CN102313160B - Light-emitting diode (LED) lamp - Google Patents
Light-emitting diode (LED) lamp Download PDFInfo
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- CN102313160B CN102313160B CN2010102251932A CN201010225193A CN102313160B CN 102313160 B CN102313160 B CN 102313160B CN 2010102251932 A CN2010102251932 A CN 2010102251932A CN 201010225193 A CN201010225193 A CN 201010225193A CN 102313160 B CN102313160 B CN 102313160B
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- distributing cap
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- 239000000758 substrate Substances 0.000 claims abstract description 137
- 239000012809 cooling fluid Substances 0.000 claims description 65
- 238000009826 distribution Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000012856 packing Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 abstract description 22
- 238000012546 transfer Methods 0.000 description 14
- 238000007789 sealing Methods 0.000 description 13
- 230000005855 radiation Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000003487 electrochemical reaction Methods 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 3
- 230000001795 light effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005755 formation reaction Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention discloses a light-emitting diode (LED) lamp. The lamp comprises a substrate light source which consists of an LED light source and an LED substrate, a substrate seat, an internal light distributing cover, an external light distributing cover and a lamp holder, wherein the LED substrate light source is arranged at the top end of the substrate seat; the internal light distributing cover is arranged on the outer side of the substrate seat; the outer side wall of the substrate seat is closely attached with the inner side wall of the internal light distributing cover; the top end of the internal light distributing cover is provided with a transparent body which is matched with the substrate light source; the external light distributing cover is arranged on the outer side of the internal light distributing cover; the inner surface of the external light distributing cover and the outer surface of the internal light distributing cover form a sealed cavity; and the sealed cavity is filled with radiator liquid. The problem that the LED substrate is corroded can be solved by the embodiment of the invention.
Description
Technical field
The present invention relates to the light emitting diode field, relate to a kind of led lamp in particular.
Background technology
LED (Light Emitting Diode, light emitting diode) is a kind of semiconductor devices that can directly be converted into electricity visible light.LED is applied to the demonstration of indicator lamp, numeral and literal the earliest.Along with the appearance of White LED, add that LED has that operating voltage is low, little power consumption, luminous efficiency height, long advantage of life-span, LED obtains more and more widely application at lighting field.LED Lantern Festival electricity is up to more than 80%, and the life-span is more than 10 times of common fluorescent tube.
It is generally acknowledged that the operating temperature of LED need control below 80 degrees centigrade, could obtain very high light efficiency and very long life-span, therefore the heat dissipation design to the LED light fixture requires very high.With reference to Fig. 1, be the structure chart of the liquid cooling LED bar-shaped light fixture of hollow type of prior art.As shown in Figure 1, described LED strip light comprises electric connector (not shown), led driver 1a, LED substrate 2a, led light source 3a, hollow inner bag 4a and luminous intensity distribution lampshade 5a, lamp socket (not shown).
Described electric connector is arranged at the two ends of LED strip lamp, and the outside is connected with civil power, and inner input with LED driving 1a links to each other; Be full of the heat transfer liquids 7a with high capacity of heat transfer in the cavity 6a that described hollow inner bag 4a and luminous intensity distribution lampshade 5a form, described LED drives 1a and is arranged in the cavity 6a of described hollow inner bag 4a, and described led light source 3a is arranged on the LED substrate 2a; Described led light source 3a is arranged in the described luminous intensity distribution lampshade 5a; Described LED substrate 2a soaks and puts in described heat transfer liquids 7a.
In the LED strip lamp of prior art, described LED substrate 2a directly is immersed among the heat transfer liquids 7a.Because heat transfer liquids 7a generally all has certain corrosivity, make the LED substrate 2a that is immersed among the heat transfer liquids 7a be easy to be corroded.Therefore, the heat transfer liquids 7a of available technology adopting need have lower corrosivity as far as possible when satisfying thermal diffusivity, feasible having relatively high expectations to heat transfer liquids 7a.Simultaneously, because LED substrate 2a directly is immersed among the heat transfer liquids 7a, heat transfer liquids 7a can penetrate into the chip internal of LED substrate 2a, corrodes chip, influences the life-span of LED light fixture.
