CN102313189A - LED (Light-Emitting Diode) lamp - Google Patents

LED (Light-Emitting Diode) lamp Download PDF

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Publication number
CN102313189A
CN102313189A CN2010102175676A CN201010217567A CN102313189A CN 102313189 A CN102313189 A CN 102313189A CN 2010102175676 A CN2010102175676 A CN 2010102175676A CN 201010217567 A CN201010217567 A CN 201010217567A CN 102313189 A CN102313189 A CN 102313189A
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CN
China
Prior art keywords
heat
led
transparent body
light source
led light
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Pending
Application number
CN2010102175676A
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Chinese (zh)
Inventor
华桂潮
张从峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THINKLUX (Zhejiang) Lighting Tech Co Ltd
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Aidi Photoelectric (Hangzhou) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Aidi Photoelectric (Hangzhou) Co Ltd filed Critical Aidi Photoelectric (Hangzhou) Co Ltd
Priority to CN2010102175676A priority Critical patent/CN102313189A/en
Publication of CN102313189A publication Critical patent/CN102313189A/en
Pending legal-status Critical Current

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The invention discloses an LED (Light-Emitting Diode) lamp, which comprises a lamp barrel, an LED baseplate, an LED light source and a transparent body; the LED light source is fixed on the LED baseplate to form an LED-baseplate light source; the LED baseplate is fixed on the lamp barrel; the transparent body is contacted with the LED-baseplate light source; the LED-baseplate light source is placed between the transparent body and the lamp barrel; and the transparent body is solid. By adopting the embodiment disclosed by the invention, the heat-radiating problem of the LED lamp can be simply and conveniently solved.

