CN102242344A

CN102242344A - Sputtering apparatus

Info

Publication number: CN102242344A
Application number: CN2010101693875A
Authority: CN
Inventors: 王仲培
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2010-05-13
Filing date: 2010-05-13
Publication date: 2011-11-16

Abstract

The invention relates to a sputtering apparatus, which comprises a sputtering cavity, a fixed frame arranged in the sputtering cavity, a plurality of stub rods arranged on the fixed frame and used for suspending workpieces to be plated, and an air inlet apparatus positioned in the sputtering cavity. The air inlet apparatus comprises an air inlet pipe and a plurality of gas-guide tubes provided corresponding to the stub rods. Each gas-guide tube comprises an inlet end communicated with the air inlet pipe and a sealed end opposite to the inlet end. Multiple pores are provided between the inlet end and the sealed end by each gas-guide tube. Gas not totally react in the sputtering cavity can be performed a complete reaction with gas introduced from the gas-guide tube through the air inlet apparatus, thereby the quality of the plated film can be guaranteed.

Description

Sputtering apparatus

Technical field

The present invention relates to a kind of sputter technology, relate in particular to a kind of sputtering apparatus.

Background technology

Sputter is a kind of physical gas phase deposition technology, the sputter principle is under vacuum environment, the energetic plasma bump rake thin that utilizes glow discharge or ionic fluid to produce comes out the atom in the rake thin and be deposited on substrate and form film from the rake thin bombardment with the momentum tranfer system.Because sputter can be reached preferable sedimentation effect, the control of accurate composition, and lower manufacturing cost, therefore be widely used in the making of various metals and nonmetal rete in the industry.

When carrying out reactive sputter, to in the sputter cavity, feed multiple reactant gas, usually, should mix in cavity of multiple reactant gases feeding earlier, and then pass through a gas pipeline with in the mixed reactant gases feeding sputter cavity, also need constantly from this sputter cavity, to bleed out simultaneously.And various factor causes reacting incomplete situation easily and takes place because the position of bleeding point setting or the speed of evacuation be too fast etc., thereby influences the plated film quality.

Summary of the invention

In view of this, be necessary to provide a kind of sputtering apparatus that can in reactive sputter process, make the reactant gases complete reaction.

A kind of sputtering apparatus, it comprise a sputter cavity, one be arranged at this intravital anchor in sputter chamber, a plurality of be arranged on this anchor and be used to hang the material bar of workpiece to be plated and one be positioned at this intravital diffuser in sputter chamber.This diffuser comprises an inlet pipe and a plurality of airways that should be provided with these a plurality of material pole pairs.Each airway comprises the inlet end and the blind end relative with this inlet end that are communicated with this inlet pipe.Each airway is provided with a plurality of pores between this inlet end and this blind end.

Compared with prior art, above-mentioned sputtering apparatus, airway by diffuser is passed into reactant gas near the material bar, make in the sputter cavity that the gas of complete reaction is incomplete with the gas reaction that feeds from this airway, avoided the generation of the incomplete situation of reaction that causes by various factors, make that reactant gases can complete reaction, thereby guarantee the plated film quality.

Description of drawings

The three-dimensional exploded view of the sputtering apparatus that Fig. 1 provides for the embodiment of the invention.

Fig. 2 is the structural representation of the diffuser among Fig. 1.

Fig. 3 is the part assembling synoptic diagram of the sputtering apparatus among Fig. 1.

Fig. 4 is the three-dimensional assembly diagram of the sputtering apparatus among Fig. 1.

The main element nomenclature

Sputtering apparatus 10

Sputter cavity 11

Inlet mouth 111

Air outlet 112

Material bar 12

Hanger bracket 121

Anchor 13

Upper supporting disk 131

Following carrier 132

Support bar 133

Diffuser 14

Fixing-holding rack 141

Ventpipe 141a

Support portion 141b

Airway 141c

Inlet end 141d

Blind end 141e

Pore 141f

Sidewall 141g

Inlet pipe 142

Isocon 143

Embodiment

For sputtering apparatus of the present invention is described further, lifts following embodiment and conjunction with figs. and be elaborated.

See also Fig. 1 and Fig. 4, for a kind of sputtering apparatus 10 provided by the invention comprises a sputter cavity 11, four material bars 12, an anchor 13 and a diffuser 14.

This sputter cavity 11 is a hollow cylinder, and it is used for workpiece to be plated (figure does not show) is carried out sputter.This sputter cavity 11 is provided with the inlet mouth 111 and the air outlet that is used for bleeding 112 that are used for feeding reactant gases.

This material bar 12 is the column body of rod, is interval with the hanger bracket 121 that is used to hang this workpiece to be plated on this material bar 12.Wherein, the quantity of this material bar 12 can be decided as the case may be.

This anchor 13 comprises carrier 132 under ring-type upper supporting disk 131 being oppositely arranged and the ring-type, it is fixing to support also to be provided with four support bars 133 between this upper supporting disk 131 and this time carrier 132, and these a plurality of material bars 12 at interval and be arranged at rotationally between this upper supporting disk 131 and this time carrier 132.The structure that this material bar 12 is arranged between this upper supporting disk 131 and this time carrier 132 can be any, can rotate with respect to this upper supporting disk 131 and this time carrier 132 as long as guarantee this material bar 12.

Please in conjunction with Fig. 2 and Fig. 3, this diffuser 14 comprises a fixing-holding rack 141, inlet pipe 142 and four isocons 143.

This fixing-holding rack 141 is arranged at this anchor 13 inboards, and this fixing-holding rack 141 comprises a ring-type ventpipe 141a who is oppositely arranged, an annular support part 141b and four airway 141c.

