010931 gold Substances 0.000 claims abstract description 30
- 229910052737 gold Inorganic materials 0.000 claims abstract description 30
- 229920002120 photoresistant polymer Polymers 0.000 claims description 46
- 230000005611 electricity Effects 0.000 claims description 35
- 239000003795 chemical substances by application Substances 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 abstract 4
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 24
- 239000011469 building brick Substances 0.000 description 13
- 238000003384 imaging method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 206010070834 Sensitisation Diseases 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000008313 sensitization Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Images
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Abstract
The invention discloses a method for manufacturing a connector. The method comprises the following steps of: providing a substrate which is provided with at least one conducting through hole and at least one convex arm contact member, wherein the convex arm contact member is fixed on the substrate and shields partial conducting through holes; next, forming a photoinduced resist layer on the innerwall of the conducting through hole, a contact end surface of the convex arm contact member and an inner surface opposite to the contact end surface; next, forming an opened hole in the photoinduced resist layer, exposing the partial contact end surface of the convex arm contact member, and leading the photoinduced resist layer to cover the inner wall of the conducting through hole and the inner surface of the convex arm contact member still; then forming an electric adhesive layer in the opened hole and on the contact end surface of the convex arm contact member; and peeling off the photoinduced resist layer. Therefore, in the method, the used amount of electric adhesive gold can effectively reduced, and the electric adhesion of the gold can be finished by only one-time exposure manufacturing process.
Description
Technical field
The present invention relates to a kind of method of making connector, and be particularly related to a kind of manufacture method of adhering to the consumption of gold to reduce electricity with positive light anti-etching agent making connector.
Background technology
With regard to the development trend of present electronic product, the multifunction of electronic product has become main direction with microminiaturization, and its multi-functional performance often needs can reach in conjunction with the running of several chips, if yet circuit the join office of the connection between each chip by printed circuit board (PCB) reached, certainly will cause the increase of the volume of electronic product, therefore present packaged type all carries out towards the direction of system in package (system in package, SIP).The main concept of system in package utilizes a connector to be medium, a plurality of wishs are integrated the also interconnected chip installing of application thereon, and said chip and connector be packaged in the lump unify encapsulating structure, then utilize the inner set wire pattern of connector to be electrically connected between each chip.In addition, system packaging structure is again by a plurality of conductive projections (bump) or the outer pin (lead) of different size, system packaging structure is carried on the printed circuit board (PCB), form a complete electronic system with other main, passive electronic building brick by this, with effective operation among various electronic product.
Present commercially available connector has generally comprised a substrate, which is provided with relative two surfaces that through hole passes substrate, and a connection piece, in order to connect chip or other main passive electronic building brick.It should be noted that on the connector and lead the contact area of passive electronic building brick in order to contact chip or other, must plate again metallic gold to increase conductivity and the resistance to wear between connector and chip or other the main passive electronic building brick.
On making, known electric is adhered to gold in the method for connector, with negative type photoresist metallic gold optionally is plated on the connector.Yet using the negative type photoresist electricity to adhere to gold will be so that be arranged in part photoresist on the through-hole wall of connector, substrate and substrate, covers because of the stereochemical structure of connector own to shine light.So, these photoresists are removed when carrying out the exposure imaging manufacture craft, and so that follow-up electricity when adhering to gold, gold will be covered in the nonfunctional zone that can't expose and need not cover on a large scale, thereby increase the gold-plated area on the connector and cause the waste of material.Moreover known adheres to golden mode with the negative type photoresist electricity, must all carry out the exposure imaging manufacture craft in the two sides of connector.So, use the re-expose development step will so that electricity to adhere to manufacture craft also loaded down with trivial details, and then increase cost and expend time in.
Therefore, known mode of adhering to gold with the negative type photoresist electricity not only causes outside the waste of material of a large amount of gold, also needs twice exposure manufacture craft just can finish gold-plated manufacture craft on the connector.
