CN102288791A - Wire frame and gold finger structure for Kelvin testing and sorting - Google Patents
Wire frame and gold finger structure for Kelvin testing and sorting Download PDFInfo
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- CN102288791A CN102288791A CN2011101194778A CN201110119477A CN102288791A CN 102288791 A CN102288791 A CN 102288791A CN 2011101194778 A CN2011101194778 A CN 2011101194778A CN 201110119477 A CN201110119477 A CN 201110119477A CN 102288791 A CN102288791 A CN 102288791A
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Abstract
The invention relates to a wire frame and gold finger structure for Kelvin testing and sorting, which comprises a frame body. One end of the frame body is provided with a testing and sorting connection area, the other end of the frame body is provided with a base positioning and installation area, the base positioning and installation area and the testing and sorting connection area are provided with a plurality of pins, and the pins are distributed along the length direction of the axial line of the frame body. Since one end of the frame body is provided with the testing and sorting connection area, the other end of the frame body is provided with the base positioning and installation area, and the base positioning and installation area is integrated with the testing and sorting connection area, short circuits, cold joints and inconsistent capacitance distribution can be avoided during welding. The testing and sorting connection area is identical to the existing wire frame structure, and a base plugging area is formed on a positioned insulator through the base positioning and installation area and is connected with a HSOP type power integration circuit. The invention has the advantages of high testing and sorting accuracy, simple and compact structure, convenient testing and sorting, long service life, good applicability, low testing cost and high safety and reliability.
Description
Technical field
The present invention relates to a kind of lead frame and golden finger structure, especially a kind of Kelvin's testing, sorting belongs to the technical field of integrated circuit testing with lead frame and golden finger structure.
Background technology
At present, at outer lead distance is the SOP(Small Outline Package of the HSOP(band heating radiator of 0.03 inch arrangement) encapsulation) the Kelvin's test and the whole dependence on import of sorting consumptive material of type power-type integrated circuit, cost an arm and a leg, and producing country still carries out this class blockade on new techniques to China at present, purpose is after China's integrated circuit envelope survey industry has been used their main frame, can constantly sell the consumptive material of their this class costliness, cause the testing, sorting cost to improve.The structure of existing Kelvin's side formula sorting need form pedestal in welding back, the end of lead frame patch the district, patches the district and goes up and carry out testing, sorting thereby then corresponding integrated circuit is installed in pedestal.But be easy to generate short circuit, rosin joint in welding process, distributed capacitance is inconsistent and the situation of fracture, causes test and sorting to be interfered easily, measuring accuracy is low, and serviceable life is short.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, provide a kind of Kelvin's testing, sorting with lead frame and golden finger structure, it is simple and compact for structure, testing, sorting is convenient, measuring accuracy height, long service life, applicability is good, and testing cost is low, and is safe and reliable.
According to technical scheme provided by the invention, described Kelvin's testing, sorting lead frame comprises support body; One end of described support body is provided with the testing, sorting bonding pad, and the other end of support body is provided with pedestal location and installation district, and described pedestal location and installation district and testing, sorting bonding pad are provided with some pins, and described pin distributes along the axial length direction of support body.
The two ends of described support body are provided with equally distributed support body connecting hole.The joint portion of described pedestal location and installation district and testing, sorting bonding pad is provided with bending; The width in pedestal location and installation district is greater than the testing, sorting bonding pad.Distance on the described support body between adjacent pin is 0.03 inch.
Described Kelvin's testing, sorting golden finger structure comprises the location and installation insulator, and described location and installation insulator is provided with first lead frame and second lead frame of symmetrical distribution; One end of first lead frame and the corresponding support body of second lead frame forms the testing, sorting bonding pad respectively, and the other end forms pedestal location and installation district respectively, on the support body of first lead frame and second lead frame pin is set respectively; One end of first lead frame and second lead frame passes the location and installation insulator, the pedestal location and installation district of first lead frame and second lead frame is positioned at a side of location and installation insulator, and the testing, sorting bonding pad of first lead frame and second lead frame is positioned at the opposite side of location and installation insulator; Form pedestal after the pedestal location and installation district corresponding matching of first lead frame and second lead frame and patch the district; The testing, sorting bonding pad of first lead frame is electrically connected with first Kelvin's test piece, and the testing, sorting bonding pad of second lead frame is electrically connected with second Kelvin's test piece.