This inlet pipe 142 is a hollow tubular, and its cross-sectional shape is not limit.This inlet pipe 142 is communicated with ventpipe 141a by these four isocons 143.

This airway 141c is a hollow round tubular also, is arranged between this ventpipe 141a and this support portion 141b and corresponding with this material bar 12.This airway 141c comprises an inlet end 141d and the blind end 141e relative with this inlet end 141d with these isocon 143 corresponding connections.This blind end 141e is fixedly arranged on this support portion 141b.This airway 141c is provided with a plurality of pore 141f between this inlet end 141d and this blind end 141e.Preferably, these a plurality of pore 141f uniformly-spaced are arranged between this inlet end 141d and this blind end 141e along this airway 141c central shaft.More preferably, the aperture of these a plurality of pore 141f increases successively from this inlet end 141d to this blind end 141e.So, gas volume that overflows near the pore 141f this inlet end 141d and the gas volume that overflows near the pore 141f this blind end 141e are more or less the same.Wherein, these a plurality of pore 141f axially forming a line and be arranged at the sidewall 141g of this airway 141c towards this material bar 12 along this airway 141c.So, help after the gas reaction fully in this sputter cavity 11 again sputter to this workpiece to be plated.In other embodiments, these a plurality of pore 141f quantity and arrangement mode can be decided according to practical situation.

In other embodiments, this airway 141c also can be tapered tube.Accordingly, these a plurality of pore 141f are positioned on the same bus of this airway 141c, and equidistant along this bus.

In other embodiments, this fixing-holding rack 141 also can be arranged at other positions of anchor 13, makes this airway 141c corresponding with this material bar 12 as long as guarantee.So, can make the gas of complete reaction not complete with the gas reaction that feeds from this airway 141c.

In other embodiments, this diffuser 14 also can not comprise this ventpipe 141a and this support portion 141b, but on this upper supporting disk 131, offering a plurality of through holes (figure does not show), this airway 141c passes these a plurality of through holes supports the blind end 141e of this airway 141c and this time carrier 132.

In the sputter process, drive this anchor 13 it revolved round the sun, and drive simultaneously this material bar 12 make this its drive workpiece to be plated and carry out rotation.Simultaneously, feed reactant gasess, it is overflowed from these a plurality of pore 141f, react with gas in this sputter cavity 11 from this inlet pipe 142.Preferably, in the process that anchor 13 revolves round the sun, this diffuser 14 also revolves round the sun simultaneously, makes the material bar 12 that is arranged on this anchor 13 remain corresponding with airway 141c on this diffuser 14.So, can more help making the reactant gases complete reaction.

Above-mentioned sputtering apparatus, airway by diffuser is passed into reactant gas near the material bar, make in the sputter cavity that the gas of complete reaction is incomplete with the gas reaction that feeds from this airway, avoided the generation of the incomplete situation of reaction that causes by various factors, make that reactant gases can complete reaction, thereby guarantee the plated film quality.

Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection domain that all should belong to claim of the present invention with distortion.

Claims

1. sputtering apparatus, it comprises a sputter cavity, one is arranged at this intravital anchor in sputter chamber and a plurality of material bar that is arranged on this anchor and is used to hang workpiece to be plated, it is characterized in that: this sputtering apparatus comprises that also is positioned at this intravital diffuser in sputter chamber, this diffuser comprises an inlet pipe and a plurality of airways that should be provided with these a plurality of material pole pairs, each airway comprises the inlet end and the blind end relative with this inlet end that are communicated with this inlet pipe, and each airway is provided with a plurality of pores between this inlet end and this blind end.

2. sputtering apparatus as claimed in claim 1 is characterized in that: the aperture of these a plurality of pores increases successively from this inlet end to this blind end.

3. sputtering apparatus as claimed in claim 2 is characterized in that: these a plurality of pores uniformly-spaced are arranged between this inlet end and this blind end along this airway central shaft.

4. sputtering apparatus as claimed in claim 1 is characterized in that: this airway is a tapered tube, the identical and spaced set in the aperture of these a plurality of pores.

5. sputtering apparatus as claimed in claim 4 is characterized in that: these a plurality of pores are positioned on the same bus of this airway, and equidistant along this bus.

6. sputtering apparatus as claimed in claim 1 is characterized in that: these a plurality of pores are located at the side that this airway and this material pole pair are answered.

7. sputtering apparatus as claimed in claim 1 is characterized in that: these a plurality of pores axially are the sidewall that at least one row are arranged at this airway along this airway.

8. sputtering apparatus as claimed in claim 1, it is characterized in that: this anchor comprises carrier under ring-type upper supporting disk being oppositely arranged and the ring-type, also be provided with some support bars with this upper supporting disk of support fixation and this time carrier between this upper supporting disk and this time carrier, these a plurality of material bars at interval and be arranged at rotationally between this upper supporting disk and this time carrier.

9. sputtering apparatus as claimed in claim 8, it is characterized in that: this diffuser also comprises an inlet pipe and a fixing-holding rack that is arranged at this anchor inboard, this fixing-holding rack comprises annular support part that a ring-type ventpipe, one and this ventpipe are oppositely arranged and a plurality of airway that is arranged between this ventpipe and this support portion and answers with this material pole pair, the inlet end of this airway is communicated with this inlet pipe by this ventpipe, and the blind end of this airway is fixedly arranged on this support portion.

10. sputtering apparatus as claimed in claim 8 is characterized in that: offer a plurality of through holes on this upper supporting disk, this airway passes these a plurality of through holes supports the blind end of this airway and this time carrier.