CN102306648B - Optical coupler - Google Patents
Optical coupler Download PDFInfo
- Publication number
- CN102306648B CN102306648B CN 201110241303 CN201110241303A CN102306648B CN 102306648 B CN102306648 B CN 102306648B CN 201110241303 CN201110241303 CN 201110241303 CN 201110241303 A CN201110241303 A CN 201110241303A CN 102306648 B CN102306648 B CN 102306648B
- Authority
- CN
- China
- Prior art keywords
- lead frame
- end lead
- infrared
- photosensitive
- optical coupler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 20
- 239000011521 glass Substances 0.000 claims abstract description 33
- 238000009413 insulation Methods 0.000 claims abstract description 11
- 239000003292 glue Substances 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 3
- 239000000084 colloidal system Substances 0.000 abstract description 17
- 238000002347 injection Methods 0.000 abstract description 13
- 239000007924 injection Substances 0.000 abstract description 13
- 238000006243 chemical reaction Methods 0.000 abstract description 6
- 230000005693 optoelectronics Effects 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 241000700608 Sagitta Species 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
The invention relates to a photoelectric element, especially to an optical coupler, which is also known as a photoisolator or an optoelectronic coupler or is called an optocoupler for short. According to the invention, a lead frame of an optical coupler falls into an infrared end lead frame and a photosensitive end lead frame; planes of glass sliding areas of the infrared end lead frame and the photosensitive end lead frame are perpendicular to a plane of the lead frame; infrared light emitting elements are installed on the infrared end lead frame and photosensitive elements are installed on the photosensitive end lead frame; the infrared end lead frame and the photosensitive end lead frame are fixed on a same plane and there is an enough insulation distance between the infrared end lead frame and the photosensitive end lead frame; the photosensitive elements directly face the infrared light emitting elements; outer surfaces of the glass sliding areas of the infrared end lead frame and the photosensitive end lead frame are cladded with transparent colloids, which are in ellipse shapes; and the infrared end lead frame, the photosensitive end lead frame and the transparent colloids are wrapped with a packaging shell tube. According to the invention, the optical coupler not only has good insulation and pressure resistant performances that a reflective optocoupler has, but also has a high photoelectric conversion efficiency that a direct-injection optocoupler has; besides, a CTR value is convenient for control.
Description
Technical field
The present invention relates to the photoelectricity element, especially photoelectrical coupler (opticalcoupler, english abbreviation are OC), also claim photoisolator or photoelectrical coupler, or be called for short optocoupler.
Background technology
Optical coupler is to come the device of transmission of electric signals take light as medium, usually photophore (infrarede emitting diode chip) and light-receiving device (photosensor chip) is encapsulated in same shell.Photophore emits beam when input adds the signal of telecommunication, and light-receiving device is accepted just to produce photoelectric current after light, flows out from output, thereby has realized " electricity-light-electricity " conversion.Optocoupler mainly contains two kinds of production methods at present: the one, and reflective, the 2nd, direct-injection type.
Consult shown in Fig. 9 a and Fig. 9 b, reflective is by interior glue, and some transparent adhesive tape and white glues form ellipsoid, makes the infrared light reflection of infrared chip emission to the photosensor chip place, thus complete electricity=light=electric control procedure.This technology mode can be accomplished very high dielectric voltage withstand, but shortcoming is the HFE (current amplification factor of triode) of power, photosensor chip except infrared chip, the factors such as interior some glue shape, height that also increased affect CTR value (the CTR value refers to the minimum value of the current ratio of the electric current of luminous tube and receiving tube), therefore the CTR value is difficult to accurate control, and can't accomplish very high CTR value and very short time parameter.
Consult shown in Figure 10 a and Figure 10 b, direct-injection type is that lead frame is divided into two parts, fill respectively infrared chip and photosensor chip, and then fixed coupling encapsulates together, two lead frame planes are parallel, and the slide glass district of the slide glass district of infrared end lead frame and photosensitive end lead frame is aspectant.This mode does not need to coat white colloid because be direct projection, and CTR is convenient to control, and is convenient to accomplish high CTR value.But owing to being aspectant, count the spun gold sagitta in, the thickness of two chips, the thickness of two lead frames has reached or near 1.5mm, the insulation distance of infrared end and photosensitive end is subject to the restriction of optocoupler height overall, and dielectric voltage withstand can't be accomplished very high; And the required precision to lead frame is very high, and the difficulty that technique realizes is larger.