Summary of the invention
In view of this, the invention provides a kind of led lamp, can solve the problem that the LED substrate is corroded by heat transfer liquids.
For achieving the above object, the invention provides following technical scheme: a kind of led lamp, described light fixture comprises: the substrate light source, substrate holder, interior light distributing cap, outer light distributing cap, the lamp socket that are made of led light source and LED substrate;
Described LED substrate light source is arranged on described substrate holder top;
Light distributing cap is arranged on the outside of described substrate holder in described, and the lateral wall of described substrate holder is close to the madial wall of described interior light distributing cap; The top of light distributing cap is a transparent body that matches with described substrate light source in described;
Described outer light distributing cap is arranged on the outside of described interior light distributing cap, and the outer surface of the inner surface of described outer light distributing cap and described interior light distributing cap forms a sealed cavity; Be full of cooling fluid in the described sealed cavity.
Preferably, described substrate holder adopts engage thread closely to be connected with described interior light distributing cap.
Preferably, described substrate holder adopts the slot form closely to be connected with described interior light distributing cap.
Preferably, the described transparent body is a light-distribution lens.
Preferably, described interior light distributing cap adopts identical or close material to make with described outer light distributing cap.
Preferably, ultrasonic bonding is adopted in the junction of described interior light distributing cap and described outer light distributing cap.
Preferably, described substrate holder has high thermal conductivity.
Preferably, between described LED substrate and substrate holder, heat-conducting medium is set.
Preferably, described heat-conducting medium is heat-conducting plate or heat conducting coating.
Preferably, in described sealed cavity, described in light distributing cap below set up baffle plate; Described baffle plate and described interior light distributing cap constitute packing less narrow and small zone.
Compared with prior art, the described LED light fixture of the embodiment of the invention, light distributing cap in adopting, with described outer light distributing cap be arranged on described in the outside of light distributing cap, form a sealed cavity with described interior light distributing cap, in described sealed cavity, be full of cooling fluid.By substrate holder, described substrate light source is arranged on the inboard of described interior light distributing cap.Thus, make described substrate light source and cooling fluid keep apart, the substrate light source no longer directly is immersed in the cooling fluid, has avoided putting the electrochemical reaction that produces, and cooling fluid corrosion that the chip of LED substrate is caused because the LED substrate directly soaks in cooling fluid.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is embodiments of the invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to the accompanying drawing that provides.
Fig. 1 is the structure chart of the liquid cooling LED bar-shaped light fixture of hollow type of prior art;
Fig. 2 is the cutaway view of the light emitting diode ball bubble shape light fixture of the embodiment of the invention one;
Cutaway view when there is bubble in Fig. 3 for the light emitting diode ball of the embodiment of the invention one bubble shape light fixture;
Fig. 4 is the cutaway view of the light emitting diode ball bubble shape light fixture of the embodiment of the invention two;
Fig. 5 is the sectional view of the light emitting diode bar shaped light fixture of the embodiment of the invention three;
Fig. 6 is the partial sectional view of the light emitting diode bar shaped light fixture of the embodiment of the invention three;
Fig. 7 is the sectional view of the light emitting diode bar shaped light fixture of the embodiment of the invention four.
The specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
The light fixture that the purpose of this invention is to provide a kind of light emitting diode can solve the problem that the LED substrate is corroded by heat transfer liquids.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
The described led lamp of the embodiment of the invention comprises: the substrate light source, substrate holder, interior light distributing cap, outer light distributing cap, the lamp socket that are made of led light source and LED substrate.
Wherein, described LED substrate light source is arranged on described substrate holder top; Light distributing cap is arranged on the outside of described substrate holder in described, and the lateral wall of described substrate holder is close to the madial wall of described interior light distributing cap; The top of light distributing cap is a transparent body that matches with described substrate light source in described; Described outer light distributing cap is arranged on the outside of described interior light distributing cap, and the outer surface of the inner surface of described outer light distributing cap and described interior light distributing cap forms a sealed cavity; Be full of cooling fluid in the described sealed cavity.
