CN102313265A - Electronic device with heat-radiating function - Google Patents
Electronic device with heat-radiating function Download PDFInfo
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- CN102313265A CN102313265A CN2010102263431A CN201010226343A CN102313265A CN 102313265 A CN102313265 A CN 102313265A CN 2010102263431 A CN2010102263431 A CN 2010102263431A CN 201010226343 A CN201010226343 A CN 201010226343A CN 102313265 A CN102313265 A CN 102313265A
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Abstract
The invention discloses an electronic device with a heat-radiating function, which comprises at least one semiconductor component, a support component, a heat-radiating module and a voltage converting unit, wherein the heat-radiating module further comprises an elastic film and a drive device, the drive device drives the elastic film to move or vibrate through magnetic conversion so as to be convenient for pushing and pressing air or to be used as a valve for guiding air, thus airflow is generated, wherein the airflow is used for radiating heat of the semiconductor component. Meanwhile, the drive device receives a first alternating voltage, the drive device has a voltage drop so as to be convenient for reducing the first alternating voltage, and one output end of the drive device outputs a second alternating voltage. In addition, the voltage converting unit is coupled to the drive device for receiving the second alternating voltage, the voltage converting unit is used for reducing and rectifying the second alternating current to direct current voltage, and one output end of the voltage converting unit outputs the direct current voltage to a drive component of the semiconductor component.
Description
Technical field
The present invention is relevant a kind of electronic installation, refers to a kind of electronic installation with active radiating module especially.
Background technology
Press semiconductor element, for example led chip (LED chip), CPU (central processing unit) or GPU (graphic process unit) have been widely used in electronic installations such as LED light fixture, computer or display card.Wherein, CPU or GPU tend to produce high heat under high-speed computation, common technology is with the air-flow that the fan-type radiating module is produced the heat energy that CPU or GPU were generated to be taken out of outside the electronic installation at present; To avoid semiconductor element to surpass the nominal operation temperature, to obtain the function of heat radiation.
Likewise, led chip converts in the process of luminous energy at electric energy, also can produce high heat, because the luminous efficiency of led chip and the characteristic that operating temperature is inversely proportional to, for example the every rising of led chip is 10 ℃, will cause light decay 5-8%, and cause reduce by half service life.Therefore, with regard to LED light fixture speech, the quality of its radiating effect, often affect the brightness and the service life of LED light fixture.
Promptly the LED light fixture with present existing incandescent lamp bulb appearance is an example, in order can successfully the heat energy that led chip distributed to be derived, between glass lamp shade to helical metal lamp holder, is provided with a passive heat radiation module usually; Radiating module is by metal, and for example aluminium alloy is processed a taper case, and case surface ring is established a plurality of fins; To increase area of dissipation; Because case is the radiating efficiency that provides bigger, so that takies the most area of LED light fixture, except that visually producing the association with existing incandescent lamp bulb; And the most apparent shortcoming is; The weight of case is too heavy, and the passive heat radiation module can only handle the heat energy that about 400 lumens of brightness are produced, and therefore can't be applicable to the high-brightness LED light fixture.
Shortcoming based on aforementioned passive heat radiation module; Also there is the dealer to be provided with an active radiating module in the LED of incandescent lamp bulb appearance lamp interior; Device is to be a miniature radiator fan, for example ball-type or maglev type fan, and the LED lamp surface is then offered inlet channel and heat dissipation channel.After the led chip of LED light fixture was lighted, radiator fan also started running, and air is got into from inlet channel, and in the process by the heat dissipation channel discharge, was with air-flow the heat energy that led chip was produced to be taken out of outside the LED light fixture, so can obtain preferable radiating effect.Only the shortcoming of aforementioned miniature radiator fan is that cost is higher, and dust is accumulated on the covering of the fan easily, and influences service life.
Especially, traditional LED light fixture be voltage conversion unit by circuit board with after general alternating current step-down and being rectified into direct current, export the driving element of led chip to.Because general alternating voltage is quite big with driving DC voltage gap, and can't obtain preferable conversion efficiency.
Summary of the invention
A purpose of the present invention is to provide a kind of electronic installation with heat sinking function; Electronic installation inside is provided with an active radiating module, and radiating module directly receives an alternating voltage, therefore; Radiating module can provide heat radiation and step-down dual-use function; Alternating voltage after the step-down again by the further step-down of circuit board be rectified into direct current, use with the driving element that semiconductor element is provided, improve conversion efficiency thus.
