CN102277091A - 粘接剂组合物、电路连接材料、电路构件的连接构造及半导体装置 - Google Patents
粘接剂组合物、电路连接材料、电路构件的连接构造及半导体装置 Download PDFInfo
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- CN102277091A CN102277091A CN2011101995600A CN201110199560A CN102277091A CN 102277091 A CN102277091 A CN 102277091A CN 2011101995600 A CN2011101995600 A CN 2011101995600A CN 201110199560 A CN201110199560 A CN 201110199560A CN 102277091 A CN102277091 A CN 102277091A
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- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
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Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP2005302944 | 2005-10-18 | ||
JP2005-302944 | 2005-10-18 | ||
JP2006-182388 | 2006-06-30 | ||
JP2006182388 | 2006-06-30 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 200680038502 Division CN101292006A (zh) | 2005-10-18 | 2006-08-24 | 粘接剂组合物、电路连接材料、电路构件的连接构造及半导体装置 |
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Publication Number | Publication Date |
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CN102277091A true CN102277091A (zh) | 2011-12-14 |
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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CN2011101995600A Pending CN102277091A (zh) | 2005-10-18 | 2006-08-24 | 粘接剂组合物、电路连接材料、电路构件的连接构造及半导体装置 |
CN2011101035061A Pending CN102222649A (zh) | 2005-10-18 | 2006-08-24 | 粘接剂组合物、电路连接材料、电路构件的连接构造及半导体装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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CN2011101035061A Pending CN102222649A (zh) | 2005-10-18 | 2006-08-24 | 粘接剂组合物、电路连接材料、电路构件的连接构造及半导体装置 |
Country Status (5)
Country | Link |
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JP (1) | JPWO2007046190A1 (ja) |
KR (1) | KR101010108B1 (ja) |
CN (2) | CN102277091A (ja) |
TW (1) | TW200718764A (ja) |
WO (1) | WO2007046190A1 (ja) |
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JP2008291199A (ja) * | 2007-04-23 | 2008-12-04 | Hitachi Chem Co Ltd | 回路接続材料およびそれを用いた接続構造体 |
CN101982515B (zh) * | 2007-05-09 | 2013-07-03 | 日立化成株式会社 | 膜状电路连接材料及电路部件的连接结构 |
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JP4978893B2 (ja) * | 2007-12-19 | 2012-07-18 | Tdk株式会社 | 固体電解コンデンサ及び固体電解コンデンサの製造方法 |
WO2013035206A1 (ja) * | 2011-09-09 | 2013-03-14 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 電子装置用シール剤組成物 |
KR20230150341A (ko) * | 2021-03-31 | 2023-10-30 | 덴카 주식회사 | 접착제 조성물, 접합체 및 접착제 조성물의 제조 방법 |
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- 2006-08-24 WO PCT/JP2006/316589 patent/WO2007046190A1/ja active Application Filing
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JPH1135647A (ja) * | 1997-07-25 | 1999-02-09 | Hitachi Chem Co Ltd | 電子部品封止用成形材料、その成形方法、電子部品装置及びその製造方法 |
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WO2007046190A1 (ja) | 2007-04-26 |
KR20080068865A (ko) | 2008-07-24 |
JPWO2007046190A1 (ja) | 2009-04-23 |
TWI336724B (ja) | 2011-02-01 |
CN102222649A (zh) | 2011-10-19 |
KR101010108B1 (ko) | 2011-01-24 |
TW200718764A (en) | 2007-05-16 |
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