CN102286209B - Plastic composition, application of plastic composition and method for selectively metallizing plastic surface - Google Patents
Plastic composition, application of plastic composition and method for selectively metallizing plastic surface Download PDFInfo
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Abstract
The invention provides a plastic composition. The plastic composition comprises a plastic substrate component and a catalyst component, wherein the catalyst component is selected from one or more than two of oxides of metallic elements except for copper in the ninth, tenth and eleventh rows of the periodic system of elements, silicate, borate and oxalate of the metallic elements in the ninth, tenth and eleventh rows of the periodic system of elements, a hydrogenation catalyst containing the metallic elements in the ninth, tenth and eleventh rows of the periodic system of elements, and ABO2-type composite oxides with delafossite structures; A is selected from one of the metallic elements in the ninth, tenth and eleventh rows of the periodic system of elements; B is Ni, Mn, Cr, Al or Fe; and the A is different from the B. The invention also relates to application of the plastic composition provided by the invention to selective metallization of a plastic surface. The invention also provides a method for selectively metallizing the plastic surface. After the method is used, a circuit can be further easily formed.
Description
Related application
The application is that application number is 200910261216.2, the applying date is on December 17th, 2009, denomination of invention is divided an application for the Chinese invention patent application of " method of plastics composite and application thereof and selective metallization of plastic surface ".
Technical field
The present invention relates to the method for a kind of plastics composite and the application in selective metallization of plastic surface and selective metallization of plastic surface.
Background technology
Directly form the technology of stereo circuit on the moulding surface, the functions such as the support of the function of the electric interconnection function of common circuit card, supporting components and parts and plastic component, protection can be implemented on the device, form circuit carrier three-dimensional, that integrate dynamo-electric function.This class technology is the shape that is fit to of design alternative as required, can realize multi-functionally, can reduce and level is installed, is reduced component number, is applied in fields such as automobile, industry, computer, communications at present.
It is an important link of stereo circuit technology that frosting optionally metallizes.Metallization of plastic surface is produced circuit a lot of methods, US5599592A adds a kind of metal oxide in the polymer materials, then the pattern that needs with the infrared laser activation will produce metal core at the position that is activated, and these metal core are as the catalyzer of subsequent chemistry plating.But also there are some problems in the method, the metal oxide Sb that adds among the one, the embodiment
2O
3A kind of carcinogenic substance and the use that is under an embargo, except Sb
2O
3In addition, can be considerably less by the metal oxide of infrared reduction; In addition, the document is also mentioned after metallization, needs thermal treatment to make metal level be diffused into the bonding force that could improve better in the plastics between metal level and the plastic substrate, but metal level can the ground diffusion of much degree be a problem.
US2003031803A1 has also reported with metal oxide particle such as ZnO, TiO
2, ZrO
2, Al
2O
3, CeO
2On the surface that is coated on matrix, then use the UV laser radiation, follow again copper-plated technique.Wherein the top speed that moves of UV is 100mm/s, and the generation of pattern is not had selectivity.
US2004/0241422A1 and US7060421 have also reported the inorganic powder that adds spinel structure in plastic substrate, these mineral compound contain the elements such as copper, nickel, cobalt, chromium, iron, then use Ultra-Violet Laser (wavelength is 248nm, 308nm, 355nm, 532nm) and infrared laser (wavelength is 1064nm and 10600nm) to activate.Mention especially the oxide compound with spinel structure in the above-mentioned document and can under lasing, restore metal simple-substance, metal simple-substance as nucleus, is induced the electroless plating metal, form metal level.The realization of this process needs strict technology controlling and process, and needing the higher laser energy of irradiation could be metal simple-substance with the Reduction of Oxide of spinel structure, thereby obtains the effect of inducing the electroless plating metal of expection, all higher to the requirement of equipment and process.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of new plastics composite and the method for selective metallization of plastic surface, after use the method, can further easily form circuit.
The invention provides a kind of plastics composite, this plastics composite contains plastic basis material component and catalyst component, wherein, described catalyst component is to be selected from the periodic table of elements the 9th beyond the copper removal, the oxide compound of 10 and 11 row metallic elements, the silicate of the periodic table of elements the 9th, 10 and 11 row metallic elements, borate and oxalate contain the hydrogenation catalyst of the periodic table of elements the 9th, 10 and 11 row metallic elements and the ABO with delafossite structure
2In the type composite oxides one or more, described hydrogenation catalyst is for making the aldehyde, ketone, lipid acid or the fatty acid ester hydrogenation that contain carbonyl become the catalyzer of alcohol; Described A is a kind of for being selected from the periodic table of elements the 9th, the 10 and 11 row metallic elements, and B is Ni, Mn, Cr, Al or Fe, and A is different from B.
