CN102240663A - Method for separating and recycling rare noble metals and waste plastics in waste circuit board - Google Patents
Method for separating and recycling rare noble metals and waste plastics in waste circuit board Download PDFInfo
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- CN102240663A CN102240663A CN2011100926124A CN201110092612A CN102240663A CN 102240663 A CN102240663 A CN 102240663A CN 2011100926124 A CN2011100926124 A CN 2011100926124A CN 201110092612 A CN201110092612 A CN 201110092612A CN 102240663 A CN102240663 A CN 102240663A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/52—Mechanical processing of waste for the recovery of materials, e.g. crushing, shredding, separation or disassembly
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
Abstract
The invention provides a method for separating and recycling rare noble metals and waste plastics in a waste circuit board, comprising the following steps of: separating components and a substrate; processing split substances; separating lead and tin; processing the components; recycling rare noble metals; and processing the substrate. There is unnecessary to heat so as to achieve low energy consumption. Simultaneously, with the premise of not damaging the substrate and the components, the soldering process is carried out so as to separate completely and recycle tin effectively. The method disclosed by the invention has high automation degree and high practicability.
Description
Technical field
The present invention relates to the processing of industrial waste, relate in particular to the separation and recovery method of rare precious metal and waste plastics in a kind of waste and old circuit board.
Background technology
Along with the raising of people's living standard, the frequency that various household electrical appliances update is more and more higher, and the quantity of the waste and old circuit board that various waste household appliances produced (PCB) is more and more.These waste and old circuit boards not only will be taken a large amount of land resources if directly abandon, and also will cause the waste of valuable metal resource, and multiple poisonous and harmful substances such as wherein contained polyvinyl chloride and halide fire retardant will produce huge pollution to surrounding environment.On the other hand, often be welded with various electronic devices and components on the circuit board, these components and parts are fixed on the substrate in the mode of scolding tin welding usually, its composition of different components and parts has nothing in common with each other, wherein gold, palladium, platinum, silver etc. belong to precious metal, tantalum, niobium, cerium etc. belong to rare metal, have great economic worth.Therefore, how effectively to handle waste and old circuit board, realize the recycling of waste and old circuit board, become problem demanding prompt solution.
If the wiring board that adopts direct comminuting method will have components and parts is pulverized, the product component complexity that obtains is difficult to therefrom reclaim pointedly valuable metal.Therefore, before from components and parts, reclaiming valuable metal, components and parts are separated with substrate and seem very important.Components and parts are disassembled to handle separately from substrate help formulating pointedly recovery scheme, reclaim the valuable metal in the components and parts efficiently, control the pollution of harmful substance effectively and reduce processing cost to greatest extent simultaneously.
At present, mainly there is following problem in the method for separating component and substrate in the industry: 1. the production efficiency of manually disassembling method is low, is not suitable for large-scale industrialization production; 2. need heat treated in the heat fused scolding tin method of extensive use, for example feed hot blast or spray high-temp liquid fusing scolding tin, the energy consumption height, and be subjected to the influence of heating-up temperature, and easily cause scolding tin to remove not exclusively, while wounded substrate and components and parts, practicality is not high.
Summary of the invention
For addressing the above problem, the present invention aims to provide the separation and recovery method of rare precious metal and waste plastics in a kind of waste and old circuit board, this method need not heat treated, energy consumption is low, simultaneously can be under the prerequisite of not wounded substrate and components and parts, realize that scolding tin removes fully and tin is reclaimed effectively, automaticity height, practicality height.
The invention provides the separation and recovery method of rare precious metal and waste plastics in a kind of waste and old circuit board, may further comprise the steps:
(1) separating component and substrate: get waste and old circuit board, cleaning, drying, waste and old circuit board vertically is held on the sealing-off equipment, spray nitric acid type tin stripping liquid to waste and old circuit board and carry out the sealing-off processing, mechanical curettage components and parts or mechanical oscillation make components and parts come off from substrate, collect the substrate behind cast and the separating component respectively;
(2) handle cast: get cast described in the step (1), according to the difference of proportion, that components and parts in the cast and scolder are separated from one another;
(3) separate slicker solder: get that scolder reclaims lead and tin respectively described in the step (2);
(4) handling components: get the components and parts in the step (2), carry out drying, thick broken, eddy current sorting, broken and electrostatic separation carefully, components and parts metal concentrate powder;
(5) reclaim rare precious metal: get components and parts metal concentrate powder described in the step (4), reclaim rare precious metal;
(6) treatment substrate: get the substrate behind the separating component in the step (1), carry out drying, thick broken, eddy current sorting, broken and electrostatic separation carefully, substrate metal enrich body powder and waste plastics powder.