The described LED ball of embodiment of the invention bubble shape light fixture, light distributing cap in adopting, with described outer light distributing cap be arranged on described in the outside of light distributing cap, form a sealed cavity with described interior light distributing cap, in described sealed cavity, be full of cooling fluid.By substrate holder, described substrate light source is arranged on the inboard of described interior light distributing cap.Thus, make described substrate light source and cooling fluid keep apart, the substrate light source no longer directly is immersed in the cooling fluid, has avoided putting the electrochemical reaction that produces, and cooling fluid corrosion that the chip of LED substrate is caused because the LED substrate directly soaks in cooling fluid.
Therefore, the described LED light fixture of the embodiment of the invention can arbitrarily adopt the liquid with high heat dispersion as cooling fluid, and need not consider the corrosivity of this liquid again, but makes that the selectance of cooling fluid is higher.
Preferably, the transparent body and the described led light source on the described interior light distributing cap top of the embodiment of the invention are equipped with.At this moment, the light beam that described led light source sends can be transmitted in the cooling fluid by the transparent body on light distributing cap top in described, penetrates by described outer light distributing cap and goes.
Preferably, the described transparent body can be a light-distribution lens, and the light beam that described led light source sends carried out once light-distribution earlier before entering cooling fluid, makes that the light enter before the cooling fluid is more even; Then, described light passes through the luminous intensity distribution of described cooling fluid again, and it will be more desirable being transmitted to airborne light effects.
In actual applications, described LED light fixture has variform, and the ball that is generally commonly used steeps shape light fixture and strip lamp.In the embodiment of the invention, be that example describes in detail with ball bubble shape light fixture and strip lamp respectively.For the LED light fixture of other forms, its operation principle is identical with it, repeats no more.
With reference to shown in Figure 2, steep the cutaway view of shape light fixture for the light emitting diode ball of the embodiment of the invention one.
In conjunction with Fig. 2, described LED ball bubble shape light fixture comprises: led light source 11, LED substrate 12, substrate holder 13, interior light distributing cap 14, outer light distributing cap 15, lamp socket 16, lamp socket connector 17, led driver 18, electrical connection (not shown).
Described led light source 11 is arranged on and constitutes the substrate light source on the described LED substrate 12, is the light emitting source of described LED light fixture.Described LED substrate light source is arranged on described substrate holder 13 tops.
Light distributing cap 14 is arranged on the outside of described substrate holder 13 in described, and the lateral wall of described substrate holder 13 is close to the madial wall of described interior light distributing cap 14.
The top of light distributing cap 14 is a transparent body 19 in described, and the described transparent body 19 matches with described led light source 11, is used for the light beam transmission that described led light source 11 sends is gone out.
Described outer light distributing cap 15 is arranged on the outside of described interior light distributing cap 14, adopt between the two and be threaded, the outer surface of the inner surface of described outer light distributing cap 15 and described interior light distributing cap 14 forms a sealed cavity 110, is full of the cooling fluid with high-cooling property in the described sealed cavity 110.
Described lamp socket 16 is threaded with described interior light distributing cap 14 by described lamp socket connector 17.Described lamp holder connector 17 forms hollow inner bags 111 with described interior light distributing cap 14, and described led driver 18 is arranged in the cavity of described hollow inner bag 111.
The described LED ball bubble of the embodiment of the invention one shape light fixture, light distributing cap 14 in adopting, with described outer light distributing cap 15 be arranged on described in the outside of light distributing cap 14, with described in light distributing cap 14 formation one sealed cavity 110, in described sealed cavity 110, be full of cooling fluid.By substrate holder 13, described substrate light source is arranged on the inboard of described interior light distributing cap 14.Thus, make described substrate light source and cooling fluid keep apart, the substrate light source no longer directly is immersed in the cooling fluid, has avoided putting the electrochemical reaction that produces, and cooling fluid corrosion that the chip of LED substrate 12 is caused because LED substrate 12 directly soaks in cooling fluid.