The invention still further relates to the application of plastics composite provided by the invention in selective metallization of plastic surface.
The present invention also provides a kind of method of selective metallization of plastic surface, and the method comprises: plastics composite provided by the invention is mixed and injection moulding, obtain plastic sample; By the irradiation energy line described plastic sample is carried out etching, expose the catalyst component particle so that the partly plastic gasification is peeled off; The plastic sample that exposes the catalyst component particle is carried out electroless copper.
The present invention is owing to selected the component that is different from prior art, use catalyst component of the present invention can directly promote electroless copper, do not need by induced with laser the metallic element in the catalyst component to be reduced to this complicated and uppity process of simple substance, thereby widened the scope of operable energy line, the stability of easier control technique.And the shape by control irradiation energy line easily obtains the shape of the chemical plating metal wanted on the plastic sample surface, namely can easily obtain on the plastic sample surface circuit that needs.
In addition, can find out from the data of table 1 of the present invention and table 2, utilize the method for selective metallization of plastic surface of the present invention, in the present invention under the promotion of employed catalyst component particle, the electroless copper speed on the plastic sample surface of shining energy line up to the 1-9 micron/hour, chemical nickel plating speed up to the 1-8 micron/hour.
Embodiment
The invention provides a kind of plastics composite, this plastics composite contains plastic basis material component and catalyst component, wherein, described catalyst component is to be selected from the periodic table of elements the 9th beyond the copper removal, the oxide compound of 10 and 11 row metallic elements, the silicate of the periodic table of elements the 9th, 10 and 11 row metallic elements, borate and oxalate contain the hydrogenation catalyst of the periodic table of elements the 9th, 10 and 11 row metallic elements and the ABO with delafossite structure
2In the type composite oxides one or more, described hydrogenation catalyst is for making the aldehyde, ketone, lipid acid or the fatty acid ester hydrogenation that contain carbonyl become the catalyzer of alcohol; Described A is a kind of for being selected from the periodic table of elements the 9th, the 10 and 11 row metallic elements, and B is Ni, Mn, Cr, Al or Fe, and A is different from B.
Consider from promoting electroless copper and nickel plating effect aspect, under the preferable case, described catalyst component is to be selected from the periodic table of elements the 10th beyond the copper removal and the oxide compound of 11 row metallic elements, the silicate of the periodic table of elements the 10th and 11 row metallic elements, borate and oxalate contain the hydrogenation catalyst of the periodic table of elements the 10th and 11 row metallic elements and the ABO with delafossite structure
2In the type composite oxides one or more, described A is a kind of for being selected from the periodic table of elements the 10th and the 11 row metallic elements, and B is Ni, Mn, Al or Fe, and A is different from B.
Wherein, in the periodic table of elements the 9th beyond described copper removal, the oxide compound of 10 and 11 row metallic elements, the metallic element of the periodic table of elements the 9th, 10 and 11 row can be Co, Rh, Pt, Ni, Pd, Pt, Ag or Au; As mentioned above, consider from the catalytic effect aspect, be preferably the copper removal periodic table of elements the 10th in addition and the oxide compound of 11 metallic elements that are listed as, namely be preferably the oxide compound of Ni, Pd, Pt, Ag or Au; Because Pd, Pt, Ag and Au are precious metal, be of little use, therefore the more preferably oxide compound of cheap Ni that is to say that commonly used is the oxide compound of Ni or Co, wherein the oxide compound of preferred Ni.Therefore, specifically, the periodic table of elements the 9th beyond the common described copper removal, the oxide compound of 10 and 11 row metallic elements can comprise Ni
2O
3, Co
2O
3And CoO, be preferably Ni
2O
3
