CN102248633A

CN102248633A - Molding and packaging technology of LED lamp bead and special die thereof

Info

Publication number: CN102248633A
Application number: CN2011101199057A
Authority: CN
Inventors: 吴小云
Original assignee: HUIZHOU SULE TECHNOLOGY CO LTD
Current assignee: HUIZHOU SULE TECHNOLOGY CO LTD
Priority date: 2011-05-10
Filing date: 2011-05-10
Publication date: 2011-11-23

Abstract

The invention discloses a molding and packaging technology of an LED lamp bead and a special die thereof. The technology comprises the steps of: A. welding an LED chip fixedly on a support; B. fixing the support welded with the welded LED chip on the upper die of a die, and injecting silica gel into a lower die cavity installed within a lower die and filling up the lower die cavity; C. combining the upper and lower dies of the die, and during the operation, raising the temperature and pressure so as to discharge air from the die cavity until the silica gel in the die cavity is cured and molded; D. separating the upper and lower dies of the die, removing the silica gel molded and packaged support from the lower die cavity, thus finishing the silica gel molding and packaging operations of a set of support; E. repeating from steps A-D, thus achieving the batch operations of silica gel molding and packaging. The technology greatly shortens the processing time, reduces the steps and improves the processing efficiency by more than 60%, thus reducing the processing cost.

Description

A kind of LED bulb-forming packaging technology and particular manufacturing craft

Technical field

The invention belongs to semiconductor packaging process, relate in particular to a kind of LED bulb-forming packaging technology and particular manufacturing craft.

Background technology

The last protection glue that adopts in the existing large-power LED light bead packaging technology; generally be form by pressure injection; silica gel is injected in the PC cover of having buckled well; fill full PC cover by silica gel; air is discharged; play the protection chip and not disturbed by extraneous oxidation, and the light rising angle is carried out catadioptric control lighting angle and improve light emission rate.The shortcoming of prior art scheme is that the PC cover that is adopted is limited by material behavior, its heatproof is relatively poor, be difficult to adapt to the requirement of 260 ℃ of Reflow Soldering making technologies, simultaneously because of needing in the processing procedure to every bracket cover PC lens or mould bar, and then every injection silica gel, injecting glue process production efficiency is low and be easy to generate and also entire bracket will be moved into baking box segmentation baking behind bubble, the injecting glue, and technology is loaded down with trivial details, the processing procedure time long, homogeneity of product control is relatively poor.And PC and two kinds of light transmissive materials of silica gel use simultaneously, can be easy to generate interlayer because of the coefficient of expansion and material hardness difference, the loss luminous flux.

Summary of the invention

At above-mentioned technological deficiency, the technical problem to be solved in the present invention provides a kind of production efficiency of LED lamp bead seal dress and the technology and particular manufacturing craft of homogeneity of product of significantly improving.

The technical problem to be solved in the present invention is achieved through the following technical solutions: a kind of LED bulb-forming packaging technology, and step is: A, at first be welded in led chip on the support admittedly; B, the support that will weld led chip admittedly are fixed on the patrix of mould, and silica gel is injected the lower mode cavity that is located at down film in advance and fills up the lower mould chamber; C, the upper and lower mould of mould is closed membrane operations, in closing membrane process, need the temperature and pressure that raises, so that discharge the air in the die cavity, the curing molding on support of the silica gel in die cavity; D, the upper and lower mould of mould is carried out the branch membrane operations, the support that the silica gel moulding is packaged takes off from lower mode cavity, finishes the silica gel moulding packaging operation of a pack support; E, repetition A～D step have been finished the mass operation of silica gel moulding encapsulation.

Further: in above-mentioned LED bulb-forming packaging technology, the rising temperature and pressure is meant that it is 150 ℃～180 ℃ that temperature raises among the described step C, and pressure raises and is 18MPa～20MPa.

The present invention also provides the particular manufacturing craft of above-mentioned LED bulb-forming packaging technology, it comprises upper die and lower die, be provided with support bracket fastened fixture on the land area of patrix, described film down is provided with the bottom film chamber that holds silica gel, and the opening surface of described bottom film chamber is consistent with land area.Described fixture be the clamping support and can with the screen frame of patrix dismounting.

Compared with prior art, above-mentioned LED bulb-forming packaging technology does not change original encapsulation silica gel material and technological principle, only existing moulding encapsulation molding processing procedure is readjusted layout technology, by importing the novel process mould, realize molding encapsulation automation, significantly shorten process time, reduce processing step, improve working (machining) efficiency more than 60%, thereby cut down finished cost.