Summary of the invention
The present invention proposes a kind of method of making connector, adheres to the consumption of gold in order to reduce electricity, and simplifies gold-plated manufacture craft.
The invention provides a kind of method of making connector, including provides a substrate, which is provided with at least one conductive through hole, be communicated with a first surface of substrate and a relative second surface, and at least one protruding arm contact part, its convexity arm contact part is bonded on the wherein surface of substrate at least, and covers at least the conductive through hole of part, and protruding arm contact part comprises a contact end face towards an external module; The person of connecing forms a photoresist layer on two surfaces of the inwall of conductive through hole, substrate and protruding arm contact part; Continue it, substrate is carried out an exposure manufacture craft; Continue it, carry out a development manufacture craft, in the photoresist layer, form an electricity and adhere to perforate, expose the contact end face of the protruding arm contact part of part; Moreover, carry out an electricity and adhere to manufacture craft, within electricity adheres to perforate, on the contact end face of protruding arm contact part, form an electric adhesion layer; And divest the photoresist layer.
The present invention also proposes a kind of method of making connector, and including provides a substrate, which is provided with at least one conductive through hole and at least one protruding arm contact part, and its convexity arm contact part is bonded on the substrate, and covers the conductive through hole of part; Continue, on the inwall of conductive through hole, on the contact end face and the inner face with respect to the contact end face of substrate surface and protruding arm contact part, form a photoresist layer; Then, in the photoresist layer, form a perforate, expose the contact end face of the protruding arm contact part of part, in order to do making the photoresist layer still cover the inwall of conductive through hole and the inner face of protruding arm contact part; Moreover, in perforate, on the contact end face of protruding arm contact part, form an electric adhesion layer; And divest the photoresist layer.
In one embodiment of this invention, the photoresist layer is a positive light anti-etching agent, and the photoresist layer can be an electric attached type photoresist.Protruding arm contact part anchors on the substrate via an adhesion layer, and protruding arm contact part can be made of electric conducting material.And this protruding arm contact part comprises an after overhang and base portion, and base portion anchors on the substrate via adhesion layer.
In one embodiment of this invention, electric adhesion layer includes gold, and electric adhesion layer can not be formed on the inner face of the inwall of conductive through hole and protruding arm contact part.In addition, the present invention can not must carry out any step of exposure to the second surface of substrate again after the first surface to substrate exposes manufacture craft.
Based on above-mentioned, the invention provides a kind of method of making connector, it uses positive light anti-etching agent to form the photoresist layer, so can only remove the end of protruding arm contact part and the photoresist of chip support plate or other electronic building brick contact area, so that a gold electricity is attached to this contact area, and reach effective effect that electricity adheres to the consumption of gold that reduces.In addition, because the positive light anti-etching agent layer keeps the photoresist be not exposed, can finish the electricity of gold and adhere to therefore need only carry out the single exposure manufacture craft.
Description of drawings
Figure 1A-1F is the generalized section of the method for the making connector that illustrates according to the present invention one preferential embodiment.
Wherein, description of reference numerals is as follows:
10 photoresist layers, 140 electric adhesion layer
20 sensitization masks, 150 adhesion layers
100 connectors, 160 metal levels
110 base material E1 first surfaces
120 conductive through hole E2 second surfaces
130 protruding arm contact part A are terminal
132 after overhang S1 contact end face
134 base portion S2 inner faces
136 electricity adhere to the inwall of perforate S3 conductive through hole
Embodiment
Figure 1A-1F is the generalized section of the method for the making connector that illustrates according to the present invention one preferential embodiment.Please refer to Fig. 1 F, the one side of connector 100 can be in order to be connected to a few chip or encapsulating carrier plate or flexible circuit board (not illustrating) in the present embodiment, and the another side of connector 100 can be carried on the circuit board (not illustrating), with in the electronic product microminiaturization, can make chip pass through connector 100 and be electrically connected to form an electronic system with each master, passive electronic building brick.Yet in other embodiments, the two sides of connector 100 also can connect respectively other main, passive electronic building brick, and the present invention is not as limit.