Silicate, borate and the oxalate of the described periodic table of elements the 9th, 10 and 11 row metallic elements is the salt of the metal ion that can not dissociate in the process of processing plastic, in silicate, borate and the oxalate of the described periodic table of elements the 9th, 10 and 11 row metallic elements, the metallic element of the periodic table of elements the 9th, 10 and 11 row can be Co, Rh, Pt, Ni, Pd, Pt, Cu, Ag or Au; As mentioned above, consider from the catalytic effect aspect, be preferably silicate, borate and the oxalate of the metallic element of the periodic table of elements the 10th and 11 row, namely be preferably silicate, borate and the oxalate of Ni, Pd, Pt, Cu, Ag or Au; Because Pd, Pt, Ag and Au are precious metal, therefore be of little use, more preferably cheap Ni and silicate, borate and the oxalate of Cu that is to say, commonly used is silicate, borate and the oxalate of Co, Ni and Cu, wherein silicate, borate and the oxalate of preferred Ni and Cu.Therefore, specifically, the common described periodic table of elements the 9th, silicate, borate and the oxalate of 10 and 11 row metallic elements can comprise CuSiO
3, NiSiO
3, CoSiO
3CuB
2O
4, Cu
3B
2O
6, NiB
2O
4, Ni
3B
2O
6NiC
2O
4, CuC
2O
4, CoC
2O
4
As mentioned above, described hydrogenation catalyst is for making the aldehyde, ketone, lipid acid or the fatty acid ester hydrogenation that contain carbonyl become the catalyzer of alcohol, the object lesson of the such hydrogenation catalyst among the present invention has: Cu-Zn, Cu-Zn-Ni, Cu-Zn-Co, Cu-Zn-Ga, Co-La, Cu-Cd and Cu-Zn-Si series hydrocatalyst, these hydrogenation catalysts can be commercially available.Wherein, in Cu-Zn, in oxide compound, the ratio of the amount of substance of Cu and Zn can be 8: 1～4: 1; In Cu-Zn-Ni, in oxide compound, the ratio of the amount of substance of Cu, Zn and Ni can be (8-20): 1: (1-2); In Cu-Zn-Co, in oxide compound, the ratio of the amount of substance of Cu, Zn and Co can be (4-8): 1: (1-2); In Cu-Zn-Ga, in oxide compound, the ratio of the amount of substance of Cu, Zn and Ga can be (4-8): 1: (1-2); In Co-La, in oxide compound, the ratio of the amount of substance of Co and La can be 8: 1～4: 1; In Cu-Cd, in oxide compound, the ratio of the amount of substance of Cu and Cd can be 8: 1～4: 1; In Cu-Zn-Si, in oxide compound, the ratio of the amount of substance of Cu, Zn and Si can be (4-8): 1: 1.
Described ABO with delafossite structure
2A can think Co, Rh, Pt, Ni, Pd, Pt, Cu, Ag or Au for being selected from the periodic table of elements the 9th, 10 and 11 row metallic elements in the type composite oxides; Consider from the catalytic effect aspect, be preferably the metallic element that is selected from the periodic table of elements the 10th and 11 row, namely be preferably Ni, Pd, Pt, Cu, Ag or Au; Because Pd, Pt, Ag and Au are precious metal, be of little use, therefore more preferably cheap Ni and Cu that is to say that as A, that commonly used is Ni, Cu or Co, wherein preferred Ni and Cu; B can be Ni, Mn, Cr, Al or Fe, and A is different from B, and the present invention does not preferably contain the catalyzer that environment is had the Cr element of pollution.Therefore, specifically, described ABO with delafossite structure commonly used
2The type composite oxides can comprise MNiO
2, MMnO
2, MCrO
2, MAlO
2And MFeO
2, M can be Cu, Ni or Co.
The present invention has no particular limits plastic basis material component contained in the described plastics composite and the content of catalyst component, as long as can realize goal of the invention, that is to say that as long as the content of catalyst component is can be so that obtain to promote preferably the effect of electroless copper and nickel plating, but consider from the aspect of the effect that obtains good promotion electroless copper and save catalyst consumption, preferably in described plastics composite, with respect to the catalyst component of 100 weight parts, the content of described plastic basis material component is the 1000-10000 weight part.
Among the present invention, described catalyst component can be particulate state, the present invention has no particular limits the size of granules of catalyst, but on principle, in certain scope, particle is less, then catalytic effect is better, therefore the average particle diameter of this particle is preferably and is not more than 100 microns, and more preferably 10 nanometers to 1 micron further are 10 nanometer to 100 nanometers.
Described plastic basis material component can be known plastic basis material component, for example can be thermoplastic resin or thermosetting resin.