Therefore, the LED ball bubble shape light fixture described in the embodiment of the invention one can arbitrarily adopt the liquid with high heat dispersion as cooling fluid, and need not consider the corrosivity of this liquid again, but make that the selectance of cooling fluid is higher.For example, can adopt perfect heat-dissipating and the water that is dirt cheap as cooling fluid, can be when realizing heat radiation, the manufacturing cost of saving the LED light fixture effectively.
Preferably, in the embodiment of the invention one, described LED substrate light source can adopt the riveted joint mode to be arranged on the described substrate holder 13, makes the lower surface of described LED substrate 12 be close to the top of described substrate holder 13.Described substrate holder 13 can adopt engage thread closely to be connected with described interior light distributing cap 14.
Concrete, can have external screw thread at the lateral wall of described substrate holder 13, the madial wall of light distributing cap 14 has the internal thread that matches with described external screw thread in described, thus, the lateral wall that can realize described substrate holder 13 be close to described in the madial wall of light distributing cap 14.
Preferably, in order to realize the heat radiation to LED substrate light source, described substrate holder 13 can adopt transcalent metal material.When 12 energisings of LED substrate, led light source 11 is lighted, and produces heat.The heat that led light source 11 produces is delivered on the interior light distributing cap of being close to described substrate holder 13 14 by substrate holder 13, and the outside of light distributing cap 14 is immersed in the described cooling fluid in described.Thus, described heat can be delivered to cooling fluid, realize heat radiation.
Simultaneously, as seen from Figure 1, described substrate holder 13 is bigger with the effective area that interior light distributing cap 14 is close to, and can very effectively the heat that produces on the LED substrate light source be sent in the described cooling fluid by light distributing cap 14 in described to greatest extent thus.
Preferably, in the embodiment of the invention, can between described LED substrate 12 and described substrate holder 13, set up heat-conducting medium, further strengthen the heat transfer efficiency between described LED substrate 12 and the substrate holder 13.
Described heat-conducting medium can be for having the heat-conducting plate of good heat conductive performance.Concrete, described LED substrate 12 is close on the upper and lower surface of described heat-conducting plate respectively and described substrate holder 13 arranges, and is used for strengthening the heat conduction between the two.
Described heat-conducting medium can also be the heat conducting coating with good heat conductive performance.Concrete, between described LED substrate 12 and substrate holder 13, smear heat conducting coating, strengthen the heat conduction between the two.
In the embodiment of the invention one, described interior light distributing cap 14 tops are a transparent body 19, and the described transparent body 19 is equipped with described led light source 11.At this moment, the light beam that described led light source 11 sends can be transmitted in the cooling fluid by the transparent body 19 on light distributing cap 14 tops in described, penetrates by described outer light distributing cap 15 and goes.Wherein, the described transparent body 19 and led light source 11 match, and refer to that the shape of the described transparent body 19 and the shape of described led light source 11 match, and the light beam that makes described led light source 11 send can throw away by the described transparent body 19 to greatest extent.
Preferably, the described transparent body 19 can be a light-distribution lens, and the light beam that described led light source 11 sends carried out once light-distribution earlier before entering cooling fluid, makes that the light enter before the cooling fluid is more even; Then, described light passes through the luminous intensity distribution of described cooling fluid again, and it will be more desirable being transmitted to airborne light effects.
In the embodiment of the invention one, described interior light distributing cap 14 and outer light distributing cap 15 adopt the form that is threaded, and the outer surface of the inner surface of described outer light distributing cap 15 and described interior light distributing cap 14 forms sealed cavity 110.
Preferably, in order to strengthen the seal of described closed cavity 110, prevent cooling fluid generation seepage, can be in described light distributing cap 14 and outside the junction of light distributing cap 15 set up sealing gasket 112.
