CN102304733B - High-temperature-resistant bright tin-plating stabilizing agent - Google Patents
High-temperature-resistant bright tin-plating stabilizing agent Download PDFInfo
- Publication number
- CN102304733B CN102304733B CN 201110241599 CN201110241599A CN102304733B CN 102304733 B CN102304733 B CN 102304733B CN 201110241599 CN201110241599 CN 201110241599 CN 201110241599 A CN201110241599 A CN 201110241599A CN 102304733 B CN102304733 B CN 102304733B
- Authority
- CN
- China
- Prior art keywords
- grams
- temperature
- substance
- plating
- stabilizing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The invention relates to a plating additive, in particular to a high-temperature-resistant bright tin-plating stabilizing agent. The high-temperature-resistant bright tin-plating stabilizing agent is a mixed solution consisting of a substance A of a structural formula shown in the specification, a substance B of a structural formula shown in the specification, sodium tungstate and aluminium potassium sulfate, wherein in the substance A, R1 and R2 are H, -OH or -CH2OH, n is 10 to 15, and R1 and R2 are the same or different; in the substance B, R1 is O, R2 is -CnH2nOh and n is an integer; and 1,000 milliliters of the mixed solution comprises 10 to 30 grams of the aluminium potassium sulfate, 5 to 20 grams of the sodium tungstate, 3.0 to 10 grams of the substance A and 5 to 15 grams of the substance B. The high-temperature-resistant bright tin-plating stabilizing agent can inhibit oxidation of Sn<2+>, has good stabilizing effect on the Sn<2+>, has strong reducing effect on Sn<4+>, can effectively reduce the Sn<4+> existing in the solution into the Sn<2+>, has the coagulation sedimentation function on suspended substances in the solution, and guarantees long-term transparency of the solution.
Description
Technical field
The present invention relates to a kind of electroplating additive, specifically a kind of high-temperature-resistant bright tin-plating stabilizing agent.
Background technology
In electronic industry, very strict to the requirement of bright tin plating, should satisfy not only that conventional bonding force is good, outside careful smooth, the many requirements such as fragility is low, solderability is good of crystallization, also require coating Wuxi palpus, without leak source, pin hole, pit; Plating bath also answer sedimentation velocity fast, can adapt under the higher temperature condition and work.
Present bright tin plating mainly is vitriol---sulfuric acid liquid technique.Its feature is that composition is simple, and sedimentation velocity is fast, and is easy to operate, with low cost, and the coating of gained can satisfy above-mentioned requirements substantially.But weak point is that the temperature that plating bath adapts to is lower, generally can only between 15-25 ℃, surpass 30 ℃ of then easy muddiness of solution, precipitation, Sn
4+Very easily produce, and produce Deposit appearance thereupon and present vaporific, greyness and pin hole, pit are arranged, even have whisker to produce.This will bring great harm to microelectronic circuits.
In vitriol or the zinc-plated process of muriatic Bivalent Tin, since raw material bring into and anode on electrochemical anodic oxidation, cause that the tetravalent tin ion accumulates more and more in the solution, after arriving certain concentration, will cause that the cathodic current effect descends, solution dispersibility is poor, coating is coarse and have tin must generation etc. problems.Use the sulfuric acid of higher concentration in the technique therefore be everlasting, to alleviating this phenomenon.Yet sulfuric acid concentration is too high, causes plating bath very easily to heat up, and secondly safety in production is brought again larger hidden danger, and can not effectively suppress stannic generation again.
In view of the foregoing, the present invention has studied and has been adapted at wider, higher temperature range light plating Sn stablizer.
Summary of the invention
Purpose of the present invention is exactly the defective for existing bright tin plating technique, and a kind of high-temperature-resistant bright tin-plating stabilizing agent is provided.The present invention can not only suppress Sn
2+Oxidation, to Sn
2+The satisfactory stability effect is arranged, also to Sn
4+Stronger reductive action is arranged, can be with already present Sn in the solution
4+Effectively be reduced to Sn
2+
This bright being achieved through the following technical solutions: it is to be by structural formula
A material, structural formula be
B material, sodium wolframate and the mixing solutions that forms of potassium aluminium sulfate, wherein R in the A material
1, R
2For H ,-OH or-CH
2OH, n=10～15, R
1, R
2Identical or different; R in the B material wherein
1Be O, R
2For-C
nH
2nOH, the n integer; Sulfur acid aluminium potassium 10～30 grams, sodium wolframate 5～20 grams, A material 3.0-10 gram, B material 5-15 gram in 1000 milliliters of mixing solutionss.
The present invention preferably technical scheme is: described A material is polyvinyl alcohol 1000, polyvinyl alcohol 1200 or polyvinyl alcohol 20000.Described B material is xitix, glucose or saccharan.
