CN102301435B

CN102301435B - Substrate Inductive Devices And Methods

Info

Publication number: CN102301435B
Application number: CN200980128651.6A
Authority: CN
Inventors: C·P·谢弗; A·J·格特瑞茨; A·W·林德纳
Original assignee: Pulse Electronics Singapore Pte Ltd
Current assignee: Pulse Electronics Singapore Pte Ltd
Priority date: 2009-07-15
Filing date: 2009-08-24
Publication date: 2014-12-24
Anticipated expiration: 2029-08-24
Also published as: CN102301435A

Abstract

The invention reveals methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive devxce comprises a plurality of vias having extended ends (106) which replace windings disposed around a magnetically permeable core (110). In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed.

Description

Substrate inductance device and method

Priority and related application

This application claims the priority of the u.s. patent application serial number 12/503682 of that apply on July 15th, 2009, that there is same names jointly all and CO-PENDING, and this u.s. patent application serial number 12/503682 requires the priority of jointly all U.S. Provisional Patent Application sequence numbers 61/135243 that apply on July 17th, 2008, that have same names, each full content quoting these patents above-mentioned is here for reference.The application also relate to application on November 13rd, 2007, name is called the CO-PENDING of " WIRE-LESS INDUCTIVE DEVICES AND METHODS (radio induction device and method) " and jointly all u.s. patent application serial numbers 11/985156, and this u.s. patent application serial number 11/985156 requires the priority of jointly all United States Patent (USP) Provisional Application serial number 60/859120 that apply on November 14th, 2006, that have same names, quote foregoing each entirety by reference here.

Copyright

A part for the disclosure of patent document comprises material protected by copyright.When the copy that any one by patent document or this patent disclosure is made copies in present patent and trademark office patent file or record, copyright owner has no objection to it, but still retains all copyrights in other any situation.

Technical field

The present invention relates generally to circuit unit, particularly relate in an illustrative aspects and there is various expectation electrically and/or the inductor of engineering properties or inductance device, and utilize and manufacture its method.

Background technology

The countless different structures of known electric sensor and inductance device in the prior art.A kind of common approach manufacturing efficient electric sensor and inductance device uses magnetic to penetrate toroidal core.Toroidal core is very effective in the magnetic flux keeping the inductance device be limited in magnetic core itself.Usually, the one or more magnet wire winding of these magnetic cores (annular or other than ring type) is wound around, and forms inductor or inductance device thus.

The inductor of prior art and the example of inductance device have various shape and manufacture configuration perhaps.Such as, be illustrated in the U.S. Patent number 3614554 authorizing the people such as Shield issued on October 19th, 1971, its name is called " Miniaturized Thin Film Inductors for use in Integrated Circuits (the miniature thin-film inductor for integrated circuit) "; In the U.S. Patent number 4253231 authorizing Nouet that on March 3rd, 1981 is issued, its name is called " Method of making an inductive circuit incorporated in a planar circuit support member (manufacture is integrated into the method for the inductive circuit in planar circuit supporting component) "; In the U.S. Patent number 4547961 authorizing the people such as Bokil that on October 22nd, 1985 is issued, its name is called " Method of manufacture of miniaturized transformer (manufacturing the method for miniature transformer) "; In the U.S. Patent number 4847986 authorizing Meinel that on July 18th, 1989 is issued, its name is called " Method of making square toroid transformer for hybrid integrated circuit (manufacturing the method for the square toroidal transformer being used for hybrid integrated circuit) "; In the U.S. Patent number 5055816 authorizing the people such as Altman that on October 8th, 1991 is issued, its name is called " Method for fabricating an electronic device (method for the manufacture of electronic installation) "; In the U.S. Patent number 5126714 authorizing Johnson that on June 30th, 1992 is issued, its name is called " Integrated circuit transformer (integrated circuit transformer) "; In the U.S. Patent number 5257000 authorizing the people such as Billings that on October 26th, 1993 is issued, its name is called " Circuit elements dependent on core inductance and fabrication thereof (relying on circuit unit and the manufacture thereof of core inductance) "; In the U.S. Patent number 5487214 authorizing Walters that on January 30th, 1996 is issued, its name is called " Method of making a monolithic magnetic device with printed circuit interconnections (manufacture has the method for the monolithic magnetic devices of printed circuit interconnects) "; In the U.S. Patent number 5781091 authorizing the people such as Krone that on July 14th, 1998 is issued, its name is called " Electronic inductive device and method for manufacturing (electronic inductance device and manufacture method) "; In the U.S. Patent number 6440750 authorizing the people such as Feygenson that on August 27th, 2002 is issued, its name is called " Method of making integrated circuit having a micromagnetic device (manufacture has the method for the integrated circuit of micro-magnetic device) "; In the U.S. Patent number 6445271 authorizing Johnson that on September 3rd, 2002 is issued, its name is called " Three-dimensional micro-coils in planar substrates (the micro-magnetic core of the three-dimensional on planar substrates) "; In the U.S. Patent Publication No. 20060176139 belonging to Pleskach that on August 10th, 2006 announces, its name is called " Embedded toroidal inductor (embedded toroidal inductor) "; In the U.S. Patent Publication No. 20060290457 belonging to the people such as Lee that on December 28th, 2006 announces, its name is called " Inductor embedded in substrate; manufacturing method thereof; micro device package; and manufacturing method of cap for micro device package (embed the inductor in substrate and manufacture method thereof; microdevice encapsulates, and for the manufacture method of the cap body of microdevice encapsulation) "; In the U.S. Patent Publication No. 20070001796 belonging to the people such as Waffenschmidt that on January 4th, 2007 announces, its name is called " Printed circuit board with integrated inductor (having the printed circuit board (PCB) of integrated inductor) "; And in the U.S. Patent Publication No. 20070216510 belonging to the people such as Jeong of announcement on September 20th, 2007, its name is called " Inductor and method of forming the same (inductor and manufacture method thereof) ".

But, although the kind of the inductor configuration of prior art is varied, in following two, all there is outstanding request to inductance device: (1) low cost of manufacture; (2) electrical property of the improvement being better than prior-art devices is provided.Ideally, such solution provides the electrical property of low-down manufacturing cost and improvement by being not only only inductor or inductance device, but also the higher consistency be provided between the device producing manufacture in batches, that is, high performance consistency and reliability is put forward by the possibility of restriction generation device error.

Summary of the invention

In a first aspect of the present invention, disclose a kind of wireless annular inductance device of improvement.In one embodiment, this inductance device comprises multiple path with elongated end, and these paths are used as the part penetrating the winding arranged around magnetic core in magnetic.Then print the track be positioned on the conductive layer of substrate, thus complete winding.In another embodiment, wireless annular inductance device is from lead-in wire.In another embodiment, aforementioned inductance device is provided for the installation site of electronic unit.

In another embodiment, this radio induction device comprises: multiple substrate, and described substrate has one or more winding formed thereon; And one magnetic penetrate magnetic core, this magnetic core is arranged between multiple printable substrate at least partly.

In a second aspect of the present invention, disclose the manufacture method of above-mentioned inductance device.

In a third aspect of the present invention, disclose a kind of electronic building brick and the circuit that comprise wireless annular inductance device.

In a fourth aspect of the present invention, disclose a kind of wireless other than ring type inductance device of improvement.In one embodiment, this other than ring type inductance device comprises multiple path with elongated end, and these paths are used as the part penetrating the winding arranged around magnetic core in magnetic.Then print the printing winding be positioned on the conductive layer of substrate, thus complete this winding.In another embodiment, this inductance device comprises multiple connection plug-in unit, and they are used as to penetrate in magnetic the part winding arranged around magnetic core.In another embodiment, this wireless other than ring type inductance device is from lead-in wire.In another embodiment, aforementioned inductance device is provided for the installation site of electronic unit.

In a fifth aspect of the present invention, disclose a kind of method manufacturing aforementioned other than ring type inductance device.In one embodiment, the method comprises: be set to by winding material on the first and second substrate magnetic heads; Magnetic core is at least partially disposed between the first and second magnetic heads; Combine with by the first and second magnetic heads, thus form described radio induction device.

In a sixth aspect of the present invention, disclose a kind of electronic building brick and the circuit that comprise wireless other than ring type inductor.

In a seventh aspect of the present invention, disclose the ring-shaped inductors device of a kind of part wiring.In one embodiment, this inductance device comprises multiple path with elongated end, and these paths act synergistically with wiring core center, penetrate to be formed in magnetic the part winding arranged around magnetic core.Then print the track be positioned on the conductive layer of substrate, thus complete winding.In another embodiment, the ring-shaped inductors device of part wiring is from lead-in wire.In another embodiment, aforementioned inductance device is provided for the installation site of electronic unit.

In another embodiment, the inductance device of this part wiring comprises: multiple substrate, and described substrate has one or more winding formed thereon; And one magnetic penetrate magnetic core, this magnetic core be at least partially disposed on multiple can between printed base plate.

In a eighth aspect of the present invention, disclose a kind of method manufacturing the inductance device of preceding sections wiring.

In a ninth aspect of the present invention, disclose a kind of method manufacturing aforementioned wiring core center.

In a tenth aspect of the present invention, disclose a kind of electronic building brick and the circuit that comprise the ring-shaped inductors device of part wiring.

In a eleventh aspect of the present invention, disclose a kind of other than ring type inductance device of part wiring of improvement.In one embodiment, this other than ring type inductance device comprises multiple path with elongated end, and these paths are used as to penetrate in magnetic a part of winding arranged around magnetic core.Then print the printing winding be positioned on the conductive layer of substrate, thus complete this winding.In another embodiment, this inductance device comprises multiple path with elongated end, and these paths act synergistically with wiring core center, are formed in magnetic and penetrate the part winding arranged around magnetic core.In another embodiment, the other than ring type inductance device of this part wiring is from lead-in wire.In another embodiment, aforementioned inductance device is provided for the installation site of electronic unit.

Accompanying drawing explanation

By making features, objects and advantages of the invention be easier to understand below in conjunction with the detailed description of accompanying drawing, wherein:

Fig. 1 is the perspective exploded view of the first embodiment of the wireless annular inductance device represented according to principle of the present invention.

Fig. 1 a is the perspective view of the elongated end path winding of the bottom magnetic head of the inductance device representing Fig. 1.

Fig. 1 b is the perspective view of the second configuration of the elongated end path winding of the bottom magnetic head of the inductance device represented for Fig. 1.

Fig. 1 c is the perspective view of the position of toroidal core in the chamber of the bottom magnetic head of the inductance device representing Fig. 1.

Fig. 1 d is the perspective view of the power path of the winding of the inductance device representing connection layout 1.

Fig. 1 e is the top magnetic head of the inductance device representing Fig. 1 and the end view of bottom magnetic head.

Fig. 1 f is the perspective view of the example winding of the toroidal core of the inductance device represented around Fig. 1.

Fig. 1 g is the perspective view of the wireless many ring-shaped inductors device represented according to principle of the present invention.

Fig. 1 h is the perspective view of the top magnetic head of many ring-shaped inductors device of Fig. 1 g.

Fig. 1 i is the perspective view of the bottom magnetic head of many ring-shaped inductors device of Fig. 1 g.

Fig. 1 j is the perspective view of many ring-shaped inductors device of Fig. 1 g, represents connecting of top magnetic head and bottom magnetic head.

Fig. 1 k is the perspective view of the bottom magnetic head of the second configuration of many ring-shaped inductors device in accordance with the principles of the present invention.

Fig. 1 l is the perspective view of the bottom magnetic head of the 3rd configuration of many ring-shaped inductors device in accordance with the principles of the present invention.

Fig. 1 m is the end view of the bottom magnetic head of many ring-shaped inductors device of Fig. 1 l.

Fig. 1 n is the perspective view of the bottom side of the bottom magnetic head of many ring-shaped inductors device of Fig. 1 l, and it illustrates the power path between elongated end path.

Fig. 1 o is the perspective view of the bottom side of the bottom magnetic head of many ring-shaped inductors device of Fig. 1 l, and it illustrates the power path connecting these paths.

Fig. 1 p represents the electronic circuit that can implement in many ring-shaped inductors device in accordance with the principles of the present invention easily.