Description

A kind of led lamp
Technical field
The present invention relates to field of illuminating lamps, relate to a kind of led lamp in particular.
Background technology
LED (Light Emitting Diode, light emitting diode) is a kind of solid-state semiconductor devices.Because characteristics such as LED has that volume is little, power consumption is low, long service life, high brightness, sturdy and durable and environmental protection are widely used in lighting field in recent years.The principle of luminosity of LED is electronics and the compound light that directly sends of hole process, so it can directly be converted into luminous energy with electric energy.But the luminous current drives that needs of LED light fixture, and in the electric energy of input LED, only having an appointment 15% effectively is converted into light, most of (about 85%) is because of the invalid heat that is converted into.Because LED is a temperature sensor, when variations in temperature, the performance of LED light fixture and encapsulating structure all can be affected, thereby influence the reliability and the service life of LED light fixture again.Statistics shows, 2 ℃ of the every risings of LED temperature, and reliability decrease 10% also is linear its service life and reduces.Therefore, about the heat dissipation technology of LED light fixture, be the key technology of this area always.
In the prior art, realize the heat radiation of LED light fixture, can adopt the liquid cooling mode.This method is employed in fills heat-conducting liquid in the sealed cavity between led light source and the lampshade, increase the area of dissipation of LED, has reduced lamp temperatures, makes the interior Temperature Distribution of light fixture more even simultaneously, thereby has improved the radiating efficiency of light fixture.But because the degree varies appearance of expanding with heat and contract with cold of different materials, the encapsulant that the temperature difference that adds light fixture work when not working causes said sealed cavity is owing to expanding with heat and contract with cold generation deformation, and then can produce sealing problem.Conductive fluid in the lampshade sealed cavity is known from experience and is penetrated in the drive circuit, and the inner member of LED light fixture is caused corrosion.Therefore this method can influence the service life of LED light fixture.
Summary of the invention
In view of this, the invention provides a kind of led lamp, can solve the heat dissipation problem of LED light fixture easily.
For realizing above-mentioned purpose, the present invention provides following technical scheme:
The LED light fixture comprises lamp tube, LED substrate, led light source and the transparent body;
Said led light source is fixed on the said LED substrate, forms LED substrate light source; Said LED substrate is fixed on the said lamp tube; The said transparent body contacts with said LED substrate light source; Said LED substrate built-in light-source is between the said transparent body and lamp tube;
The said transparent body is solid.
Preferably, the material of the said transparent body is: glass or plastics.
Preferably, further comprise heat-conducting medium between the light-emitting area of the inner surface that is arranged on the said transparent body and said LED substrate light source.
Preferably, said heat-conducting medium is: be arranged on the heat-conducting plate between the said transparent body and the said LED substrate light source.
Preferably, have the hole of matching on the said heat-conducting plate with said led light source.
Preferably, said heat-conducting medium is: spread upon the heat conducting coating between the said transparent body and the said LED substrate light source.
Preferably, said transparent body inner surface has the hole of matching with said led light source.
Preferably, further comprise the heat-conducting medium that is arranged between said LED substrate and the said lamp tube.
Preferably, said heat-conducting medium is: heat-conducting plate or heat conducting coating.
Can know that via above-mentioned technical scheme compared with prior art, the said LED light fixture of the embodiment of the invention adopts the solid transparent body that the LED light fixture is dispelled the heat.The solid transparent body is as a kind of solid material, and is littler than the thermal resistance of gas, helps the conduction of heat, can realize heat sinking function.The invention discloses a kind of LED light fixture that utilizes the solid transparent body to dispel the heat, avoided filling the sealing problem that heat-conducting liquid brings in the prior art, can realize heat radiation easily the LED light fixture.
Description of drawings
In order to be illustrated more clearly in the technical scheme of the embodiment of the invention; The accompanying drawing of required use is done to introduce simply in will describing embodiment below; Obviously, the accompanying drawing in describing below only is embodiments of the invention, for those of ordinary skills; Under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to the accompanying drawing that provides.
Fig. 1 is the LED light fixture cutaway view of first embodiment of the invention;
Fig. 2 is the LED light fixture explosive view of first embodiment of the invention;
Fig. 3 is the LED light fixture cutaway view of second embodiment of the invention;
Fig. 4 is the LED light fixture explosive view of second embodiment of the invention.
The specific embodiment
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme in the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
The embodiment of the invention discloses a kind of LED light fixture that utilizes the transparent body to dispel the heat.
See figures.1.and.2, be respectively the LED light fixture cutaway view and the explosive view of first embodiment of the invention.Embodiment one said LED light fixture comprises drive power supply 1, lead 2, lamp tube 3, LED substrate 4, led light source 5, the transparent body 6 and heat-conducting plate 7.
Said led light source 5 is fixed on the said LED substrate 4, forms LED substrate light source; Said LED substrate 4 is fixed on the said lamp tube 3; The said transparent body 6 contacts with said LED substrate light source, and said LED substrate built-in light-source is between the said transparent body 6 and lamp tube 3.
Said drive power supply 1 one ends link to each other with lamp tube 3 through lead 2, and said lamp tube 3 links to each other with LED substrate 4.Said drive power supply 1 provides power supply for the led light source 5 on the said LED substrate 4.
In the embodiment of the invention, the said transparent body 6 is solid.
In the prior art, what generally adopt is the hollow transparent body, have gas in the transparent body, and the heat conductivility of gas is poor, also is that thermal resistance is big, is unfavorable for the propagation of heat, so heat dispersion is bad.The present invention adopts solid transparent body 6, and solid transparent body 6 is as a kind of solid material, and is littler than the thermal resistance of gas, helps the conduction of heat, can realize heat sinking function.The embodiment of the invention is dispelled the heat through adopting 6 pairs of LED light fixtures of solid transparent body, has replaced the heat-conducting liquid that in the prior art LED light fixture is dispelled the heat, and has avoided filling the sealing problem that heat-conducting liquid brings.
For the ease of the bright dipping of led light source 5, the said transparent body 6 can be that any one can printing opacity and have the solid material than thermal conductive resin, like glass or plastics.But the material of the said transparent body 6 of the embodiment of the invention not only is confined to glass or plastics, and along with the development of LED light fixture technology, the material of any transparent body that can be used as the LED light fixture is all within the scope of the present invention's protection.