For reaching aforesaid purpose; The technological means that the present invention taked provides a kind of electronic installation with heat sinking function; Electronic installation comprises: at least one semiconductor element, a support component, a radiating module and a voltage conversion unit; Aforementioned radiating module further comprises: an elastic membrane and a drive unit, and drive unit drives elastic membrane by reversal of magnetism and moves or vibrate, so that pushing air or as the valve direct air; Produce air-flow thus, air-flow is in order to semiconductor element is dispelled the heat.
And aforementioned drive unit receives one first alternating voltage, and drive unit has a pressure drop so that first alternating voltage is carried out step-down, and an output of drive unit is exported one second alternating voltage.In addition; Above-mentioned voltage conversion unit is to be coupled to drive unit to receive above-mentioned second alternating voltage; Voltage conversion unit is to the further step-down of second alternating voltage and be rectified into direct current, the driving element of output output DC a to semiconductor element of voltage conversion unit.
Description of drawings
For further specifying concrete technology contents of the present invention, below in conjunction with embodiment and accompanying drawing specifies as after, wherein:
Figure 1A is according to the first embodiment of the present invention, and elastic membrane moves downwards, and face is kept smooth, so that push air downwards;
Figure 1B is according to the first embodiment of the present invention, and elastic membrane moves and causes under the film lateral vibration to the top, to flow downward as the valve direct air;
Fig. 2 A is according to the first embodiment of the present invention, and elastic membrane moves to the top, and face is kept smooth, so that upwards push air;
Fig. 2 B is according to the first embodiment of the present invention, and elastic membrane is vibrated toward moving down and cause on the film lateral, upwards to flow as the valve direct air;
Fig. 3 A is according to the first embodiment of the present invention, and elastic membrane is incorporated into the framework lower surface, drives framework by movable part and moves down, and causes elastic membrane integral body to be close to framework, with the pushing air flows downward;
Fig. 3 B is according to the first embodiment of the present invention, and elastic membrane is incorporated into the framework lower surface, drives framework by movable part and moves up, and causes elastic membrane peripheral part to leave framework, to flow downward as the valve direct air;
Fig. 4 A is according to the first embodiment of the present invention, a kind of design of support component;
Fig. 4 B is according to the first embodiment of the present invention, the design of another kind of support component;
Fig. 5 is the three-dimensional exploded view of LED light fixture according to a second embodiment of the present invention;
Fig. 6 is the sketch map of voltage conversion unit according to a second embodiment of the present invention;
Fig. 7 is the three-dimensional exploded view of radiating module according to a second embodiment of the present invention;
Fig. 8 is the stereogram after LED light fixture group is stood according to a second embodiment of the present invention;
Fig. 9 is the profile after LED light fixture group is stood according to a second embodiment of the present invention; And
Figure 10 a to Figure 10 c is that radiating module carries out the sketch map that air blast is moved according to a second embodiment of the present invention.
The specific embodiment
The first embodiment of the present invention discloses a kind of electronic installation with heat sinking function; Comprise: at least one semiconductor element " for example: led chip (chip), CPU (central processing unit) or GPU (graphic process unit) ", a support component, a radiating module and a voltage conversion unit; Above-mentioned radiating module comprises an elastic membrane and a drive unit; Drive unit by reversal of magnetism to drive elastic membrane and move or to vibrate (moving or vibrating); So that pushing air or as the valve direct air produces air-flow thus semiconductor element is dispelled the heat.
And aforementioned drive unit receives one first alternating voltage, and drive unit has a pressure drop so that first alternating voltage is carried out step-down, and an output of drive unit is exported one second alternating voltage.In addition; Above-mentioned voltage conversion unit is to be coupled to drive unit to receive above-mentioned second alternating voltage; Voltage conversion unit is to the further step-down of second alternating voltage and be rectified into direct current, the driving element of output output DC a to semiconductor element of voltage conversion unit.
In a preferred embodiment, elastic membrane 623 can move downwards or move to the top, but 623 meetings of elastic membrane produce vibration at some specific directions.See also Figure 1A and Figure 1B; Arrow A is represented elastic membrane 623 moving directions, and arrow B is represented air-flow direction, and Figure 1A shows that elastic membrane 623 moves down; Face is kept smooth; So that push air downwards, Figure 1B shows that elastic membrane 623 moves up and causes under the film lateral vibration, to flow downward as the valve direct air.Relatively, the situation of Fig. 2 A and Fig. 2 B is opposite with Figure 1B with Figure 1A just, and elastic membrane 623 causes on the film lateral when moving down to be vibrated, and therefore, the direction of gas flow is also opposite with Figure 1A and Figure 1B.
In present embodiment, above-mentioned drive unit comprises a fixture and a movable part, drive movable part by reversal of magnetism and move with respect to fixture, and elastic membrane is to be incorporated on the movable part.