Preferably, described sealing gasket 112 can adopt sealing properties such as silica gel, rubber preferably material make, for example, silica gel sealing pad, rubber gasket etc.
When described LED light fixture is worked, because led light source 11 luminous generation heats, light distributing cap 14 and outer light distributing cap 15 expanded by heating in making.When the coefficient of expansion difference of light distributing cap 14 and outer light distributing cap 15 was big in described, the two was easy to make the junction of described interior light distributing cap 14 and outer light distributing cap 15 slit occur, thereby causes cooling fluid seepage to occur because being subjected to thermogenetic expansion deformation difference this moment.
In the embodiment of the invention one, for addressing the above problem, described interior light distributing cap 14 and described outer light distributing cap 15 adopt close material to make, and make that the coefficient of expansion of the two is close, compatibility is better, because being subjected to thermogenetic expansion deformation very approaching, can better realize the sealing function to cooling fluid.
Preferably, adopt same material to make light distributing cap 14 in described and described outer light distributing cap 15, make that the coefficient of expansion of the two is identical, it is subjected to thermogenetic deformation also identical, and sealing effectiveness is better.
Preferably, because described interior light distributing cap 14 uses close with described outer light distributing cap 15 or identical materials is made, this moment can be in the employing ultrasonic bonding of the threaded connection place of interior light distributing cap 14 and outer light distributing cap 15, the two threaded connection place is melt into one, make its better tightness, more be conducive to prevent the seepage of cooling fluid.
With reference to Fig. 3, the cutaway view when having bubble for the embodiment of the invention one described light emitting diode ball bubble shape light fixture.Because the certain coefficient of expansion of liquid is so can expand after cooling fluid is heated.For described sealed cavity 110, fill full cooling fluid in it, light distributing cap 15 breaks outside may causing behind the described cooling fluid expanded by heating.Therefore, in the practical application, in sealed cavity 110, filling in the process of described cooling fluid, can in described sealed cavity 110, keep a certain size bubble 113.The existence of described bubble 113 can make when described cooling fluid expanded by heating have certain space to hold the liquid of expansion, has prevented breaking of outer light distributing cap 15 effectively.
But the position of described bubble 113 is difficult to fixing, and as shown in Figure 3, bubble 113 is positioned at the top of sealed cavity 110.When the led light source 11 on the LED substrate 12 was luminous, light penetrated outer light distributing cap 15 through bubble 113 backs, can occur hot spot in range of exposures.The light emitting diode ball bubble shape light fixture that the embodiment of the invention two provides has effectively solved this problem.
With reference to Fig. 4, steep the cutaway view of shape light fixture for the light emitting diode ball of the embodiment of the invention two.Among Fig. 4, in described sealed cavity 110, described in increase baffle plate 114 below light distributing cap 14 and described outer light distributing cap 15 junctions, with the fixed-site of described bubble 113 bottom at sealed cavity 110.Because light distributing cap 14 is not the light out part of LED light fixture with the below of described outer light distributing cap 15 junctions in described, does not have light to send from this, makes the existence of bubble 113 can not produce hot spot.
Baffle plate described in the embodiment of the invention 114 is installed in the below of described interior light distributing cap 14, be specially the below, junction of described outer light distributing cap 15 and interior light distributing cap 14, the outer surface of the edge of described baffle plate 114 and interior light distributing cap 14 has certain distance, this distance makes described interior light distributing cap 14 and described baffle plate 114 constitute packing less narrow and small zone, and described bubble 113 is constrained in the described narrow and small zone.Because light does not penetrate from outer light distributing cap 15 and the junction of interior light distributing cap 14, so the existence of bubble 113 can not produce hot spot in range of exposures.
With reference to Fig. 5 and shown in Figure 6, be sectional view and the partial sectional view of the light emitting diode bar shaped light fixture of the embodiment of the invention three.
In conjunction with Fig. 5 and Fig. 6, described LED strip lamp comprises: led light source 21, LED substrate 22, substrate holder 23, interior light distributing cap 24, outer light distributing cap 25, lamp socket 26, led driver 27, interior seal cover 28, electrical connection (not shown).