Summary of the invention
Therefore, the present invention is directed to the weak point of these 2 kinds of optocouplers, and propose a kind of improved optical coupler structure, not only possess the good dielectric voltage withstand performance of conventional reflective optocoupler, simultaneously also possesses Japanese direct-injection type optocoupler photoelectric conversion efficiency high, the advantage that the CTR value is convenient to control.
The technical solution used in the present invention is:
the lead frame of optical coupler is divided into infrared end lead frame and photosensitive end lead frame, the plane in the slide glass district of infrared end lead frame and photosensitive end lead frame is all vertical with lead frame, the slide glass district of infrared end lead frame can be plane or cup-shaped, the slide glass district of photosensitive end lead frame can be plane or cup-shaped, infrared end lead frame installation infrared light-emitting component, photosensitive end lead frame is installed light-sensitive element, infrared end lead frame and photosensitive end lead frame are fixed in same plane, and leave enough insulation distances, and the light-sensitive element light accepting part is over against the infrared light-emitting component setting, then carry out a glue and encapsulation.That is, cover transparent colloid, infrared end lead frame and photosensitive end lead frame outer wrapping one encapsulating package of an elliptical shape outside the slide glass district of infrared end lead frame and photosensitive end lead frame.
Wherein, described infrared end lead frame and photosensitive end lead frame are expert at and are fixed in same plane before a glue and encapsulation, and leave enough insulation distances, and photosensor chip to remain unchanged over against the state of infrared chip setting be to realize by moulds of industrial equipment.
Further, described light-sensitive element can be photistor, photosensitive Darlington transistor, photosensitive thyristor or photosensitive IC chip.
Optical coupler of the present invention is with the difference of existing reflective optocoupler: structurally, existing reflective optocoupler is that infrared light-emitting component and light-sensitive element are contained on same lead frame, then put that transparent colloid forms the ellipsoid shape and at transparent colloid outer cladding white colloid, two photoelectric cells are in respectively two focuses of spheroid, and the infrared light of infrared light-emitting component emission converges to the light-sensitive element light receiving area by the reflection of white colloid.And the present invention is divided into two parts with lead frame, fills respectively infrared light-emitting component and light-sensitive element, and then with two parts lead frame by frock be fixed together a transparent colloid and parcel outer package shell.The present invention structurally, infrared light-emitting component and light-sensitive element over against, therefore the infrared light overwhelming majority all can be transmitted into the light-sensitive element light accepting part, on photoelectric conversion efficiency, all will greatly be better than reflective optocoupler on response speed.And saved white glues colloid shape and highly on the impact of photoelectric conversion efficiency, for photistor output type optocoupler, can improve the controllability of CTR value and to the shelves rate.
Optical coupler of the present invention is with the difference of existing direct-injection type optocoupler: the slide glass district of existing direct-injection type two parts lead frame is parallel with lead frame, after respectively photoelectric cell being installed, two lead frames are fixed by the coupling of frock, place, parallel surface opposite transparent colloid and parcel outer package shell have guaranteed that also light-sensitive element is over against infrared light-emitting component simultaneously.And in the present invention, the slide glass district of two parts lead frame is vertical with lead frame, and cup-shaped can be made by the slide glass district of two parts lead frame.After respectively photoelectric cell being installed, utilize frock that two parts lead frame is fixed in same plane and light-sensitive element over against infrared light-emitting component (perpendicular to the fixed pan of lead frame) some transparent colloid and parcel outer package shell.The present invention plays the effect of optically focused owing to can doing the design of a cup-shaped in the slide glass district of two parts lead frame more, and therefore more Japanese direct-injection type optocoupler can be higher on the infrared light efficiency of transmission; The present invention can be by the adjustment of lead frame, regulate the insulation distance between two parts, the dielectric voltage withstand value can be accomplished very high, and Japanese direct-injection type optocoupler is due to the restriction that is subject to space (optocoupler height overall), and the dielectric voltage withstand value can't be accomplished very high (especially for miniature optocoupler); Japanese direct-injection type is due to the overlapping coupling that exists between two parts lead frame on level, therefore to the precision of lead frame, the requirement of technique is all higher, and two parts lead frame of the present invention is only to be placed in same Plane-point transparent colloid and parcel outer package shell, do not have each other overlapping coupling, therefore in the lead frame required precision, technique realizes on difficulty all lower than Japanese direct-injection type optocoupler.