The better technical scheme of the present invention is: sulfur acid aluminium potassium 15～25 grams, sodium wolframate 10～15 grams, A material 3.0-5.0 gram, B material 7.5-10 gram in 1000 milliliters of mixing solutionss.More preferably potassium aluminium sulfate 20 sodium wolframates 15 grams, A material 4, B material 6.Under this conditions of mixture ratios, the stabilising effect of stablizer is better.
The present invention uses the electrochemistry survey technology, and the electrochemistry cyclic voltammetric behavior that records at the Pt electrode shows: stablizer is to restraining Sn
2+Oxidation, stable plating bath has very significantly effect.The result of same basic solution actual contrast under the condition of same period, same temperature is shown there is not the solution of stablizer, leave standstill and put 5-7 days, turbid phenomenon just occurs; The solution that has added stablizer then just occurs muddy after 3-4 week.When actually operating is produced, only need in time add stablizer, more can keep long-term stable, transparent of plating bath.It can not only suppress Sn
2+Oxidation, to Sn
2+The satisfactory stability effect is arranged, also to Sn
4+Stronger reductive action is arranged, can be with already present Sn in the solution
4+Effectively be reduced to Sn
2+And can the coagulative precipitation function be arranged to the floating outstanding thing in the solution, guaranteed the transparent for a long time of solution.
Embodiment
Below in conjunction with embodiment the present invention is described further:
Embodiment 1
To prepare 1000 milliliters as example, preparation method of the present invention is:
1, take by weighing 15 gram potassium aluminium sulfates, 10 gram sodium wolframates, insert in 600 milliliters the water, heating for dissolving obtains potassium aluminium sulfate and sodium wolframate mixing solutions;
2, take by weighing 3.0 gram polyvinyl alcohol 1200 and join in the above-mentioned mixing solutions stirring and dissolving;
3, add again 7.5 gram xitix and join in the mentioned solution, stir dissolving; Add water and be supplemented to 1000 milliliters.
Embodiment 2
To prepare 1000 milliliters as example, preparation method of the present invention is:
1, take by weighing 20 gram potassium aluminium sulfates, 15 gram sodium wolframates, insert in 600 milliliters the water, heating for dissolving obtains potassium aluminium sulfate and sodium wolframate mixing solutions;
2, take by weighing 4 gram polyvinyl alcohol 1200 and join in the above-mentioned mixing solutions stirring and dissolving;
3, add again 6 gram glucose and join in the mentioned solution, stir dissolving; Add water and be supplemented to 1000 milliliters.
Embodiment 3
To prepare 1000 milliliters as example, preparation method of the present invention is:
1, take by weighing 30 gram potassium aluminium sulfates, 20 gram sodium wolframates, insert in 600 milliliters the water, heating for dissolving obtains potassium aluminium sulfate and sodium wolframate mixing solutions;
2, take by weighing 10 gram polyvinyl alcohol 20000 and join in the above-mentioned mixing solutions stirring and dissolving;
3, add again 15 gram saccharans and join in the mentioned solution, stir dissolving; Add water and be supplemented to 1000 milliliters.
Embodiment 4
To prepare 1000 milliliters as example, preparation method of the present invention is:
1, take by weighing 15 gram potassium aluminium sulfates, 15 gram sodium wolframates, insert in 600 milliliters the water, heating for dissolving obtains potassium aluminium sulfate and sodium wolframate mixing solutions;
2, take by weighing 5 gram polyvinyl alcohol 20000 and join in the above-mentioned mixing solutions stirring and dissolving;
3, add again 5 gram saccharans and join in the mentioned solution, stir dissolving; Add water and be supplemented to 1000 milliliters.
Claims (2)
1. high-temperature-resistant bright tin-plating stabilizing agent, the mixing solutions that it is comprised of polyvinyl alcohol, antioxidant, sodium wolframate and potassium aluminium sulfate, sulfur acid aluminium potassium 10 ~ 30 grams, sodium wolframate 5 ~ 20 grams, polyvinyl alcohol 3.0-10 gram, antioxidant 5-15 gram in 1000 milliliters of mixing solutionss, described polyvinyl alcohol is polyvinyl alcohol 1000, polyvinyl alcohol 1200 or polyvinyl alcohol 20000, and described antioxidant is xitix, glucose or saccharan.