Described led light source 21 is arranged on and constitutes the substrate light source on the described LED substrate 22, is the light emitting source of described LED light fixture.Described LED substrate light source is arranged on the top of described substrate holder 23.
The top of light distributing cap 24 is a transparent body 29 in described, and the described transparent body 29 matches with described led light source 21, is used for the light beam transmission that described led light source 21 sends is gone out.
Described outer light distributing cap 25 be arranged on described in the outside of light distributing cap 24, the connection that realizes between the two by described lamp socket 26.Concrete, described outer light distributing cap 25 closely is connected with described lamp socket 26.Light distributing cap 24 is realized being connected with the tight of described lamp socket 26 by seal cover in described 28 in described.The outer surface of the inner surface of described outer light distributing cap 15 and described interior light distributing cap 14 and lamp socket 26 form a sealed cavity 210, are full of the cooling fluid with high-cooling property in the described sealed cavity 210.
Described led driver 27 is arranged in the hollow inner bag 211 of described substrate holder 23.
As shown in Figure 5, described interior seal cover 28 forms hollow cavities with described interior light distributing cap 24, and described LED substrate light source is positioned at described hollow cavity.
As seen from the figure, the invention process three routine described LED strip lamps adopt interior light distributing cap 24, described outer light distributing cap 25 are arranged on the outside of described interior light distributing cap 24, form a sealed cavity 210 with described interior light distributing cap 24, in described sealed cavity 210, be full of cooling fluid.Described LED substrate light source then is arranged in the hollow inner bag 211 of described light distributing cap 24 and seal cover 28 formations.Make described LED substrate light source and cooling fluid keep apart thus, the substrate light source no longer directly is immersed in the cooling fluid, has avoided putting the electrochemical reaction that produces, and cooling fluid corrosion that the chip of LED substrate 22 is caused because LED substrate 22 directly soaks in cooling fluid.Therefore, the LED strip lamp described in the embodiment of the invention three can arbitrarily adopt the liquid with high heat dispersion as cooling fluid, and need not consider the corrosivity of this liquid again, but makes that the selectance of cooling fluid is higher.
Preferably, in the embodiment of the invention three, the lateral wall of described substrate holder 23 is close to the madial wall of described interior light distributing cap 14.Concrete, in the LED strip lamp, described substrate holder 23 can adopt the slot form to be connected with described interior light distributing cap 24.
Preferably, in order to realize the heat radiation to LED substrate light source, described substrate holder 23 can adopt transcalent metal material.When 22 energisings of LED substrate, led light source 21 is lighted, and produces heat.The heat that led light source 21 produces is delivered on the interior light distributing cap of being close to described substrate holder 23 24 by substrate holder 23, and the outside of light distributing cap 24 is immersed in the described cooling fluid in described, thus, described heat can be delivered to cooling fluid, realizes heat radiation.
Simultaneously, as seen from Figure 2, described substrate holder 23 is bigger with the effective area that interior light distributing cap 24 is close to, and can very effectively the heat that produces on the LED substrate light source be sent in the described heat radiation by light distributing cap 24 in described to greatest extent thus.
Preferably, in the embodiment of the invention, can between described LED substrate 22 and described substrate holder 23, set up heat-conducting medium, further strengthen the heat transfer efficiency between described LED substrate 22 and the substrate holder 23.
Described heat-conducting medium can be for having the heat-conducting plate of good heat conductive performance.Concrete, described LED substrate 22 is close on the upper and lower surface of described heat-conducting plate respectively and described substrate holder 23 arranges, and is used for strengthening the heat conduction between the two.
Described heat-conducting medium can also be the heat conducting coating with good heat conductive performance.Concrete, between described LED substrate 22 and substrate holder 23, smear heat conducting coating, strengthen the heat conduction between the two.
In the embodiment of the invention three, described interior light distributing cap 24 tops are a transparent body 29, and the described transparent body 29 is equipped with described led light source 21.At this moment, the light beam that described led light source 21 sends can be transmitted in the cooling fluid by the transparent body 29 on light distributing cap 24 tops in described, penetrates by described outer light distributing cap 25 and goes.
Preferably, the described transparent body 29 can be a light-distribution lens, and the light beam that described led light source 21 sends carried out once light-distribution earlier before entering cooling fluid, makes that the light enter before the cooling fluid is more even; Then, described light passes through the luminous intensity distribution of described cooling fluid again, and it will be more desirable being transmitted to airborne light effects.In the embodiment of the invention three, described outer light distributing cap 25 adopts with described lamp socket 26 and is threaded, and the outer surface of the inner surface of described outer light distributing cap 25 and described interior light distributing cap 24 and lamp socket 26 form closed cavities 210.
Preferably, in order to strengthen the seal of described closed cavity 210, prevent cooling fluid generation seepage, can outside described, set up sealing gasket 20 with the junction of lamp socket 26 by light distributing cap 25.
Described LED substrate light source is arranged in described light distributing cap 24 and constitutes hollow cavity with seal cover 28.Further, leak in the described hollow cavity in order to prevent described cooling fluid, corrode described LED substrate light source, can in described, also set up sealing gasket 212 with the junction of interior seal cover 28 by light distributing cap 24.
Preferably, described sealing gasket 212 can adopt sealing properties such as silica gel, rubber preferably material make, for example, silica gel sealing pad, rubber gasket etc.
When described LED light fixture is worked, because led light source 21 luminous generation heats, light distributing cap 24, outer light distributing cap 25, lamp socket 26 and interior seal cover 28 all can expanded by heating in making, are easy to cause their threaded connection places each other the slit to occur, thereby cause cooling fluid seepage to occur.
In the embodiment of the invention three, for addressing the above problem, light distributing cap 24, outer light distributing cap 25, lamp socket 26, interior seal cover 28 all adopt close material to make in described, make that its coefficient of expansion is close, compatibility is better, because being subjected to thermogenetic expansion deformation very approaching, can better realize the sealing function to cooling fluid.
Preferably, all adopt same material to make interior light distributing cap 24, outer light distributing cap 25, lamp socket 26, interior seal cover 28, make that the coefficient of expansion of the two is identical, it is subjected to thermogenetic deformation also identical, and sealing effectiveness is better.
Preferably, because light distributing cap 24, outer light distributing cap 25, lamp socket 26, interior seal cover 28, the identical or close material of use are made in described, can adopt ultrasonic bonding this moment in they threaded connection places each other, each threaded connection place is melt into one, make its better tightness, more be conducive to prevent the seepage of cooling fluid.
In order to prevent that described cooling fluid expanded by heating from causing outer light distributing cap to break, in the sealed cavity 210 of the described bar-shaped LED light fixture of the embodiment of the invention, also can keep a certain size bubble.But the not limited timing in position when described bubble may produce hot spot in range of exposures.The embodiment of the invention four has effectively solved this problem.
With reference to Fig. 7, be the light emitting diode bar shaped light fixture cross sectional view of the embodiment of the invention four.
Among Fig. 7, in described sealed cavity 210, described in light distributing cap 24 below increase baffle plate 214, concrete, described baffle plate 214 be arranged on described in the below of light distributing cap 24 and described substrate holder 23 junctions, with the fixed-site of bubble 213 bottom at sealed cavity 210.Because the below of light distributing cap 24 is not the light out part of LED light fixture in described, does not have light to send from this, makes the existence of described bubble 213 can not produce hot spot.
The below of light distributing cap 24 in baffle plate described in the embodiment of the invention 214 is installed in, described baffle plate 214 constitutes packing less narrow and small zone with described interior light distributing cap 24, makes described bubble 213 be constrained in the described narrow and small zone.Because light does not penetrate from interior light distributing cap 24 belows, so the existence of bubble 213 can not produce hot spot in range of exposures.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be apparent concerning those skilled in the art, and defined General Principle can realize under the situation that does not break away from the spirit or scope of the present invention in other embodiments herein.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the wideest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
1. a led lamp is characterized in that, described light fixture comprises: the substrate light source, substrate holder, interior light distributing cap, outer light distributing cap, the lamp socket that are made of led light source and LED substrate;
Described substrate light source is arranged on described substrate holder top;
Light distributing cap is several fonts in described, and described substrate holder is the door font;
Light distributing cap is arranged on the outside of described substrate holder in described, and the lateral wall of described substrate holder is close to the madial wall of described interior light distributing cap; The top of light distributing cap is a transparent body that matches with described substrate light source in described;
Described outer light distributing cap is arranged on the outside of described interior light distributing cap, and the outer surface of the inner surface of described outer light distributing cap and described interior light distributing cap forms a sealed cavity; Be full of cooling fluid in the described sealed cavity;
The light beam that described led light source sends is transmitted in the cooling fluid by the transparent body on light distributing cap top in described, penetrates by described outer light distributing cap and goes.
2. led lamp according to claim 1 is characterized in that, described substrate holder adopts engage thread closely to be connected with described interior light distributing cap.
3. led lamp according to claim 1 is characterized in that, described substrate holder adopts the slot form closely to be connected with described interior light distributing cap.
4. led lamp according to claim 1 is characterized in that, the described transparent body is a light-distribution lens.
5. led lamp according to claim 1 is characterized in that, described interior light distributing cap adopts identical or close material to make with described outer light distributing cap.
6. led lamp according to claim 5 is characterized in that, ultrasonic bonding is adopted in the junction of described interior light distributing cap and described outer light distributing cap.
7. led lamp according to claim 1 is characterized in that, described substrate holder has high thermal conductivity.
8. led lamp according to claim 1 is characterized in that, between described LED substrate and substrate holder heat-conducting medium is set.
9. led lamp according to claim 8 is characterized in that, described heat-conducting medium is heat-conducting plate or heat conducting coating.
10. led lamp according to claim 1 is characterized in that, in described sealed cavity, described in light distributing cap below set up baffle plate; Described baffle plate and described interior light distributing cap constitute packing less narrow and small zone.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102251932A CN102313160B (en) | 2010-07-08 | 2010-07-08 | Light-emitting diode (LED) lamp |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102251932A CN102313160B (en) | 2010-07-08 | 2010-07-08 | Light-emitting diode (LED) lamp |
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| CN102313160A CN102313160A (en) | 2012-01-11 |
| CN102313160B true CN102313160B (en) | 2013-07-10 |
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| CN2010102251932A Expired - Fee Related CN102313160B (en) | 2010-07-08 | 2010-07-08 | Light-emitting diode (LED) lamp |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102691971A (en) * | 2012-05-31 | 2012-09-26 | 英飞特光电（杭州）有限公司 | LED (light emitting diode) lens |
| CN104132261B (en) * | 2014-04-28 | 2016-02-24 | 上虞市宝之能照明电器有限公司 | A kind of high-efficient heat-dissipating LED lamp |
| CN104110599A (en) * | 2014-07-21 | 2014-10-22 | 福建永德吉灯业股份有限公司 | Led light source |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201892047U (en) * | 2010-07-08 | 2011-07-06 | 艾迪光电（杭州）有限公司 | Light emitting diode lamp |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2004127686A (en) * | 2002-10-02 | 2004-04-22 | Hitachi Lighting Ltd | Bulb shaped fluorescent lamp |
| FR2939183B1 (en) * | 2008-11-28 | 2011-04-15 | Fd Eclairage Architectural | POWER LED DIODE LIGHT SOURCE EQUIPPED WITH FLUID COOLING SYSTEM |
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| CN201892047U (en) * | 2010-07-08 | 2011-07-06 | 艾迪光电（杭州）有限公司 | Light emitting diode lamp |
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| JP特开2004-127686A 2004.04.22 |
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