To sum up, optical coupler of the present invention not only possesses the good dielectric voltage withstand performance of reflective optocoupler, also possesses direct-injection type optocoupler photoelectric conversion efficiency simultaneously high, the advantage that the CTR value is convenient to control.
Description of drawings
Fig. 1 is the structural representation of photosensitive end lead frame.
Fig. 2 is the structural representation of infrared end lead frame.
Fig. 3 is a pair of photosensitive end lead frame and infrared end lead frame position fixed relationship schematic diagram.
Fig. 4 is the upward view of the photosensitive end lead frame in Fig. 3.
Fig. 5 is the vertical view of the infrared end lead frame in Fig. 3.
Fig. 6 is the schematic diagram that a pair of photosensitive end lead frame and infrared end lead frame are installed photoelectric cell.
Fig. 7 is the schematic diagram of a pair of photosensitive end lead frame and infrared end lead frame point transparent colloid and parcel outer package shell.
Fig. 8 is the left view of Fig. 7.
Fig. 9 a is the structural representation of existing reflective optocoupler.
The rear cutaway view along A-A of existing reflective optocoupler encapsulation of Fig. 9 b.
Figure 10 a is the structural representation of existing direct-injection type optocoupler.
The rear cutaway view along A-A of existing direct-injection type optocoupler encapsulation of Figure 10 b.
Embodiment
Now the present invention is further described with embodiment by reference to the accompanying drawings.Although the slide glass district of the slide glass district of infrared end lead frame and photosensitive end lead frame all can be cup-shaped or plane in claim of the present invention, but following example is only take the slide glass district of infrared end lead frame as cup-shaped, and the slide glass district of photosensitive end lead frame is that the plane describes.
Consult illustrated in figures 1 and 2, the lead frame of optical coupler is divided into infrared end lead frame 2 and photosensitive end lead frame 1, a plurality of infrared end lead frame unit or photosensitive end lead frame unit group infrared end lead frame in a row or photosensitive end lead frame rush the lead frame pin again and are separated into the independent entry device after encapsulation manufacturing is completed.
For the convenience that illustrates, the following examples only illustrate with a pair of photosensitive end lead frame and infrared end lead frame.
Consult Fig. 3, shown in Figure 4, the plane in the slide glass district 11 of photosensitive end lead frame 1 is all vertical with the plane of its pin 12, and the slide glass district 11 of photosensitive end lead frame 1 is the plane.Consult Fig. 3, shown in Figure 5, the plane in the slide glass district 21 of infrared end lead frame 2 is all vertical with the plane of its pin 22, and the slide glass district 21 of infrared end lead frame 2 is structures of cup-shaped.
Consult shown in Figure 6ly, then at photosensitive end lead frame and infrared end lead frame, photoelectric cell is installed respectively, in the slide glass district 11 of photosensitive end lead frame 1, light-sensitive elements 3 are installed, at the slide glass district of infrared end lead frame 2 21 installation infrared light-emitting components 4.Described light-sensitive element 3 can be photistor, photosensitive Darlington transistor, photosensitive thyristor or photosensitive IC chip.Described infrared light-emitting component 4 can be the infrared LED chip.