Specifically, connector 100 can comprise a base material 110, and is provided with at least one conductive through hole 120 in base material 110 and penetrates base material 110, and is communicated with a first surface E1 and a second surface E2 of base material 110.One protruding arm contact part 130 is located on the first surface E1 of base material 110, and its convexity arm contact part 130 has an after overhang 132 and a base portion 134.Base portion 134 is in order to connecting base material 110, and after overhang 132 can in order to an assembly (not illustrating), for example chip or chip support plate are connected, and make chip via connector 100 and the mutual electric connection of other system.In addition, the terminal A place of after overhang 132 is provided with an electric adhesion layer 140, and its material is generally gold, the mode of adhering to electricity is covered in terminal A place, and meaning namely is positioned at the contact position between protruding arm contact part 130 and chip, encapsulating carrier plate, flexible circuit board or other electronic building brick (not illustrating).Electricity adhesion layer 140 is in order to increase the conductivity of protruding arm contact part 130 and chip support plate or other electronic building brick, and during with protruding arm contact part 130 buckles or electrical contact chip, encapsulating carrier plate, flexible circuit board or other electronic building brick, increase after overhang 132 under repeatable operation resistance to wear and prevent this place's oxidation.It is worth mentioning that, electricity adhesion layer 140 for example is gold, known manufacture method is to use the negative type photoresist layer to do the exposure imaging manufacture craft, and make golden electricity be attached to the terminal A place of after overhang 132, and the characteristic of this negative type photoresist layer can make the photoresist without the exposure area remove in manufacture process, and then the nonfunctional zone of causing Jin Beidian to be attached to must not to cover gold, thereby cause waste.The present invention proposes a process for making in order to solve the problem that Jin Zaidian adheres to be wasted on the manufacture craft in a large number.
In the present embodiment, can be provided with a conductive through hole 120 on the base material 110, perhaps a plurality of conductive through holes 120 are with the setting of the protruding arm contact part 130 of arranging in pairs or groups.And conductive through hole 120 penetrates in the present embodiment base material 110 and connects first surface E1 and second surface E2, but conductive through hole 120 also can not penetrate base material 110 in other embodiments.In addition, the protruding arm contact part 130 of the present embodiment only is arranged at the first surface E1 of base material 110, so that protruding arm contact part 130 is by after overhang 132 buckles or be contacted with on the support plate of carries chips, the second surface E2 of base material 110 then can pass through the outer pin (lead) of tin ball, conductive projection (bump) or different size, so that connector 100 is carried on the circuit board.Certainly, in other embodiments, protruding arm contact part 130 also can be arranged on the second surface E2 of base material 110.That is protruding arm contact part 130 can be located on the first surface E1 and second surface E2 of base material, so that the two sides of protruding arm contact part 130 all can protruding arm contact part 130 after overhang 132 buckles or other electronic building brick of electrical contact, and other electronic building brick be electrically connected to each other and form a drivable electronic system.In addition, the material of the electric adhesion layer 140 of the present embodiment is take gold as example, but also can be in other embodiments other metal material, and the present invention is not as limit.
Furthermore, protruding arm contact part 130 can be by being consisted of such as copper, corronil or the multilayer conductive materials such as copper and nickel, and its base portion 134 can be bonded on the substrate 110 by an adhesion layer 150.In general, except protruding arm contact part 130 contacts with adhesion layer 150 with base portion 134 and is fixed in the substrate 110, adhesion layer 150 also can make protruding arm contact part 130 and base material 110 insulation.Therefore, conductive through hole 120 and the base portion 134 of protruding arm contact part 130 and the junction of after overhang 132 at substrate 110, meaning is namely on an outer rim of the adhesion layer 150 between base material 110 and the after overhang 132, need electricity to adhere to a metal level 160, so that the conductive through hole 120 in the base material 110 is electrically connected with protruding arm contact part 130.Thus, but chip or support plate that the terminal A place of the protruding arm contact part 130 of conducting connects.In one embodiment, metal level 160 can for example be a conductive copper layer, but it also can be formed by other electric conducting material in other embodiments, and the present invention is not as limit.