Described location and installation insulator is provided with mounting groove.The testing, sorting bonding pad of described first lead frame and the joint portion of first Kelvin's test piece are provided with front insulator; The testing, sorting bonding pad of second lead frame and the joint portion of second Kelvin's test piece are provided with the back insulator.
On described first lead frame and second lead frame corresponding pin respectively with first Kelvin's test piece, second Kelvin's test piece on the corresponding connection of pin.
Advantage of the present invention: an end of support body forms the testing, sorting bonding pad, and the other end forms pedestal location and installation district; The integrally manufactured moulding in pedestal location and installation district and testing, sorting bonding pad, the inconsistent situation of short circuit, rosin joint and distributed capacitance that has caused when having avoided welding; The testing, sorting bonding pad is identical with existing conducting wire frame structure, first lead frame and the corresponding pedestal location and installation of second lead frame district form pedestal and patch the district on the location and installation insulator, pedestal patches the district and links to each other with HSOP type power integrated circuit, thereby can conveniently be used for HSOP type power integrated circuit Kelvin is tested; Testing, sorting precision height, simple and compact for structure, testing, sorting is convenient, long service life, applicability is good, and testing cost is low, and is safe and reliable.
Description of drawings
Fig. 1 is the structural representation of lead frame of the present invention.
Fig. 2 is the structural representation of golden finger of the present invention.
Fig. 3 is the vertical view of Fig. 2.
Embodiment
The invention will be further described below in conjunction with concrete drawings and Examples.
As Fig. 1 ~ shown in Figure 3: the present invention includes front insulator 1, back insulator 2, location and installation insulator 3, first Kelvin's test piece 4, second Kelvin's test piece 5, first lead frame 6, second lead frame 7, pedestal location and installation district 8, pin 9, bending 10, testing, sorting bonding pad 11, support body connecting hole 12, support body 13, pedestal and patch district 14 and mounting groove 15.
As shown in Figure 1: for fear of existing Kelvin's testing, sorting golden finger structure, need form pedestal by welding on lead frame and patch the district at 14 o'clock, cause the inconsistent situation of short circuit, rosin joint and distributed capacitance easily, lead frame comprises support body 13, one end of described support body 13 is provided with and forms testing, sorting bonding pad 11, and the other end is provided with and forms pedestal location and installation district 8; Pedestal location and installation district 8 is integrally manufactured formation with testing, sorting bonding pad 11, the inconsistent situation of short circuit, rosin joint and distributed capacitance of having avoided existing lead frame to cause when welding is used.Support body 13 is provided with the pin 9 that distributes along support body 13 axial lengths, and the spacing of adjacent pin 9 is 0.03 inch on the support body 13, being complementary of the distribution of pin 9 and HSOP type power-type integrated circuit.Pedestal location and installation district 8 is provided with bending 10 with the joint portion of testing, sorting bonding pad 11, and the width in pedestal location and installation district 8 is got the width of bonding pad 11 greater than testing, sorting; Testing, sorting bonding pad 11 is corresponding with the planform of existing lead frame; Testing, sorting bonding pad 11 is rectangular; Pedestal location and installation district 8 is positioned on the same surface level with testing, sorting bonding pad 11; Parameters such as the structure in described pedestal location and installation district 8, size are consistent with the structure that the pedestal that existing welding obtains patches district 14.Pin 9 is corresponding with the shape of pedestal location and installation district 8 and testing, sorting bonding pad 11.The two ends of support body 13 are provided with the support body connecting hole 12 that distributes symmetrically, and described support body connecting hole 12 is four.The material of support body 13 and pin 9 has adopted copper-beryllium-Yin ternary alloy three-partalloy, makes support body 13 have higher mechanical properties.The pedestal location and installation district 8 that forms on the support body 13 adopts sapphire cold laser cutting machine to be processed into testing, sorting bonding pad 11 integrative-structures, thereby can guarantee the degree of accuracy that adjacent pin 9 distributes on the support body 13.
