CN102313612B - Temperature sensor and manufacturing method - Google Patents

Temperature sensor and manufacturing method Download PDF

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Publication number
CN102313612B
CN102313612B CN 201110218917 CN201110218917A CN102313612B CN 102313612 B CN102313612 B CN 102313612B CN 201110218917 CN201110218917 CN 201110218917 CN 201110218917 A CN201110218917 A CN 201110218917A CN 102313612 B CN102313612 B CN 102313612B
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epoxy resin
thermistor
leads
sensor
temperature sensor
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CN102313612A (en
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汪雪婷
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Abstract

The invention, which belongs to the electronic device technology field, relates to a temperature sensor and a manufacturing method thereof. The temperature sensor possesses two leads which are mutually insulated. The two leads, which are used as terminals of sensing terminals, are respectively electrically connected with a thermistor. The sensing terminals are encapsulated by epoxy resin insulation layers which are in a bowling pin shape. The thermistor is located on a bottle head position of the epoxy resin insulation layers. The leads, which correspond to the positions of convex belly partsof the epoxy resin insulation layers, are sleeved on insulating bushes which are encapsulated in the epoxy resin insulation layers. By using the sensor and the method of the invention, the shape of asensor temperature sensing head can be conveniently formed and can satisfy requirements without a mold and injecting grease. Therefore, production efficiency can be substantially raised and manufacturing costs can be reduced.

Description

A kind of temperature sensor and preparation method thereof
Technical field
The present invention relates to a kind of temperature sensor, also relate to its method for making simultaneously, belong to technical field of electronic devices.
Background technology
Existing have that the special-shaped termination---for example the basic structure of bowling ampuliform temperature sensor is: the lead termination of two mutually insulateds is electrically connected with thermistor respectively, and this thermistor is encapsulated in the epoxy resins insulation layer end of formation bowling ampuliform.For a long time, the technology of making this bowling ampuliform temperature sensor is always: with thermistor with after two mutual insulated conductors are electrically connected, put into the mould location with pin inner chamber one by one, adopt grease injection process again, epoxy resin is encapsulated thermistor and wire termination in the shape chamber of mould, form the pin profile, take out finally by solidifying the back.
Above-mentioned traditional handicraft need be made particular manufacturing craft, and needs to take apart mould after solidifying end; And depanning certainly leads to burr, needs artificial deburring, and the production efficiency of therefore making temperature sensor is very low, and the man's activity link is more, is unfavorable for ensuring the quality of products.
Summary of the invention
The objective of the invention is to: at the shortcoming that above-mentioned prior art exists, it is simple to propose a kind of forming technology, can obviously enhance productivity, reduce the temperature sensor of manufacturing cost, provides corresponding method for making simultaneously.
In order to reach above purpose, temperature sensor of the present invention has the lead of two mutually insulateds, described two leads are electrically connected with thermistor respectively as the termination of sensor ends, described sensor ends is encapsulated with the epoxy resins insulation layer that profile is the bowling ampuliform, described thermistor is positioned at the bottle head position epoxy resins insulation layer of described pin profile, and the bulging place of the corresponding described pin profile of described lead is with the insulating bushing that is encapsulated in the described epoxy resins insulation layer.
The manufacturing process steps of temperature sensor of the present invention is:
The first step, insulating bushing is inserted in from the end of two mutually insulated leads as sensor ends;
Second step, thermistor is welded on the sensor ends termination of two mutually insulated leads, forms and be electrically connected;
The 3rd sensor ends that goes on foot, will be welded with thermistor immerses in the epoxy resin liquid, until the submergence insulation sleeve;
The 4th goes on foot, sensor ends is proposed from epoxy resin liquid, makes its natural sagging form bowling ampuliform profile;
The 5th step, heating make epoxy resin cure, form the temperature-sensitive head of the temperature sensor with pin profile insulation course.
This shows that the present invention has broken traditional handicraft, adopted unique lining to dip forming technology.Because insulation sleeve of the present invention and thermistor lay respectively at bulging place and bottle head place that sensor ends forms the pin profile, therefore after dipping the epoxy resin liquid with viscosity, seal its outer epoxy resin under surface tension effects, form bulging and bottle head that the pin profile seamlessly transits naturally.Like this, without mould, also need not greasing, can form satisfactory sensor ends profile very easily, thereby the production efficiency of significantly improving reduces manufacturing cost.
Description of drawings
The present invention is further illustrated below in conjunction with accompanying drawing.
Fig. 1 is the structural representation before the one embodiment of the invention epoxy resin dipping.
Fig. 2 is the finished product structural representation of Fig. 1 embodiment.
Embodiment
Embodiment one
The temperature sensor of present embodiment as depicted in figs. 1 and 2, two wicking copper conductors 3 that are arranged in insulated wire 1, its termination as sensor ends is electrically connected by AC spot-welding with the two poles of the earth of water droplet shape temperature-measuring thermistor 4 respectively.This sensor ends is encapsulated with the epoxy resins insulation layer 5 that profile is pin, and thermistor 4 is positioned at the bottle head position epoxy resins insulation layer of pin profile, and the bulging place of the corresponding pin profile of lead is with the insulating bushing 2 that is encapsulated in the epoxy resins insulation layer.Level and smooth in order to ensure profile after soaking fat, insulating bushing 2 is the waist drum shape.
During making, processing step is as follows:
1, behind fixed length, wire stripping head, the wicking, insulating bushing is inserted in from two leads as an end of sensor ends;
2, by AC spot-welding, thermistor is welded on the sensor ends termination of two leads, form and be electrically connected;
3, the sensor ends that one group of temperature sensor is welded with thermistor immerses in the epoxy resin liquid simultaneously, until the submergence insulation sleeve;
4, sensor ends is proposed from epoxy resin liquid, make its natural sagging form bowling ampuliform profile;
5,100 ± 5 ℃ of heating, maintenance 3 ± 0.2 hours make epoxy resin cure, form to have the temperature-sensitive head that the pin profile is sealed the temperature sensor of insulation course.
In order to make the profile sagging not only smooth, and have enough adhesions, epoxy resin evenly mixes by epoxy resin major ingredient and amine curing agent and as the styrene of thinning agent, and the volume proportion of its each component is:
Epoxy resin major ingredient: hardening agent: thinning agent=100: 40-45: 18-22 (being preferably 100: 43: 20); Wherein, preferred epoxy resin major ingredient is mixed by the bisphenol A epoxide resin of mass percent 60~90%, 10~30% silicon powder, 0.1~1% carbon black.
Facts have proved that after the structure and technology of employing present embodiment, everyone only can only produce 2000-3000 to production efficiency by every day, only brings up to 15000-20000, effect is very remarkable.And need not artificial form removal, deburring, profile forms naturally, is conducive to guarantee stable product quality.
In addition to the implementation, the present invention can also have other embodiments.All employings are equal to the technical scheme of replacement or equivalent transformation formation, all drop on the protection domain of requirement of the present invention.