consult Fig. 7 and shown in Figure 8, infrared end lead frame 2 and photosensitive end lead frame 1 are fixed in same plane, and leave enough insulation distances, the slide glass district 21 that namely guarantees the slide glass district 11 of photosensitive end lead frame 1 and infrared end lead frame 2 has an insulation distance, and the slide glass district 21 of the slide glass district 11 of photosensitive end lead frame 1 and infrared end lead frame 2 is right opposite settings, thereby realize that light-sensitive element 3 arranges over against infrared light-emitting component 4, then put again transparent colloid and parcel outer package shell, it is the transparent colloid 5 of null ellipse shape, and with encapsulating package 6, they all are encapsulated in inside.In order to guarantee that described infrared end lead frame 2 and photosensitive end lead frame 1 are fixed in same plane before a transparent colloid and parcel outer package shell, and leave enough insulation distances, and light-sensitive element remains unchanged over against the state of infrared light-emitting component setting, realize by moulds of industrial equipment in operation, the corresponding lead frame groove that infrared end lead frame 2 and photosensitive end lead frame 1 is positioned over moulds of industrial equipment gets final product.About the structure of the moulds of industrial equipment of anchor leg framework, be the skilled technological means of grasping of those skilled in the art, launch no longer in detail explanation for the moulds of industrial equipment structure.Like this, by fixing stability and the consistency that can improve infrared end lead frame 2 and photosensitive end lead frame 1 stationary state of moulds of industrial equipment, than manual operation, improve and make efficient.
Like this, when electric current passes through the infrared light-emitting component 4 of optical coupler of the present invention, infrared light-emitting component 4 emission infrared lights, focussing force through the cup-like structure in the slide glass district 21 of infrared end lead frame 2, infrared light substantially converge to over against the plane in slide glass district 11 of photosensitive end lead frame 1 on the light accepting part of light-sensitive element 3, make light-sensitive element 3 enter operating state.
Although specifically show and introduced the present invention in conjunction with preferred embodiment; but the those skilled in the art should be understood that; within not breaking away from the spirit and scope of the present invention that appended claims limits; can make a variety of changes the present invention in the form and details, be protection scope of the present invention.
Claims (6)
1. optical coupler, it is characterized in that: the lead frame of optical coupler is divided into infrared end lead frame and photosensitive end lead frame, and the plane in the slide glass district of infrared end lead frame and photosensitive end lead frame is all vertical with lead frame; The slide glass district installation infrared light-emitting component of infrared end lead frame, light-sensitive element is installed in the slide glass district of photosensitive end lead frame; Infrared end lead frame and photosensitive end lead frame are fixed in same plane, and leave enough insulation distances, and light-sensitive element then carries out a glue and encapsulation over against infrared chip setting.
2. optical coupler according to claim 1 is characterized in that: the slide glass district of described infrared end lead frame is cup-shaped or plane.
3. optical coupler according to claim 1 is characterized in that: the slide glass district of described photosensitive end lead frame is cup-shaped or plane.
4. according to claim 1 and 2 or 3 described optical couplers, it is characterized in that: described light-sensitive element is photistor, photosensitive thyristor or photosensitive IC chip.
5. optical coupler according to claim 4, it is characterized in that: described photistor is photosensitive Darlington transistor.
6. optical coupler according to claim 1, it is characterized in that: described infrared end lead frame and photosensitive end lead frame be expert at a glue and the encapsulation before be fixed in same plane, and leave enough insulation distances, and photosensor chip to remain unchanged over against the state of infrared chip setting be to realize by moulds of industrial equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110241303 CN102306648B (en) | 2011-08-22 | 2011-08-22 | Optical coupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110241303 CN102306648B (en) | 2011-08-22 | 2011-08-22 | Optical coupler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102306648A CN102306648A (en) | 2012-01-04 |
| CN102306648B true CN102306648B (en) | 2013-05-15 |
Family