Wherein, described thermoplastics can be for being selected from polyolefine, polycarbonate (PC), polyester, polymeric amide, polyarylether, polyester-imide, polycarbonate/(acrylonitrile-butadiene-styrene (ABS)) alloy (PC/ABS), polyphenylene oxide (PPO), polyphenylene sulfide (PPS), polyimide (PI), polysulfones (PSU), polyether-ether-ketone (PEEK), polybenzimidazole (PBI) and the liquid crystalline polymers (LCP) one or more.Wherein, " alloy " in described polycarbonate/(acrylonitrile-butadiene-styrene (ABS)) alloy is not general metal alloy but polymer alloy, polymer alloy generally refers to the mixture of two or more polymkeric substance of obtaining after polymkeric substance is processed by physical methods such as blend, and described polycarbonate/(acrylonitrile-butadiene-styrene (ABS)) alloy refers to the mixture of polycarbonate and acrylonitrile-butadiene-styrene (ABS).Described liquid crystalline polymers is a kind ofly to be made of the stiff molecule chain, and the flowability that can occur existing liquid under certain physical condition has again the polymer substance of the physicals anisotropic states (this state is called liquid crystal state) of crystal.Particularly, described polyolefine can be for being selected from polystyrene (PS), polypropylene (PP), polymethylmethacrylate and poly-(acrylonitrile-butadiene-styrene (ABS)) one or more; Described polyester can be for being selected from the poly terephthalic acid hexanaphthene in diformazan alcohol ester (PCT), PDAIP (PDAIP), poly terephthalic acid diallyl (PDAP), PBN (PBN), polyethylene terephthalate (PET) and the polybutylene terephthalate (PBT) one or more; Described polymeric amide can be for being selected from polyhexamethylene adipamide (PA-66), poly-azelaoyl hexanediamine (PA-69), poly-succinyl hexanediamine (PA-64), nylon 612 (PA-612), polyhexamethylene sebacamide (PA-610), nylon 1010 (PA-1010), nylon 11 (PA-11), poly-lauramide (PA-12), poly-decoylamide (PA-8), poly-9 aminononanoic acid (PA-9), polycaprolactam (PA-6), poly-paraphenylene terephthalamide's phenylenediamine (PPTA), poly-6I hexamethylene isoterephalamide (MXD6), in poly-hexamethylene terephthalamide (PA6T) and the poly-paraphenylene terephthalamide's nonamethylene diamine (PA9T) one or more.
Described thermosetting resin can be for selecting in resol, urea-formaldehyde resin, melamine formaldehyde resin, Resins, epoxy, Synolac and the urethane one or more.
In addition, plastic polymer of the present invention can also contain one or more in mineral filler, oxidation inhibitor, photostabilizer and the lubricant.
In described plastics composite, with respect to the catalyst component of 100 weight parts, the content of described mineral filler can be the 10-70 weight part.Take the gross weight of plastics composite as benchmark, the content of described oxidation inhibitor can be the 0.01-1 % by weight, and the content of described photostabilizer can be the 0.01-1 % by weight, and the content of described lubricant can be the 0.01-1 % by weight.
Wherein, described mineral filler can be the physics filler that laser is not played any physics or chemical action, for example, and talcum powder and calcium carbonate; Although glass fibre is insensitive to laser, add the degree of depth that glass fibre can be deepened plastic substrate depression behind the laser activation greatly, be conducive to the adhesion of copper in the electroless copper.Described mineral filler can also be the mineral filler that laser is played a role, and for example, stannic oxide especially nano tin dioxide can increase the capacity usage ratio of infrared laser when peeling off frosting; Functional filler also has carbon black, and it also can increase plastics to infrared absorption, increases the extent of exfoliation of plastics.Preferably do not contain Cr etc. in the described mineral filler to environment and human body harmful's element.Described mineral filler can also be glass microballon, calcium sulfate, barium sulfate, titanium dioxide, pearlescence, wollastonite, diatomite, kaolin, coal dust, potter's clay, mica, kerosene shale ash, pure aluminium silicate, aluminum oxide, carbon fiber, silicon-dioxide or zinc oxide.