Claims (2)

1. temperature sensor production method, this temperature sensor has the lead of two mutually insulateds, described two leads are electrically connected with thermistor respectively as the termination of sensor ends, described sensor ends is encapsulated with the epoxy resins insulation layer that profile is the bowling ampuliform, described thermistor is positioned at the bottle head position epoxy resins insulation layer of pin profile, the bulging place of the corresponding described pin profile of described two leads is with the insulating bushing that is encapsulated in the described epoxy resins insulation layer, described insulating bushing is the waist drum shape, it is characterized in that comprising the steps:
The first step, insulating bushing is inserted in from the end of two mutually insulated leads as sensor ends;
Second step, thermistor is welded on the sensor ends termination of two mutually insulated leads, forms and be electrically connected;
The 3rd sensor ends that goes on foot, will be welded with thermistor immerses in the epoxy resin liquid, until the submergence insulating bushing;
The 4th goes on foot, sensor ends is proposed from epoxy resin liquid, makes its natural sagging form bowling ampuliform profile;
The 5th step, heating make epoxy resin cure, form the temperature-sensitive head with pin profile insulation course.
2. temperature sensor production method according to claim 1 is characterized in that: described curing heating and temperature control 100 ± 5 ℃, kept 3 ± 0.2 hours.
CN 201110218917 2011-07-26 2011-07-26 Temperature sensor and manufacturing method Active CN102313612B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201110218917 CN102313612B (en) 2011-07-26 2011-07-26 Temperature sensor and manufacturing method

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Application Number Priority Date Filing Date Title
CN 201110218917 CN102313612B (en) 2011-07-26 2011-07-26 Temperature sensor and manufacturing method

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CN102313612A CN102313612A (en) 2012-01-11
CN102313612B true CN102313612B (en) 2013-09-18

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106248242B (en) * 2016-10-26 2018-08-24 深圳市敏杰电子科技有限公司 A kind of quick insulated type plane thermometric NTC temperature sensors
CN107631810A (en) * 2017-10-25 2018-01-26 江苏杰创科技有限公司 A kind of pump housing bearing shell oil resistance thermometer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111382B2 (en) * 1986-08-08 1995-11-29 株式会社大泉製作所 Method of manufacturing temperature sensor
JPH08153601A (en) * 1994-11-28 1996-06-11 Murata Mfg Co Ltd Electronic part
JP3344684B2 (en) * 1996-05-20 2002-11-11 株式会社村田製作所 Electronic components
CN202149817U (en) * 2011-07-26 2012-02-22 汪雪婷 Temperature sensor

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