Description of drawings

Fig. 1 installs standoff mould vertical profile structure diagram;

Fig. 2 is the vertical profile structure diagram of matched moulds up and down;

Fig. 3 is the vertical profile structure diagram of branch film;

Wherein, 1 led chip, 2 supports, 3 patrixes, 4 times films, 5 lower mode cavities, 6 screen frames.

The specific embodiment:

For the ease of those skilled in the art's understanding, structural principle of the present invention is further described in detail below in conjunction with the specific embodiment and accompanying drawing.

As Fig. 1-3, a kind of particular manufacturing craft of LED bulb-forming packaging technology, it comprises patrix 3, counterdie 4, is provided with the fixture of fixed support 3 on the land area of patrix 3, described film 4 down is provided with the bottom film chamber 5 that holds silica gel, and the opening surface of described bottom film chamber 5 is consistent with land area.Described fixture be clamping support 3 and can with the screen frame 6 of patrix dismounting, shown in 1.Its processing step is: at first led chip 1 is welded on the support 2 admittedly; Admittedly the support that welds led chip is fixed on the patrix 3 of mould, silica gel is injected the lower mode cavity 5 that is located at down film 4 in advance and fills up lower mould chamber 5, promptly utilize the gravitational principle of the earth, silica gel is injected in the lower mould chamber 5 in advance, utilize the mobile and deadweight of silica gel self, fill up the cavity that mould needs moulding.After treating that silica gel is filled with the need molding cavity, remove the injecting glue bucket.The upper and lower mould of mould is closed membrane operations, in closing membrane process, need the temperature and pressure that raises, so that the air in the discharge die cavity, silica gel in die cavity is curing molding on support 2, as shown in Figure 2, and the pressurization of in this process, will heating, it is 150 ℃～180 ℃ that temperature must raise, pressure must raise and be 18MPa～20MPa, by pore and the runner that designs in the mould, fills up silica gel with unnecessary air discharge and according to lower mode cavity 5 shapes.The upper and lower mould of mould is carried out the branch membrane operations, and the support 2 that the silica gel moulding is packaged takes off from lower mode cavity 5, forms the silica gel 7 as the lower mode cavity shape on the support, so just finishes the silica gel moulding packaging operation of a pack support, as shown in Figure 3.Repeat above-mentioned steps, finished the mass operation of silica gel moulding encapsulation.

By the way, finished the existing pattern of single operation of silica gel encapsulation molding automation replacement, the lifting of implementation efficiency and quality.

Above-mentioned embodiment only is preferred implementation of the present invention, and under the prerequisite that does not break away from the present invention's design, any conspicuous replacement all should fall within protection scope of the present invention.

Claims

1. LED bulb-forming packaging technology, step is:

A, at first led chip (1) is welded on the support (2) admittedly;

B, the support that will weld led chip admittedly are fixed on the patrix (3) of mould, and silica gel is injected the lower mode cavity (5) that is located at down film (4) in advance and fills up lower mould chamber (5);

C, the upper and lower mould of mould is closed membrane operations, need the temperature and pressure that raises in closing membrane process, so that discharge the air in the die cavity, the silica gel in die cavity is gone up curing molding at support (2);

D, the upper and lower mould of mould is carried out the branch membrane operations, the support that the silica gel moulding is packaged (2) takes off from lower mode cavity (5), finishes the silica gel moulding packaging operation of a pack support;

E, repetition A～D step have been finished the mass operation of silica gel moulding encapsulation.

2. LED bulb-forming packaging technology according to claim 1 is characterized in that: the rising temperature and pressure is meant that it is 150 ℃～180 ℃ that temperature raises among the described step C, and pressure raises and is 18MPa～20MPa.

3. particular manufacturing craft that is exclusively used in claim 1 or 2 described LED bulb-forming packaging technologies, it comprises patrix (3), counterdie (4), it is characterized in that: the fixture that on the land area of patrix (3), is provided with fixed support (3), described film (4) down is provided with the bottom film chamber (5) that holds silica gel, and the opening surface of described bottom film chamber (5) is consistent with land area.

4. the particular manufacturing craft of LED bulb-forming packaging technology according to claim 3 is characterized in that: described fixture be clamping support (3) and can with the screen frame (6) of patrix dismounting.