Described oxidation inhibitor can improve the antioxidant property of resin combination of the present invention, thereby improves the work-ing life of the product that finally obtains.Described oxidation inhibitor has been conventionally known to one of skill in the art, for example can contain primary antioxidant and auxiliary antioxidant, and the weight ratio of described primary antioxidant and described auxiliary antioxidant can be 1: 1-4.Described primary antioxidant can be hindered phenol type antioxidant, the example of this hindered phenol type antioxidant comprises oxidation inhibitor 1098 and 1010 (oxidation inhibitor that Ciba company produces), wherein the main component of oxidation inhibitor 1098 is N, N '-two-(3-(3, the 5-di-tert-butyl-hydroxy phenyl) propionyl) hexanediamine, the main component of antioxidant 1010 is four [3-(3,5-di-tert-butyl-hydroxy phenyl) propionic acid] tetramethylolmethane; Described auxiliary antioxidant can be phosphite type oxidation inhibitor, and the example of this phosphite type oxidation inhibitor has irgasfos 168 (oxidation inhibitor that Ciba company produces), and its main component is three (2,4-di-tert-butyl-phenyl) phosphorous acid ester.The oxidation inhibitor that the present invention preferably adopts is for as the antioxidant 1010 of primary antioxidant with as the mixture of the irgasfos 168 of auxiliary antioxidant.
Described photostabilizer can make the light stability that resin combination of the present invention is provided, thereby improves the work-ing life of the product that finally obtains.Described photostabilizer can be various known photostabilizers, hindered amine type light stabilizer for example, and the example of hindered amine type light stabilizer has two (2,2,6,6-tetramethyl--4-piperidyl) sebates.
That resin combination is mixed to get is more even thereby described lubricant can make resin combination have better flowability.Described lubricant can be various known lubricants, for example can be in the copolymerization wax (EVA wax), polyethylene wax (PE wax) and the stearate that are selected from ethylene/vinyl acetate one or more.
The invention still further relates to the application of plastics composite provided by the invention in selective metallization of plastic surface.Shape by control irradiation energy line easily obtains the shape of the chemical plating metal wanted on the plastic sample surface, namely can easily obtain on the plastic sample surface circuit that needs.
The present invention also provides a kind of method of selective metallization of plastic surface, and the method comprises: plastics composite provided by the invention is mixed and injection moulding, obtain plastic sample; By the irradiation energy line described plastic sample is carried out etching, expose the catalyst component particle so that the partly plastic gasification is peeled off; The plastic sample that exposes the catalyst component particle is carried out electroless copper.
The present invention has no particular limits the method for injection moulding, can use the method for conventional injection moulding, for example can will put into the forcing machine extruding pelletization in the described plastics composite first, and then put into the plastic sample that injection moulding machine is injection molded into the shape that needs and get final product.
Have no particular limits by the irradiation energy line described plastic sample being carried out etched degree among the present invention, puncture and can expose the catalyst component particle only otherwise with plastic sample and get final product, if the plastics that etch away are thicker, there is partially catalyzed agent component particles to fall down also not affect and realizes purpose of the present invention, will fall to clean out at the lip-deep particle of plastic sample and get final product.
Described energy line can obtain by various known approach, preferably obtain laser by laser apparatus, thereby pass through irradiating laser and obtain energy line, the wavelength of described laser is 157 nanometers to 10.6 micron, and sweep velocity is the 500-8000 mm/second, and step-length is the 3-9 micron, time-delay is the 30-100 microsecond, frequency is the 30-40 kilohertz, and power is 3-4 watt, and filling spacing is the 10-50 micron.The thickness of general plastic sample is 1 micron at least, by shining such laser, the thickness of the plastics that generally etch away is several microns to tens microns, thereby so that the catalyst component particle in the plastic sample comes out, plastic sample forms on the microcosmic as having the rough surface structure in rugged space.When follow-up electroless copper, copper just is embedded in the hole of uneven surface, thereby and forms very strong bonding force between the plastic sample.
The plastics that expose the catalyst component particle are carried out the method for electroless copper also for conventionally known to one of skill in the art, for example the method can comprise the plastic sample after the etching is contacted with copper electrolyte, described copper electrolyte contains mantoquita and reductive agent, the pH value is 12-13, described reductive agent can be reduced to copper simple substance with cupric ion in the mantoquita, and for example described reductive agent can be in oxoethanoic acid, hydrazine and the inferior sodium phosphate one or more.For example, " sufacing " in December, 2002, the 31st volume the 6th interim basic composition is of disclosing a typical plating bath: CuSO
45H
2O:0.12mol/L, Na
2EDTA2H
2O:0.14mol/L, yellow prussiate of potash: 10mg/L, 2,2 '-dipyridyl: 10mg/L, oxoethanoic acid (HOCCOOH): 0.10mol/L, and with NaOH and H
2SO
4The pH value of regulating plating bath is 12.5-13.In addition, if think behind the electroless copper that copper thickness is not enough, can also carry out electro-coppering.