According to the manufacture method of the connector 100 of a preferential embodiment, will under elaborate.
See also Figure 1A-1F, the manufacture method of connector 100 includes provides a substrate 110, and at least one conductive through hole 120 is set thereon, to be communicated with first surface E1 and the second surface E2 of substrate 110.At least one protruding arm contact part 130, by pressing base portion 134 and adhesion layer 150, adhesion layer 150 for example is low discharge dielectric layer (low-flow prepreg), base portion 134 is bonded on the first surface E1 of substrate 110, and this protruding arm contact part 130 will cover the conductive through hole 120 of part, and protruding arm contact part 130 comprise one towards the contact end face S1 of an external module and one day the inner face S2 (such as Figure 1A) to conductive through hole 120.Then, electricity adheres to a metal level 160, so that the conductive through hole 120 in the base material 110 is electrically connected with protruding arm contact part 130.Then, contact end face S1 and inner face S2 upper in the inwall S3 of conductive through hole 120 and protruding arm contact part 130 upward form a photoresist layer 10, wherein photoresist layer 10 is formed by positive light anti-etching agent, and the photoresist of photoresist layer 10 can be an electric attached type photoresist (such as Figure 1B), and it can be formed on the stereochemical structure surface uniformly.Then, carry out an exposure manufacture craft (such as Fig. 1 C) with the first surface E1 of 20 pairs of substrates 110 of sensitization mask of a patterning, but second surface E2 does not need then to expose.Continue it, carry out a development manufacture craft, adhere to perforate (a perhaps opening) 136 in photoresist layer 10, to form an electricity, and expose the contact end face S1 of the protruding arm contact part 130 of part.And, because using, 10 on photoresist layer of the present invention is positive light anti-etching agent, therefore still can covering, photoresist layer 10 is not exposed the zone that maybe can't shine light, for example the inner face S2 of the inwall S3 of conductive through hole 120 and protruding arm contact part 130 (such as Fig. 1 D).Continue it, carry out an electricity and adhere to manufacture craft, adhere to perforate 136 with the electricity on the contact end face S1 that is positioned at protruding arm contact part 130, form an electric adhesion layer 140, wherein the material of electric adhesion layer 140 is gold in the present embodiment, but also can be in other embodiments other metal material (such as Fig. 1 E).Divest again at last photoresist layer 10 (such as Fig. 1 F).
It should be noted that, 10 on photoresist layer of the present invention uses and is positive light anti-etching agent, therefore only at the terminal A place of protruding arm contact part 130, the zone (being that electricity adheres to perforate 136) that needs plated with gold, photoresist layer 10 on it just can be removed because of exposure imaging, and other unexposed zone still keeps photoresist layer 10 in the surface behind exposure imaging, therefore can make gold only be attached to electricity by electricity and adhere in the perforate 136.In other words, electric adhesion layer 140 can not be formed on the nonfunctional zones such as inner face S2 of the inwall S3 of conductive through hole 120 and protruding arm contact part 130.Thus, the present invention can significantly reduce the electric bond area of gold, and then reduces the materials'use cost of gold.Specifically, learn according to experiment, photoresist layer 10 is replaced negative type photoresist with positive light anti-etching agent after, can reduce the consumption that 97% electricity adheres to gold, effect is remarkable.
