CN102291859A - Method for manufacturing internal-heating reinforced composite board connected by hot-melting wafer - Google Patents
Method for manufacturing internal-heating reinforced composite board connected by hot-melting wafer Download PDFInfo
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- CN102291859A CN102291859A CN2011102291332A CN201110229133A CN102291859A CN 102291859 A CN102291859 A CN 102291859A CN 2011102291332 A CN2011102291332 A CN 2011102291332A CN 201110229133 A CN201110229133 A CN 201110229133A CN 102291859 A CN102291859 A CN 102291859A
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Abstract
The invention discloses a method for manufacturing an internal-heating reinforced composite board connected by a hot-melting wafer. The method comprises the following steps: 1, adhering external wiring electrode plates (4) to two ends of a circuit board (3) which is printed on the upper surface of a lower substrate (2); 2, on an upper substrate (1), arranging line holes (6) with sealing plastic plugs (8) at positions corresponding to outgoing lines, wherein the two outgoing lines (5) pass through holes in the middle of the sealing plastic plugs (8) and extend out of the upper substrate (1); and 3, clamping the hot-melting wafer (7) between the upper substrate (1) and the lower substrate (2), vacuumizing the space between the upper substrate (1) and the lower substrate (2) in connection, heating the hot-melting wafer (7) to for melting the hot-melting wafer (7) into liquid, sealing and adhering the circuit board (3) between the upper substrate (1) and the lower substrate (2) by using the hot-melting wafer liquid, and finally cooling to obtain the internal-heating reinforced composite board.
Description
Technical field
The present invention relates to a kind of preparation method who adopts the internal heat generation reinforced composite board material of hot melt wafer connection.
Background technology
At present, the just plank that substrate adopts in the known compound internal heat generation sheet material, the plank composite methods is that the heating wiring board is imprinted on the paper, coat liquid adhesive glue handle with two planks then and stamp the paper clamp of heating wiring board in the middle of two planks, be composited by heating and pressurizing, but interior hot plank range of application is limited, and plank multilayer in recombination process has been used a large amount of adhesive glues, some harmful chemicals of meeting slow release polluted indoor environment after these adhesive glues were heated
Summary of the invention
The invention provides a kind of preparation method who adopts the internal heat generation reinforced composite board material that the hot melt wafer connects, adopt the composite board of this method preparation not only can prevent craze and transfiguration, immersion and cause damage, and very energy-conserving and environment-protective, environment protected effectively.
The present invention has adopted following technical scheme: a kind of preparation method who adopts the internal heat generation reinforced composite board material of hot melt wafer connection, it may further comprise the steps: step 1, upper surface with infrabasal plate is printed on wiring board earlier, is pasted with the external connection battery lead plate at the wiring board two ends; Step 2 is welded with lead-out wire respectively on two external connection battery lead plates, have the line hole at upper substrate and the corresponding position of lead-out wire, fills in the sealed plastic plug in the online hole, and the through hole that two lead-out wires pass in the middle of the sealed plastic plug stretches out upper substrate; Step 3, between upper substrate and infrabasal plate, accompany the hot melt wafer, upper substrate and infrabasal plate coincide and link together, then to vacuumizing between upper substrate after connecting and the infrabasal plate, make and form no air tight connecting between upper substrate and the infrabasal plate, again the hot melt wafer is heated, the hot melt wafer that is clipped between upper substrate and the infrabasal plate is melted into liquid, the hot melt wafer seal bond that wiring board is liquefied is made the internal heat generation reinforced composite board after cooling off at last between upper substrate and infrabasal plate.
Upper substrate is glass plate, ceramic wafer, marble slab, terrazzo plate or other hard plate materials in step 1 of the present invention and the step 3.Infrabasal plate is glass plate, ceramic wafer, marble slab, terrazzo plate or other hard plate materials in step 2 of the present invention and the step 3.Wiring board in the step 1 of the present invention is printed on the infrabasal plate by heating carbon slurry.The hot melt wafer of step 3 of the present invention is EVA or PVB hot melt wafer, and the temperature that the hot melt wafer is heated is 120 ℃, and be 40min heating time.
The present invention has following beneficial effect: the present invention adopts glass plate, ceramic wafer, marble slab, terrazzo plate or other hard plate materials to make upper substrate and infrabasal plate; link together by EVA or PVB hot melt wafer between upper substrate and the infrabasal plate and make the internal heat generation reinforced composite board; this method is nontoxic in the process that the preparation composite plate is made; pollution-free; very energy-conserving and environment-protective; protect environment effectively; and the composite board of preparation can be used as writing surface or tea table face; make the hand of learning winter to write not cold, the tea of having tea is not cool.Can be on the ground as floor heating heating floor tile.Can also make insulating box with the sheet material of this heating, be applied to R﹠D institution laboratory and hospital, applied range can prevent simultaneously craze and transfiguration, immersion and causes damage.
Description of drawings
Fig. 1 is the structural representation of the composite board of the present invention's preparation
Embodiment
The invention discloses a kind of preparation method who adopts the internal heat generation reinforced composite board material of hot melt wafer connection, it may further comprise the steps: step 1, upper surface with infrabasal plate 2 is printed on wiring board 3 earlier, wiring board 3 is printed on the infrabasal plate 2 by heating carbon slurry, be pasted with external connection battery lead plate 4 at wiring board 3 two ends, infrabasal plate 2 is glass plate, ceramic wafer, marble slab or terrazzo plate; Step 2, on two external connection battery lead plates 4, be welded with lead-out wire 5 respectively, have line hole 6 in upper substrate 1 and the corresponding position of lead-out wire, upper substrate 1 is glass plate, ceramic wafer, marble slab or terrazzo plate, fill in the through holes that sealed plastic plug 8, two lead-out wires 5 pass in the middle of the sealed plastic plug 8 in the online hole 6 and stretch out upper substrate 1; Step 3, between upper substrate 1 and infrabasal plate 2, accompany hot melt wafer 7, hot melt wafer 7 is EVA or PVB hot melt wafer, upper substrate 1 coincide with the hot melt wafer that is clipped in the middle with infrabasal plate 2 and links together, then to vacuumizing between upper substrate 1 after connecting and the infrabasal plate 2, form no air tight connecting between the hot melt wafer that makes upper substrate 1 and infrabasal plate 2 and be clipped in the middle, again hot melt wafer 7 is heated, the temperature that hot melt wafer 7 is heated is 120 ℃, be 40min heating time, the hot melt wafer 7 that is clipped between upper substrate 1 and the infrabasal plate 2 is melted into liquid, hot melt wafer 7 seal bond that wiring board 3 is liquefied are between upper substrate 1 and infrabasal plate 2, cool off at last and make internal heat generation reinforced composite board material, can lead to the 45V direct power 15 minutes at lead-out wire 5 like this, glass surface just can reach 30 ℃.
In Fig. 1, the composite board of the present invention's preparation comprises upper substrate 1 and infrabasal plate 2, upper substrate 1 and infrabasal plate 2 all are glass plate, ceramic wafer, marble slab, terrazzo plate or other hard plate materials, upper substrate 1 and infrabasal plate 2 are set to hard laminate, wiring board 3 is arranged on infrabasal plate 2, be pasted with external connection battery lead plate 4 in the both sides of wiring board 3, external connection battery lead plate 4 is a copper sheet, be welded with lead-out wire 5 respectively on the link electrode plate 4 outside, have line hole 6 in upper substrate 1 and lead-out wire 5 corresponding positions, two lead-out wires 5 are worn cable-through hole 6 and are stretched out upper substrate 1, be provided with sealed plastic plug 8 in the line hole 6, the through hole that two lead-out wires 5 pass in the middle of the sealed plastic plug 8 stretches out upper substrate 1, between upper substrate 1 and infrabasal plate 2, post hot melt wafer 7, hot melt wafer 7 is EVA or PVB hot melt wafer, and upper substrate 1 and infrabasal plate 2 coincide by hot melt wafer 7 and link together.