As shown in Figures 2 and 3: be the golden finger structure of utilizing lead frame shown in Figure 1 to constitute.The golden finger structure comprises location and installation insulator 3, first lead frame 6 and second lead frame 7 of symmetrical distribution are set on the described location and installation insulator 3, one end of first lead frame 6 and second lead frame, 7 corresponding support bodys 13 forms testing, sorting bonding pad 11 respectively, and the other end forms pedestal location and installation district 8 respectively.On the support body 13 of first lead frame 6 and second lead frame 7 pin 9 is set respectively; One end of first lead frame 6 and second lead frame 7 passes location and installation insulator 3, the pedestal location and installation district 8 of first lead frame 6 and second lead frame 7 is positioned at a side of location and installation insulator 3, and the testing, sorting bonding pad 11 of first lead frame 6 and second lead frame 7 is positioned at the opposite side of location and installation insulator 3; Form pedestal after pedestal location and installation district 8 corresponding matching of first lead frame 6 and second lead frame 7 and patch district 14, described pedestal patches pedestal that district 14 and existing welding form, and to patch district 14 in full accord, can adapt to the requirement of corresponding Kelvin's testing apparatus; The testing, sorting bonding pad 11 of first lead frame 6 is electrically connected with first Kelvin's test piece 4, and the testing, sorting bonding pad 11 of second lead frame 7 is electrically connected with second Kelvin's test piece 4.First lead frame 6 and second lead frame 7 mutually insulated in location and installation insulator 3 have avoided first lead frame 6 and second lead frame 7 in the interference of carrying out producing when Kelvin tests.
The bottom of location and installation insulator 3 is provided with mounting groove 15, and location and installation insulator 3 can be easily installed on the corresponding testing apparatus by mounting groove 15.First lead frame 6 is positioned at the top of second lead frame 7.After being installed on the corresponding tester for fear of location and installation insulator 3, first Kelvin's test piece 4, second Kelvin's test piece 5 are disturbed mutually with corresponding testing apparatus, first Kelvin's test piece 4 is provided with front insulator 1, the second Kelvin's test piece 5 corresponding to the joint portion with first lead frame, 6 corresponding testing, sorting bonding pads 11 and is provided with back insulator 2 corresponding to the joint portion with second lead frame, 7 corresponding testing, sorting bonding pads 11.Pin distribution in first Kelvin's test piece 4 is complementary with the pin 9 on first lead frame 6, pin 9 on the pin in second Kelvin's test piece 5 and second lead frame 7 is complementary, thereby guarantee interconnecting of the first Kelvin's test piece 4 and first lead frame 6, the interconnecting of the second Kelvin's test piece 5 and second lead frame 7.
As Fig. 1 ~ shown in Figure 3: during use, first lead frame 6 and second lead frame, 7 symmetries are installed on the location and installation insulator 3, the testing, sorting bonding pad 11 of first lead frame 6 is electrically connected with first Kelvin's test piece 4, and the testing, sorting bonding pad 11 of second lead frame 7 is electrically connected with second Kelvin's test piece 5.Mounting groove 15 by location and installation insulator 3 is installed on the corresponding testing apparatus, then first Kelvin's test piece 4, second Kelvin's test piece 5 is linked to each other with the corresponding terminal of testing apparatus; Also need after having avoided existing conducting wire frame structure to be installed on the location and installation insulator 3 to form the step that pedestal patches district 14 by welding corresponding material, install easy to connect, simultaneously, the inconsistent situation of rosin joint, short circuit and distributed capacitance that produces in the time of can reducing welding has improved the reliability of Kelvin's test.After connection is finished, HSOP type power integrated circuit is installed in pedestal to patch in the district 14, first lead frame 6 and second lead frame 7 are tested and sorting thereby can conveniently carry out Kelvin to HSOP type power integrated circuit respectively as the connector that sends signal and received signal.After above-mentioned installation, carry out conventional Kelvin's testing, sorting at HSOP type power integrated circuit, connect parameter so that determine the circuit of corresponding HSOP type power integrated circuit, and can in time adjust.After test is finished, HSOP type power integrated circuit is patched the district from pedestal 14 remove, be convenient to carry out testing, sorting next time.Owing to be wholely set pedestal location and installation district 8 on first lead frame 6 and second lead frame 7, avoided the end end welding of existing lead frame to form the operation that pedestal patches district 14, the inconsistent situation of short circuit, rosin joint and distributed capacitance that has caused when having avoided welding; The employing of first lead frame 6 and second lead frame 7 makes integral body have very high mechanical property, not easy fracture.