In addition, because positive light anti-etching agent only just can be removed after developing in the zone that is exposed, therefore the present invention is after the first surface E1 to substrate 110 exposes manufacture craft, must be not again the second surface E2 of substrate not be carried out any step of exposure, can reach the photoresist layer 10 at the terminal A place that only removes protruding arm contact part 130, and keep simultaneously the purpose of other regional photoresist layer 10.With this, the present invention is with respect to the exposure imaging manufacture craft of using negative type photoresist in the known technology, its must be respectively concerning the first surface E1 of substrate 110 and second surface E2 carry out step of exposure, can a plurality of simplification manufacturing process steps, and then reach the effect that reduces the manufacture craft cost.
In sum, the invention provides a kind of manufacture method of connector, it uses positive light anti-etching agent to form the photoresist layer, so can keep major part and be positioned at the photoresist that is not exposed on the connector, and only remove the end of protruding arm contact part and the photoresist of chip, support plate or other electronic building brick contact area, so that gold only is attached to this contact area by electricity, thereby reach effective effect that electricity adheres to the consumption of gold that reduces.In addition, because the positive light anti-etching agent layer can keep the photoresist that is not exposed, can finish the electricity of gold and adhere to therefore need only carry out the single exposure manufacture craft, simplify manufacture craft.
The above only is the preferred embodiments of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (9)
1. method of making connector is characterized in that including:
One substrate is provided, which is provided with at least one conductive through hole, be communicated with a first surface of this substrate and a relative second surface, and at least one protruding arm contact part, wherein this protruding arm contact part is bonded on the wherein surface of this substrate at least, at least cover this conductive through hole of part, and this protruding arm contact part comprises a contact end face towards an external module;
On inwall, this two surface and this protruding arm contact part of this conductive through hole, form a positive light anti-etching agent layer;
This substrate is carried out an exposure manufacture craft;
Carry out a development manufacture craft, in this positive light anti-etching agent layer, form an electricity and adhere to perforate, expose this contact end face of this protruding arm contact part of part;
Carry out an electricity and adhere to manufacture craft, adhere in the perforate in this electricity, on this contact end face of this protruding arm contact part, form an electric adhesion layer; And
Divest this positive light anti-etching agent layer.
2. the method for making connector as claimed in claim 1 is characterized in that this photoresist layer is an electric attached type photoresist.
3. the method for making connector as claimed in claim 1 is characterized in that this protruding arm contact part anchors on this substrate via an adhesion layer.
4. the method for making connector as claimed in claim 3 is characterized in that this protruding arm contact part comprises an after overhang and a base portion.
5. the method for making connector as claimed in claim 1 is characterized in that this exposure manufacture craft carries out at this first surface of this substrate, and this second surface of this substrate is not carried out any step of exposure.
6. the method for making connector as claimed in claim 1 is characterized in that this protruding arm contact part is made of electric conducting material.
7. the method for making connector as claimed in claim 1 is characterized in that this electricity adhesion layer includes gold.
8. the method for making connector as claimed in claim 1 is characterized in that this electricity adhesion layer can not be formed on the inner face of the inwall of this conductive through hole and this protruding arm contact part.