Under the preferable case, after method of the present invention also is included in copper facing and finishes again electroless plating one deck nickel prevent that the copper coating surface is oxidized.
Method of the present invention is first electroless plating one deck nickel before electroless copper more preferably, is placed on suction post-etching copper coating in the air to prevent plastics.
The method of chemical nickel plating has been conventionally known to one of skill in the art, for example the method can comprise plastic sample is contacted with nickel-plating liquid, for example, consisting of of a typical nickel plating bath: single nickel salt: 23g/l, inferior sodium phosphate: 18g/l, lactic acid: 20g/l, oxysuccinic acid: 15g/l, temperature: 85-90 ℃ of PH:5.2 (regulating with NaOH).Thickness to chemical Ni-plating layer has no particular limits, as long as plastic substrate can be finished covering, so the thickness of nickel coating is preferably 0.5-1 μ m, need not make nickel coating too thick.
The present invention will be described in more detail below with reference to embodiment.
Embodiment 1
Present embodiment is used for illustrating the method for plastics composite of the present invention and selective metallization of plastic surface.
Be the Ni of 50 nanometers with the average particle diameter of 100g
2O
3Join in the polycarbonate of 1000g with the talcum powder of 10g, high-speed mixing is even, obtains plastics composite of the present invention, then it is changed over to extruding pelletization in the forcing machine, and then changes it over to be injection molded into 2 mm thick in the injection moulding machine plastic sample.Plastic sample is placed on the laser apparatus sample table, with laser focusing, the movement of computer program control light beam or sample table, used laser apparatus is the YLP-20 of big nation type laser apparatus, laser parameter is: wavelength 1064nm, sweep velocity 1000mm/s, step-length 9 μ m, the 30 μ s that delay time, frequency 40KHz, power 3W fills spacing 50 μ m.Behind the laser ablation, plastic sample is carried out abatement processes, then place to consist of CuSO
45H
2O:0.12mol/L, Na
2EDTA2H
2O:0.14mol/L, yellow prussiate of potash: 10mg/L, 2,2 '-dipyridyl: 10mg/L, oxoethanoic acid (HOCCOOH): in the plating bath of 0.10mol/L, and with NaOH and H
2SO
4The pH value of regulating plating bath is 12.5 to carry out electroless copper, and after tested, copper facing speed is 4 μ m/h.
Embodiment 2
Present embodiment is used for illustrating the method for plastics composite of the present invention and selective metallization of plastic surface.
Be the Co of 100 nanometers with the average particle diameter of 100g
2O
3Join among the PC of 5000g with the glass fibre of 30g, high-speed mixing is even, obtains plastics composite of the present invention, then it is changed over to extruding pelletization in the forcing machine, and then changes it over to be injection molded into 2 mm thick in the injection moulding machine plastic sample.Plastic sample is placed on the laser apparatus sample table, with laser focusing, the movement of computer program control light beam or sample table, used laser apparatus is the YLP-20 of big nation type laser apparatus, laser parameter is: wavelength 300nm, sweep velocity 5000mm/s, step-length 3 μ m, the 60 μ s that delay time, frequency 40KHz, power 3W fills spacing 30 μ m.Behind the laser ablation, plastic sample is carried out abatement processes, then place to consist of CuSO
45H
2O:0.12mol/L, Na
2EDTA2H
2O:0.14mol/L, yellow prussiate of potash: 10mg/L, 2,2 '-dipyridyl: 10mg/L, oxoethanoic acid (HOCCOOH): in the plating bath of 0.10mol/L, and with NaOH and H
2SO
4The pH value of regulating plating bath is 13 to carry out electroless copper, and after tested, copper facing speed is 2 μ m/h.
Embodiment 3
Present embodiment is used for illustrating the method for plastics composite of the present invention and selective metallization of plastic surface.