Wherein, reasonably combine two kinds of technologies of wet method sealing-off method and mechanical phonograph recorder separation in the step (1), efficiently components and parts are disassembled from substrate.
On the one hand, wet method sealing-off method need not the scolding tin heat treated, and energy consumption is low, simultaneously can realize that scolding tin removes fully under the prerequisite of not wounded substrate and components and parts.
Usually, the leypewter layer that is plated on the circuit board and the copper between the base copper-layer-ashbury metal thickness are 0.05 μ m～0.1 μ m, and As time goes on increase, so waste and old circuit board needs the scolding tin that removes that strong oxidizer could be strong.Tin stripping liquid of the present invention is the nitric acid type, and its oxidation system is made up of nitric acid and ferric nitrate/iron chloride.Preferably, nitric acid type tin stripping liquid of the present invention comprises following component and percetage by weight: nitric acid 15～50%, and ferric nitrate or iron chloride 1～20%, sulfonic acid 1～5%, all the other are water.
Wherein, nitric acid is the main oxidant of dissolving scolding tin, and can select mass percent for use is 68% nitric acid.Because tin is the torpescence metal, diluted acid and tin effect are very slow.Tin stripping liquid of the present invention is compared the concentration that existing tin stripping liquid has improved nitric acid, has effectively improved the corrosion rate to scolding tin.
Fe in ferric nitrate or the iron chloride
3+Have strong oxidizing property, add the oxidability that ferric nitrate or iron chloride can improve tin stripping liquid, and then effectively improve the speed of dissolving scolding tin, simultaneously, play the effect that promotes corrosion signal bronze layer.
In moving back the tin process, tin mainly is with Sn
2+Form exist in solution.Because Sn
2+Be oxidized to Sn by red fuming nitric acid (RFNA), airborne oxygen etc. easily
4+, and Sn
4+Facile hydrolysis produces β-stannic acid precipitation, finally causes β-stannic acid attached to the dissolving that influences scolding tin on the scolding tin, so needs to add sulfonic acid in the tin stripping liquid.The effect of sulfonic acid be with solution in Sn
2+Form stable complex, promote the dissolving of scolding tin.Simultaneously, sulfonic acid is a kind of strong acid, can suppress the decomposition of nitric acid in the tin stripping liquid effectively.Consider that from cost of material more preferably, sulfonic acid is selected sulfamic acid for use.
More preferably, tin stripping liquid of the present invention comprises following component and percetage by weight: nitric acid 30～50%, and ferric nitrate or iron chloride 10～18%, sulfonic acid 3～5%, all the other are water.Further preferably, tin stripping liquid of the present invention comprises following component and percetage by weight: nitric acid 50%, and ferric nitrate or iron chloride 18%, sulfonic acid 5%, all the other are water.
Handle because tin stripping liquid of the present invention only is used for that the scolding tin on the waste and old circuit board is carried out sealing-off, and this class waste and old circuit board can not repeat to utilize again, need not to consider the protection to copper circuit on the circuit board, therefore tin stripping liquid of the present invention need not to add corrosion inhibiter.Tin stripping liquid component of the present invention is simple and to move back tin speed fast.
The preparation method of tin stripping liquid of the present invention comprises: get ferric nitrate or iron chloride, sulfonic acid and be dissolved in fully in the water, add nitric acid, stir, make tin stripping liquid of the present invention.
On the other hand, mechanical phonograph recorder separation can improve the efficient that components and parts come off from substrate.Particularly, sealing-off equipment comprises: move back tin device, separator and accumulator tank.Wherein, move back the tin device and comprise that inside is equipped with the liquid holding rector of tin stripping liquid, the sidewall of liquid holding rector is provided with the anchor clamps that are used for the clamping waste and old circuit board and is provided with spray-hole in the sidewall relevant position.Separator comprises locating shaft and the cutter that is arranged on the locating shaft, locating shaft is arranged on from anchor clamps a distance, can comprehensive rotation also can be up and down along plotted along the axle center, when movable, the cutter that is provided with it on can contact with the waste and old circuit board in being clamped in anchor clamps is surperficial.Accumulator tank is arranged on the below of moving back tin device and separator.The upper wall of liquid holding rector is outward extended with circulating line, and circulating line finally extends in the accumulator tank, and it is recycling that the useless tin stripping liquid that is used for collecting in the accumulator tank is circulated to liquid holding rector.Be provided with circulating pump in the circulating line.Preferably, the sealing-off equipment conveying device that also comprises before the spray-hole that waste and old circuit board can be delivered to liquid holding rector and the waste and old circuit board after the sealing-off is removed.
Step of the present invention (1) is specially, waste and old circuit board is clamped in the anchor clamps of liquid holding rector sidewall, from spray-hole, spray tin stripping liquid to the surface of waste and old circuit board scolding tin one side and move back the tin processing, simultaneously, the locating shaft activity makes that the surface of cutter contact waste and old circuit board components and parts one side is also vertically up and down, causes components and parts to be scraped to accumulator tank by cutter.Preferably, locating shaft also is provided with vibrating device, is used for components and parts are dropped in the accumulator tank from the substrate vibration.
In the step (1), the scolder on the waste and old circuit board is often along with coming off of components and parts drops in the accumulator tank together.Therefore, need to carry out step (2) behind the cast in the collection accumulator tank: handle cast, according to the difference of proportion, that components and parts in the cast and scolder are separated from one another.
Isolated scolder contains the metallic tin (price of current tin metal up to 150,000 yuan/ton about) of high level in the step (2), has great recovery value.Simultaneously, scolder also contains the lead ion of high level.Therefore, be necessary to carry out step (3): get scolder and reclaim lead and tin respectively.
Step (4) is a handling components: get the components and parts in the step (2), carry out drying, thick broken, eddy current sorting, broken and electrostatic separation carefully, components and parts metal concentrate powder.
Step (5) is for reclaiming rare precious metal: get components and parts metal concentrate powder described in the step (4), extract rare precious metal.Rare precious metal comprises rare metals such as precious metals such as gold, palladium, platinum, silver and tantalum, niobium, cerium.Preferably, step (5) also comprises metals such as extracting lead, antimony, aluminium, copper, nickel.
More preferably, the method for extracting lead, antimony, aluminium is for to leach lead ion, antimony ion and aluminium ion from components and parts metal concentrate powder, and leachate obtains Na after evaporation and concentration
2PbO
3, Na
2SbO
3And Na
2AlO
2Mixed crystal.
More preferably, the method for extracting copper, nickel, silver, gold is to extract after the acidleach, and electrodeposition obtains electro deposited copper, electro deposited nickel, electrodeposition silver and electrodeposition gold respectively.
More preferably, the method for extraction platinum is to add saturated NH after the acidleach
4Filter behind Cl reaction 2～8h, filter residue is an ammonium chloroplatinate, obtains spongy platinum after refining.
More preferably, the method for extracting palladium is in palladium: the formic acid mass ratio is 0.5～3: 1 ratio adding formic acid, reacts 0.5～2h under 50～90 ℃ of intensively stirred conditions, and the pH value is controlled at 6.0～9.0, obtains thick palladium powder.
For example, step (5) is as follows:
A. extract lead, antimony and aluminium: get components and parts metal concentrate powder described in the step (4), leach lead ion, antimony ion and Al ion, filter, filtrate obtains Na after evaporation and concentration
2PbO
3, Na
2SbO
3And Na
2AlO
2Mixed crystal, mother liquid evaporation return the water logging operation;
B. extract copper: the filter residue of getting deleading described in the A, antimony and aluminium, add 0.5～3.5mol/L sulfuric acid solution and oxidant, under 20～70 ℃ of temperature, leach 2～8h, solution after leaching is filtered, eddy flow selectivity electro deposited copper, its electrodeposition condition is: electrolyte ph is 1.0～5.0, and temperature is 20～60 ℃, and current density is 200～550A/m
2, the electrodeposition time is 0.5～4h, obtains electro deposited copper, the copper removal filter residue enters D;
C. extract nickel: get among the B liquid eddy flow selectivity electro deposited nickel behind the electrodeposition, its electrodeposition condition is: electrolyte ph is 1.0～5.0, and temperature is 20～70 ℃, and current density is 200～450A/m
2, the electrodeposition time is 0.5～4h, obtains electro deposited nickel, liquid returns the sulfuric acid leaching behind the electrodeposition;
D. extract silver: get the filter residue of copper removal described in the B, by the concentration with salpeter solution is 1: 1～3 adding salpeter solution dissolving silver and palladiums, the control extraction temperature is 25～85 ℃ of leaching 0.5～3h, the isolated by filtration solid-liquid, get argentiferous, the filtrate of palladium and desilver, the filter residue of palladium is subsequently at argentiferous, control pH value is 3～5 in the filtrate of palladium, and normal temperature constantly stirs down, add NaOH solution, make the palladium precipitation, silver ion is stayed in the solution, the isolated by filtration solid-liquid, get argentiferous filtrate and contain the palladium sediment, add sodium chloride to described argentiferous filtrate, make the silver precipitation, the isolated by filtration solid-liquid, get silver nitride precipitation, desilver, the palladium filter residue enters E;
E. extract gold: get desilver described in the E, palladium filter residue, add the chloroazotic acid of 1～5 times of quality, the speed with 100～1000r/min under 20～70 ℃ of temperature stirs, and leaches 1～2.5h; Leachate eddy flow electrodeposition gold, its electrodeposition condition is: temperature is 20～60 ℃, current density is 50～400A/m
2, the electrodeposition time is 0.5～4h, and electrolyte ph is 1.0～5.5, obtains the electrodeposition gold, and liquid enters F behind the electrodeposition;
F. extract platinum: get among the E liquid behind the electrodeposition, add saturated NH
4Filter behind Cl reaction 2～8h, filter residue is an ammonium chloroplatinate, obtains spongy platinum after refining, removes platinum filtrate and enters G;
G. second extraction palladium: get and remove platinum filtrate described in the F, by palladium: the formic acid mass ratio is 0.5～3: 1 ratio adding formic acid, reacts 0.5～2h under 50～90 ℃ of intensively stirred conditions, and the pH value is controlled at 6.0～9.0, obtains thick palladium powder.
Step (6) is for to get the substrate behind the separating component in the step (1), carries out drying, thick broken, eddy current sorting, broken and electrostatic separation carefully, substrate metal enrich body powder and waste plastics powder.The waste plastics powder can be used for preparation and moulds wood products.
The separation and recovery method of rare precious metal and waste plastics in a kind of waste and old circuit board provided by the invention, has following beneficial effect: need not heat treated, energy consumption is low, simultaneously can be under the prerequisite of not wounded substrate and components and parts, realize that scolding tin removes fully and tin is reclaimed effectively, the automaticity height, the practicality height.
The specific embodiment
The following stated is a preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also are considered as protection scope of the present invention.
Embodiment one
The separation and recovery method of rare precious metal and waste plastics in a kind of waste and old circuit board may further comprise the steps:
(1) separating component and substrate:
Get ferric nitrate or iron chloride, sulfonic acid and be dissolved in fully in the water, add nitric acid, stir, make nitric acid type tin stripping liquid of the present invention according to following proportioning: nitric acid 50%, ferric nitrate 18%, sulfamic acid 5%, all the other are water;
Get waste and old circuit board, cleaning, drying.Waste and old circuit board vertically is clamped in the anchor clamps of liquid holding rector sidewall, from spray-hole, spray tin stripping liquid to the surface of waste and old circuit board scolding tin one side and move back the tin processing, simultaneously, the locating shaft activity makes that the surface of cutter contact waste and old circuit board components and parts one side is also vertically up and down, causes components and parts to be scraped to accumulator tank by cutter or utilize the vibrating device that is provided with in the locating shaft that components and parts are vibrated from substrate dropping in the accumulator tank.Collect the substrate behind cast and the separating component respectively.
(2) handle cast: get cast described in the step (1), according to the difference of proportion, that components and parts in the cast and scolder are separated from one another.
(3) separate slicker solder: get that scolder reclaims lead and tin respectively described in the step (2).
(4) handling components: get the components and parts in the step (2), carry out drying, thick broken, eddy current sorting, broken and electrostatic separation carefully, components and parts metal concentrate powder.
(5) reclaim rare precious metal and other metal (lead, antimony, aluminium, copper, nickel):
A. extract lead, antimony and aluminium: get components and parts metal concentrate powder described in the step (4), with components and parts metal concentrate powder 500 ℃ of roasting temperatures 1 hour, reach the effect of metals such as lead oxide, antimony, aluminium, copper and mickel, then the material after the roasting was leached 6 hours with alkali, liquid-solid ratio is 2: 1, extraction temperature is 90 ℃, filters, and filtrate obtains Na after evaporation and concentration
2PbO
3, Na
2SbO
3And Na
2AlO
2Mixed crystal, mother liquid evaporation return the water logging operation, and the filter residue of deleading, antimony and aluminium enters B.
B. extract copper: get the filter residue of deleading described in the A, antimony and aluminium, add 0.5mol/L sulfuric acid solution and Na
2S
2O
8, under 20～70 ℃ of temperature, leach 2h, the solution after leaching is filtered, eddy flow selectivity electro deposited copper, its electrodeposition condition is: electrolyte ph is 1.0, and temperature is 20 ℃, and current density is 200A/m
2, the electrodeposition time is 4h, obtains electro deposited copper, the copper removal filter residue enters D.
C. extract nickel: get among the B liquid eddy flow selectivity electro deposited nickel behind the electrodeposition, its electrodeposition condition is: electrolyte ph is 1.0, and temperature is 20 ℃, and current density is 200A/m
2, the electrodeposition time is 4h, obtains electro deposited nickel, liquid returns the sulfuric acid leaching behind the electrodeposition.
D. extract silver: get the filter residue of copper removal described in the B, by the concentration with salpeter solution is that 1: 1 adding salpeter solution dissolves silver and palladium, the control extraction temperature is 25 ℃ of leaching 3h, the isolated by filtration solid-liquid, get argentiferous, the filtrate of palladium and desilver, the filter residue of palladium is subsequently at argentiferous, control pH value is 3 in the filtrate of palladium, and normal temperature constantly stirs down, add NaOH solution, make the palladium precipitation, silver ion is stayed in the solution, the isolated by filtration solid-liquid, get argentiferous filtrate and contain the palladium sediment, add sodium chloride to described argentiferous filtrate, make the silver precipitation, the isolated by filtration solid-liquid, get silver nitride precipitation, desilver, the palladium filter residue enters step e.
E. extract gold: get desilver described in the D, palladium filter residue, add the chloroazotic acid of 1 times of quality, the speed with 100r/min under 20 ℃ of temperature stirs, and leaches 2.5h; Leachate eddy flow electrodeposition gold, its electrodeposition condition is: temperature is 20 ℃, current density is 50A/m
2, the electrodeposition time is 4h, and electrolyte ph is 1.0, obtains the electrodeposition gold, and liquid enters F behind the electrodeposition.
F. extract platinum: get among the E liquid behind the electrodeposition, add saturated NH
4Filter behind the Cl reaction 2h, filter residue is an ammonium chloroplatinate, obtains spongy platinum after refining, removes platinum filtrate and enters step (10).
G. second extraction palladium: get and remove platinum filtrate described in the F, by palladium: the formic acid mass ratio is 0.5: 1 a ratio adding formic acid, reacts 2h under 50 ℃ of intensively stirred conditions, and the pH value is controlled at 6.0, obtains thick palladium powder.
The rate of recovery of each metal is respectively: tin 91%, lead 90%, antimony 91%, aluminium 91%, copper 99%, nickel 97%, silver 97%, gold 99%, platinum 98% and palladium 96%.
(6) treatment substrate: get the substrate behind the separating component in the step (1), carry out drying, thick broken, eddy current sorting, broken and electrostatic separation carefully, substrate metal enrich body powder and waste plastics powder.The waste plastics powder is used for preparation and moulds wood products.
Claims (10)
1. the separation and recovery method of rare precious metal and waste plastics in the waste and old circuit board is characterized in that, may further comprise the steps:
(1) separating component and substrate: get waste and old circuit board, cleaning, drying, waste and old circuit board vertically is held on the sealing-off equipment, spray nitric acid type tin stripping liquid to waste and old circuit board and carry out the sealing-off processing, mechanical curettage components and parts or mechanical oscillation make components and parts come off from substrate, collect the substrate behind cast and the separating component respectively;
(2) handle cast: get cast described in the step (1), according to the difference of proportion, that components and parts in the cast and scolder are separated from one another;
(3) separate slicker solder: get that scolder reclaims lead and tin respectively described in the step (2);
(4) handling components: get the components and parts in the step (2), carry out drying, thick broken, eddy current sorting, broken and electrostatic separation carefully, components and parts metal concentrate powder;
(5) reclaim rare precious metal: get components and parts metal concentrate powder described in the step (4), reclaim rare precious metal;
(6) treatment substrate: get the substrate behind the separating component in the step (1), carry out drying, thick broken, eddy current sorting, broken and electrostatic separation carefully, substrate metal enrich body powder and waste plastics powder.
2. the method for claim 1 is characterized in that, nitric acid type tin stripping liquid comprises following component and percetage by weight described in the step (1): nitric acid 15～50%, and ferric nitrate or iron chloride 1～20%, sulfonic acid 1～5%, all the other are water.
3. method as claimed in claim 2 is characterized in that, described nitric acid type tin stripping liquid comprises following component and percetage by weight: nitric acid 30～50%, and ferric nitrate or iron chloride 10～18%, sulfonic acid 3～5%, all the other are water.
4. method as claimed in claim 3 is characterized in that, described nitric acid type tin stripping liquid comprises following component and percetage by weight: nitric acid 50%, and ferric nitrate or iron chloride 18%, sulfonic acid 5%, all the other are water.
5. the method for claim 1 is characterized in that, reclaims rare precious metal in the described step (5) for extracting one or more rare precious metals in silver, gold, platinum and the palladium.
6. the method for claim 1 is characterized in that, described step (5) also comprises extracts metallic lead, antimony, aluminium, copper and mickel.
7. method as claimed in claim 6 is characterized in that, the method for described extraction lead, antimony, aluminium is for to leach lead ion, antimony ion and aluminium ion from components and parts metal concentrate powder, and leachate obtains Na after evaporation and concentration
2PbO
3, Na
2SbO
3And Na
2AlO
2Mixed crystal.
8. method as claimed in claim 6 is characterized in that, the method for described extraction copper, nickel, silver, gold is to extract after the acidleach, and electrodeposition obtains electro deposited copper, electro deposited nickel, electrodeposition silver and electrodeposition gold respectively.
9. method as claimed in claim 6 is characterized in that, the method for described extraction platinum is to add saturated NH after the acidleach
4Filter behind Cl reaction 2～8h, filter residue is an ammonium chloroplatinate, obtains spongy platinum after refining.
10. method as claimed in claim 6, it is characterized in that the method for described extraction palladium is in palladium: the formic acid mass ratio is 0.5～3: 1 ratio adding formic acid, reacts 0.5～2h under 50～90 ℃ of intensively stirred conditions, the pH value is controlled at 6.0～9.0, obtains thick palladium powder.
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| CN2011100926124A CN102240663A (en) | 2011-04-13 | 2011-04-13 | Method for separating and recycling rare noble metals and waste plastics in waste circuit board |
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| CN2011100926124A CN102240663A (en) | 2011-04-13 | 2011-04-13 | Method for separating and recycling rare noble metals and waste plastics in waste circuit board |
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| CN103484679A (en) * | 2013-09-13 | 2014-01-01 | 江西理工大学 | Method for recycling tin and copper from waste tinned copper needles |
| CN103667707A (en) * | 2013-12-04 | 2014-03-26 | 江苏融源再生资源科技有限公司 | Method of recovering gold and silver from a waste circuit board |
| CN103706613A (en) * | 2012-09-29 | 2014-04-09 | 咏兴机械工业有限公司 | Electronic component scraping machine for recovered circuit board |
| CN103934536A (en) * | 2014-05-12 | 2014-07-23 | 上海第二工业大学 | Method for disassembling welded components of waste printed circuit board |
| CN106346641A (en) * | 2016-08-31 | 2017-01-25 | 上海斐讯数据通信技术有限公司 | Method and device for stripping mobile terminal metal elastic sheet antenna and plastic bracket |
| WO2017120815A1 (en) * | 2016-01-14 | 2017-07-20 | Entegris, Inc. | Integrated electronic waste recycling and recovery system and process of using same |
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Application publication date: 20111116 |