Conspicuous, those skilled in the art can carry out technical finesse according to the actual requirements to the said transparent body 6.For example, when needing the LED light fixture to send the light of certain color, can use the transparent body 6 of respective color that it is carried out luminous intensity distribution; When the face shaping of LED light fixture is had requirement, also can be processed into different shape according to corresponding requirements.
Can be connected through screw mode or alternate manner between wherein said solid transparent body 6 and the said lamp tube 3.
Preferably, link to each other through heat-conducting medium between the one side (light-emitting area of hereinafter referred LED substrate light source) that is fixed with led light source 5 on the LED substrate 4 and the transparent body 6.
When the LED light fixture was worked, led light source 5 also can be converted into heat energy with a part of electric energy inevitably except electric energy is converted into luminous energy.This part heat that led light source 5 produces conducts to the external world through the transparent body 6.Because consider the bright dipping of led light source 5, the material of the said transparent body 6 generally can be glass or plastics.And some have the material of good heat conductive performance, because itself does not have transparent characteristic, can not be used as the transparent body 6.
In the embodiment of the invention, in order further to improve the heat dispersion of LED light fixture, can between the light-emitting area of said LED substrate light source and the transparent body 6, heat-conducting medium be set.Can further reduce the light-emitting area of LED substrate light source and the thermal resistance between the transparent body 6 like this.The heat that this technology produces in the time of can making the work of LED light fixture is transmitted in the outside air more fast, effectively improves heat transfer efficiency.
In the present embodiment, said heat-conducting medium can adopt heat-conducting plate 7.Said heat-conducting plate 7 is close to the light-emitting area of said LED substrate light source.
Further, have the aperture that matches with said led light source 5 on the heat-conducting plate 7.
Being that example describes shown in the accompanying drawing 2 of the present invention.Led light source 5 in the embodiment of the invention be shaped as the granule of square shape one by one, so correspondingly just on heat-conducting plate 7, have corresponding square aperture.During installation, the led light source 5 on the LED substrate 4 can be embedded in the aperture corresponding on the heat-conducting plate 7.
Conspicuous, when the shape of led light source 5 is not the square graininess, but during other shape (like cylindrical, sphere etc.), the aperture on the said heat-conducting plate 7 also correspondingly is split into the shape that meets led light source 5 and gets final product.
Owing to have the aperture that matches with led light source 5 on the heat-conducting plate 7, the light that led light source 5 sends can pass heat-conducting plate 7 and propagate into the outside, is convenient to the bright dipping of led light source 5 again.
Specifically, the material of said heat-conducting plate 7 can be any material with good heat conductive performance.
With reference to Fig. 3 and Fig. 4, be respectively the LED light fixture cutaway view and the explosive view of second embodiment of the invention.Embodiment two said LED light fixtures comprise: drive power supply 1, lead 2, lamp tube 3, LED substrate 4, led light source 5 and the transparent body 6.Its annexation is basic identical with embodiment one.The difference part is that the heat-conducting medium here adopts heat conducting coating.Specifically, be between the light-emitting area of LED substrate light source and the transparent body 6, to smear said heat conducting coating.
Here, about the use of heat conducting coating, specify as follows at this:
In heat radiation and heat conduction were used, even very bright and clean two planes, surface have the space to occur being in contact with one another Shi Douhui, the air in these spaces was the non-conductor of heat, can hinder the conduction of heat to heat abstractor.And heat conducting coating is exactly a kind of these spaces of can filling, and makes the smooth and easy more material rapidly of conduction of heat.
When LED worked, the heat that led light source 5 sends can accumulate in the space between the led light source 5 and the transparent body 6, is full of air in the space, and gas conduction property is bad, is unfavorable for the conduction of heat.Smear after the heat conducting coating, the heat that LED sends at first is transmitted on the transparent body 6 through heat conducting coating, and the transparent body 6 is transmitted to heat in the outside air through self again.The heat conducting coating of smearing has reduced the light-emitting area of LED substrate light source and the thermal resistance between the transparent body 6, heat is transmitted on the transparent body 6 more easily, and then has improved heat transfer efficiency.
Among the embodiment two, have the aperture that matches with led light source 5 on the transparent body 6.
Being that example describes shown in the accompanying drawing 4 of the present invention.Led light source 5 be shaped as the granule of square shape one by one, so correspondingly just on the transparent body 6, have corresponding square aperture.During installation, the led light source 5 on the LED substrate 4 can be embedded in the aperture corresponding on the transparent body 6.
Conspicuous, as to have on the transparent body 6 aperture also is more conducive to the bright dipping of led light source 5.Certainly, if the shape of led light source 5 is not the square graininess, but other shape (like cylindrical, sphere), the aperture on the said transparent body 6 also correspondingly is split into the shape that meets led light source 5.
Preferably, more than among two embodiment, can also between LED substrate 4 and lamp tube 3, heat-conducting medium be set.Heat-conducting medium can be heat-conducting plate or heat conducting coating.Be provided with after the heat conducting coating, led light source 5 conducts to the heat on the LED substrate 4, just can outwards conduct through the good heat-conducting medium of heat conductivility.Finally be transmitted in the outside air through lamp tube 3.
Therefore, the heat-conducting medium that between LED substrate 4 and lamp tube 3, is provided with has reduced the thermal resistance between LED substrate 4 and the lamp tube 3, has improved the heat conduction efficiency between LED substrate 4 and the lamp tube 3, more helps the heat that LED substrate 4 distributes and is transmitted in the outside air.
In addition; Can find out by above-mentioned two embodiment: on the basis of the heat dispersion that adopts the transparent body 6 improvement LED light fixtures; In the junction of the various piece of LED light fixture of the present invention, all can adopt the mode that heat-conducting medium is set, come the present invention is optimized.
Specifically,
In embodiment one, be provided with after the said heat-conducting plate 7, further can smear heat conducting coating in the said heat-conducting plate 7 and the light-emitting area joint of LED substrate light source.Also can smear heat-conducting medium between the heat-conducting plate 7 and the transparent body 6.Also heat-conducting plate can be set between LED substrate 4 and the lamp tube 3, heat conducting coating can also be smeared in two surfaces up and down of heat-conducting plate.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined General Principle can realize under the situation that does not break away from the spirit or scope of the present invention in other embodiments among this paper.Therefore, the present invention will can not be restricted to these embodiment shown in this paper, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.