One end of support body 13 of the present invention forms testing, sorting bonding pad 11, and the other end forms pedestal location and installation district 8; Pedestal location and installation district 8 and the 11 integrally manufactured moulding of testing, sorting bonding pad, the inconsistent situation of short circuit, rosin joint and distributed capacitance that has caused when having avoided welding; Testing, sorting bonding pad 11 is identical with existing conducting wire frame structure, first lead frame 6 and second lead frame, 7 corresponding pedestal location and installation districts 8 form pedestal and patch district 14 on location and installation insulator 3, pedestal patches district 14 and links to each other with HSOP type power integrated circuit, thereby can conveniently be used for HSOP type power integrated circuit Kelvin is tested; Testing, sorting precision height, simple and compact for structure, testing, sorting is convenient, long service life, applicability is good, and testing cost is low, and is safe and reliable.
Claims (8)
1. Kelvin's testing, sorting lead frame comprises support body (13); It is characterized in that: an end of described support body (13) is provided with testing, sorting bonding pad (11), the other end of support body (13) is provided with pedestal location and installation district (8), described pedestal location and installation district (8) and testing, sorting bonding pad (11) are provided with some pins (9), and described pin (9) distributes along the axial length direction of support body (13).
2. Kelvin's testing, sorting lead frame according to claim 1 is characterized in that: the two ends of described support body (13) are provided with equally distributed support body connecting hole (12).
3. Kelvin's testing, sorting lead frame according to claim 1 is characterized in that: described pedestal location and installation district (8) is provided with bending (10) with the joint portion of testing, sorting bonding pad (11); The width in pedestal location and installation district (8) is greater than testing, sorting bonding pad (11).
4. Kelvin's testing, sorting lead frame according to claim 1 is characterized in that: the distance that described support body (13) is gone up between adjacent pin (9) is 0.03 inch.
5. Kelvin's testing, sorting golden finger structure of utilizing the described lead frame of claim 1, it is characterized in that: comprise location and installation insulator (3), described location and installation insulator (3) is provided with first lead frame (6) and second lead frame (7) of symmetrical distribution; One end of first lead frame (6) and the corresponding support body of second lead frame (7) (13) forms testing, sorting bonding pad (11) respectively, the other end forms pedestal location and installation district (8) respectively, on the support body (13) of first lead frame (6) and second lead frame (7) pin (9) is set respectively; One end of first lead frame (6) and second lead frame (7) passes location and installation insulator (3), the pedestal location and installation district (8) of first lead frame (6) and second lead frame (7) is positioned at a side of location and installation insulator (3), and the testing, sorting bonding pad (11) of first lead frame (6) and second lead frame (7) is positioned at the opposite side of location and installation insulator (3); Form pedestal after pedestal location and installation district (8) corresponding matching of first lead frame (6) and second lead frame (7) and patch district (14); The testing, sorting bonding pad (11) of first lead frame (6) is electrically connected with first Kelvin's test piece (4), and the testing, sorting bonding pad (11) of second lead frame (7) is electrically connected with second Kelvin's test piece (4).
6. Kelvin's testing, sorting golden finger structure according to claim 5 is characterized in that: described location and installation insulator (3) is provided with mounting groove (15).
7. Kelvin's testing, sorting golden finger structure according to claim 5 is characterized in that: the testing, sorting bonding pad (11) of described first lead frame (6) is provided with front insulator (1) with the joint portion of first Kelvin's test piece (4); The testing, sorting bonding pad (11) of second lead frame (7) is provided with back insulator (2) with the joint portion of second Kelvin's test piece (4).