Claims (5)
1. preparation method who adopts the internal heat generation reinforced composite board material that the hot melt wafer connects, it may further comprise the steps:
Step 1, the upper surface with infrabasal plate (2) is printed on wiring board (3) earlier, is pasted with external connection battery lead plate (4) at wiring board (3) two ends;
Step 2, on two external connection battery lead plates (4), be welded with lead-out wire (5) respectively, have line hole (6) in upper substrate (1) and the corresponding position of lead-out wire, fill in sealed plastic plug (8) in the online hole (6), the through hole that two lead-out wires (5) pass in the middle of the sealed plastic plug (8) stretches out upper substrate (1);
Step 3, between upper substrate (1) and infrabasal plate (2), accompany hot melt wafer (7), upper substrate (1) coincide with infrabasal plate (2) and links together, then going up between basic (1) and the infrabasal plate (2) after connecting vacuumized, make and form no air tight connecting between upper substrate (1) and the infrabasal plate (2), again hot melt wafer (7) is heated, the hot melt wafer (7) that will be clipped between upper substrate (1) and the infrabasal plate (2) is melted into liquid, hot melt wafer (7) seal bond that wiring board (3) is liquefied is made the internal heat generation reinforced composite board after cooling off at last between upper substrate (1) and infrabasal plate (2).
2. the preparation method of the internal heat generation reinforced composite board material that employing hot melt wafer according to claim 1 connects is characterized in that upper substrate in step 1 and the step 3 (1) is glass plate, ceramic wafer, marble slab, terrazzo plate or other hard plate materials.
3. the preparation method of the internal heat generation reinforced composite board material that employing hot melt wafer according to claim 1 connects is characterized in that infrabasal plate in step 2 and the step 3 (2) is glass plate, ceramic wafer, marble slab, terrazzo plate or other hard plate materials.
4. the preparation method of the internal heat generation reinforced composite board material that employing hot melt wafer according to claim 1 connects is characterized in that the wiring board (3) in the step 1 is printed on the infrabasal plate (2) by heating carbon slurry.
5. the preparation method of the internal heat generation reinforced composite board material that employing hot melt wafer according to claim 1 connects, the hot melt wafer (7) that it is characterized in that step 3 is EVA or PVB hot melt wafer, the temperature that hot melt wafer (7) is heated is 120 ℃, and be 40min heating time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102291332A CN102291859A (en) | 2011-08-06 | 2011-08-06 | Method for manufacturing internal-heating reinforced composite board connected by hot-melting wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102291332A CN102291859A (en) | 2011-08-06 | 2011-08-06 | Method for manufacturing internal-heating reinforced composite board connected by hot-melting wafer |
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| CN102291859A true CN102291859A (en) | 2011-12-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011102291332A Pending CN102291859A (en) | 2011-08-06 | 2011-08-06 | Method for manufacturing internal-heating reinforced composite board connected by hot-melting wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115035810A (en) * | 2021-03-05 | 2022-09-09 | 江西华创触控科技有限公司 | LED film screen |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1462082A (en) * | 2002-05-02 | 2003-12-17 | 瓦尔达微电池有限责任公司 | Electrochemical cell with thin electrode |
| WO2009025429A1 (en) * | 2007-08-21 | 2009-02-26 | Dongwha Nature Flooring Co., Ltd. | Impregnated heating sheet, heating board and the method thereof |
| CN201571213U (en) * | 2009-12-11 | 2010-09-01 | 石伟 | Electric heating composite board for geothermal heating |
| CN201764779U (en) * | 2010-09-02 | 2011-03-16 | 许春钢 | Filling material for refrigerating device heat insulation |
| CN102215609A (en) * | 2011-04-21 | 2011-10-12 | 王亚奇 | Internal heating reinforced composite board connected through hot-melt dry film |
-
2011
- 2011-08-06 CN CN2011102291332A patent/CN102291859A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1462082A (en) * | 2002-05-02 | 2003-12-17 | 瓦尔达微电池有限责任公司 | Electrochemical cell with thin electrode |
| WO2009025429A1 (en) * | 2007-08-21 | 2009-02-26 | Dongwha Nature Flooring Co., Ltd. | Impregnated heating sheet, heating board and the method thereof |
| CN201571213U (en) * | 2009-12-11 | 2010-09-01 | 石伟 | Electric heating composite board for geothermal heating |
| CN201764779U (en) * | 2010-09-02 | 2011-03-16 | 许春钢 | Filling material for refrigerating device heat insulation |
| CN102215609A (en) * | 2011-04-21 | 2011-10-12 | 王亚奇 | Internal heating reinforced composite board connected through hot-melt dry film |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115035810A (en) * | 2021-03-05 | 2022-09-09 | 江西华创触控科技有限公司 | LED film screen |
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Application publication date: 20111221 |