2. a kind of high-temperature-resistant bright tin-plating stabilizing agent according to claim 1 is characterized in that: sulfur acid aluminium potassium 15 ~ 25 grams, sodium wolframate 10 ~ 15 grams, polyvinyl alcohol 3.0-5.0 gram, antioxidant 7.5-10 gram in 1000 milliliters of mixing solutionss.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110241599 CN102304733B (en) | 2011-08-22 | 2011-08-22 | High-temperature-resistant bright tin-plating stabilizing agent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110241599 CN102304733B (en) | 2011-08-22 | 2011-08-22 | High-temperature-resistant bright tin-plating stabilizing agent |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102304733A CN102304733A (en) | 2012-01-04 |
| CN102304733B true CN102304733B (en) | 2013-04-17 |
Family
ID=45378644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110241599 Expired - Fee Related CN102304733B (en) | 2011-08-22 | 2011-08-22 | High-temperature-resistant bright tin-plating stabilizing agent |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102304733B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1385556A (en) * | 2002-01-23 | 2002-12-18 | 武汉大学 | Stabilizer for plating tin-bismuth alloy and preparation method thereof |
| US20090236232A1 (en) * | 2008-03-24 | 2009-09-24 | Fujitsu Limited | Electrolytic plating solution, electrolytic plating method, and method for manufacturing semiconductor device |
| CN101922026A (en) * | 2010-08-18 | 2010-12-22 | 济南德锡科技有限公司 | Methanesulfonic acid-based matte pure tin electroplating solution and additive thereof |
| CN101962790A (en) * | 2010-08-20 | 2011-02-02 | 河南科技大学 | Electrolyte composition for half bright acid tinning |
-
2011
- 2011-08-22 CN CN 201110241599 patent/CN102304733B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1385556A (en) * | 2002-01-23 | 2002-12-18 | 武汉大学 | Stabilizer for plating tin-bismuth alloy and preparation method thereof |
| US20090236232A1 (en) * | 2008-03-24 | 2009-09-24 | Fujitsu Limited | Electrolytic plating solution, electrolytic plating method, and method for manufacturing semiconductor device |
| CN101922026A (en) * | 2010-08-18 | 2010-12-22 | 济南德锡科技有限公司 | Methanesulfonic acid-based matte pure tin electroplating solution and additive thereof |
| CN101962790A (en) * | 2010-08-20 | 2011-02-02 | 河南科技大学 | Electrolyte composition for half bright acid tinning |
Non-Patent Citations (2)
| Title |
|---|
| 尹国光 等.硫酸盐电镀锡添加剂的探讨.《材料保护》.2011,第44卷(第6期),1-4. |
| 硫酸盐电镀锡添加剂的探讨;尹国光 等;《材料保护》;20110630;第44卷(第6期);1-4 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102304733A (en) | 2012-01-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102758228B (en) | A kind of sulfonic acid type semi-bright Pure Tin Plating Process liquid | |
| CN102162110B (en) | Methyl sulfonate tinning electrolyte and tinning method of steel strip or steel plate | |
| CN102277601B (en) | Cyanogen-free silver-plating electroplating liquid containing auxiliary complexing agent | |
| CN101922026B (en) | Methanesulfonic acid-based matte pure tin electroplating solution and additive thereof | |
| CN100469942C (en) | Electroplating solution containing organic acid complexing agent | |
| US9228269B2 (en) | Tin alloy plating solution | |
| CN101838828B (en) | Cyanogen-less gold plating solution | |
| EP3030698B1 (en) | Electrolyte for the electrolytic deposition of silver-palladium alloys and method for deposition thereof | |
| CN104109885A (en) | Weak-alkalinity pyrophosphate solution and technology for electroplating bright tin | |
| CN108866583A (en) | Tin or tin-lead alloy plating solution applied to leadless electronic component, and preparation method and plating method thereof | |
| CN109666954A (en) | A kind of tin plating additive and preparation method thereof | |
| TWI681084B (en) | Tin alloy plating solution | |
| CN102304733B (en) | High-temperature-resistant bright tin-plating stabilizing agent | |
| CN105063680A (en) | Sulfonic acid type semi-bright pure-tin electroplating liquid | |
| CN111321435A (en) | Acidic tin electroplating solution and preparation method and application thereof | |
| WO2022170803A1 (en) | Electroplating solution for steel substrate direct cyanide-free plating under strong acidic conditions, and preparation method therefor | |
| JP2012126951A (en) | Nickel plating liquid and nickel plating method | |
| CN103173786B (en) | A kind of environment-friendly high-efficiency produces the method for electrolytic metal Mn | |
| Ding et al. | Effects of four N-based additives on imitation gold plating | |
| CN102732918B (en) | A kind of gold-tin eutectic solder (AuSn20) electroplate liquid and preparation method | |
| CN102212852A (en) | Zinc-plating additive and preparation method thereof | |
| CN114108031B (en) | Environment-friendly cyanide-free alkaline copper plating refiner and preparation method thereof | |
| CN112095127A (en) | Neutral tin additive and preparation method and application thereof | |
| CN103469263B (en) | Electroplating deposition prepares the method for nanocrystalline structure silver tin alloy coat | |
| CN107642413A (en) | Idle pulley mounting assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130417 Termination date: 20210822 |