ID=45380483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110241303 Active CN102306648B (en) | 2011-08-22 | 2011-08-22 | Optical coupler |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102306648B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103730456B (en) * | 2014-01-07 | 2017-02-08 | 苏州承源光电科技有限公司 | High-pressure-resistant photoelectric coupler |
| CN107370484B (en) * | 2017-06-26 | 2020-06-09 | 西安微电子技术研究所 | Transmission ratio adjusting method for infrared photoelectric coupler |
| CN108155106A (en) * | 2017-12-22 | 2018-06-12 | 珠海市大鹏电子科技有限公司 | A kind of length climbs the preparation process of electric light electric coupler |
| CN109301028B (en) * | 2018-09-20 | 2020-01-31 | 西安微电子技术研究所 | Manufacturing method of plastic-sealed photoelectric couplers molded for times |
| CN112397495B (en) * | 2020-11-18 | 2023-11-07 | 珠海市大鹏电子科技有限公司 | High-sensitivity miniaturized photoelectric coupler and high-sensitivity processing method thereof |
| CN114141760A (en) * | 2022-01-06 | 2022-03-04 | 北京华芯微半导体有限公司 | Soft package photoelectric coupler method and soft package photoelectric coupler |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101582420A (en) * | 2009-06-26 | 2009-11-18 | 哈尔滨海格科技发展有限责任公司 | Focusing infrared receiver with built-in reflective cup |
| CN201549509U (en) * | 2009-06-26 | 2010-08-11 | 哈尔滨海格科技发展有限责任公司 | Focusing infrared receiver with internal reflective cup |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3742211B2 (en) * | 1998-02-09 | 2006-02-01 | シャープ株式会社 | Mold and marking method for semiconductor device |
| US6913400B2 (en) * | 2000-11-03 | 2005-07-05 | Tyco Electronics Corporation | Optoelectric module for multi-fiber arrays |
-
2011
- 2011-08-22 CN CN 201110241303 patent/CN102306648B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101582420A (en) * | 2009-06-26 | 2009-11-18 | 哈尔滨海格科技发展有限责任公司 | Focusing infrared receiver with built-in reflective cup |
| CN201549509U (en) * | 2009-06-26 | 2010-08-11 | 哈尔滨海格科技发展有限责任公司 | Focusing infrared receiver with internal reflective cup |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102306648A (en) | 2012-01-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102306648B (en) | Optical coupler | |
| CN104601244B (en) | A kind of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit | |
| US4851695A (en) | Optoelectronic coupling element with transparent spacer elements | |
| CN103250249B (en) | Opto-electronic semiconductor module, for the manufacture of the method for described device and the application of this kind of device | |
| CN201812067U (en) | Single optical fiber bidirectional light receiving-transmitting assembly for OLT (optical line terminal) | |
| CN104126137A (en) | Apparatus and method for optical communications | |
| US9209338B2 (en) | Optical device with through-hole cavity | |
| CN106409822A (en) | Optical coupling device | |
| US20160276327A1 (en) | Photocoupler package | |
| CN108091613B (en) | Method for adjusting amplification power of photoelectric coupler | |
| CN103633551B (en) | The individual laser package method of light network on sheet | |
| CN107462956B (en) | Light-receiving secondary module and optical module | |
| CN107315229B (en) | Integrated encapsulation structure and technique for making integrated encapsulation structure | |
| JP2003008065A (en) | Method for manufacturing smd type optical element module | |
| CN107871789A (en) | Transmitting-receiving integrated optical-electrical converter | |
| US20140119691A1 (en) | Opto-coupler with light guide | |
| CN202275831U (en) | Photo coupler | |
| CN114460698B (en) | Light emitting module | |
| CN110515166A (en) | A kind of lens fixing device | |
| CN205899084U (en) | Mix integrated multi -wavelength emission of light subassembly | |
| CN202018965U (en) | Coupler with light-emitting diode (LED) and photoresistor | |
| JP2013065717A (en) | Semiconductor device and manufacturing method of the same | |
| CN205176331U (en) | Light wavelength devision multiplex separates multiplexing encapsulation subassembly | |
| CN207558792U (en) | Block the photoelectrical coupler encapsulating structure of ambient light interference | |
| JP2013098381A (en) | Optical coupling element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 361000 Fujian Province, Xiamen torch hi tech Industrial Development Zone Hualian electronic building Patentee after: XIAMEN HUALIAN ELECTRONICS Corp.,Ltd. Address before: 361000 Fujian Province, Xiamen torch hi tech Industrial Development Zone Hualian electronic building Patentee before: XIAMEN HUALIAN ELECTRONICS Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231109 Address after: Room 208-93, Hengye Building, No. 100 Xiangxing Road, Xiang'an Industrial Zone, Xiamen Torch High tech Zone, Xiamen, Fujian Province, 361000 Patentee after: Xiamen Hualian Semiconductor Technology Co.,Ltd. Address before: 361000 Hualian electronic building, torch hi tech Industrial Development Zone, Fujian, Xiamen Patentee before: XIAMEN HUALIAN ELECTRONICS Corp.,Ltd. |