Fig. 2 is the perspective exploded view of the first configuration representing the annular inductance device that partly connects up in accordance with the principles of the present invention.

Fig. 2 a be the part of Fig. 2 connect up annular inductance device bottom magnetic head and annular perspective view.

Fig. 2 b is the perspective view of the example winding of the toroidal core of the part wiring inductance device represented around Fig. 2.

Fig. 2 c is the perspective view of the single wiring core center in the ring-shaped inductors device of the part wiring being used in Fig. 2.

Fig. 2 D is the perspective view of the first configuration of the many ring-shaped inductors device representing part wiring in accordance with the principles of the present invention.

Fig. 2 e is the perspective view of the substrate magnetic head of many ring-shaped inductors device of the part wiring of Fig. 2 D.

Fig. 2 f is that the part of Fig. 2 connects up the decomposition diagram of many ring-shaped inductors device, represents the setting of the toroidal core in substrate magnetic head.

Fig. 3 is the top plan view of the bottom magnetic head of example ring-shaped inductors device, and it illustrates expression in accordance with the principles of the present invention around the position of the winding path in toroidal core chamber.

Fig. 4 is the perspective view of the annular inductance device of oneself lead-in wire of example in accordance with the principles of the present invention.

Fig. 5 represents the perspective view of distortion to the example ring-shaped inductors device of winding.

Fig. 6 is the perspective exploded view of the example ring-shaped inductors device representing the winding realized on printed base plate.

Fig. 7 represents that electronic unit receives the perspective view of the top magnetic head of the example ring-shaped inductors device of pad.

Fig. 8 is the perspective view representing the example capacitance structure used in inductance device in accordance with the principles of the present invention.

Fig. 8 a is the perspective view representing the example capacitance structure be arranged in the magnetic head of inductance device.

Fig. 8 b represents the perspective view comprising the another example capacitance structure used in the inductance device of another example capacitance structure in parallel, multi-layer capacity pad.

Fig. 9 a is the logical flow chart of the first exemplary method represented for the manufacture of the radio induction device manufactured according to the principle of the invention.

Fig. 9 b is the logical flow chart of the second exemplary method represented for the manufacture of the part wiring inductance device manufactured according to the principle of the invention.

Figure 10 is the logical flow chart of the exemplary method represented for the manufacture of the wiring core center be used in part wiring inductance device in accordance with the principles of the present invention.

Referring now to accompanying drawing, be described, wherein identical mark represents identical parts.

Embodiment

Be described referring now to graphic, wherein approximate element numbers represents parts approximate in full.

As used herein; term " integrated circuit " should comprise the integrating device of any type with any function; and no matter be single-chip or multi-chip; or small-scale or large-scale integrated; include but not limited to application-specific integrated circuit (ASIC) (ASIC); field programmable gate array (FPGA), digital processing unit (such as DSP, CISC microprocessor or risc processor), and so-called " system single chip " (SoC) device.

As used herein, term " Signal Regulation " or " adjustment " should be understood to include but be not limited to signal voltage conversion, filtering and noise mitigation, Signal separator, impedance Control and correction, current limit, Capacity control and time delay.

As used herein, term " electric parts " and " electronic unit " can exchange and use and represent the parts being suitable for providing some electricity and/or signal conditioning functions, include but not limited to inductive reactor (" choking-winding "), transformer, filter, transistor, toroidal core of misunderstanding each other (gapped core toroids), inductor (coupling or other), capacitor, resistor, operational amplifier and diode, and no matter it is discrete parts or integrated circuit, no matter be also independent or combination.

As used herein, term " magnetic penetrates " refers to any amount of material being used to form inductance core or like, includes but not limited to the various formulas be made up of ferrite.

As used herein, term " top ", " end ", " side ", " on ", D score etc. only means parts relative to the relative position of another parts or geometry, and be in no case mean definitely with reference to or the orientation of any requirement.Such as, when parts are installed to another device (such as, being installed to the downside of PCB), in fact " top " portion of these parts may be positioned at the below in " end " portion.

General introduction

Invention particularly provides a kind of Low-cost electric induction device of improvement and the method for manufacture and utilization thereof.

In the electronics industry, as numerous industry just like that, to manufacture the relevant cost of various device directly relevant with the complexity of the cost of material, the quantity of parts used in the apparatus and/or packaging technology.Therefore, in the height Cost Competition environment of such as electronics industry, there is the manufacturer of the electronic installation of the design making cost minimized (minimizing as by the cost factor making to mention emphatically) above, will the clear superiority being superior to competition manufacturer be kept.

A kind of such device comprises and has the device that coiling magnetic penetrates magnetic core.But there is the problem of electrically change in the inductance device of these prior aries: (1) winding interval heterogeneous and distribution due to especially following factor; And (2) operator error (such as the number of turn of mistake, the winding pattern, misalignment etc. of mistake).In addition, this prior-art devices often can not integrate with other electronic unit effectively, and/or there is manufacturing process problem, and these manufacturing process are essentially highly manual, causes higher production loss and adds the cost of these devices.

The present invention makes great efforts cost minimization especially by these highly manual prior art processes of elimination (being such as wound around toroidal core by hand), and by providing a kind of manufacture method to improve electrical property, this manufacture method can automatically and in the mode of high uniformity control such as to be wound around pitch, to be wound around interval, the number of turn etc.Therefore, the invention provides not only obviously reduce and even eliminate precision apparatus manufacture in " artificially " factor (better performance and consistency can be realized thus) but also obviously reduce the apparatus and method of the cost of this device of manufacture.

In an exemplary embodiment, disclose " wireless " inductance device of a kind of improvement.This inductance device comprises at least one head stack (header element), and this head stack has multiple through hole path.In a modification of above-mentioned " wireless " inductance device embodiment, described path is better comprises the elongated end be associated with through hole path, and described through hole path is used as the part penetrating the winding arranged around magnetic core in magnetic when it is completed.The windings section of printing (etching) is also applied on this magnetic head, complete thus magnetic penetrate to arrange around magnetic core described in " winding ".

In another embodiment, especially in order to capacity effect, use substantially flat with parallel plate structure.

Detailed description of illustrative embodiments

Now, various embodiment and the modification of described apparatus and method of the present invention will be described in detail.

Wireless annular inductance device

Referring now to Fig. 1, be wherein shown specifically and describe the first exemplary embodiment of the present invention.Made following discussion although should be realized that with regard to inductor, but the present invention is applicable to other inductance device (including but not limited to choking-winding, inductive reactor, transformer, filter etc.) equally.These and other application will be discussed below more comprehensively.

The inductance device 100 of Fig. 1 comprises magnetic and penetrates toroidal core 110 and two wireless substrate magnetic heads 102,108.As previously mentioned, the term " wireless " used in the present context refers to such fact: inductance device 100 of the present invention does not need, as the magnetic wire winding arranged around toroidal core conventional in prior art, not get rid of the winding of any kind may inferred by this term completely yet.It should further be appreciated that, although Primary Reference toroidal core is discussed (mainly due to they conventional property in whole industry), will be appreciated that and any amount of core shapes of type known in the art (i.e. rectangle, Dual-barrel-shaped (binocular), triangle etc.) can be used easily to replace toroidal core discussed herein.In fact, should know as those of ordinary skill in the art after knowing present disclosure by understood, by suitable transformation, almost can use any shape.

Its winding is incorporated on one or more substrate magnetic head printed and/or can etch by the present embodiment shown in Fig. 1, and in some structures (as shown in Figure 1 person); These windings realize by means of the through hole path comprising elongated end.The path with " elongated end " is similar to conventional via path well known in the art, and it is included in printed circuit board (PCB) or other connects plating hole (can be plated or rivet) in the substrate of copper or the passage of other conductive material traces or another layer from one deck of plate to substrate.But in " elongated end " path, described coating section extends beyond the surface in plating hole and pierces through substrate surface.Described elongated end provides the advantage being superior to coiling prior-art devices, and this will discuss below more all sidedly.But it should be noted that, although discussion is below mainly with regard to the inductance device embodiment comprising elongated end path, but also contemplate the use of conventional via path, this transformation can be realized by the those skilled in the art reading the disclosure easily.Use elongated end via configuration especially solves the following FAQs in inductance device design: wherein low-density path needs to extend through the inductance device with the very high substrate (comprising PCB) of depth-to-width ratio (aspect ratio).The size of low-density path is comparatively large, because which limit the amount that can be placed on single inductance device.Correspondingly, some embodiments of the present invention attempt to overcome this defect in the following way: it just extends on a surface of a substrate by making conductor, namely make the end of path extend, provide the inductance device comprising high-density via.Photoimageable material technology or other technology can be passed through, to load identical mode by elongated end channel setting on substrate with solder projection.Also used other method well known by persons skilled in the art and material can be replaced easily.

Get back to Fig. 1, the toroidal core 110 of the present embodiment belongs to the type that this area generally uses.Optionally, known coating (as Parylene (parylene)) can be used to apply toroidal core 110, especially to improve the isolation between magnetic core and any adjacent winding.And toroidal core 110 forms gap (no matter be partly or fully) alternatively, to improve the saturation characteristic of magnetic core.Such as, in on November 4th, 2003 issue, name is called in jointly all U.S. Patent numbers 6642827 of " Advanced electronic microminiature coil and method of manufacturing (advanced electronic microminiature coil and manufacture method) " the optional magnetic core configuration disclosing these and other, quotes its full content for reference in this.Easily can also use other toroidal core embodiment according to the present invention, especially be included in shown in that on September 19th, 2006 is issued, that name is called jointly all U.S. Patent numbers 7109837 of " Controlled inductance device and method (controlled inductance device and method) " 13-16 figure and those contents of associated description, the full content quoting the document is here for reference.And, embodiment shown in that on June 30th, 2004 applies for, that name is called the US application serial No. 10/882864 of the jointly all of " Controlled inductance device and method (controlled inductance device and method) " and CO-PENDING 17a-17f figure and incorporated by reference herein can be used according to the present invention, such as, wherein one or more " pad (washer) " is arranged in one or more magnetic head 102,108.By knowing present disclosure and those contents incorporated by reference above, it will be appreciated by those skilled in the art that other countless configurations, and quoting above is only illustrate principle widely.

Alternatively, the top magnetic head 102 of device 100 can comprise can the material of circuit printing, be such as but not limited to: ceramic substrate (such as, LTCC, or " LTCC "), synthesis (such as based on graphite, soft FR-4 (Flex on FR-4) etc.) material, or the material based on glass fibre conventional in this area, as FR-4 etc.With regard to cost and whole world wide usability, the material based on glass fibre has the advantage being better than LTCC; But LTCC has advantage too.Specifically, LTCC technology shows advantage in the following areas: due to special material component, can be ceramic at the roasting temperature lower than about 900 DEG C.This makes it possible to burn altogether with other high conductive material (i.e. silver, copper, gold etc.).LTCC also achieves the ability be embedded into as resistor, capacitor and inductor by passive component in the ceramic packaging of mainly (underlying) below.With regard to dimensional stability and moisture absorption, LTCC also have be better than much based on glass fibre or the advantage of material of synthesis, thus provide the reliable basic material of dimension for main inductor or inductance device.

The top magnetic head 102 of shown embodiment comprises example and prints as is well known or hollow out version (stenciling) technology, multiple windings section 104 of directly printing or setting on top magnetic head 102.Although the present embodiment incorporates the windings section 104 of multiple printing, but the present invention is never confined to this.Such as, if necessary, easily single-turn winding can also be used.

As shown in by Fig. 1 a the best, bottom magnetic head 108 comprises multiple winding path 106,116 and is suitable for receiving the optional chamber 112 of toroidal core (also see Fig. 1 c, 110).As previously mentioned, this winding path can comprise elongated end in a kind of modification.

The bottom magnetic head 108 of Fig. 1 a also comprises multiple winding path, and these winding paths are arranged to the multiple outside winding path 106 that the external margin along chamber 112 is arranged; And the center of chamber 112 arrange multiple inner winding path 116.Illustrated object in Fig. 1 a is exemplary in essence, the exact magnitude of the winding path 106,116 therefore arranged on bottom magnetic head 108 can according to desired electric/magnetic properties and changing significantly.The shape of chamber 112 is the circle (in substance form cylindrical chamber) with convex center 114 substantially, and this convex center is suitable in the opening at the center being assembled to toroidal core.Convex center 114 has the inside winding path 116 arranged thereon.Be also to be noted that center 114 is not necessarily elevated regions always.This center also can comprise any amount of structure according to the invention, especially comprises and being set directly in chamber 112 or bottom magnetic head 108 base plate by inner winding path 116.It is evident that, can as required, chamber 112 be arranged in any one of top and/or bottom magnetic head 102,108, or be arranged in both.

Such as, in one embodiment, two magnetic heads 102,108 comprise substantially identical parts, and each parts comprise the chamber of (in vertical direction) the roughly half being suitable for receiving annular 110.

In another embodiment, annular 110 is received in of magnetic head 102,108 completely, and another does not have chamber (in fact comprising flat board) completely.In another embodiment, two magnetic heads 102,108 eachly all have chamber, but the respective degree of depth is different from each other.Then, inner winding path 116 and outside winding path 106 are electrical interconnection (see Fig. 1 f).

Should also be understood that and according to any amount of configuration, inner winding path 116 and outside winding path 106 can be arranged in around toroidal core 110.Such as, Fig. 1 b illustrates such variation: wherein configure different from the paired external path 106 shown in Fig. 1 a, external path 106 is distributed in around chamber 112 completely.But, as previously mentioned, after knowing present disclosure, will easily understand other configurations various drawing inner winding path 116 and outside winding path 106.Such as, path propinquity can be utilized to respond to desired capacity effect, and such capacity effect can cause winding heterogeneous to distribute.

Fig. 1 c illustrates in the reception chamber 112 toroidal core 110 being placed into bottom magnetic head 108.As discussed in greater detail below, (Fig. 1 convex center a) is assembled in toroidal core 110 intracardiac, and outside winding path 106 is arranged to exactly outside the edge of toroidal core 110 simultaneously to comprise inner winding path.

Fig. 1 d illustrates the downside of the bottom magnetic head 108 shown in Fig. 1.As shown in the figure, outside winding path 106 is electrically connected to inner winding path by windings section 118.This windings section 118 is similar to reference to those windings section (i.e. windings section 104) shown in top magnetic head 102.In addition, the first end 1181 from windings section 118 extends by external path 106.Then, external path 106, at the second end 1182 place of windings section 118, is connected to internal path 116 by windings section 118.

It should be noted, just exemplary in essence by the particular path shown in bottom magnetic head windings section 118 and top magnetic head windings section 104, therefore illustrate only for the one in the multiple possible configuration of these power paths.Any amount of path configurations all can be used for outside winding path and inner winding path being coupled together with conforming to the present invention, such as especially crossedpath, modulation (such as sinusoidal) path, direct access path etc.Should also be understood that and can construct these paths based on the reason of geometry and electricity.Such as, capacity effect and/or the inductive effect of windings section 118 can be affected for the adjustment of the width of windings section 118, interval and/or length.

Fig. 1 e illustrates the example inductive device 100 (i.e. three section Example) comprising three parts: (i) top magnetic head 102, and itself and (ii) bottom magnetic head 108 and (iii) magnetic be placed between top magnetic head 102 and bottom magnetic head 108 penetrate toroidal core 110 and connects.It should be understood, however, that with can realize using more or less head portion with conforming to the present invention other configure, or the magnetic head material substituted.The windings section 104 of top magnetic head path 120 from the surface being arranged on top magnetic head 102 extends.The windings section 118 of bottom magnetic head path 106 from the surface being arranged on bottom magnetic head 108 extends.When top magnetic head 102 connects with bottom magnetic head 108, top magnetic head path 120 becomes with bottom magnetic head path 106 and is electrically connected.As shown in fig. le, the electrical connection between bottom passageway 120 and bottom passageway 106 completes " winding " around toroidal core 110.

The toroidal core 110 that Fig. 1 f describes wherein Cheng Huan to be received in chamber 112 and all winding paths by the embodiment connected.This comprises inner top winding path 122 and outside top winding path 120, and the bottom winding path 116 of inside and outside bottom winding path 106.For the sake of clarity, top and bottom magnetic head is eliminated in view.As shown in the figure, the elongated end of the elongated end of the outside winding path 106 of bottom and the outside winding path 120 on top connects.The outside winding path 120 on top is connected to the inside winding path 122 on top by windings section 104.The elongated end of the inside winding path 122 on top is connected to the elongated end of the inside winding path 116 of bottom similarly.Next, they are connected by the outside winding path 106 of windings section 118 with bottom.Therefore, by magnetic core 110 is received in chamber 112, winding path (outside winding path 106,120 and inner winding path 116,122) is combined with top magnetic head windings section 104 and bottom magnetic head windings section 118 and surrounds magnetic core 110, thus with the winding inductor of prior art or inductance device similar.Although merely depict single turn, can find out, can understand after knowing present disclosure as those of ordinary skill in the art, aforementioned pattern can be repeated, to complete multiturn inductance device 100.

Windings section 104 in Fig. 1 f is illustrated as cross-over configuration.Can print each windings section 104 of top magnetic head 102 with the position precision of height, this just brings another outstanding advantages that this technology is superior to magnet winding inductor conventional in prior art.Because these windings be positioned on both top head portion 102 and bottom head portion 108 use the technique of high degree of controlled print or arrange, therefore very high accuracy can be used to control interval and/or the pitch of these windings, the electrical property consistency that the wire-wound inductor device thus providing prior art can not be compared, the wire-wound inductor device of these prior aries comprises change to a certain degree in essence, depends on the type as winding machines used, the personnel for each magnetic core coiling etc. factor.

It should further be appreciated that, term " interval " can represent the distance between winding and the outer surface of magnetic core, and interval between winding and winding or spacing.Advantageously, shown device 100 very accurately controls the interval between " winding " (head portion of path and printing) and magnetic core 110, this is because the chamber 112 formed in magnetic head 102,108 has exact position relative to the outer surface of path and magnetic head and dimension.Therefore, winding just can not by unintentionally around to top each other, or the undesirable gap formed between they and magnetic core, this gap such as due to when wire is wound around wire relaxes cause, as prior art is contingent.

Equally, the thickness of each windings section 104,118, width and further feature and size can be accurately controlled, and provide advantageous benefits thus at consistent electrical quantity (such as resistance or impedance, vortex flow density etc.) aspect.Therefore, the characteristic of this main manufacturing processes electrical property that brings the height in a large amount of device consistent.Such as, in the prior art in obtainable scheme, due to the craft of the winding process of prior art and the speciality of alterable height, such as often there is sizable variability in the electrical characteristics such as interwinding capacity, leakage inductance.In some applications, extensively confirmed that the winding process of these prior aries is difficult to control.Such as, in inductance device manufactured by a large amount of, verified being difficult to as one man adjusts winding pitch (interval) in batch production.

In addition, the present embodiment of inductance device 100 has the following advantages: by magnetic head structure and use automatic typography, also accurately control the number of turn, thereby eliminate and may cause such as the wrong number of turn being applied to the such error depending on operator of magnetic core.

Although in the application of many prior aries, verified these above-mentioned variabilities are not very serious under many circumstances, but use over data networks along with the data transfer rate continued to increase, the demand for more accurate with the consistent electrical property of inductance device becomes more and more general.While client in recent years continues to increase for the demand of more high-performance electric subassembly, these require also along with the increased requirement for more Low-cost electric subassembly.Therefore, it is highly desirable that the inductance device of any improvement not only improves to some extent in electrical property relative to the Winder of prior art, but also provide cost emulative scheme for client.In fact cost competitive is had relative to the wire-wound inductor device of prior art at the automatic process relating to manufacture inductance device 100.Relative to exemplary fabrication process and 9a-10 figure, these automatic manufacturing process will be described in more detail subsequently herein.

The present invention also allows the physical separation of winding and toroidal core, to make winding directly not contact with magnetic core, avoids the variability that the excessive winding (over winding) etc. due to other circle produces.And, owing to not having conventional winding to be wound on magnetic core, therefore avoid the damage that annular (comprising described coating, as parylene) is caused, avoid thus in the surface of annular or in its coating, causing otch by wire.Example embodiment also physically by toroidal core 110 and magnetic head 102,108 and windings section 104,116 uncoupling, makes it possible to be separated separately or process these parts.

On the contrary, " separation " winding and annular is used to make it possible under many circumstances without the need to extra parts or coating.Such as, parylene coating, silicon sealing (silicone encapsulant) etc. (they are often used on the Winder of prior art) can not be needed in the exemplary embodiment, this is because pass between winding and magnetic core is fixing, and these parts are separated opens.

Present invention also offers the chance using polygamy to put magnetic head.Such as, in an alternative embodiment, magnetic head 102,108 can be configured to the path with any amount (N), thus the device utilized for all N bar paths of " winding " can be formed thus, or form the device with the winding of the mark (such as N/2, N/3 etc.) of N.In an exemplary situation, when forming N/2 winding arrangement, advantageously, special processing is not needed during manufacture by the elongated end path used.Specifically, its can with for the path of winding identical ground plating and placement, and be only not ' attach ' on the coupling path on another head surface, if or match on another path, be not then electrically connected by windings section.Alternatively, if wish N number of winding, then connect all paths (being all plated in either case) as illustrated in fig. 1.This can be very useful, such as, when carrying out standardization to the magnetic head platform of multiple electricity configuration.

In another embodiment (not shown), different from above-mentioned three section Example, inductance device 100 assembly can comprise two parts: (i) bottom magnetic head 108 assembly and (ii) toroidal core 110.According to the present embodiment, optionally, bottom magnetic head can comprise can circuit printing material, such as, but not limited to: ceramic substrate (such as LTCC, or " LTCC "), conventional in (such as based on graphite) material of synthesis or this area material based on glass fibre, such as FR-4.Be arranged in those component class on the head stack of bottom seemingly with above-described, the present embodiment comprises bottom windings section 118, and has the lower passages 116 of multiple inside of elongated end and outside lower passages 106.In order to complete " winding " set up by the elongated end of internal path 116 and external path 106, windings section is placed directly toroidal core 110 on the surface.

Alternatively, in another modification, windings section comprises copper track or other conductive material bands at the top extending past toroidal core 110.

In another embodiment, multiple (such as three or more) head stack (not shown) can by together overlapped, to form the encapsulation for magnetic core.Such as, in a modification, top, middle part and bottom magnetic head is used to form toroidal core encapsulation.

And it should be understood that the material for magnetic head unit needs not to be identical, also can be heterogeneous (heterogeneous) in speciality.Such as, when aforesaid " flat top magnetic head ", in fact top magnetic head can comprise PCB or other this type of substrate (such as FR-4), and bottom magnetic head comprises another kind of material (such as LTCC, PBT plastic etc.).This can be used for reducing manufacturing cost, and makes it possible to easily place other electronic unit (such as passive component, as resistor, capacitor etc.) thereon.

Wireless many ring-shaped inductors device

Referring now to Fig. 1 g, be wherein shown specifically and describe the example embodiment of the present invention utilizing many annular design.Should be realized that, with embodiment previously discussed is identical herein, although discussion is below with regard to inductor, but the present invention can be applicable to other inductance device (including but not limited to choking-winding, inductive reactor, transformer, filter etc.) equally.

The inductance device 100 of Fig. 1 g comprises multiple magnetic and penetrates toroidal core 110 and two wireless substrate magnetic heads 102,108.This graphic extension is exemplary in essence, although only describe four (4) individual toroidal cores, can use the toroidal core of any quantity (n) with the present invention with conforming to.In addition, as previously mentioned, term " wireless " refers to such fact: inductance device 100 does not need the magnet wire winding arranged around toroidal core 110, but its winding is incorporated into one or more substrate magnetic head of printing and/or can etch and has on the path of elongated end.It should be noted that, in an alternate embodiment (not shown), through hole path can also be integrated.And, any amount of wireless substrate magnetic head 102,108 can be used with conforming to the present invention, comprise two, or more, or less individual.And it should be understood that the material for magnetic head unit needs not to be identical, can be also heterogeneous in speciality.Such as, one or more wireless substrate magnetic head 102,108 can comprise printed circuit board (PCB), LTCC or the material based on polymer.

Relative to the magnetic head described in 1-1f figure before being similar to, the top magnetic head 102 of described device 100 comprises alternatively can circuit printing material, such as, but not limited to: ceramic substrate (such as " LTCC "), (such as based on graphite) material of synthesis, or the material based on glass fibre conventional in this area, as FR-4 or soft FR-4 etc.

The top magnetic head 102 of illustrated embodiment comprises multiple windings section 104, and they are that example is printed as is well known or hollow out platemaking technology directly prints or is arranged on top magnetic head 102.As described in Fig. 1 g, the quantity (N) of the direct toroidal core 100 along with providing in arbitrary specific embodiment changes by the quantity N being arranged on the windings section 104 on top magnetic head 102.In detail in this figure, owing to describing four (4) individual toroidal cores, therefore four (4) individual windings section are shown.In addition, the particular path set up by the windings section in the embodiment shown in Fig. 1 g is only illustrative; Other path configurations of countless versions is also feasible.Such as, the embodiment of the top magnetic head 102 utilizing directapath 104x can be seen in Fig. 1 h.Other path configurations (not shown), especially comprises crossedpath and repeatedly crossedpath, also may be used for the present invention.

Return Fig. 1 g, illustrated therein is in the reception chamber 112 toroidal core 110 being set to bottom magnetic head 108.As described in more detail below, reception chamber 112 in an example embodiment comprises the convex center (not shown) with inner winding path (also not shown), and it is suitable for the center being assembled to toroidal core 110; Outside winding path 106 is arranged to the outside of the toroidal core 110 exactly on bottom magnetic head 108.

As shown in the best in Fig. 1 i, the bottom magnetic head 108 of the present embodiment comprises multiple winding path and is suitable for receiving several chambers 112 of toroidal core 110 (as described in Fig. 1 g).This winding path comprises elongated end, and this elongated end has the outstanding advantages being obviously better than magnet winding inductor conventional in prior art, as mentioned above.The quantity (N) of the chamber 112 on the magnetic head 108 of bottom corresponds to the quantity N of the toroidal core 110 that will receive wherein.

Several winding path is arranged on the magnetic head 108 of bottom, and comprises outside winding path 106 and inner winding path 116.External margin along each chamber 112 arranges several outside winding path 106.As what discuss relative to single ring-shaped inductors device before, the outside winding path 106n of any quantity (N) can be set around single chamber 112.The distribution patterns of outside winding path 106 around chamber 112 can change equally.In fact, it should be understood that and around toroidal core 110, inner winding path 116 and outside winding path 106 can be set according to any configuration mode.The inner elongated end of winding path 116 and the elongated end electrical interconnection of outside winding path 106.This is connected electrically in shown in Fig. 1 j.

Fig. 1 j illustrates the example many ring-shaped inductors device 100:(i comprising three parts) top magnetic head 102, and (ii) bottom magnetic head 108 and (iii) multiple magnetic be placed between top magnetic head 102 and bottom magnetic head 108 to penetrate toroidal core 110 matched.As previously mentioned, it should be understood that other that can realize using more or less head portion or annular with the present invention with conforming to configures, or the magnetic head material substituted.Such as, Fig. 1 k describes individual annular 110 the present invention realized of use eight (8), and other quantity is also feasible.

In another embodiment, as shown in 1l-1o figure, multiple inductance device 100 assembly comprises two parts (" two parts embodiment "), instead of above relative to three parts described in Fig. 1 g.These two parts are (i) bottom magnetic head 108 and (ii) multiple toroidal core (not shown, but itself and toroidal core discussed above 110 are similar).

Fig. 1 l illustrates the bottom head stack 108 of described two parts embodiment.Although it should be understood that the bottom head stack 108 of Fig. 1 l is integrated to be provided with four (4) individual toroidal cores, the toroidal core (not shown) of any quantity (N) also can be utilized with conforming to the present invention.

The bottom head stack 108 of this two parts embodiment comprises the substrate of above-mentioned material.Bottom head stack 108 also comprises the multiple inner winding path 116 and outside winding path 106 with elongated end.As previously mentioned, in other embodiment (not shown), can replace using the path with elongated end by using through hole path.Inner winding path 116, by being arranged on the windings section 118 on the surface of bottom magnetic head 108 (see 1n and 1o figure), is electrically connected to outside winding path 106.As long as maintain enough spaces for arranging toroidal core (not shown), can configure with countless versions, inner winding path 116 and outside winding path 106 being arranged on bottom magnetic head 108 on the surface.Place inner winding path 116 and outside winding path 106, to make inner winding path 116 be arranged in the cavity center of annular (not shown), outside winding path 106 is arranged on the outside of loop configuration (not shown).Like this, outside winding path 106 generally will form the profile of toroidal core, and inner winding path 106 generally forms toroidal core center.The present invention also can adopt other to configure.

In one embodiment, as previously mentioned, " winding " is by replacing copper track or other similar electric conducting material has brought on the top of whole toroidal core.In another embodiment (not shown), winding has been come by permutation circuit footpath on the surface of toroidal core itself, wherein when being placed on by this toroidal core on the magnetic head 108 of bottom, it is electrically connected with inner winding path 116 and outside winding path 106.

Another outstanding advantages of aforementioned many core inductance device is used to be can with any amount of variation configuration to manufacture each inductance device in many core inductance device.As illustrated in figure 1p, in telecommunications application, use magnet assembly to be useful, such as filtering is carried out to the speech in twisted pair wire and data-signal.Utilize many core inductance device, people can realize whole circuit (as illustrated in figure 1p) easily in single assembly.Such as, in the circuit shown in Fig. 1 p, shown circuit can utilize upper and lower magnetic head and four (4) individual toroidal cores to realize.Then, resistor and capacitor can be molded in magnetic head itself, or alternatively, these magnetic heads also can use the discrete installation site for discrete electronic components.In this way, discussed technology can be utilized above, realize complete circuit (such as circuit shown in Fig. 1 p) according to accurate and the effective mode of cost easily.This method also has by conductor development length (such as; track or extra lead is had to extend the discrete assembly installed in farther position) minimized advantage, alleviate EMI, eddy current effects thus and extend other relevant adverse effect to this more long conductor.

The ring-shaped inductors device of part wiring

Referring now to Fig. 2, wherein illustrate and describe another example embodiment of the present invention in detail.Should be realized that, although discussion is below with regard to inductor, the present invention is applicable to other inductance device (including but not limited to choking-winding, inductive reactor, transformer, filter etc.) equally.

The inductance device 200 of Fig. 2 comprises the substrate magnetic head 202,208 that magnetic penetrates toroidal core 210 and two part wirings.Term in this specific context " part wiring " refers to the following fact: the inductance device 200 of the present embodiment utilizes the winding arranged around toroidal core, the described winding of part to comprise magnet wire, one or more substrate magnetic head of printing and/or can etch and path.In the embodiment of fig. 2, advantageously, path comprises elongated end.This method, for the prior-art devices of complete coiling, provides obvious advantage, will discuss in further detail subsequently herein to it.In another embodiment (not shown), described path comprises conventional via or through hole path.

The toroidal core 210 of the present embodiment belongs to type conventional in this area, therefore discusses in detail no longer further.Also can other be utilized to configure with conforming to the present invention, such as, toroidal core can be flattened (being discussed in more detail below), can be coated, or can form gap (no matter be partly or fully).Those of ordinary skill in the art are after knowing present disclosure, other configuration of countless versions will be understood easily, those contents disclosed in the US application serial No. 10/882864 being included in jointly all U.S. Patent numbers 6642827,7109837 and all and CO-PENDING jointly, the full content quoting each section of above-mentioned document is here for reference.

The top magnetic head 202 of described device 200 comprises alternatively can circuit printing material, such as, but not limited to (such as based on graphite, soft FR-4 etc.) material of: ceramic substrate (such as LTCC), synthesis, or based on the material of glass fibre, as FR-4, be described previously the associated advantages of each.The top magnetic head 202 of illustrated embodiment comprises example and to print as is well known or hollow out platemaking technology directly prints or is arranged on the multiple windings section 204 on top magnetic head 202.Although the present embodiment incorporates the windings section 204 of multiple printing, the present invention is not limited thereto absolutely.Such as, if necessary, also easily single-turn winding can be used.In addition, the power path shown in the present embodiment is the example of countless versions possibility power path.

As found out best by Fig. 2 a, bottom magnetic head 208 comprises multiple winding path (described) below and is suitable for receiving the chamber 212 of toroidal core 210.Optionally, bottom magnetic head 208 can comprise can circuit printing material, such as, but not limited to ceramic substrate or the material based on glass fibre.In addition as previously mentioned, advantageously, winding path can comprise elongated end (not shown).

Fig. 2 a also shows in the reception chamber 212 toroidal core 210 being placed into bottom magnetic head 208.The shape of chamber 212 is the circles with wiring core center 222, and described wiring core center 222 is suitable in the opening at the center being assembled to toroidal core 210.As described in more detail below, the core center 222 that connects up mainly comprises the magnet wire 224 of a molded bunchy.Multiple outside winding path 206 is arranged to outside the edge of exactly chamber 212, so that when toroidal core 210 is placed in reception chamber 212, described multiple outside winding path 206 is retained in the outside of toroidal core 210.

Outside winding path 206 passes through the power path 218 on bottom magnetic head 208 surface, with magnet wire 224 electric interconnection of wiring core center 222.Power path 218 can be formed by etching or other similar electrically connected method known to persons of ordinary skill in the art.In addition, when bottom magnetic head 208 connects with top magnetic head 202, " winding " around the toroidal core 210 being centered around setting in connected top magnetic head 202 and bottom magnetic head 208 is completed.Fig. 2 b represents a kind of such winding.Although only illustrate single turn, but it should be understood that above-mentioned pattern can carry out repetition as required, to produce multiturn inductance device 200.

As described in Fig. 2 b, the magnet wire 224 of wiring core center (not shown), by being arranged on the power path 218 on the magnetic head 208 of bottom, is electrically connected to outside winding path 206.Outside winding path 206 is by being arranged on the power path 204 on top magnetic head 202, and identical magnet wire 224 is got back in electrical connection again.Therefore, by magnetic core 210 is received in chamber 212, magnet wire 224 and the outside winding path 206 of wiring core center 222 surround magnetic core 210 in conjunction with top magnetic head windings section 204 and bottom magnetic head windings section 218, thus with the winding inductor of prior art or inductance device similar, but there is obvious advantage, also describe as other place of this paper.Here, in order to for simplicity, single turn embodiment is shown; But those of ordinary skill, after knowing present disclosure, easily can understand the improvement for this configuration, to realize the electricity configuration expected.

In another embodiment, at least one end (not shown) of power path 204,218 ends at elongated end path.Elongated end path (not shown) contributes to connecting of top magnetic head 202 and bottom magnetic head 208, and provides the above-mentioned advantage being better than prior art.

Referring again to Fig. 2 a, should also be understood that and according to any various configurations, outside windings section 206 can be arranged in around toroidal core 210.This especially comprises and being fully distributed in all even for path around chamber, or takes paired configuration.And, contemplate other via configuration various with conforming to present disclosure.In addition, as what discuss in detail relative to the manufacture of wiring core center 222, also magnet wire 224 can be set according to various extensive configuration relative to each other, to make can improve raising electrical characteristics in some execution mode below.

An example embodiment of wiring core center 222 has been shown in Fig. 2 c.This wiring core center 222 comprises the multiple magnet wire 224 arranged with substantially parallel orientation.Wiring core center 222 can comprise the magnet wire 224n of any quantity N.In addition, by often with injected plastic or other suitable molded of polymeric material 230 between wire, magnet wire 224 harness is become a common structure.Alternatively, also the different technique of countless versions can be replaced with easily, such as cable (cable), pyrocondensation (heat-shrink), pourable thermosetting (pourable thermoset), extruding (extruded) etc.Then optionally enclosed by bundle conductor in sheath 232, this sheath 232 comprises identical inside harness material or some other suitable materials.The method for manufacturing wiring core center 222 will be described below in detail.Such as any surface mounting technology method can be passed through, wiring core center be directly coupled on bottom substrate (being PCB in some embodiments), described surface mounting technology method includes but not limited to that ball bar array, solder projection load or also carry out the stencil printing of Reflow Soldering subsequently.

Get back to Fig. 2, for top windings section 204 and bottom windings section 218, it should also be understood that shown certain electric path can adopt any amount of configuration.Any amount of different path configurations can be formed with conforming to from the present invention, so that outside winding path 206 is connected to magnet wire 224, such as especially crossedpath, direct access path etc.

And, although the embodiment of Fig. 2 illustrates comprise three parts (namely, top magnetic head 202, itself and bottom magnetic head 208 and the magnetic be placed between top magnetic head 202 and bottom magnetic head 208 penetrate toroidal core 210 and connect) example inductive device 200, but can also realize comprising other that use more or less head portion with the present invention with conforming to configure.Such as, this device can comprise two parts, or alternatively, this device can comprise the head stack substantially encasing toroidal core more than two.And, material for magnetic head unit can be heterogeneous in speciality, such as comprise by PCB or other such substrate (such as FR-4) as a magnetic head, and other magnetic head comprises other material (such as LTCC, PBT plastic etc.).This method may be used for reducing manufacturing cost, and makes it possible to place other electronic unit (such as passive component, as resistor, capacitor etc.) thereon.

Should also be understood that in the embodiment comprising two or more magnetic heads, (head numbers of use can be depended on) as required, chamber 212 to be arranged in arbitrary magnetic head/two magnetic heads all arrange/are arranged in all magnetic heads.Such as, in the embodiment with two magnetic heads 202,208, they respectively can comprise the chamber being suitable for receiving roughly one semi-circular 210 (in vertical direction).In another embodiment, annular 210 is fully received in one of magnetic head, and other magnetic head does not have chamber (in fact comprising flat board) at all.In another embodiment, each magnetic head has chamber, but the degree of depth of each chamber is different.

In an embodiment (not shown) again, different from above-mentioned three section Example, part wiring inductance device 200 assembly can comprise two parts (two parts embodiment): (i) bottom magnetic head 208 assembly (comprising wiring core center 222) and (ii) toroidal core 210.According to this two parts embodiment, optionally, bottom magnetic head 218 can comprise PCB or other such substrate (such as FR-4), bottom windings section 218 and multiple external path 206 and the core center 222 that connects up.In another embodiment, be similar to mentioned above, outside winding path 206 has elongated end.In order to complete " winding " set up by the magnet wire 224 of wiring core center 222 and outside winding path 206, windings section (not shown) can be set directly at toroidal core 210 on the surface.As another replacement scheme, windings section (not shown) comprise the top extending past toroidal core 210 copper track, lead line or belt.

Many ring-shaped inductors device of part wiring

Fig. 2 D illustrates and utilizes multiple above-mentioned wiring core center 222 to set up the example embodiment of the present invention of part connecton layout.The feature of the present embodiment is also multiple toroidal core.Should be realized that, embodiment described here is applicable to various inductance device (including but not limited to choking-winding, inductive reactor, transformer, filter etc.).

The inductance device 200 of Fig. 2 D comprises multiple magnetic and penetrates toroidal core 210 and part wiring centers magnetic head 208.Quantity along with used toroidal core 210n changes by the quantity of wiring core center 222n pro rata.

As in other embodiment mentioned above, the toroidal core 210 of the present embodiment belongs to the conventional type in this area, therefore discusses in detail no longer further here.Should be appreciated that, although the embodiment of Fig. 2 D comprises four toroidal cores, the present invention can use any quantity with conforming to.

As Fig. 2 e the best illustrates, central head 208 comprises multiple winding path (as described below), and is suitable for the multiple chambers 212 receiving multiple toroidal core (not shown) and multiple wiring core center (not shown).The direct quantity along with toroidal core 210 changes by the quantity (and quantity of wiring core center 222) of chamber 212.Optionally, bottom magnetic head 208 can comprise can circuit printing material, such as, but not limited to ceramic substrate or the material based on glass fibre.In addition, winding path can comprise elongated end (not shown), and it has the outstanding advantages being better than magnet winding inductor conventional in prior art, as mentioned above.

Each edge along multiple chamber 212 arranges multiple outside winding path 206, so that when magnetic core is placed in their respective reception chambers 212, described multiple outside winding path 206 is retained in the outside of respective toroidal core 210.Can according to relative to each other and relative to any multiple difference configuration of chamber 212 placing outside winding path 206; Fig. 2 D just illustrates an embodiment for this placement.

Fig. 2 f illustrates and wiring core center 222 and toroidal core 210 is placed in the reception chamber 212 of bottom magnetic head 208.The shape of the chamber 212 of the present embodiment is circular, and size is even as big as holding both wiring core center 222 and toroidal core 210.

Wiring core center 222 is similar to described in figure 2 c wiring core center above, its have by molded 230 harnesses of plastics (or other material) and the multiple magnet wire 224 encased by sheath 232 alternatively, according to required character, sheath 232 comprises identical inside harness material or some other materials.The wiring core center 222 of 2d-2f figure also can comprise any amount of magnet wire 224, and can various configurations relative to each other place.Will be discussed in more detail below the method for manufacturing wiring core center 222.

As described in Fig. 2 f, each wiring core center 222 is by adaptive for being assembled in the center cavity of corresponding toroidal core 210 individually.In the embodiment shown, placement toroidal core 210 before, by wiring core center 222 be placed on bottom magnetic head 208 chamber 212 in the heart.In another embodiment (not shown), first wiring core center 222 is placed in toroidal core 210, then each core assembly (not shown) is placed in the corresponding reception chamber 212 of bottom magnetic head 208.

Outside winding path 206 passes through the power path (not shown) on central head 208 lower surface, with magnet wire 224 electric interconnection of wiring core center 222.Described power path by etching or can be formed by other similar electrically connected method that those of ordinary skill in the art generally know.Still it is noted that any amount of path configurations can be formed according to the present invention, outside winding path 206 is connected to magnet wire 224, such as especially crossedpath, direct access path etc." winding " is formed when the magnet wire 224 of the core center 222 that connects up is electrically connected the outside winding path 206 of the over top of getting back to toroidal core 210.Alternatively, central head also by overlapped between two substrates, thus can avoid the power path in central head 208.

In one embodiment, this formation is by having connected bottom magnetic head 208 and top magnetic head (not shown).In addition, when bottom magnetic head 208 connects with top magnetic head, magnet wire 224 is electrically connected to outside winding path 206 by the windings section be arranged on the magnetic head of top.As previously mentioned, can by etching or by similar approach as known in the art, power path being placed on the magnetic head of top.Therefore, in this three section Example, by being centered around " winding " around the toroidal core 210 comprising magnet wire, top magnetic head windings section, outside winding path and bottom magnetic head windings section as above, substantially with the winding inductor of prior art or inductance device similar.But the winding of the present embodiment has significant advantage (as mentioned above).In addition, illustrate only single turn although it should be understood that in figure, but multiturn inductance device 200 can be formed by repeating aforementioned pattern.

(not shown) in another embodiment, in order to complete " winding " set up by magnet wire 224 and the outside winding path 206 of the core center 222 that connects up, windings section can be set directly on the surface of toroidal core 210.In yet another alternative, the copper conductor band comprising windings section (not shown) extends past the top of each toroidal core 210.

In another embodiment, at least one end (not shown) of power path ends at elongated end path.Elongated end path (not shown) helps connecting of top magnetic head in aforementioned three section Example and bottom magnetic head 208, or help connecting of the power path that arranges on toroidal core and/or bottom magnetic head 208 and magnet wire 224 and/or outside winding path 206, this depends on used scheme.

Be also to be understood that other embodiment of similar realization use more than one head portion that also can conform to the present invention.Such as, such device can comprise the two or more head stacies substantially encasing toroidal core.Alternatively, also can be designed such that in them one or more comprises the chamber 212 being suitable for receiving toroidal core 210 for these head stacies.And should also be understood that as previously mentioned, the material for head stack can be heterogeneous in speciality.As mentioned above, this method can be particularly useful for reducing manufacturing cost, and makes it possible to place other electronic unit (such as passive component, as resistor, capacitor etc.) thereon.

As above relative to as described in 1-1f and 2-2h figure, each windings section can be printed with height and position accuracy, this address another outstanding advantages of the magnet winding inductor being better than commonly using in the prior art.For (not shown) on bottom magnetic head 208, on the upper or copper strips of top magnetic head (in three section Example, not shown) or the windings section that arranges on the surface of toroidal core, be also like this.Owing to using high degree of controlled technique print or arrange these windings, therefore can carry out interval and/or the pitch of controlled winding with very high accuracy, provide electrical property consistency thus, and this to be the wire-wound inductor device of prior art incomparable.

The term " interval " used in this context both can refer to the distance between winding and the outer surface of magnetic core also can refer to interval or pitch between winding and winding.Advantageously, in the aforementioned embodiment, the interval of " winding " is subject to point-device control, because chamber has exact position relative to path and dimension.Therefore, winding can not due to may usually occur in such as prior art winding wire time wire relaxes, and adversely around to above another, or between they and magnetic core, form undesirable gap or irregularity.Similarly, the thickness of each windings section and dimension can be subject to point-device control, provide advantage thus in consistent electrical quantity (such as resistance or impedance, vortex flow density etc.).Therefore, the characteristic of this main manufacturing processes electrical property that brings the height in a large amount of device consistent.

In addition, the previous embodiment of part wiring inductance device 200 (for single annular, how annular) has the following advantages: also configured by magnetic head and use automatic printing technique accurately to control the number of turn, eliminating thus and may cause the error depending on the operator such as wrong number of turn being applied to magnetic core.

Advantageously, the present invention can also realize the physical separation of winding and toroidal core, thus winding does not directly contact with magnetic core, and avoids the change that the winding etc. excessively due to other circle causes.Therefore, avoid the damage to annular, this is because the winding of routine is not wound on magnetic core, thus avoid by wire in annular surface or its coating (if present; Use " separation " winding and annular can get rid of extra parts or the demand of coating in some cases) middle generation otch.Such as, in the exemplary embodiment, can not need parylene coating, silicon sealing etc. (as on the Winder through being commonly used in prior art), this is because pass between winding and magnetic core is fixing, and these isolation of components are opened.This feature has all saved cost in material and labour two.

The present invention also provides the chance using polygamy to put magnetic head.Such as, in an alternative embodiment, bottom magnetic head 208 can be configured to have any amount of path, makes the aisled device that can be formed utilization " winding " by it, or can form the device of path of the mark (such as N/2, N/3 etc.) with quantity N.

Connect interval

Referring now to Fig. 3, another outstanding advantages of the inductance device 100,200 of above-described embodiment is described.At bottom magnetic head 208, place looks down from top, produces the angle intervals of restriction corresponding to the internal diameter of toroidal core 110,210 and multiple connections 302,106 of external diameter respectively.The bottom magnetic head 108,208 of the present embodiment can comprise part wiring or wireless device, makes inner connection 302 thus or in wireless embodiment, becomes specific passageways 116 (no matter being through hole or elongated end); Or in part wiring embodiment, become specific magnet wire 224.It is outside that to connect 106 can be path (no matter being through hole or elongated end) in part wiring and wireless embodiment.As previously mentioned, in some applications, the angle intervals between controlled winding is very crucial for the normal operation of inductor or inductance device 100,200.As shown in Figure 3, show one group three (3) individual outside winding path 106a, 106b, 106c, with difference predetermined angle interval θ and φ.Therefore, another outstanding advantages that inductance device 100,200 of the present invention is better than the Winder of prior art can closely control these angle intervals θ and φ according to any amount of representative function, as shown in formula (1) to (3).

Formula (1): angle θ=angle φ;

Formula (2): θ < angle, angle φ; And

Formula (3): θ > angle, angle φ

Therefore, different from the method for winding of prior art, almost can use any amount of predefine angle intervals with conforming to the principle of various embodiments of the present invention.The interval of this controlled winding and the ability of layout make it possible to electricity and/or the magnetic attribute (such as annular forms gap part, and winding controls magnetic flux density etc. relative to the placement in this gap) of control device.

Multiturn inductance device

Although for illustrative purposes, main shown in embodiment before and describe single winding inductance arrangement 100,200, but principle of the present invention can be equally applicable to Multiple coil embodiment, those shown in 1d and the 1e figure being such as called the u.s. patent application serial number 11/985156 of the jointly all of " WIRE-LESS INDUCTIVE DEVICE AND METHODS (radio induction device and method) " and CO-PENDING in name, the full content quoting the document is here for reference.Specifically, the application describe by using multilayer printed board to form secondary winding, to extend track between internal path and external path and/or wire.Also disclose the use of three (3) individual or more windings.

From lead-in inductance device

Fig. 4 marks the another embodiment of inductance device 100,200, and wherein bottom magnetic head 108,208 utilizes two (2) individual plating pads 402, to be surface mounted on external device (ED) (not shown) by inductance device 100,200.In fact, the pad 402 of the present embodiment makes inductance device 100,200 become from thread guide devices.Pad 402 is used as the interface between external device (ED) (not shown) and the winding overhang of inductor.These pads 402 comprise plating track, and it is similar to the track used relatively with the top magnetic head winding 104 such as illustrated on top magnetic head 102.Then, known solder technology (as IR Reflow Soldering) now conventional in electronic applications can be used in, inductance device 100,200 is surface mounted on external device (ED).In addition, it should be understood that the pad that easily can use any quantity and shape with the present invention with conforming to.And pad 402 can comprise single pad, or completely or partially can be placed on an edge (multiple edge) of device 100,200, or be completely or partially placed on the surface of device 100,200.After knowing these disclosures provided herein, these modification of pad layout belong to the knowledge of a those of ordinary skill completely, are therefore no longer described in further detail.

And, although the embodiment that the embodiment describing Fig. 4 feature describes with the embodiment that connect up relative to the single annular of Fig. 2 above, part is roughly similar, any one (how include but not limited to annular and/or wireless embodiment) in above-described embodiment can be used with conforming to the present invention.

Twisted-pair feeder winding

Referring now to Fig. 5, be shown specifically and describe the another embodiment of inductance device 100,200.In the 5 embodiment of figure 5, twisted-pair feeder winding is integrated in one or more magnetic heads of inductance device 100,200.As known in the art, twisted-pair feeder winding is following wiring configuration: wherein two or more conductor is around wrapped around one another, and its object is especially in order to eliminate the electromagnetic interference (" EMI ") caused by the crosstalk between external source and/or adjacent conductor.This configuration also can provide capacitive coupling.The snarl ratio (twist rate) (being generally defined as every meter of snarl number or per inch snarl number) of winding forms a part for the specification of any given twisted-pair feeder winding classification.Generally, the quantity of snarl is larger, and the unfavorable electrical interference of such as crosstalk reduces more.The wire of snarl decreases the relevant interference of loop area between wire, this so that determine the magnetic coupling that is introduced in main signal.Such as, in network application, often there are two conductors carrying equal and opposite signal, these two kinds of signals will combine by subtracting each other in destination.The noise signal being introduced into or receiving on two wires cancels each other out in the phase reducing of destination, this is because two wires were once exposed to the electromagnetic interference noise of same levels.

Similarly, two " winding " only each other substantially in parallel but closely connect up, thus can produce electric capacity and/or the electromagnetic coupled of expected degree between which.Such as, in transformer embodiments, the proximity of " winding " can be used to the electromagnetic energy be coupling between the primary and secondary of transformer.Any two or more track on device 100,200 is not always the case, that is, by place them in expectation position (such as parallel) and distance in, the coupling of the expected degree between winding can be realized.And, in multiple layer that this coupling process can be used on this device or rank.

Fig. 5 shows an example of the snarl of the bottom magnetic head 108 at outside winding path 106 place.But be understandable that, there is various other embodiments, include but not limited to following embodiment: wherein in appropriate circumstances (namely in wireless embodiment), the outside winding path 102 of top magnetic head, the inside winding of top magnetic head and/or the inside winding of bottom magnetic head comprise snarl winding.As can be seen from Figure 5, the adjacent external winding path 106 of bottom magnetic head forms multiple twin together by between the top surface 502 and lower surface 504 of magnetic head 108,208.At other magnetic head 108,208 place (or in embodiment of the multiple magnetic head of storehouse) of intergrade, form track, this track around each other " screw winding ", provides multiple twin effect effectively thus in independent path 106.Although mainly discuss with reference to two-wire multiple twin, be understandable that and three line/tetra-wire-wound groups etc. can be added to (not shown) in inductance device design.After knowing present disclosure provided herein, these amendments and transformation all belong in the technical ability ken of those of ordinary skill in the art, are therefore no longer described in further detail here.

It will also be appreciated that, although the embodiment describing Fig. 5 feature with relative to roughly similar with reference to the single annular in figure 2, the part embodiment that embodiment describes that connect up above, any one in above-described embodiment (how include but not limited to annular and/or wireless embodiment) can be used with conforming to the present invention.

Can PCB install inductance device

With reference now to Fig. 6, be shown specifically and describe another embodiment of inductance device 100,200.But be understandable that, although explain clear single annular embodiment, but also according to the feature shown in Fig. 6, various other embodiments can be adopted, such as, comprise many annulars, part wiring and/or wireless embodiment.In addition, the present embodiment can also be implemented together with the path with elongated end, and its advantage is described in detail before this.

As Fig. 6 can find out, the direct bottom winding 118 be once integrated into before realization on female (such as user's) printed circuit board (PCB) 602 on bottom magnetic head (such as describing in Fig. 1 d, see bottom magnetic head 108) now.The route of input trajectory 604 and output trajectory 602 is provided between inductance device 100/200 and other electronic unit provided on circuit board 602.In the present embodiment, top magnetic head 102 illustrates the explanation of following embodiment: wherein winding (winding 104 namely on Fig. 1) is no longer visible on the top surface of inductance device 100,200, or electrically expose.This by such as after formation winding 104, the top surface of magnetic head 102 can deposit layer of non-conductive material to realize.The method of this " covering " makes it possible to use the automatic processes such as such as pickup-place machine to carry out surface-mount devices 100,200, and can not damage potentially and mainly print winding.

Identical magnetic head inductance device

In two head embodiment discussed above (namely having the embodiment of three parts), these two magnetic heads can be substantially identical.In a kind of modification, two substantially identical magnetic heads have the substantially identical windings section arranged on them separately outer surface, make final (with printing) magnetic head also substantially identical.This generates one group of crossover or " being wound around mutually " winding, actually comprises loose helical form or two-wire layout.This method has such advantage: it can utilize identical magnetic head to construct the device 100,200 finally obtained; Namely top magnetic head and bottom magnetic head can be identical, avoid the parts that needs are different thus.Which significantly reduces manufacturing cost, because do not need the magnetic head manufacturing, store and process different configuration.

These substantially identical parts (not shown) can also have achirality (achiality at least twice, namely non-handedness), make them substantially can have nothing to do (orientation-agnostic) with orientation in an assembling process thus.Such as, machine can place " top " magnetic head with random rotation (angle) orientation, then with contrary but second bottom magnetic head is placed in the orientation that angle aspect remains random.For example, if the profile of magnetic head is square, what do so is only the turning of alignment of top magnetic head and bottom magnetic head, guarantees that the path of each magnetic head will also be aim at thus.Be understandable that, the magnetic head manufacturing other shape also can realize above-mentioned identical achirality.This considerably improves and manufacture flexibility reduce cost, be enough to pickup two magnetic heads this is because such as only need to have for the manufacture of the machine of these devices, place a magnetic head with the orientation contrary relative to another magnetic head, then aim at the wisdom at turning.

Integrated inductor device

With reference now to Fig. 7, show the exemplary top substrate magnetic head 702 of multiple ring-shaped inductors device.In the present embodiment, magnetic head 702 comprises multiple winding 108, and one or more electronic unit receives pad 704.Be understandable that, the feature of the head substrate magnetic head 702 in Fig. 7 can be used in conjunction with any the above embodiments together, include but not limited to single annular, part wiring and/or wireless embodiment.

The example head substrate 702 of the present embodiment also has another advantage being better than prior art wire-wound inductor device.Namely, pad 704 can be received with one or more electronic unit and print windings section 104,204 in combination.Then use these electronic units to receive pad 704, between each winding 108 of ring-shaped inductors device 100,200, installation example is as surface-mountable electronic unit (such as chip capacitor, resistor, integrated circuit etc.).This achieve the integrated inductor device not only using toroidal core, and provide integrated customer solution.This also gets rid of the demand of discrete capacitor/resistor.In addition, RLC matching network or other this type of circuit can be embedded in PCB or other substrate.Such as, a lot of known magnetic circuit such as used in Gigabit Ethernet (Gigabit Ethernet) circuit topology make use of the terminal being commonly called as " Bob Smith (Bob Smith) " terminal known in industry.These terminals use the multiple resistors be connected in parallel with ground capacitor usually.Such as, be illustrated in issue on April 7th, 1998 authorize the people such as Townsend, name is called the U.S. Patent number 5736910 of " Modular iack connector with a flexible laminate capacitor mounted on a circuit board (having the modular jack connector of the flexible laminate capacitor installed on circuit boards) ", the document is all incorporated by reference here.By providing for these circuit units the installation site be directly installed on substrate magnetic head 702, integrated magnetics solution can be provided with minimum fringe cost.

Other loop configuration inductance device

In another embodiment, planar annular magnetic core (not shown) can be used, and do not use the traditionally shaped toroidal core 110,210 in the example embodiment of 1-7 figure above.Planar annular magnetic core can be used in all described above-described embodiments, include but not limited to: the embodiment of part wiring, wireless, single annular and many annulars.Planar annular magnetic core tool has the following advantages: it is thinner, and can use thinner PCB and more highdensity path thus.Planar annular magnetic core also tool has the following advantages: it has the surface area (being greater than the surface area of traditional endless magnetic core) of increase.Advantageously, the surface area of this increase can be used for holding more track and more kinds of locus configurations (such as comprising cross track), and can realize the distance of change between circuit paths.In addition, planar annular magnetic core can by partly integrated, and wherein circuit for signal conditioning is placed on magnetic core on the surface.

Other than ring type inductance device

In yet another embodiment, one or more magnetic that the chamber of above-mentioned inductance device, winding path and wiring centers magnetic core (in suitable situation) can be adapted to receive non-circular shape penetrates magnetic core (not shown).Some examples of other than ring type magnetic core include but not limited to: E shape magnetic core, cylindrical bar, " C " type or " U " type magnetic core, EFD or ER type magnetic core, the bitubular (binocular) magnetic core and pot magnetic core.But can recognize, toroidal core, such as herein relative to those toroidal cores (see toroidal core 110,210) that 1-6 figure describes, to there is many advantages brought by the geometry of these magnetic cores.That is, the geometry of annular has space and the effective device of power for inductance device provides, and it has quite low EMI characteristic.

High-frequency coupling

As shown in 8-8b figure, multiple winding track can also each other closely but arrange in the magnetic head of device 100,200 or the different layers of related substrate.This configuration, can be very useful as high-frequency signal coupling.Be understandable that, the embodiment of 8-8b figure can use together with the embodiment of any above-mentioned inductance device 100,200, includes but not limited to many annulars, single annular, embodiment that is wireless and that partly connect up.

Specifically, ground (G), just (+) of coupling transformer and negative (-) winding can be set in the different layers of magnetic head or substrate (such as FR-4PCB etc.), and by dielectric, they be separated.Then described winding and dielectric can be used to form capacitance structure 800, and between different winding, provide induction (magnetic) field to be coupled.

This configuration is similar to the method for crosstalk reduction and compensation in modular connector field, such as, what be illustrated in issue on December 25 calendar year 2001 authorizes Bareel's, the U.S. Patent number 6332810 that name is called " Modular telecommunication jack-type connector with crosstalk reduction (reducing the modular telecom jack type connector of crosstalk) ", its full content is hereby incorporated by reference, the document discloses a kind of modular jack connector that there is crosstalk compensation and arrange, it comprises the spring beam contact portion (S4 being connected to terminal, S6) parallel metal sheet (P4, P6).According to this invention, described plate is the metal surface of parallel installation, to form physical capacitor, reduce different conductor between known crosstalk effect, particularly near-end cross (Near End CrossTalk) or NEXT.As another example, in on June 25th, 2002 issue authorize Reede, name is called that the U.S. Patent number 6409547 of " Modular connectors with compensation structures (having the modular connector of collocation structure) " discloses one and comprises Modular connector system, it comprises the plug and socket being all arranged for high frequency data transfer, and the document is also all hereby incorporated by reference.This connector system comprises several counter coupled (counter-coupling) or collocation structure, and each structure all has special reduction crosstalk function.Described collocation structure is designed to offset (offset) to the electric capacity and inductance coupling high that depend on frequency and carry out electric equilibrium thus.Described a kind of collocation structure is arranged near contacts, and forms conductive path between the bonder terminal and the bonder terminal of plug of socket, and this collocation structure comprises several parallel capacitor board.According to this invention, described plate is placed on the outside in the path that the rear side of spiral arm spring contact and following electric current flow through, and the high-frequency signal of the contact from plug and socket is sent to the collocation structure in the high-frequency signal path from plug to socket by described electric current.

In fig. 8, the example capacitance structure 800 be placed in magnetic head or substrate is shown.In the present embodiment, the layer that can arrange the magnetic head substrate of winding thereon comprises capacitor board 802.Each capacitor board 802 is physically attached to the independent winding 804 of winding to 806.Described winding 804 can be the outside winding (namely 106 in Fig. 1 f) of bottom magnetic head, or can be outside or the inner winding (namely, being 102 and 122 of Fig. 1 f respectively) of top magnetic head.Will also be appreciated that in wireless embodiment, winding 804 can as the example of the inside winding of bottom magnetic head (namely, 116 in Fig. 1 f).

With bedded structure, place the capacitor board 802 in the embodiment of Fig. 8 substantially in parallel with each other, to set up above-mentioned induction (magnetic) field coupling between winding is to 806 (comprising winding 804).Capacitor board 802 is designed to have previously selected overlapping, and this overlapping makes the electric capacity between plate maximize, and the amount making the high-frequency energy between contact be coupled thus maximizes.In addition, in order to obtain best compensation, calculate and the size of control capacittance plate 802 and the selection of dimension, and they are relative to each other and/or relative to dielectric distance.Capacitor board 802 can comprise metal or metal alloy, or other suitable electric conducting material any.

The embodiment of Fig. 8 a shows with unstratified parallel to placement capacitor board 802.But, although remain parallel, but be placed in mutually the same plane by the capacitor board 802 of Fig. 8 a, set up thus and be intended to strengthen winding to the favourable capacitance field of the high-frequency coupling of 806 (comprising winding 804), wherein capacitor board 802 extends from described winding 806.

Fig. 8 a also describes and place capacitance structure 800 in the main body of magnetic head or substrate 812.As mentioned above, magnetic head or substrate can include but not limited to top magnetic head, bottom magnetic head or PCB.

In addition, as shown in Figure 8 b, can in capacitance structure 800 stacking any amount of capacitor board 802, with increase winding to 806 high-frequency coupling.This realizes in the following way: the capacitor board 802 placing a certain quantity on winding 804, so that the space setting up q.s holds dielectric and other capacitor board with desired distance (if necessary, this can change with different plate) place among each other.Then, with the same way with the first winding 804, winding another winding 804 to 806 is placed the capacitor board 802 of setting quantity.The position of capacitor board 802 on the first and second windings 804 will offset (offset) to some extent, to make the capacitor board 802 of the first winding 804 drop between the capacitor board 802 of the second winding 804, set up the structure with capacitor board 8021,8022...802n thus.When placing the winding 804 of winding to 806 adjacent to each other, establishing the high surface area of capacitance structure 800, thus providing the high-frequency coupling of increase.

Sheathed winding

Except the consideration of physics and manufacture, it is also conceivable to the electrical property of inductance device.A kind of means being used for measuring electrical property are high potential (withstand voltage) tests.In order to provide enough insulation and provide higher tolerance thus, in May 1 calendar year 2001 issue authorize Machado, name is called that jointly all U.S. Patent numbers 6225560 of " Advanced electronic microminiature package and method (advanced electronic microencapsulated and method) " disclose a kind of sheathed insulated conductor, it is used as at least one winding of toroidal transformer, and the document is all incorporated by reference at this.Such as, this sheathed wire can be used according to part wiring embodiment of the present invention.

Underfill

And above-described embodiment of device can also utilize underfill or the Vacuum bottoms filling technique of standard, to increase tolerance and to prevent flashover (flashover).Tolerate to enable inductance device described herein and apply high-potential voltage (withstand voltage) between adjacent conductive assembly, with dielectric substance, each conductive component must be insulated effectively, to prevent electric arc.

The example conductive component found in published inductance device is: the extension path formed in top, bottom magnetic head or other magnetic head modification, BGA interconnection between the magnetic head of upper and lower, stencil printing between the magnetic head of upper and lower and reflux solder interconnection, conductive epoxy resin interconnection between the magnetic head of upper and lower, the conductive winding assembly that magnetic head is formed, and the conductive winding assembly formed on magnetic core etc.

Countless versions technique can be adopted to realize electric isolution that is above-mentioned and similar conductive component.In semiconductor electronic package field, known a kind of such technique is commonly called as " underfill ".Underfill comprises epoxy resin, and it mixes with the solid particle comprising pottery, silicon dioxide or other similar common compounds usually.Underfill has a lot of formulas affecting special properties, such as thermal coefficient of expansion, heat trnasfer and for the capillary flow dynamic characteristic required for often kind of unique application.As described herein, also there is the known method of multiple application underfill; But these methods are only exemplary methods, they do not limit and other known method are used for disclosed inductance device.

Common application process is like this capillary force utilized between underfill and magnetic head, with in the interval that restriction was drawn or be drawn onto to this material or " gap ", and the interval between such as, magnetic head after assembling or gap.Described material distributes near described interval, and flows through described interval by means of capillary force, seals the conductive component of all exposures be arranged in described interval thus completely.Then described assembly is exposed to the temperature of rising, the temperature of this rising makes cross linking of epoxy resin and solidifies.

Another common methods of underfill application is called on " B rank solidification (B-stage curing) ".This application process is included in the upper silk screen printing of substrate (such as magnetic head) or this underfill of stencil printing.Substrate is equipped with conductive interconnecting structure, and it ends in solder layer usually.The those of ordinary skill in Electronic Packaging field is understandable that, in fact substrate can be included in the multiple separate parts arranged in unified panelization array, can carry out Large Copacity process thus.Then by the exposure of substrates after printing at specific temperature, the solidification of this temperature section ground solidified polymeric layer, make it glutinous dry thus, but be not fully cured.Then can process coated substrate like a cork, and proceed to parts placement technique, thus parts are placed on the top of partially cured polymeric layer, and aim at the electrical interconnection corresponding with it be placed on substrate top layer.Once parts have been placed, be then exposed in solder reflow process by assembly, in the process, described partially cured underfill liquefaction, around the conductive component flowing be arranged in described interval.Along with ambient temperature raises further, solder structure liquefies, the electrical interconnection on parts and form pad between the corresponding electrical interconnection being arranged on substrate.Along with temperature reduces, solder solidification, and underfill is completely crosslinked subsequently, and around conductive component solidification, form epoxy coating around all conductive components thus.

This type of technique of another kind underfill being applied to assembly adopts the technique being called Vacuum bottoms and filling.Usually, this technique performs as the final treatment step after magnetic head and parts being welded or combined.Assembly is placed in the chamber, is substantially found time by air wherein by means of vacuum pump or similar device.Then underfill is distributed near the described interval between magnetic head, is sometimes assigned in described interval, then make air get back in chamber, thus by means of air pressure difference, underfill is pressed in all gaps in assembly.

Another exemplary method encapsulating conductive component in dielectric coating uses vapor deposition process.These techniques are common in electronics and semiconductor applications, wherein assembly are exposed to chemical gas, and described chemical gas, by pyrolysis or electromagnetic means, modification occurs, and deposit subsequently over the assembly.Such technique is an application Parylene coating, and wherein vaporising under vacuum dimerization hydrocarbon polymer (dimer hydrocarbon polymer), produces hydrocarbon dimer (hydrocarbon dimer) gas.Then the dimer gas pyrolysis will produced, by its structurally-modified one-tenth monomer.Subsequently using this monomer as continuous polymer film, be deposited in whole inductance device structure, thus all assembly (conduction and nonconducting) encapsulated in the dielectric material.The outstanding advantages of this technique is the high dielectric strength of the deposited polymer film that result obtains, the Large Copacity manufacturing capacity of this technique, and gas penetration is to the apertured ability of this structure, set up void-free continuous coated thus on all conductive components, and no matter their geometry is how.

Example inductive device or inductance device application

Inductor and inductance device, relative to those inductors of 1-7 figure description and inductance device such as, can be widely used in various simulation and signal processing circuit.Inductor and inductance device form tuning circuit in conjunction with capacitor and other parts, and described tuning circuit can strengthen or the specific signal frequency of filtering (such as, DSL filter).Various embodiment of the present invention easily can be applicable to any amount of different induction device or inductance device application.These application can from the use of larger inductor in power supply, to the small electric sense transmitting radio frequency interference each device for preventing in a network.Inductor of the present invention or inductance device can also easily be applicable to common mode choke coil or inductive reactor, described common mode choke coil or inductive reactor prevent electromagnetic interference (EMI) and radio frequency interference (RFI) from applying extensive in be all useful.

Less inductor/capacitor can also used to combine with in the tuning circuit used in radio reception and/or broadcast.Two (or multiple) inductors with couples magnetic flux can form transformer, and described transformer is useful in the application such as needing to isolate between device.Inductor of the present invention and inductance device can also be applied in power supply and/or data transmission system, use them to suppress system voltage or fault current limiting etc. wittingly in these application scenarios.Inductor and inductance device and being applied in electronic applications of they are known, will no longer discuss further it at this.

In one aspect of the method, can by adaptive for the apparatus and method described herein parts used for the formation of micro-machine, the such as parts of small-sized cage type induction motor.As is known, this induction machine uses rotor " cage " (rotor " cage "), and this rotor " cage " is made up of the substantially parallel sliver arranged with cylindrical configuration.The path such as, described before can using and winding portion assign to form this cage, or can also form the magnetic field winding (stator) of this motor.Because induction machine is not applied to the magnetic field of rotor windings, so do not need and the electrical connection of rotor (such as commutator etc.).Therefore, path and windings section can form their electrical interconnections but the conductive path of still electrical separation, flow wherein (as responded to by mobile stator field) for electric current.

The manufacture method of radio induction device

Present detailed description is relative to the manufacture method of the radio induction device 100,200 described in 1-1o figure.In order to object discussed below, assuming that magnetic head 102,108 provides by means of any amount of known manufacturing process, described technique such as comprises LTCC and burns altogether, forms the magnetic head etc. of multilayer based on fiber, but these materials and formation process never apply any restriction to the present invention.

Also will be appreciated that, although following description is with regard to the previously described embodiment of this paper, but method of the present invention is usually by suitably transforming, be applied to various other configuration and embodiments of inductance device disclosed herein, this transformation belongs to electronic installation and manufactures within the scope of the Knowledge Capability of the those of ordinary skill in the art in field.

With reference now to Fig. 9 a, be shown specifically and describe first exemplary method 900 manufacturing radio induction device (such as shown in Fig. 1).In step 902, top magnetic head is connected up and prints, to form the top section of winding for inductance device.Wiring and the printing of substrate (such as, based on the substrate of glass fibre) are known.Connecting up and printing in the first exemplary process of top magnetic head, usually get out path with the microbit that other suitable material of solid tungsten carbide is made.Usually the automatic drilling machine by through hole being arranged on exact position performs described boring.In some embodiment needing minimum path, due to wearing and tearing and the damage of two-forty, so may be very expensive with mechanical drill boring.In this case, " evaporation " described path can be carried out by using laser well known in the art.Can also use and other technology of path (be included in mother substrate/magnetic head be molded or be shaped time) is provided.

Then for the substrate with two-layer or multilayer, with copper or other material or alloy plating these get out or the wall in hole that formed, to form plated through hole, the conductive layer of these through holes electrical connection magnetic head substrate, thus form the windings section between the top surface and lower surface of magnetic head.In one embodiment, the material for the formation of the coating section of through hole is extended through head surface.Any amount of known additive process can be used or subtract into technique to print top winding 104.Three kinds of the most frequently used techniques that subtract into are: (1) silk screen printing, and it uses the etching technics of the copper facing on anticorrosion ink protective substrate-subsequently to remove undesired copper facing usually; (2) photoetching (photoengraving), it uses " light shield " and chemical etching process from substrate removal of copper paper tinsel; (3) PCB grinding, it uses 2 or 3 shaft mechanical grinding systems to grind away layers of copper from substrate, but a rear technique is not used in the product manufactured in enormous quantities usually.So-called additive process can also be used, such as laser direct forming.These techniques are known for those of ordinary skill in the art, and after knowing present disclosure, easily can be applied in the present invention, be no longer discussed further it at this.

In step 904, connect up and print bottom magnetic head, relative to those treatment steps that step 902 is discussed above being similar to.In step 906, magnetic core is placed between top magnetic head and bottom magnetic head.

In step 908, in conjunction with top magnetic head and bottom magnetic head, form the winding around placed magnetic core thus.Exist for the many possibilities in conjunction with top magnetic head and bottom magnetic head.A kind of exemplary method comprises and such as in the internal path and external path of bottom magnetic head, adds ball bar array (BGA) type soldered ball.Then top magnetic head is placed (and alternatively clamp) at the top of bottom magnetic head, and use solder reflow process (such as IR reflux technique) to come in conjunction with described top magnetic head and bottom magnetic head.Such as, can use hollow out version printing technology and Reflow Soldering, it can be ultrasonic welding technique, or even can use conductive adhesive (avoiding Reflow Soldering thus).

In step 910, test the assembly combined, to guarantee to define its exact connect ion that should have and part function.

Being understandable that, by a little transformation, can be the said method of the wireless annular inductance device assembly of form use of single annular and many ring devices.In addition, can recognize, in two parts embodiment, only need a magnetic head, avoid formation and the step in conjunction with second magnetic head, this is conducive to placing winding on the surface of toroidal core or on the copper strips extending past toroidal core.

With reference now to Fig. 9 b, disclose and describe the second exemplary method 950 of fabrication portion wiring inductance device 200 (such as shown in Fig. 2).In step 952, connect up and print magnetic head, this is similar previously in step 902 discussed above, but except only holing to outside winding path/be shaped, plating and/or extension, do not need in the present embodiment to carry out inner winding path.

In step 954, wiring core center is placed in the chamber of magnetic head.Wiring core center is connected to the winding be distributed on magnetic head.The manufacture of wiring core center will be described in detail below.

In step 956, magnetic core is placed in the chamber of magnetic head.

According to step 958, next top winding is placed on the top of magnetic core.Winding directly can be placed on the surface of magnetic core, or can winding be placed on copper strips, then copper strips is placed on magnetic core top.

In step 960, optionally, assembly is tested, and then prepare to be installed on consumer products, printed circuit board (PCB) in such as communication system etc.

Manufacture the method for wiring core center

As shown in Figure 10, the exemplary method 1000 of the wiring core center 202 of fabrication portion wiring inductance device 200 (describing relative to 2-2f figure) will be described now in detail above.

As according to step 1002, first magnet wire is placed in pressurizing unit.

In step 1004, to be stretched wire by punch die, and moved in mold.Described mold will determine wire position relative to each other, and such as, wire can be formed as the concentric circles in wire harness by mold, or in another example, wire can be formed as the layout of precise intervals by mold.Be understandable that, multiple conductor configurations can be formed according to mold structure.Such as, as previously discussed, wire is placed as and can changes the device electrical characteristics because capacity effect causes closer to (or further from) each other

In step 1006, harness material is injected in the mold comprising small diameter wire.Described harness material can be plastics or other suitable material with appropriate characteristics any.

In step 1008, bunch will be become to enclose in sheath.Sheath can be made up of above-mentioned material, or can comprise the material being more suitable for increasing voltage-withstand test.

Finally, in step 1010, by enclose sheath, the wire of bunchy disconnects or is stitched into little column part, this column part will be placed in the toroidal core of inductance device.

It will also be appreciated that exemplary device 100,200 as described herein can stand the test of production in enormous quantities method.Such as, in one embodiment, multiple device is formed with using common magnetic head material sheet or member parallel.Then, by such as stripping and slicing, cutting, the ready-made connection of fracture etc., (singulate) these single assemblies are isolated from common assemblies.In a modification, in the common sheet or layer of such as LTCC or FR-4, form top and the bottom magnetic head 104,106 of each device, and terminal pad (such as by hollow out version plating or suitable process) is set on the bottom exposed or top surface of each device.Then top and bottom magnetic head " sheet " are immersed in electroplating solution, to carry out plating to path and the windings section 108/208 that formed on all devices simultaneously.Then toroidal core is inserted between each, and as previously described, Reflow Soldering or gluing is carried out to two sheets, form parallel multiple devices thus.Then separate these devices, form multiple single assembly.Such an approach achieves manufacture efficiency and the process consistency of high level, thus reduce the manufacturing cost because process variability causes and loss.

Although it should be understood that the particular order of steps with regard to method describes some aspect of the present invention, these descriptions are only the illustrations of more extensive method of the present invention, and can modify according to the requirement of application-specific.In some cases, some step may be unnecessary or optional.And, some step or function can be added in disclosed embodiment, or the execution sequence of two or more steps of exchange sequence.All these modification are all considered to be included in disclosed and ask herein in the scope of the present invention protected.

Although above-mentioned detail specifications illustrates, describes and points out the novel feature of the present invention being applied to multiple embodiment, but be understandable that, multiple omission, replacement and change can be made to the form of illustrated device or technique and details not departing from art technology under condition of the present invention.Explanation is above that best mode of the present invention is implemented in design at present.This specification never means that work restricts, but should it can be used as illustrating General Principle of the present invention.Scope of the present invention should be determined with reference to claims.

Claims

1. a radio induction device, comprising:

Multiple substrate, each substrate comprises at least part of copper-plated outer surface, substrate described in each has one or more winding formed thereon, and also comprise multiple extension conductor, extending from described outside copper coatings at least partially of described multiple extension conductor, and extending substantially across described substrate, this extension conductor provides an electrical connection between the substrates; And

One magnetic penetrates magnetic core, and described magnetic core is arranged between described multiple substrate at least partly;

Wherein, described multiple substrate comprises at least three substrates, and it comprises a head substrate, a bottom substrate and one or more Intermediate substrate; And

One second magnetic penetrates magnetic core, and described second magnetic penetrates the electronic unit of magnetic core and described multiple substrate, integration and described magnetic penetrates together with core combination, forms a complete filter circuit.

2. radio induction device as claimed in claim 1, in wherein said substrate, described multiple extension conductors of a first substrate extend above an interior surface of described first substrate, thus connect with the corresponding person in the described extension conductor of a second substrate in described substrate.

3. radio induction device as claimed in claim 2, one or more winding wherein said and described multiple extension conductor and described magnetic penetrate magnetic core physical isolation.

4. radio induction device as claimed in claim 1, also comprise one be arranged on described multiple substrate at least one in capacitance structure, described capacitance structure comprises multiple capacitor board, and described multiple capacitor board is generally parallel placed each other with bedded structure.

5. manufacture a method for a radio induction device, it comprises:

Multiple conductive winding is arranged on one first and second substrate magnetic head;

Multiple magnetic core is at least partially disposed between described first and second substrate magnetic heads;

The electronic unit of integration is arranged at least one in described first and second substrate magnetic heads; And

By multiple elongated end extended from the surface of described first substrate magnetic head, described first and second substrate magnetic heads are combined, thus forms the complete filter circuit be made up of described radio induction device.

6. method as claimed in claim 5, also comprises:

Form described first and second substrate magnetic heads, make them substantially mutually the same, described first and second substrate magnetic heads also comprise achirality at least twice.

7. method as claimed in claim 5, the wherein said action arranging described multiple conductive winding comprises according at least two different angle intervals limited to arrange described multiple conductive winding.

8. method as claimed in claim 5, be also included in described first or second substrate magnetic head at least one on arrange one from lead contact.

9. method as claimed in claim 5, also comprises and carries out underfill, to increase the opposing for high-potential voltage to the first and second substrate magnetic heads of described combination.

10. an inductance device for part wiring, it comprises:

Multiple substrate, substrate described in each has one or more conductive path formed thereon;

One wiring core center, described wiring core center comprises the magnet wire of a molded bunchy;

One magnetic penetrates magnetic core, and described magnetic penetrates magnetic core and is at least partially disposed between described multiple substrate,

Multiple outside winding path, described multiple outside winding path is arranged in each of described multiple substrate at least partly and described magnetic penetrates the outside of magnetic core; And

One or more winding, one or more winding described is formed in described magnetic and penetrates around magnetic core, and each in one or more winding described to comprise in the magnet wire of described molded bunchy, described multiple outside winding path and one or more conductive path described at least partially.

The inductance devices of 11. part wirings as claimed in claim 10, wherein multiple substrate described in each also comprises multiple extension path arranged thereon, described multiple extension path at least partially with described multiple substrate interconnect.

The method of the inductance device of 12. 1 kinds of fabrication portion wirings, it comprises:

One and first and second winding materials of substrate magnetic head electric connection are set, wherein said winding material comprise a wiring core center at least partially;

Wiring core center in the wherein said inductance device being used in the wiring of described part is formed according to following method, and it comprises:

Obtain multiple magnet wire;

Molded described multiple magnet wire; And

Disconnect described molded magnet wire

One magnetic core is at least partially disposed between described first and second substrate magnetic heads; And

Described first and second substrate magnetic heads are combined, thus forms the inductance device of described part wiring.

13. methods as claimed in claim 12, wherein by sealing described molded magnet wire with a sheath material, form described wiring core center further.

14. 1 kinds of radio induction devices, comprising:

One first substrate, described first substrate comprises one at least partly by the outer surface of conduction plating, described first substrate has one or more windings section formed thereon, and also comprise more than one first extension conductor, described more than first of described first substrate extend being extended by the outside on the surface of conduction plating at least partly from described in it at least partially of conductor, and extend through described first substrate, thus raise above an interior surface of described first substrate;

One second substrate, described second substrate comprises the outer surface of an at least part of conduction plating, and described second substrate has one or more windings section formed thereon; And

One first magnetic penetrates magnetic core, and described first magnetic penetrates magnetic core and is at least partially disposed between described first and second substrates;

Wherein when assembling described radio induction device, described in each, more than first extends conductor and described second substrate electric connection, thus forms the power path penetrating magnetic core setting at least in part around described first magnetic;

Wherein, described radio induction device also comprises one second magnetic and penetrates magnetic core, and described second magnetic penetrates the electric parts of magnetic core and described substrate, integration and described first magnetic penetrates together with core combination, forms a complete filter circuit.

15. radio induction devices as claimed in claim 14, also comprise one be arranged on described first or second substrate at least one in capacitance structure, described capacitance structure comprises multiple capacitor board, and described multiple capacitor board is generally parallel placed each other with a bedded structure.

16. radio induction devices as claimed in claim 14, at least one of wherein said first and second substrates comprises one and is suitable for receiving described first magnetic at least partially and penetrates the groove of magnetic core.

17. radio induction devices as claimed in claim 16, several persons in described multiple extension conductors of wherein said both first and second substrates are arranged on the form of essentially concentric in both inner side and outer side of radial direction of described groove, thus form the inner ring and outer shroud that extend conductor around described groove.