Be the CuSiO of 500 nanometers with the average particle diameter of 100g
3Join in the 10000g polyethylene terephthalate with the kaolin of 70g, high-speed mixing is even, obtain plastics composite of the present invention, then it is changed over to extruding pelletization in the forcing machine, and then change it over to be injection molded into 2 mm thick in the injection moulding machine plastic sample.Plastic sample is placed on the laser apparatus sample table, with laser focusing, the movement of computer program control light beam or sample table, used laser apparatus is the YLP-20 of big nation type laser apparatus, laser parameter is: wavelength 10600nm, sweep velocity 8000mm/s, step-length 6 μ m, the 100 μ s that delay time, frequency 30KHz, power 4W fills spacing 40 μ m.Behind the laser ablation, plastic sample is carried out abatement processes, then place to consist of CuSO
45H
2O:0.12mol/L, Na
2EDTA2H
2O:0.14mol/L, yellow prussiate of potash: 10mg/L, 2,2 '-dipyridyl: 10mg/L, oxoethanoic acid (HOCCOOH): in the plating bath of 0.10mol/L, and with NaOH and H
2SO
4The pH value of regulating plating bath is 12.5 to carry out electroless copper, and after tested, copper facing speed is 5 μ m/h.
Embodiment 4-19
Present embodiment is used for illustrating the method for plastics composite of the present invention and selective metallization of plastic surface.
Adopt embodiment 1 described method to prepare plastics composite and make selective metallization of plastic surface, different is, adopts respectively the catalyst component shown in the table 1, and measures respectively the copper facing speed of embodiment 4-19, and the result is as shown in table 1.
Wherein, employed hydrogenation catalyst is self-control and obtains among the embodiment, and the self-control method is according to document: Acta PhySico-Chimica Sinica, 2004,20 (5): 524-528 and Angew.Chem.Int.Ed.2003, the described method of 42,3815-3817 is carried out.
For example the Cu-Zn hydrogenation catalyst prepares according to the method for being prepared as follows: by Cu: the Zn mol ratio is the mixed nitrate solution of 8: 1 preparation Cu and Zn, and making the total concn of metal ion in the mixed solution is that the total concn of cupric ion and zine ion is 0.25mol/L, with Na
2CO
3Be precipitation agent, Na
2CO
3Concentration be 0.5mol/L, under 85 ℃ and rapid stirring, and drip adds above-mentioned mixed nitrate solution and Na
2CO
3Solution is in reactor, control the pH=6.8 of solution～7.0 with the rate of addition of two kinds of solution simultaneously, the pH value of solution was then aging 1h under this temperature of 7.0. when reaction finished, and cooled and filtered is used deionized water wash, drain, and 110 ℃ of oven dry, then just can obtain required Cu-Zn hydrogenation catalyst at 350 ℃ of roasting 4h, in the Cu-Zn hydrogenation catalyst that makes after testing, in oxide compound, the ratio of the amount of substance of Cu and Zn is 8.1: 1.
Comparative Examples 1
This Comparative Examples is used for illustrating the method for existing plastics composite and selective metallization of plastic surface.
Adopt embodiment 1 described method to prepare plastics composite and make selective metallization of plastic surface, different is, adopts respectively the catalyst component shown in the table 1, and measures the copper facing speed of Comparative Examples 1, and the result is as shown in table 1.
Table 1
Comparing embodiment 1 and Comparative Examples 1 can be found out, under the identical condition of other condition, adopt existing catalyst component ZnO, and electroless copper speed only is 0.05 μ m/h, and use the preferred Ni of the present invention
2O
3As catalyst component, electroless copper speed is up to 4 μ m/h.
Embodiment 20-38
Present embodiment is used for illustrating the method for plastics composite of the present invention and selective metallization of plastic surface.
Embodiment 20-38 adopts respectively the described method of embodiment 1-19 to prepare plastics composite and make selective metallization of plastic surface, different is, to shining the plastic sample of too drastic light, first chemical nickel plating before electroless copper, and measuring respectively the nickel plating speed of embodiment 20-38, the result is as shown in table 2.The method of chemical nickel plating is as described below:
Behind the laser ablation, plastic sample is carried out abatement processes, then place to consist of single nickel salt: 23g/l, inferior sodium phosphate: 18g/l, lactic acid: 20g/l is in the plating bath of oxysuccinic acid: 15g/l, regulating pH with NaOH is 5.2, and bath temperature is 90 ℃, carries out chemical nickel plating.
Comparative Examples 2
This Comparative Examples is used for illustrating the method for existing plastics composite and selective metallization of plastic surface.
Adopt Comparative Examples 1 described method to prepare plastics composite and make selective metallization of plastic surface, different is, to shining the plastic sample of too drastic light, and first chemical nickel plating before electroless copper, and measure the nickel plating speed of Comparative Examples 2, the result is as shown in table 2.Chemical nickel plating method adopts the method described in the embodiment 20-38 to carry out.