Among the above-mentioned fixture and movable part, one of which has a permanent magnetism element, and another has an electromagnetic component, and electromagnetic component receives first alternating voltage, so that electromagnetic component produces the mechanical energy of repelling each other or inhaling mutually with the permanent magnetism element.In addition, the reversal of magnetism frequency of the electromagnetic component of the change in voltage FREQUENCY CONTROL drive unit of first alternating voltage.
In another preferred embodiment; Please refer to shown in Fig. 3 A and Fig. 3 B; Movable part further comprises a framework (frame) 621, and it is that framework 621 has a relative first surface and a second surface in order to combination elastic membrane 623; For example upper surface and lower surface, framework 621 have perforation (throughhole) 622 air feed stream to be passed through.Above-mentioned elastic membrane 623 is attached at the lower surface of framework 621, covers partly or whole perforation, and the middle body of elastic membrane 623 is incorporated on the framework 621, and its peripheral part is unfixing; Driving said frame 621 by movable part moves toward lower surface or upper surface direction; Cause elastic membrane 623 integral body to be close to framework 621 or elastic membrane 623 peripheral part leave framework 621; Flow downward with the pushing air flows downward or as the valve direct air, thereby produce air-flow; Preferably, be the air-flow of one-way flow.
In another preferred embodiment; Among the above-mentioned fixture and movable part, fixture has electromagnetic component, and movable part has the permanent magnetism element; And movable part further connects a flexible member; Repelling each other or inhaling the distortion that motion causes flexible member mutually of movable part and fixture by the elastic restoring force of flexible member, carried out corresponding counter motion to drive movable part.
In the present embodiment; Support component can be divided into two big types: first kind support component provides heat sinking function; Can use metal material, its design principle is to increase and the semiconductor element contact area as far as possible, for example face contact; To remove heat that semiconductor element is produced fast, remove the heat of support component accumulation again by the type of cooling; Second type of support component do not provide heat sinking function, can use plastic material, and its design principle is to expose semiconductor element as far as possible, with convenient directly cooling semiconductor element.
First kind support component is illustrated, please refer to shown in Fig. 4 A, support component 2 can be a cooling base (heat sink), allows cooling blast contact cooling base.Preferably, cooling base designs for boss, and semiconductor element 1 is to be fixed in the boss end face, and cooling blast contact boss bottom surface.
Second type of support component illustrated, please refer to shown in Fig. 4 B, support component 2 part contact semiconductor elements 1, for example annular contact is to expose the most area of semiconductor element 1, the surface of the direct contact semiconductor element 1 of air-flow.When semiconductor element 1 was led chip, it had a light-emitting area and a real estate, and support component 2 parts contact led chip is to expose the most area of light-emitting area and/or real estate, the light-emitting area and/or the real estate of the direct contact semiconductor element of air-flow.
The real estate material of above-mentioned led chip comprises a kind of in the following group: sapphire (sapphire), silicon and metal be aluminium, copper for example ..., be to be known technology owing to have the led chip of different substrate material, do not intend at this and giving unnecessary details.
The second embodiment of the present invention discloses a kind of LED light fixture with radiating module, to shown in Figure 9, comprises at least one led chip 1, one support component 2, one spacer elements 3, one cases 4, one lampshades 5, one radiating modules 6 like Fig. 5, and 7 in a lamp holder combines.
Led chip 1 is to be connected on the aluminium extruded substrate 11, so that led chip 1 is connected with circuit on the aluminium extruded substrate 11.
Wherein, support component 2 can be the cooling base of circular cone appearance, and its end face offers two or above through hole 21, and for provide support element 2 can with after chat a spacer element 3 and combine, support component 2 card peripheries vertically offer two or above catching groove 22.
Moreover, the affixed shading ring 44 in case 4 bottoms, it is the usefulness as the air-flow isolation, makes air-flow only can pass through shading ring 44, after getting into, chats radiating module 6.Wherein, shading ring 44 is vertically offered two wire casings, so that supply the lamp holder 7 and the pair of conductive line 73 of electromagnetic component 741 to pass through, and is coupled to circuit board 36.
Lampshade 5 is transparent or semitransparent spheroids of being processed by glass or plastics, and its bottom opening tipping for example is adhered to spacer element 3 top peripheries, thereby led chip 1 and support component 2 are coated on lampshade 5 inside.Before address, the conical boss design that support component 2 is special makes it be able to stretch into lampshade 5 inside, for example rough center.