8. Kelvin's testing, sorting golden finger structure according to claim 5 is characterized in that: described first lead frame (6) and second lead frame (7) go up corresponding pin (9) respectively with first Kelvin's test piece (4), second Kelvin's test piece (5) on the corresponding connection of pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110119477 CN102288791B (en) | 2011-05-10 | 2011-05-10 | Wire frame and gold finger structure for Kelvin testing and sorting |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110119477 CN102288791B (en) | 2011-05-10 | 2011-05-10 | Wire frame and gold finger structure for Kelvin testing and sorting |
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| Publication Number | Publication Date |
|---|---|
| CN102288791A true CN102288791A (en) | 2011-12-21 |
| CN102288791B CN102288791B (en) | 2013-06-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201110119477 Active CN102288791B (en) | 2011-05-10 | 2011-05-10 | Wire frame and gold finger structure for Kelvin testing and sorting |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102565468A (en) * | 2011-12-26 | 2012-07-11 | 天津中环半导体股份有限公司 | Kelvin test slide stage |
| CN102707214A (en) * | 2012-05-14 | 2012-10-03 | 江阴新顺微电子有限公司 | Method for detecting positive and saturation voltage drop of transistor chip of discrete device |
| CN103499711A (en) * | 2013-09-23 | 2014-01-08 | 无锡市汇博普纳电子有限公司 | High-frequency integrated circuit alternating current automatic test probe with ultra small spacing |
| CN108693388A (en) * | 2017-04-07 | 2018-10-23 | 迈来芯科技有限公司 | Kelvin's connection with positioning accuracy |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008519253A (en) * | 2004-11-03 | 2008-06-05 | リエゾン、エレクトロニク−メカニク、エルウエム、ソシエテ、アノニム | Kelvin connector with temperature sensor |
| CN201243407Y (en) * | 2008-05-19 | 2009-05-20 | 凤凰半导体通信(苏州)有限公司 | Golden finger connecting device |
| CN201499375U (en) * | 2009-09-17 | 2010-06-02 | 浙江龙威电子科技有限公司 | Flexible printed circuit board for connection |
| CN101868119A (en) * | 2009-04-17 | 2010-10-20 | 比亚迪股份有限公司 | Flexible printed circuit board connecting structure body and manufacturing method thereof |
-
2011
- 2011-05-10 CN CN 201110119477 patent/CN102288791B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008519253A (en) * | 2004-11-03 | 2008-06-05 | リエゾン、エレクトロニク−メカニク、エルウエム、ソシエテ、アノニム | Kelvin connector with temperature sensor |
| CN201243407Y (en) * | 2008-05-19 | 2009-05-20 | 凤凰半导体通信(苏州)有限公司 | Golden finger connecting device |
| CN101868119A (en) * | 2009-04-17 | 2010-10-20 | 比亚迪股份有限公司 | Flexible printed circuit board connecting structure body and manufacturing method thereof |
| CN201499375U (en) * | 2009-09-17 | 2010-06-02 | 浙江龙威电子科技有限公司 | Flexible printed circuit board for connection |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102565468A (en) * | 2011-12-26 | 2012-07-11 | 天津中环半导体股份有限公司 | Kelvin test slide stage |
| CN102565468B (en) * | 2011-12-26 | 2013-10-16 | 天津中环半导体股份有限公司 | Kelvin test slide stage |
| CN102707214A (en) * | 2012-05-14 | 2012-10-03 | 江阴新顺微电子有限公司 | Method for detecting positive and saturation voltage drop of transistor chip of discrete device |
| CN103499711A (en) * | 2013-09-23 | 2014-01-08 | 无锡市汇博普纳电子有限公司 | High-frequency integrated circuit alternating current automatic test probe with ultra small spacing |
| CN108693388A (en) * | 2017-04-07 | 2018-10-23 | 迈来芯科技有限公司 | Kelvin's connection with positioning accuracy |
| CN108693388B (en) * | 2017-04-07 | 2021-06-18 | 迈来芯科技有限公司 | Kelvin connection with positioning accuracy |
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| Publication number | Publication date |
|---|---|
| CN102288791B (en) | 2013-06-19 |
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