CN102250314A - Low-molecular-weight liquid bisphenol A epoxy resin - Google Patents
Low-molecular-weight liquid bisphenol A epoxy resin Download PDFInfo
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- CN102250314A CN102250314A CN 201110103267 CN201110103267A CN102250314A CN 102250314 A CN102250314 A CN 102250314A CN 201110103267 CN201110103267 CN 201110103267 CN 201110103267 A CN201110103267 A CN 201110103267A CN 102250314 A CN102250314 A CN 102250314A
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- epoxy resin
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- liquid bisphenol
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Abstract
The invention discloses a low-molecular-weight liquid bisphenol A epoxy resin, which comprises the following components in part by mass: 660 to 690 parts of diphenol propane, 560 to 580 parts of epoxy chloropropane and 860 to 880 parts of 30-percent sodium hydroxide. The low-molecular-weight liquid bisphenol A epoxy resin disclosed by the invention can be used in environment with high acid, alkali and salt concentration and has high waterproof performance, sealing performance and long service life.
Description
Technical field
The present invention relates to a kind of resin, be specially a kind of Resins, epoxy that composition contains the solvent reactive coating that is used to be suitable for combine with amine curing agent.
Background technology
The kind of present Resins, epoxy has a variety of, and purposes is also very extensive; Because its cohesive force is strong, shrinkability good, stability is high, in tackiness agent, casting, sealing, anticorrosive coating, varnish, obtained using widely.But the Resins, epoxy of Shi Yonging water resisting property in corrosive environment is poor in the market, physical strength is good inadequately, for the casting in some corrosive atmospheres, sealing can not reach that anti-water-lute requires or because of erosion resistance difference seal durability short.
Summary of the invention
Goal of the invention:, the invention provides a kind of lower molecular weight liquid bisphenol A type epoxy resin that water resisting property is strong in corrosive environment in order to solve the problems of the prior art.
Technical scheme: to achieve these goals, a kind of lower molecular weight liquid bisphenol A type epoxy resin of the present invention, the mass fraction of its content is as follows: 660 parts-690 parts of diphenylol propanes; 560 parts-580 parts of epoxy chloropropane; 30% sodium hydroxide 860-880 part.
It is 70-75 ℃ that lower molecular weight liquid bisphenol A type epoxy resin of the present invention generates temperature; Churning time is 35 seconds.
The optimum quality umber of lower molecular weight liquid bisphenol A type epoxy resin of the present invention is as follows: 680 parts of diphenylol propanes; 570 parts of epoxy chloropropane; 870 parts in 30% sodium hydroxide; Stir generation in 35 seconds down at 73.5 ℃.
Beneficial effect: the present invention compared with prior art has following advantage:
Lower molecular weight liquid bisphenol A type epoxy resin of the present invention can use under high density is the environment of salt of alkali, 30-45% of acid, the 45-50% of 70%-85%, and good waterproof performance, stopping property height, long service life.
Embodiment
Below in conjunction with specific embodiment, further illustrate the present invention, should understand these embodiment only is used to the present invention is described and is not used in and limit the scope of the invention, after having read the present invention, those skilled in the art all fall within the application's claims to the modification of the various equivalent form of values of the present invention and limit.
Embodiment 1
A kind of lower molecular weight liquid bisphenol A type epoxy resin, proportioning is as follows: diphenylol propane 680kg; Epoxy chloropropane 570kg; 30% sodium hydroxide 870kg; Stir generation in 35 seconds down at 73.5 ℃.
Embodiment 2
A kind of lower molecular weight liquid bisphenol A type epoxy resin, proportioning is as follows: diphenylol propane 660kg; Epoxy chloropropane 560kg; 30% sodium hydroxide 860kg; Stir generation in 35 seconds down at 70 ℃.
Embodiment 3
A kind of lower molecular weight liquid bisphenol A type epoxy resin, proportioning is as follows: diphenylol propane 690kg; Epoxy chloropropane 580kg; 30% sodium hydroxide 880kg; Stir generation in 35 seconds down at 72 ℃.
Embodiment 4
A kind of lower molecular weight liquid bisphenol A type epoxy resin, proportioning is as follows: diphenylol propane 690kg; Epoxy chloropropane 565kg; 30% sodium hydroxide 865kg; Stir generation in 35 seconds down at 74 ℃.
Embodiment 5
A kind of lower molecular weight liquid bisphenol A type epoxy resin, proportioning is as follows: diphenylol propane 670kg; Epoxy chloropropane 568kg; 30% sodium hydroxide 875kg; Stir generation in 35 seconds down at 75 ℃.
Claims (3)
1. lower molecular weight liquid bisphenol A type epoxy resin, it is characterized in that: the mass fraction of its content is as follows: 660 parts-690 parts of diphenylol propanes; 560 parts-580 parts of epoxy chloropropane; 30% sodium hydroxide 860-880 part.
2. lower molecular weight liquid bisphenol A type epoxy resin according to claim 1 is characterized in that: it is 70-75 ℃ that this lower molecular weight liquid bisphenol A type epoxy resin generates temperature; Churning time is 35 seconds.
3. lower molecular weight liquid bisphenol A type epoxy resin according to claim 1, it is characterized in that: the mass fraction of described its content is as follows: 680 parts of diphenylol propanes; 570 parts of epoxy chloropropane; 870 parts in 30% sodium hydroxide; Stir generation in 35 seconds down at 73.5 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110103267 CN102250314A (en) | 2011-04-25 | 2011-04-25 | Low-molecular-weight liquid bisphenol A epoxy resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110103267 CN102250314A (en) | 2011-04-25 | 2011-04-25 | Low-molecular-weight liquid bisphenol A epoxy resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102250314A true CN102250314A (en) | 2011-11-23 |
Family
ID=44977908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110103267 Pending CN102250314A (en) | 2011-04-25 | 2011-04-25 | Low-molecular-weight liquid bisphenol A epoxy resin |
Country Status (1)
| Country | Link |
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| CN (1) | CN102250314A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013063753A1 (en) * | 2011-11-01 | 2013-05-10 | Dow Global Technologies Llc | Liquid epoxy resin formulations |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1931890A (en) * | 2006-09-26 | 2007-03-21 | 蓝星化工新材料股份有限公司无锡树脂厂 | Synthesis process of epoxy resin with anionic catalyst |
| CN101613458A (en) * | 2008-06-25 | 2009-12-30 | 中国石油化工集团公司 | A kind of preparation method of bisphenol-A liquid epoxy resin |
-
2011
- 2011-04-25 CN CN 201110103267 patent/CN102250314A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1931890A (en) * | 2006-09-26 | 2007-03-21 | 蓝星化工新材料股份有限公司无锡树脂厂 | Synthesis process of epoxy resin with anionic catalyst |
| CN101613458A (en) * | 2008-06-25 | 2009-12-30 | 中国石油化工集团公司 | A kind of preparation method of bisphenol-A liquid epoxy resin |
Non-Patent Citations (1)
| Title |
|---|
| 《四川师范大学学报（自然科学版）》 20010331 杨东洁 双酚A 低分子环氧树脂的合成工艺研究 171-173 1-3 第24卷, 第2期 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013063753A1 (en) * | 2011-11-01 | 2013-05-10 | Dow Global Technologies Llc | Liquid epoxy resin formulations |
| US9745409B2 (en) | 2011-11-01 | 2017-08-29 | Blue Cube Ip Llc | Liquid epoxy resin formulations |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111123 |