With Fig. 7 is example, and elastic membrane 623 is attached at the lower surface of framework 621, when framework 621 down surface direction move; Cause elastic membrane 623 integral body to be close to framework 621; Therefore, air is by down surface direction pushing of elastic membrane 623, produces the air-flow that surface direction down moves.When framework 621 up surface direction move; Cause elastic membrane 623 peripheral part to receive the air drag effect; (when elastic membrane 623 was combined in framework 621 bottom surfaces, weight around the film or the inertia force that adds counterweight can help around the film away from framework 621 and away from framework 621; When elastic membrane 623 is combined in framework 621 end faces; Weight around the film can be offseted upwards air drag of part); Manifest the perforation 622 that originally is capped; Therefore, through perforation 622, this moment, elastic membrane 623 flowed as the downward surface direction of valve direct air air by the downward surface direction of upper surface.
In addition, for increasing the flexible ability of movable part 62, its outside, for example socket one flexible member 64, for example spring between the flange of upper and lower end.
Especially, electromagnetic component 741 itself promptly has a pressure drop, when electromagnetic component 741 receive one first alternating voltage (for example: domestic power supply), first alternating voltage carried out step-down after, export one second alternating voltage to voltage conversion unit 361.Since second alternating voltage with to desire output dc voltage numerical value comparatively approaching, therefore, voltage conversion unit 361 can obtain preferable conversion efficiency.For example, first alternating voltage is 110V, and the DC voltage that the institute desire obtains is 24V, and when the pressure drop that is produced when electromagnetic component 741 was 40V, voltage conversion unit 361 only needed second alternating voltage of 70V (110V-40V) is converted into the DC voltage of 24V.And the pressure drop that is produced when electromagnetic component 741 is when being 50V, and voltage conversion unit needs the alternating voltage of 60V (110V-50V) is converted into the DC voltage of 24V.Under these two kinds of situations, voltage conversion unit 361 all can obtain preferable conversion efficiency.In addition, when the DC voltage of the more approaching output of second alternating voltage, its conversion efficiency is also good more.Above-mentioned first alternating voltage is such as but not limited to 110V, and DC voltage is for example and without limitation to 3.8V-72V.Dc source is to be that example is explained with 24V in the present embodiment, but not as limit.
After LED light fixture of the present invention stood via the aforementioned components group, its stereogram was as shown in Figure 8, and the profile of organizing after standing is as shown in Figure 9.Because lamp holder is to adopt existing specification, so can directly be installed on existing lamp socket.
Shown in Figure 10 A, when LED light fixture of the present invention was not lighted, movable part 62 was positioned on the electromagnetic component 741 of fixture 74 the permanent magnetism element 63 of movable part 62 bottoms by the stretching, extension elastic force of self and flexible member 64.
Shown in Fig. 9 and Figure 10 B, when LED light fixture of the present invention via switch open, make first alternating voltage through lamp holder 7 and electromagnetic component 741; After first alternating voltage carried out step-down, and export the voltage conversion unit 361 of one second alternating voltage to circuit board 36, to carry out further step-down and to be rectified into DC voltage; So that give the driving element of led chip 1, make it light and produce heat energy, and electromagnetic component 741 produce to form with permanent magnetism element 63 identical magnetic poles and repel each other; And then promote to move on the movable part 62, flexible member 64 is compressed, elastic membrane 623 moves past in the journey in last; Its outer ledge opens downwards because of effect of inertia, makes elastic membrane 623 open movable part 62, with downward as the valve direct air; Cold air is sucked by inlet channel 35, and through spacer element 3, movable part 62, and get into lamp holder 7 inside.
Shown in Fig. 9 and Figure 10 C; Inhale when electromagnetic component 741 generations form with permanent magnetism element 63 opposite magnetic poles mutually, and then attract movable part 62 to move down, make elastic membrane 623 in folding process; Its outer ledge closely is resisted against framework 621 edges of movable part 62; Make and with the pushing air, lamp holder 7 inner hot-airs are discharged by elastic membrane 623 sealing movable parts 62 by louvre 43.
When electromagnetic component receives general domestic power supply, it is the alternating voltage of frequency 60Hz, and each sine wave period comprises 1 positive waveform and 1 negative wave, and therefore, the reversal of magnetism frequency of electromagnetic component 741 is per 1/120 a second exchange magnetic pole (N, the S utmost point).
Especially, by changing the position that elastic membrane 623 is hubbed at framework 621, can change the direct of travel of air-flow.For example the elastic membrane 623 of previous embodiment is hubbed at framework 621 bottom surfaces; So that movable part 62 is reciprocally during length travel; Make elastic membrane 623 seal or open movable part 62; To produce the pushing air respectively or as the valve direct air, cold air to be got into by inlet channel 35, hot-air is then discharged by louvre 43.Anti-, if elastic membrane 623 is hubbed at framework 621 end faces, then can change the flow direction of air-flow, that is cold air gets into by louvre, hot-air is then discharged by inlet channel.