9. method of making connector is characterized in that including:
One substrate is provided, which is provided with at least one conductive through hole and at least one protruding arm contact part, wherein this protruding arm contact part is bonded on this substrate, and covers this conductive through hole of part;
In on the inwall of this conductive through hole and on the contact end face and the inner face with respect to this contact end face of this protruding arm contact part, form a positive light anti-etching agent layer;
In this positive light anti-etching agent layer, form a perforate, expose this contact end face of this protruding arm contact part of part, in order to do making this positive light anti-etching agent layer still cover the inwall of this conductive through hole and this inner face of this protruding arm contact part;
In this perforate, on this contact end face of this protruding arm contact part, form an electric adhesion layer; And
Divest this positive light anti-etching agent layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010216702 CN102315580B (en) | 2010-06-30 | 2010-06-30 | Method for manufacturing connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010216702 CN102315580B (en) | 2010-06-30 | 2010-06-30 | Method for manufacturing connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102315580A CN102315580A (en) | 2012-01-11 |
| CN102315580B true CN102315580B (en) | 2013-09-18 |
Family
ID=45428494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010216702 Expired - Fee Related CN102315580B (en) | 2010-06-30 | 2010-06-30 | Method for manufacturing connector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102315580B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5612573A (en) * | 1994-04-26 | 1997-03-18 | International Business Machines Corporation | Electronic package with multilevel connections |
| CN1527793A (en) * | 2001-02-12 | 2004-09-08 | 佛姆法克特股份有限公司 | Method for forming microelectronic spring structures on a substrate |
| CN1942057A (en) * | 2005-07-15 | 2007-04-04 | 新光电气工业株式会社 | Method of forming metal plate pattern and circuit board |
| CN101501937A (en) * | 2006-06-02 | 2009-08-05 | 内奥科尼克斯公司 | A connector (17) including elastic contact arms (15) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100790895B1 (en) * | 2006-11-16 | 2008-01-03 | 삼성전자주식회사 | Semiconductor probe having resistive tip and method of fabricating the same |
-
2010
- 2010-06-30 CN CN 201010216702 patent/CN102315580B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5612573A (en) * | 1994-04-26 | 1997-03-18 | International Business Machines Corporation | Electronic package with multilevel connections |
| CN1527793A (en) * | 2001-02-12 | 2004-09-08 | 佛姆法克特股份有限公司 | Method for forming microelectronic spring structures on a substrate |
| CN1942057A (en) * | 2005-07-15 | 2007-04-04 | 新光电气工业株式会社 | Method of forming metal plate pattern and circuit board |
| CN101501937A (en) * | 2006-06-02 | 2009-08-05 | 内奥科尼克斯公司 | A connector (17) including elastic contact arms (15) |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102315580A (en) | 2012-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102217060B (en) | Flexible and stackable semiconductor die packages, systems using same, and methods of making same | |
| KR101193416B1 (en) | Three-dimensionally integrated semiconductor device and method for manufacturing the same | |
| CN101515574B (en) | Chip package substrate, chip package body, and method for manufacturing chip package body | |
| KR101609016B1 (en) | Semiconductor device and method of manufacturing substrates for semiconductor elements | |
| US20010005050A1 (en) | Semiconductor device, method making the same, and electronic device using the same | |
| CN1873935B (en) | Method of fabricating wiring board and method of fabricating semiconductor device | |
| WO2008032470A1 (en) | Semiconductor device, lead frame product used in the semiconductor device, and method for manufacturing the semiconductor device | |
| CN101383301B (en) | Method of forming flip-chip bump carrier type package | |
| CN111599702A (en) | Manufacturing method of fan-out type chip packaging structure | |
| TWI429043B (en) | Circuit board structure, packaging structure and method for making the same | |
| CN101310379B (en) | Semiconductor device | |
| CN103098565B (en) | Substrate having built-in components | |
| CN102315580B (en) | Method for manufacturing connector | |
| CN100442465C (en) | Producing process for chip packaging body without kernel dielectric layer | |
| CN216217750U (en) | Electroplating type stepped welding pad PCB | |
| US20110272799A1 (en) | Ic chip and ic chip manufacturing method thereof | |
| US20110254152A1 (en) | Chip structure, chip bonding structure using the same, and manufacturing method thereof | |
| KR101674536B1 (en) | Method for manufacturing circuit board by using leadframe | |
| CN110690191A (en) | Double-sided chip packaging structure and packaging method | |
| US6420207B1 (en) | Semiconductor package and enhanced FBG manufacturing | |
| CN213401180U (en) | Substrate structure | |
| JP2002343927A (en) | Semiconductor module and manufacturing method therefor | |
| JP5835735B2 (en) | Wiring board manufacturing method | |
| CN101740410B (en) | Manufacturing process for a chip package structure | |
| US8318411B2 (en) | Method for fabricating an interposer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130918 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |