CN102290506A - Manufacturing technology of LED (Light Emitting Diode) module with graphical transparent thin-film electrode - Google Patents
Manufacturing technology of LED (Light Emitting Diode) module with graphical transparent thin-film electrode Download PDFInfo
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Abstract
The invention relates to the technical field of a luminous display device, in particular to a novel graphical manufacturing technology of a nanometer material base transparent thin-film electrode; the manufacturing technology is characterized by comprising the following preparing steps of: a. preparing a raw material of a transparent conductive thin-film for standby application; using polyimide or one of PET (Polyethylene Terephthalate), PEN (Polyethylene Naphthalate), PC (Polycarbonate), PVC (Polyvinyl Chloride), PMMA (Polymethyl Methacrylate) and PES (Polyethersulfone) as a transparent flexibility substrate; b. preparing an insulating layer; c. preparing a graphical transparent conductive electrode; d. preparing a double-layer crossing or a multilayer graphical transparent conductive electrode; e. coating an LED (Light Emitting Diode); f. drying; and g. coating the film on the surface. Compared with the prior art, the manufacturing technology has the advantages that the novel thin-film electrode with the graphical function can be manufactured on the flexibly transparent base, the thin-film and the technology are combined with the manufacturing technology of a transparent LED (Light Emitting Diode) display device, a product is transparent and attractive and can be repeatedly bent and used and the manufacturing cost is low.
Description
Technical field
The present invention relates to the light-emitting display device technical field, specifically a kind of graphical manufacturing process of novel nano-material based transparent film electrode.
Background technology
The LED display screen is a kind of luminous device system that carries out the information demonstration by control LED matrix.Some special occasions, need LED display module light transmission good as environment such as glass curtain wall, shopper window, tridimensional advertisement board, stage background, hotel, airports, simultaneously, wish that display screen has bending, function such as flexible, be convenient to install, carrying and maintenance at the display screen in on-plane surface zone.
In publication CN100481448C, provided a kind of transparent LED display that is used for the presentation information of motor vehicle, adopted be coated with transparent conductive oxide film as the glass of conductive path as the display device flexible substrate; Patent CN 201622784U has designed a kind of transparent demonstration, patent CN100514637C based on glass plate and has provided transparent LED display and manufacture method thereof, above patent and other relevant patent of announcing at present all adopt transparent conductive oxide film TCO as conductive path, TCO mainly is divided into these 3 kinds of ITO, FTO and AZO, the preparation technology of TCO conductive film material mainly adopts technique for vacuum coating, need be by expensive equipment, its application price ratio is relatively low.In addition, such transparency conductive electrode film belongs to metal oxide based electric conducting material, therefore the graphical making of such film need be passed through complicated technologies realization patterned conductive paths such as laser ablation, wet etching, one side cost of manufacture height, its technological flexibility is restricted on the other hand.Above patent all adopts glass as the conductive path of the transparent display spare carrier with the TCO film, the hard feature limits of glass itself its range of application can only in plane domain, can't realize the transparent demonstration of curved surface and cambered surface.
Mentioned that in patent CN100514637 display adopts the plastics flexible substrate that is covered with the TCO conductive film, it has flexibility.But TCO belongs to inorganic oxide material, the flexible substrate plastics are organic material, both stress, draftability, surface tension are all different, adhesive force itself is just relatively poor between simultaneously inorganic TCO and the organic plastics flexible substrate, under flexible use occasion, use through alternating bending, based on the TCO film conductive path of plastics flexible substrate situation such as very easily rupture, come off, thereby cause the inefficacy of transparent display spare, so display flexibility and useful life that this patent relates to are restricted.
Along with the progress of nano materials research, at the applied defect of TCO film, research and development multiple novel transparent conductive film, patent CN102087886 for example, CN101697288 and CN102087884 etc. has mentioned the transparent conductive film based on nano silver wire; Patent CN101842446, CN102110489, CN101535395 and CN102017012 etc. has provided carbon nanotube-based transparent conductive film; Patent CN101859858, CN101901640 has related to grapheme material and has been applied to transparent conductive film among the CN101462717.The preparation technology of the transparent conductive film of above novel nano-material base mainly adopts first suction filtration or the spin coating process of transfer press again, this manufacture craft exist tack poor, can't fine patternization etc. problem.In existing process route, does not still have typography such as employing prior art silk screen printing and prepare patterned novel nano-material based transparent film electrode.Can only be used for preparing nontransparent conductive film material as existing silk-screen printing technique and prescription, membrane technology is because be with in the whole immersion solution of circuit board for another example, can all be covered with conductive film on the two sides of circuit board like this, be to can not do the patterned electrodes circuit board like this.
Among the patent CN100514637, the method of attachment of LED light emitting source and circuit electrode is proposed, adopt the toe-in of conventional metals line to close technology Wire-bonding, general gold thread, aluminum steel or the copper cash of adopting, on flexible substrate, such connected mode, the LED light emitting source that very easily causes broken string or distortion to cause lost efficacy.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, preparation on the basis of existing technology has the flexible and transparent circuit board of graphical function transparent membrane electrode, and is applied to make novel transparent LED display spare.
For achieving the above object, design a kind of led module manufacturing process with graphical transparent membrane electrode, it is characterized in that adopting be prepared as follows step: a, material is prepared: carbon nano-tube or nano silver wire or Graphene are ground the back adopt and ultrasonicly evenly be dispersed in the water or be mixed in the terpinol or PVA or PVDF organic solution that has close-burning polyurethane or contain ethyl cellulose, raw material as the preparation transparent conductive film, standby, the weight ratio that described carbon nano-tube or nano silver wire or Graphene account for water or described organic solution is 0.01～5%; The transparent flexible substrate adopts any among polyimides or PET, PEN, PC, PVC, PMMA, the PES, with the transparent flexible substrate clean the back in drying box through 80～120 ℃ of dryings 1～3 hour, standby; B, preparation insulating barrier: adopt membrane or whirl coating technology preparation layer of transparent insulating polymer film earlier, and, form the ground floor insulating barrier with 120 ℃ of bakings 1～2 hour of heating; C, prepare patterned transparency conductive electrode: according to designed circuit layout, upper surface at the ground floor insulating barrier adopts mask in conjunction with membrane technology or droplet membrane process or silk screen printing/roll printing method/inkjet printing or spraying process again, be distributed on the ground floor insulating barrier that is covered with mask the raw material of the above-mentioned transparent conductive film for preparing is even, again with 80～120 ℃ of heat dryings, and be incubated 1～3 hour, after waiting to solidify, remove mask, through 120～150 ℃, sintering 2～5 hours, the film that stays have just formed the patterned transparency conductive electrode of ground floor; D, intersect or during the transparency conductive electrode of multi-layer graphicalization when preparation is double-deck, then on the patterned transparency conductive electrode of ground floor, adopt mask method to repeat to prepare a layer insulating and patterned transparency conductive electrode respectively successively again, obtain the flexible and transparent multilayer circuit board; E, LED pastes and adopts following two kinds of methods: according to designed circuit layout, select the patterned transparency conductive electrode of one deck, the regional two ends that will paste the LED luminous element on selected patterned transparency conductive electrode layer are adopted and are planted gold goal technology or little gluing process and prepare the conduction contact point with curing temperature respectively at 100～130 ℃ cold curing elargol, adopt solid brilliant method or chip mounter that the LED luminous element is fixed between two conduction contact points with the transparent insulation crystal-bonding adhesive then, make the positive and negative end of LED luminous element contact the conduction contact point at two ends respectively simultaneously, adopt heat pressing process that the LED luminous element is fixed on the transparent insulation crystal-bonding adhesive again, the both positive and negative polarity that makes the LED luminous element respectively with the conduction contact point conducting at two ends; Or adopt earlier solid brilliant method or chip mounter that the LED luminous element directly is fixed on selected patterned transparency conductive electrode layer with the transparent insulation crystal-bonding adhesive will to paste on the zone of LED luminous element, respectively drop is in the both positive and negative polarity of LED luminous element with the cold curing elargol to adopt little gluing process then, and the both positive and negative polarity that makes the LED luminous element respectively and its conducting between zone of pairing patterned transparency conductive electrode down; F, drying: 80～100 ℃ of bakings of drying case 1 hour form led module; G, surface coating: preparation one layer thickness is the DLC transparent membrane of 5～20nm on the led module of the one side that is fixed with the LED luminous element.
Described transparent insulation thin polymer film adopts PVAC polyvinylalcohol, Kynoar PVDF, polyvinylchloride, polycarbonate, polyethylene terephtalate, polyvinyl acetate PVAC, polythene-ethenol PEVOH, polymetylmethacrylate, poly-methyl-hydroxy-ethyl acrylate PM/HEA, polystyrene PS, polyurethane PEU, poly-bis-phenol carbonic ester PCR, poly-methyl vinyl ketone PVMK, poly-(3,4-dioxoethyl thiophene), in the poly-p styrene sulfonic acid any is prepared from, or the composite membrane that adopts the combination in any of above-mentioned polymer to be prepared from.
Described cold curing elargol adopts the nano silver wire of length more than 15～25 μ m to be prepared from.
The present invention compares with prior art, can prepare the novel transparent membrane electrode with graphical function on flexible transparent substrate, and this kind film and technology are combined with transparent LED display spare manufacturing process, product is transparent attractive in appearance, and can alternating bending use, cost of manufacture is low.
Description of drawings
Fig. 1 is the structural representation after the transparent flexible substrate surface that is covered with the ground floor insulating barrier prepares the patterned transparency conductive electrode of ground floor in the one embodiment of the invention.
Fig. 2 is the structural representation behind preparation second layer insulating barrier on the basis of Fig. 1.
Fig. 3 is the structural representation of the patterned transparency conductive electrode of the preparation second layer on the basis of Fig. 2.
Fig. 4 is the structural representation behind preparation conduction contact point on the basis of Fig. 3.
Fig. 5 is at the structural representation that pastes the led module that forms behind the LED luminous element on the basis of Fig. 4.
Fig. 6 is the structural representation after the transparent flexible substrate surface that is covered with the ground floor insulating barrier prepares the patterned transparency conductive electrode of ground floor in the another embodiment of the present invention.
Fig. 7 is the structural representation behind preparation second layer insulating barrier on the basis of Fig. 6.
Fig. 8 is the structural representation of the patterned transparency conductive electrode of the preparation second layer on the basis of Fig. 7.
Fig. 9 is the structural representation behind preparation conduction contact point on the basis of Fig. 8.
Figure 10 is at the structural representation that pastes the led module that forms behind the LED luminous element on the basis of Fig. 9.
Embodiment
Now in conjunction with the accompanying drawings the present invention is further described.
Embodiment 1
The transparent flexible substrate: the PET transparent flexible substrate that will have 180 ℃ of heat resistances is clean with the 1:1 mixed liquor ultrasonic cleaning of deionized water and alcohol, puts into 100 ℃ of bakings of drying oven 2 hours.
The ground floor insulating barrier: the PVDF powder dissolution is prepared into the concentration that contains PVDF in dimethylacetamide solvent be 10% dimethylacetamide solution, on above-mentioned transparent flexible substrate, prepare one deck PVDF transparent insulation thin polymer film by membrane technology, heat 120 ℃ and toasted 2 hours, form ground floor insulating barrier 2; Ground floor insulating barrier 2 surfaces are made into regular irregular micro-structural through nano-imprint process, and this depth of microstructure 1～50nm whenever finishes the transparent insulation thin polymer film of one deck as insulating barrier in the technology of back, all implement once above nano-imprint process.
The patterned transparency conductive electrode of ground floor: selecting length for use is 25 μ m, diameter is the nano silver wire 1mg of 80nm, get terpinol 10g, by grinding and ultrasonication, nano silver wire is dispersed in the terpinol, in the terpinol slurry, add ethyl cellulose 600mg, after stirring and dissolving is even, be prepared into translucent electrocondution slurry, on the ground floor insulating barrier,, adopt silk screen print method to prepare the patterned transparency conductive electrode 3 of one deck more again, heat 150 ℃ and toast curing in 2 hours by patterned silk screen, throw off silk screen, form the patterned transparency conductive electrode 3 of ground floor, patterned here silk screen is equivalent to play the effect of mask, referring to Fig. 1.
Second layer insulating barrier: if preparation multi-layer transparent conductive electrode, then at the regional area of patterned transparency conductive electrode 3 upper surfaces of ground floor by being equivalent to the graphical silk screen of mask, adopt polyurethane PU to prepare patterned transparent second layer insulating barrier 4 by silk screen print method, and the baking 1 hour of under 120 ℃, heating, referring to Fig. 2.
The patterned transparency conductive electrode of the second layer: the translucent electrocondution slurry that adopts above-mentioned nano-silver thread preparation again, adopt silk screen print method to prepare the patterned transparency conductive electrode 5 of the second layer by the graphical silk screen that is equivalent to mask at second layer insulating barrier upper surface, then after the baking of heating under 150 ℃ was solidified in 2 hours, throw off silk screen, obtain the transparent multilaminar circuit board, referring to Fig. 3.
The LED luminous element is selected the small-power 0603 type LED of white paster encapsulation for use, in ground floor transparency conductive electrode 3, will paste on the zone of LED luminous element, with length is that the low-temperature setting elargol that 15～25 μ m nano-silver threads are made with traditional handicraft adopts the gluing process preparation to form conduction contact point 7, referring to Fig. 4; Adopt the transparent insulation crystal-bonding adhesive, by solid brilliant technology fixed L ED luminous element 6, the positive and negative polarities of LED luminous element 6 are connected with conduction contact point 7 respectively, thereby make LED luminous element and its patterned transparency conductive electrode of pairing ground floor conducting that is connected down, through 130 ℃ of heating cure 30min, finished the making of flexible and transparent LED display module, referring to Fig. 5.
For weakening the sticking grey ability of contamination on the LED luminous element, the using plasma chemical vapour deposition technique prepares the transparent DLC film that a layer thickness is 10nm in the LED of led module emitter surface.
The transparent flexible substrate: the PVC film that will have 180 ℃ of heat resistances is clean with the 1:1 mixed liquor ultrasonic cleaning of deionized water and alcohol, puts into 100 ℃ of bakings of drying oven 2 hours, and is standby as the transparent flexible substrate.
The ground floor insulating barrier: preparation concentration is 8% the PVA aqueous solution, prepares one deck PVA transparent insulation thin polymer film by whirl coating technology on above-mentioned transparent flexible substrate, heats 120 ℃ to toast to form ground floor insulating barrier 2 in 2 hours.
The patterned transparency conductive electrode of ground floor: with the used positive glue of conventional lithography process, prepare one deck face photoresist in the position that does not need conductive electrode with silk-screen printing technique, through 80 ℃ of dry bakings 1 hour, bombard above-mentioned prepared face photoresist with plasma surface treatment craft by the figure that designs, form patterned mask; Selecting length for use is 30 μ m, diameter is the carbon nano-tube 0.1mg of 100nm, get the PVA of 0.9mg, put into the 20ml deionized water with carbon nano-tube, by stirring and ultrasonication, make the PVA dissolving form solution, even carbon nanotube is dispersed in the solution, and form suspension with viscosity; Above-mentioned suspension is being covered with the film that forms transparency conductive electrode on the PVA film of photoresist by whirl coating technology, with 150 ℃ of sintering 1 hour, solidify, after will adopting exposure to remove photoresist as the face photoresist of mask then, stay the patterned transparency conductive electrode 3 of ground floor, through 60 ℃ of dryings 1 hour, finish the making of the patterned transparency conductive electrode 3 of ground floor, adopt heat pressing process then, with 120 ℃, 1～2kg pressure compresses the surface of the patterned transparency conductive electrode 3 of ground floor, consolidating the adhesion of the patterned transparency conductive electrode of ground floor 3 and PVA transparent insulation thin polymer film, and reduce the contact resistance between the surface carbon pipe, use plasma surface treatment craft again, bombard the face of above prepared gained, referring to Fig. 6.
Second layer insulating barrier: then, utilize patterned silk screen to adopt polyvinylchloride to prepare second layer transparent insulation thin polymer film on the patterned transparency conductive electrode of ground floor upper strata again, through 100 ℃ of bakings 1 hour, referring to Fig. 7 by silk-screen printing technique.
The patterned transparency conductive electrode of the second layer: adopt above-mentioned electrically conducting transparent electricity preparation technology to prepare the patterned transparency conductive electrode 5 of the second layer on the upper strata of second layer insulating barrier 4 again, referring to Fig. 8.
Plant gold goal technology by tradition, adopt the cold curing elargol to plant gold goal respectively by the pre-designed transparency conductive electrode zone that is positioned at LED luminous element 6 both positive and negative polarity edges and form conduction contact point 7, referring to Fig. 9, LED luminous element 6 is selected the low-power LED flip-chip for use, by traditional Flip-Chip Using technology, the both positive and negative polarity of transparent led chip directly is fixedly attached to respectively on the conduction contact point, finishes the making of flexible and transparent LED display module, referring to Figure 10.
Adopt the filtered cathodic vacuum arc method simultaneously to prepare the transparent DLC film that a layer thickness is 15nm again at the LED luminous element of flexible and transparent LED display module.
Claims (3)
1. led module manufacturing process with graphical transparent membrane electrode, it is characterized in that adopting be prepared as follows step: a, material is prepared: carbon nano-tube or nano silver wire or Graphene are ground the back adopt and ultrasonicly evenly be dispersed in the water or be mixed in the terpinol or PVA or PVDF organic solution that has close-burning polyurethane or contain ethyl cellulose, raw material as the preparation transparent conductive film, standby, the weight ratio that described carbon nano-tube or nano silver wire or Graphene account for water or described organic solution is 0.01～5%; The transparent flexible substrate adopts any among polyimides or PET, PEN, PC, PVC, PMMA, the PES, with the transparent flexible substrate clean the back in drying box through 80～120 ℃ of dryings 1～3 hour, standby; B, preparation insulating barrier: on above-mentioned transparent flexible substrate, adopt membrane or whirl coating technology preparation layer of transparent insulating polymer film earlier, and, form ground floor insulating barrier (2) with 120 ℃ of bakings 1～2 hour of heating; C, prepare patterned transparency conductive electrode: according to designed circuit layout, upper surface at the ground floor insulating barrier adopts mask in conjunction with membrane technology or droplet membrane process or silk screen printing/roll printing method/inkjet printing or spraying process again, be distributed on the ground floor insulating barrier that is covered with mask the raw material of the above-mentioned transparent conductive film for preparing is even, again with 80～120 ℃ of heat dryings, and be incubated 1～3 hour, after waiting to solidify, remove mask, through 120～150 ℃, sintering 2～5 hours, the film that stays have just formed the patterned transparency conductive electrode of ground floor (3); D, intersect or during the transparency conductive electrode of multi-layer graphicalization when preparation is double-deck, then on the patterned transparency conductive electrode of ground floor, adopt mask method to repeat to prepare a layer insulating and patterned transparency conductive electrode respectively successively again, obtain the flexible and transparent multilayer circuit board; E, LED pastes and adopts following two kinds of methods: according to designed circuit layout, select the patterned transparency conductive electrode of one deck, the regional two ends that will paste LED luminous element (6) on selected patterned transparency conductive electrode layer are adopted and are planted gold goal technology or little gluing process and prepare respectively at 100～130 ℃ cold curing elargol with curing temperature and conduct electricity contact point (7), adopt solid brilliant method or chip mounter that LED luminous element (6) is fixed between two conduction contact points with the transparent insulation crystal-bonding adhesive then, make the positive and negative end of LED luminous element (6) contact the conduction contact point (7) at two ends respectively simultaneously, adopt heat pressing process that LED luminous element (6) is fixed on the transparent insulation crystal-bonding adhesive again, the both positive and negative polarity that makes LED luminous element (6) respectively with conduction contact point (7) conducting at two ends; Or adopt earlier solid brilliant method or chip mounter that LED luminous element (6) directly is fixed on selected patterned transparency conductive electrode layer with the transparent insulation crystal-bonding adhesive will to paste on the zone of LED luminous element, respectively drop is in the both positive and negative polarity of LED luminous element (6) with the cold curing elargol to adopt little gluing process then, and the both positive and negative polarity that makes the LED luminous element respectively and its conducting between zone of pairing patterned transparency conductive electrode down; F, drying: 80～100 ℃ of bakings of drying case 1 hour form led module; G, surface coating: preparation one layer thickness is the DLC transparent membrane of 5～20nm on the led module of the one side that is fixed with the LED luminous element.
2. a kind of led module manufacturing process as claimed in claim 1 with graphical transparent membrane electrode, it is characterized in that: described transparent insulation thin polymer film adopts PVAC polyvinylalcohol, Kynoar PVDF, polyvinylchloride, polycarbonate, polyethylene terephtalate, polyvinyl acetate PVAC, polythene-ethenol PEVOH, polymetylmethacrylate, poly-methyl-hydroxy-ethyl acrylate PM/HEA, polystyrene PS, polyurethane PEU, poly-bis-phenol carbonic ester PCR, poly-methyl vinyl ketone PVMK, poly-(3,4-dioxoethyl thiophene), in the poly-p styrene sulfonic acid any is prepared from, or the composite membrane that adopts the combination in any of above-mentioned polymer to be prepared from.
3. a kind of led module manufacturing process with graphical transparent membrane electrode as claimed in claim 1 is characterized in that: described cold curing elargol adopts the nano silver wire of length more than 15～25 μ m to be prepared from.
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| CN103198886A (en) * | 2013-04-08 | 2013-07-10 | 西南交通大学 | Preparation method of surface transparent conducting thin film of flexible substrate |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101492151A (en) * | 2009-02-17 | 2009-07-29 | 华中科技大学 | High-conductivity transparent metal single-wall nano-carbon tube film and method of producing the same |
| CN101589473A (en) * | 2006-10-12 | 2009-11-25 | 凯博瑞奥斯技术公司 | Nanowire-based transparent conductors and applications thereof |
| CN101916831A (en) * | 2010-06-30 | 2010-12-15 | 华南理工大学 | Method for preparing organic light-emitting diode (OLED) display screen by full printing process |
| CN102087886A (en) * | 2009-12-08 | 2011-06-08 | 中国科学院福建物质结构研究所 | Silver nanowire-based transparent conductive thin film and preparation method thereof |
| CN102148270A (en) * | 2011-01-05 | 2011-08-10 | 福建钧石能源有限公司 | Flexible thin film solar cell and manufacturing method thereof |
| US20110192636A1 (en) * | 2010-02-08 | 2011-08-11 | Industrial Technology Research Institute | Touch panel roll and manufacturing method thereof |
-
2011
- 2011-09-20 CN CN 201110278660 patent/CN102290506B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101589473A (en) * | 2006-10-12 | 2009-11-25 | 凯博瑞奥斯技术公司 | Nanowire-based transparent conductors and applications thereof |
| CN101492151A (en) * | 2009-02-17 | 2009-07-29 | 华中科技大学 | High-conductivity transparent metal single-wall nano-carbon tube film and method of producing the same |
| CN102087886A (en) * | 2009-12-08 | 2011-06-08 | 中国科学院福建物质结构研究所 | Silver nanowire-based transparent conductive thin film and preparation method thereof |
| US20110192636A1 (en) * | 2010-02-08 | 2011-08-11 | Industrial Technology Research Institute | Touch panel roll and manufacturing method thereof |
| CN101916831A (en) * | 2010-06-30 | 2010-12-15 | 华南理工大学 | Method for preparing organic light-emitting diode (OLED) display screen by full printing process |
| CN102148270A (en) * | 2011-01-05 | 2011-08-10 | 福建钧石能源有限公司 | Flexible thin film solar cell and manufacturing method thereof |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102855827A (en) * | 2012-09-26 | 2013-01-02 | 华东师范大学 | Transparent display screen and manufacture method thereof |
| CN102855827B (en) * | 2012-09-26 | 2015-10-28 | 华东师范大学 | A kind of transparent display screen and preparation method thereof |
| CN103198886A (en) * | 2013-04-08 | 2013-07-10 | 西南交通大学 | Preparation method of surface transparent conducting thin film of flexible substrate |
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| CN103839608A (en) * | 2014-01-06 | 2014-06-04 | 沈阳化工大学 | Method for manufacturing conductive graphene film through ink-jet printing |
| CN104945014A (en) * | 2014-03-26 | 2015-09-30 | 苏州汉纳材料科技有限公司 | Patterning method of graphene-based transparent conducting film |
| CN103956359A (en) * | 2014-05-19 | 2014-07-30 | 四川柏狮光电技术有限公司 | Single-ended power supply all-around LED lamp filament and manufacturing method thereof |
| CN103996785A (en) * | 2014-06-04 | 2014-08-20 | 宁波亚茂照明电器有限公司 | Built-in drive full-angle light-emitting LED light source and packaging process |
| CN104715684A (en) * | 2015-03-30 | 2015-06-17 | 赵琪科 | Light transmitting glass display screen and manufacturing method |
| CN104953009A (en) * | 2015-05-21 | 2015-09-30 | 深圳市联建光电股份有限公司 | Transparent LED module manufacturing method |
| CN104868038A (en) * | 2015-05-21 | 2015-08-26 | 深圳市联建光电股份有限公司 | Transparent led packaging structure |
| CN105161220A (en) * | 2015-10-09 | 2015-12-16 | 重庆文理学院 | Preparation method of high-temperature-resistant silver conductive film |
| CN105206350A (en) * | 2015-10-09 | 2015-12-30 | 重庆文理学院 | Preparing method for silver conductive thin film resisting water and oil |
| CN107104178B (en) * | 2016-12-01 | 2019-06-04 | 正昌新视界股份有限公司 | LED module production method and its structure |
| CN107104178A (en) * | 2016-12-01 | 2017-08-29 | 正昌新视界股份有限公司 | LED modules preparation method and its structure |
| CN107482030A (en) * | 2017-07-31 | 2017-12-15 | 安徽三安光电有限公司 | Micro- LED component and preparation method thereof |
| CN108184310A (en) * | 2017-12-28 | 2018-06-19 | 深圳大学 | The production method of transparent flexible multi-layer PCB |
| CN108346730A (en) * | 2018-01-11 | 2018-07-31 | 浙江大学 | Doubling LED ornament materials and preparation method based on nano silver wire transparent circuitry |
| CN110853527A (en) * | 2018-08-01 | 2020-02-28 | 深圳Tcl新技术有限公司 | Transparent LED display device and manufacturing method thereof |
| CN111388698A (en) * | 2020-03-23 | 2020-07-10 | 苏州星烁纳米科技有限公司 | Filter element and protective product |
| DE102022122745A1 (en) | 2022-09-07 | 2024-03-07 | Ams-Osram International Gmbh | METHOD FOR PRODUCING CONDUCTOR TRACKS AND TRANSPARENT COMPOSITE DISC |
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