Table 2
Comparing embodiment 20 and Comparative Examples 2 can be found out, under the identical condition of other condition, adopt existing catalyst component ZnO, and chemical nickel plating speed only is 0.05 μ m/h, and use the preferred Ni of the present invention
2O
3As catalyst component, chemical nickel plating speed is up to 3 μ m/h.
Claims (12)
1. the method for a selective metallization of plastic surface, the method comprises:
Plastics composite is mixed and injection moulding, obtain plastic sample;
By the irradiation energy line described plastic sample is carried out etching, expose the catalyst component particle so that the partly plastic gasification is peeled off;
The plastic sample that exposes the catalyst component particle is carried out electroless copper;
Wherein, described plastics composite contains plastic basis material component and catalyst component, and described catalyst component is one or more in the oxalate of the periodic table of elements the 9th, 10 and 11 row metallic elements.
2. the method for selective metallization of plastic surface according to claim 1, wherein, described catalyst component is one or more in the oxalate of the periodic table of elements the 10th and 11 row metallic elements.
3. the method for selective metallization of plastic surface according to claim 1, wherein, in described plastics composite, with respect to the catalyst component of 100 weight parts, the content of described plastic basis material component is the 1000-10000 weight part.
4. according to claim 1 or the method for 3 described selective metallization of plastic surface, wherein, described catalyst component is particulate state, and the average particle diameter of this particle is not more than 100 microns.
5. the method for selective metallization of plastic surface according to claim 4, wherein, the average particle diameter of described particle is 10 nanometers to 1 micron.
6. the method for selective metallization of plastic surface according to claim 5, wherein, the average particle diameter of described particle is 10 nanometer to 100 nanometers.
7. according to claim 1 or the method for 3 described selective metallization of plastic surface, wherein, described plastic basis material component is thermoplastic resin or thermosetting resin.
8. the method for selective metallization of plastic surface according to claim 7, wherein, described thermoplastic resin is for being selected from polyolefine, polycarbonate, polyester, polymeric amide, polyarylether, polyester-imide, polycarbonate/(acrylonitrile-butadiene-styrene (ABS)) alloy, polyphenylene sulfide, polyimide, polysulfones, polyether-ether-ketone, in polybenzimidazole and the liquid crystalline polymers one or more, described thermosetting resin is for being selected from resol, urea-formaldehyde resin, melamine formaldehyde resin, Resins, epoxy, in Synolac and the urethane one or more.
9. the method for selective metallization of plastic surface according to claim 1, wherein, described plastics composite also contains one or more in mineral filler, oxidation inhibitor, photostabilizer and the lubricant;
In described plastics composite, with respect to the catalyst component of 100 weight parts, the content of described mineral filler is the 10-70 weight part; Take the gross weight of plastics composite as benchmark, the content of described oxidation inhibitor is the 0.01-1 % by weight, and the content of described photostabilizer is the 0.01-1 % by weight, and the content of described lubricant is the 0.01-1 % by weight;
Described mineral filler is one or more that are selected from glass fibre, stannic oxide, glass microballon, calcium carbonate, calcium sulfate, barium sulfate, talcum powder, titanium dioxide, pearlescence, wollastonite, diatomite, kaolin, coal dust, potter's clay, mica, kerosene shale ash, pure aluminium silicate, aluminum oxide, carbon black, carbon fiber, silicon-dioxide and the zinc oxide;
Described oxidation inhibitor contains primary antioxidant and auxiliary antioxidant, and the weight ratio of described primary antioxidant and described auxiliary antioxidant is 1:1-4, and described primary antioxidant is hindered phenol type antioxidant, and described auxiliary antioxidant is phosphite type oxidation inhibitor;
Described photostabilizer is hindered amine type light stabilizer;
Described lubricant is to be selected from copolymerization wax, polyethylene wax and the stearate of ethylene/vinyl acetate one or more.
10. the method for selective metallization of plastic surface according to claim 1, wherein, described energy line obtains by irradiating laser, the wavelength of described laser is 157 nanometers to 10.6 micron, and sweep velocity is the 500-8000 mm/second, and step-length is the 3-9 micron, time-delay is the 30-100 microsecond, frequency is the 30-40 kilohertz, and power is 3-4 watt, and filling spacing is the 10-50 micron.
11. the method for selective metallization of plastic surface according to claim 1, wherein, the method also is included in chemical nickel plating behind the electroless copper.
12. according to claim 1 or the method for 11 described selective metallization of plastic surface, wherein, the method also is included in chemical nickel plating before the electroless copper.
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