Disclosed, be a kind of of preferred embodiment, the change of every part or modification and come from technological thought of the present invention and be have the knack of a technology the people was easy to know by inference, all do not take off claim category of the present invention.
Claims (14)
1. electronic installation with heat sinking function, this electronic installation comprises:
At least one semiconductor element;
One support component, this support component is in order to fixing this semiconductor element;
One radiating module, this radiating module further comprises:
One elastic membrane; With
One drive unit, this drive unit is moved by this elastic membrane of reversal of magnetism driving or vibrates, so that push air or as the valve direct air, produce air-flow thus, this air-flow is in order to this semiconductor element is dispelled the heat; Wherein, this drive unit receives one first alternating voltage, and this drive unit has a pressure drop, so that this first alternating voltage is carried out step-down, an output of this drive unit is exported one second alternating voltage; And
One voltage conversion unit; It is coupled to this drive unit to receive this second alternating voltage; This voltage conversion unit is to the further step-down of this second alternating voltage and be rectified into direct current, the driving element of output output this direct current to this semiconductor element of this voltage conversion unit.
2. the electronic installation with heat sinking function as claimed in claim 1, wherein this drive unit comprises a fixture and a movable part, drive this movable part by reversal of magnetism and move with respect to this fixture, and this elastic membrane is incorporated on this movable part.
3. the electronic installation with heat sinking function as claimed in claim 2; Wherein among this fixture and this movable part; One of which has a permanent magnetism element; Another has an electromagnetic component, and this electromagnetic component receives this first alternating voltage, so that this electromagnetic component produces the mechanical energy of repelling each other or inhaling mutually with this permanent magnetism element.
4. the electronic installation with heat sinking function as claimed in claim 3, wherein the reversal of magnetism frequency of the electromagnetic component of this drive unit of change in voltage FREQUENCY CONTROL of this first alternating voltage.
5. the electronic installation with heat sinking function as claimed in claim 2, wherein this movable part further comprises a framework, and it is in order to combine this elastic membrane, and this framework has a relative first surface and a second surface, and this framework has perforation air feed stream to be passed through.
6. the electronic installation with heat sinking function as claimed in claim 5, wherein this elastic membrane is attached at the first surface of this framework, covers perforation at least partly, and the middle body of this elastic membrane is incorporated on this framework, and its peripheral part is unfixing; Drive said frame by this movable part and move, cause this elastic membrane integral body to be close to this framework or this elastic membrane peripheral part leaves this framework,, thereby produce this air-flow with the pushing air or as the valve direct air toward first surface or second surface direction.
7. the electronic installation with heat sinking function as claimed in claim 5, wherein this elastic membrane is attached at the first surface of this framework, and covers all perforation, and the middle body of this elastic membrane is incorporated on this framework, and its peripheral part is unfixing; Drive said frame by this movable part and move, cause this elastic membrane integral body to be close to this framework or this elastic membrane peripheral part leaves this framework,, thereby produce this air-flow with the pushing air or as the valve direct air toward first surface or second surface direction.
8. the electronic installation with heat sinking function as claimed in claim 1, wherein this semiconductor element is to be led chip, central processing unit or graphic process unit.
9. the electronic installation with heat sinking function as claimed in claim 1, wherein this support component is as cooling base, this air-flow directly contacts this cooling base.
10. the electronic installation with heat sinking function as claimed in claim 9, wherein this cooling base designs for boss, and this semiconductor element is fixed in this boss end face.
11. the electronic installation with heat sinking function as claimed in claim 1; Wherein this semiconductor element has a light-emitting area and a real estate; This support component partly contacts this semiconductor element; To expose the most area of this light-emitting area and/or this real estate, this air-flow directly contacts this light-emitting area and/or this real estate of this semiconductor element.
12. the electronic installation with heat sinking function as claimed in claim 11, wherein this support component is a plastic material.
13. the electronic installation with heat sinking function as claimed in claim 3; Wherein this fixture has this electromagnetic component; This movable part has this permanent magnetism element, and this movable part further connects a flexible member, the repelling each other or inhale mutually to move and cause the distortion of this flexible member of this movable part and this fixture; By the elastic restoring force of this flexible member, carry out corresponding counter motion to drive this movable part.
14. the electronic installation with heat sinking function as claimed in claim 1, wherein this air-flow is the air-flow of one-way flow.
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