Claims (9)

1. a led lamp is characterized in that, comprises lamp tube, light emitting diode base plate, LED source and the transparent body;
Said LED source is fixed on the said light emitting diode base plate, forms the light emitting diode base plate light source; Said light emitting diode base plate is fixed on the lamp tube; The said transparent body contacts with said LED substrate light source; Said light emitting diode base plate built-in light-source is between the said transparent body and lamp tube;
The said transparent body is solid.
2. led lamp according to claim 1 is characterized in that, the material of the said transparent body is: glass or plastics.
3. led lamp according to claim 1 is characterized in that, said light fixture also comprises the heat-conducting medium between the light-emitting area of the inner surface that is arranged on the said transparent body and said light emitting diode base plate light source.
4. led lamp according to claim 3 is characterized in that, said heat-conducting medium is: be arranged on the heat-conducting plate between the said transparent body and the said light emitting diode base plate light source.
5. led lamp according to claim 4 is characterized in that, has the hole of matching with said LED source on the said heat-conducting plate.
6. led lamp according to claim 3 is characterized in that, said heat-conducting medium is: spread upon the heat conducting coating between the said transparent body and the said light emitting diode base plate light source.
7. led lamp according to claim 6 is characterized in that, said transparent body inner surface has the hole of matching with said LED source.
8. according to any described led lamp of claim 1 to 7, it is characterized in that, further comprise the heat-conducting medium that is arranged between said light emitting diode base plate and the said lamp tube.
9. led lamp according to claim 8 is characterized in that, said heat-conducting medium is: heat-conducting plate or heat conducting coating.
CN2010102175676A 2010-07-02 2010-07-02 LED (Light-Emitting Diode) lamp Pending CN102313189A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010102175676A CN102313189A (en) 2010-07-02 2010-07-02 LED (Light-Emitting Diode) lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010102175676A CN102313189A (en) 2010-07-02 2010-07-02 LED (Light-Emitting Diode) lamp

Publications (1)

Publication Number Publication Date
CN102313189A true CN102313189A (en) 2012-01-11

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CN2010102175676A Pending CN102313189A (en) 2010-07-02 2010-07-02 LED (Light-Emitting Diode) lamp

Country Status (1)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201180968Y (en) * 2008-03-31 2009-01-14 鹤山丽得电子实业有限公司 LED Lamp
CN201228865Y (en) * 2008-07-17 2009-04-29 张光发 High power LED lighting fixture
US20100164346A1 (en) * 2008-12-31 2010-07-01 Intematix Corporation Light emitting device with phosphor wavelength conversion
CN201739840U (en) * 2010-07-02 2011-02-09 艾迪光电(杭州)有限公司 LED lamp

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201180968Y (en) * 2008-03-31 2009-01-14 鹤山丽得电子实业有限公司 LED Lamp
CN201228865Y (en) * 2008-07-17 2009-04-29 张光发 High power LED lighting fixture
US20100164346A1 (en) * 2008-12-31 2010-07-01 Intematix Corporation Light emitting device with phosphor wavelength conversion
CN201739840U (en) * 2010-07-02 2011-02-09 艾迪光电(杭州)有限公司 LED lamp

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C53 Correction of patent of invention or patent application
CB02 Change of applicant information

Address after: Hangzhou City, Zhejiang province 310053 Binjiang District Dongxin Road No. 66 East communication D block 208

Applicant after: LED ONE (Hangzhou) Co., Ltd.

Address before: Hangzhou City, Zhejiang province 310053 Binjiang District Dongxin Road No. 66 East communication D block 208

Applicant before: Aidi Photoelectric (Hangzhou) Co., Ltd.

COR Change of bibliographic data

Free format text: CORRECT: APPLICANT; FROM: LEDONE HANGZHOU CO., LTD. TO: LED ONE (HANGZHOU) CO., LTD.

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Owner name: ZHEJIANG THINKLUX LIGHTING TECHNOLOGY CO., LTD.

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Effective date: 20130402

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Effective date of registration: 20130402

Address after: Hangzhou City, Zhejiang province Binjiang District 315002 shore road 95 2 Building 3 layer

Applicant after: Thinklux (Zhejiang) Lighting Technology Co., Ltd.

Address before: Hangzhou City, Zhejiang province 310053 Binjiang District Dongxin Road No. 66 East communication D block 208

Applicant before: LED ONE (Hangzhou) Co., Ltd.

C12 Rejection of a patent application after its publication
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Application publication date: 20120111