CN102233546A - Slurry supplying system in chemical mechanical polishing - Google Patents
Slurry supplying system in chemical mechanical polishing Download PDFInfo
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- CN102233546A CN102233546A CN2010101642958A CN201010164295A CN102233546A CN 102233546 A CN102233546 A CN 102233546A CN 2010101642958 A CN2010101642958 A CN 2010101642958A CN 201010164295 A CN201010164295 A CN 201010164295A CN 102233546 A CN102233546 A CN 102233546A
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- lapping liquid
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- magnetic suspension
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Abstract
The invention provides a slurry supplying system in chemical mechanical polishing. In the system, a pump unit is a magnetic suspension pump; a slurry accommodation barrel is connected with the slurry inlet of the magnetic suspension pump through a pipeline; the slurry is conveyed to a slurry supplying outlet from the slurry outlet of the magnetic suspension pump through a pipeline; the slurry supplying outlet comprises a slurry backflow outlet which is connected with the slurry accommodation barrel through a pipeline to form a backflow passage; and a pressure sensor is arranged on the backflow passage and is connected with a controller which is connected with the control voltage input end of the magnetic suspension pump. The slurry supplying system ensures that slurry particles are not easy to gather, and the flow of the slurry is stable, and solves the problem that the oil vapor generated by lubricating grease brought by using lubricating oil in the conventional bearing flows back to pollute a vacuum chamber.
Description
Technical field
The present invention relates to the cmp technical field in the semiconductor manufacturing, the lapping liquid supply system in particularly a kind of cmp.
Background technology
Cmp (CMP) not only is used at the wafer preparatory phase as requisite one technology in the chip manufacture, and also is used to do the crystal column surface global planarization in the wafer machining process.Chemical mechanical milling method mainly is to utilize the mechanical polishing principle, cooperates chemical assistant and chip surface in the lapping liquid to react, with the chip surface planarization that polished of yo-yo profile just.The parameter control of the various processing procedures of one highest wisdom is suitable, cmp can provide by lapped face and reach flatness more than 94%, but development along with semicon industry, the development of integrated circuit manufacturing is rapid, and cmp also is faced with more and more higher challenge as indispensable one technology in the chip manufacture.
Lapping liquid is crucial running stores in the chemical mechanical milling tech, plays an important role in the chip cmp.In order to satisfy the needs of different processing procedures in the chemical mechanical milling tech, increasing lapping liquid is developed and comes into operation, and the physicochemical properties of every kind of lapping liquid have nothing in common with each other, particularly learn the needs of mechanical lapping processing procedure for adaptation, same work-table of chemicomechanical grinding mill may need several different lapping liquids, thereby it is particularly important that the improvement in performance of the supply system of lapping liquid and raising seem.In order to reach grinding effect preferably, obtain the higher surface of planarization effect, necessarily require the flow uniformity of the lapping liquid that slurry supply apparatus provides.Usually adopt air driven pump as its power set in traditional lapping liquid supply system, in its course of work, one presses a transformation of taking out will inevitably cause the variation of pressure, and this also will cause the fluctuation of lapping liquid supply flow.Simultaneously, the air driven pump piston directly contacts with lapping liquid, and collision easily produces the lapping liquid particle aggregation repeatedly, and noise is big, and because the bearing in the air driven pump must be lubricated, the oil vapour of its lubricant grease backflows and caused pollution to vacuum chamber, produces the micronic dust particle.For addressing the above problem, in the lapping liquid supply system that adopts air driven pump, usually a constant-current stabilizer can be set, even but set up constant-current stabilizer and still can not thoroughly address the above problem.
Summary of the invention
The technical problem to be solved in the present invention provides the lapping liquid supply system in a kind of cmp, the lapping liquid supply system easily produces the lapping liquid particle aggregation in the chemical mechanical milling tech to solve, and the lapping liquid mass flow discrepancy is even and easily pollute the problem that vacuum chamber produces other micronic dust particles.
For solving the problems of the technologies described above, the invention provides the lapping liquid supply system in a kind of cmp, comprise lapping liquid Sheng bucket, pump, lapping liquid is supplied with outlet, pressure sensor and controller, wherein, described pump is a magnetic suspension pump, described magnetic suspension pump comprises the lapping liquid inlet, lapping liquid outlet and control voltage input end, described lapping liquid is contained bucket and is connected with the lapping liquid inlet of described magnetic suspension pump by pipeline, the lapping liquid outlet of described magnetic suspension pump transfers to described lapping liquid by pipeline with lapping liquid and supplies with outlet, described lapping liquid is supplied with outlet and is comprised the lapping liquid bypass outlet, described lapping liquid bypass outlet is contained the bucket formation current return circuit that is connected by pipeline and described lapping liquid, described pressure sensor is arranged on the described current return circuit, the pressure sensitive signal outlet of described pressure sensor is connected with the signal input part of described controller, and the current controling signal output of described controller is connected with the control voltage input end of described magnetic suspension pump.
Optionally, described magnetic suspension pump comprises pump main support, impeller, rotor, coil and stator, described rotor is covered by in the described impeller, described impeller and described rotor are fixed by snap close in described pump main support, described coil is wrapped on the described stator, described coil and stator place described pump main support below, are respectively equipped with lapping liquid inlet and lapping liquid outlet on the described pump main support.
Optionally, a plurality of lapping liquid distribution duct that lapping liquid are supplied to different grinder stations of described lapping liquid supply outlet connection.
Optionally, on the described lapping liquid distribution duct filter is set all.
Lapping liquid supply system in the cmp provided by the invention owing to adopt magnetic suspension pump to be difficult for producing the lapping liquid agglomeration of particles as the power set of lapping liquid supply system, makes the flow of lapping liquid steady.Because magnetic suspension pump adopts magnetic bearing, does not need lubricating oil that bearing is lubricated, fundamentally solved the oil vapour that lubricant grease that traditional bearing uses lubricating oil to bring produces and backflowed and to produce pollution problems to vacuum chamber.Because the magnetic bearing of magnetic suspension pump does not have mechanical wear, also can effectively reduce the downtime and the maintenance cost of system simultaneously, also can reduce the noise and the vibration of system to a great extent.
Description of drawings
Fig. 1 is the cross-sectional view of the magnetic suspension pump that adopted in the lapping liquid supply system of the present invention;
Fig. 2 is the structural representation of the lapping liquid supply system in the cmp of the present invention;
Fig. 3 is the distribution situation comparison chart of lapping liquid supply system of the present invention and lapping liquid micronic dust that supply system produces of the prior art.
The specific embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the specific embodiment of the present invention is described in detail below in conjunction with accompanying drawing.
Processing method of the present invention can be widely applied in many technologies; and can utilize multiple suitable material to make; be to be illustrated below by preferred embodiment; certainly the present invention is not limited to this specific embodiment, and the known general replacement of one of ordinary skilled in the art is encompassed in protection scope of the present invention far and away.
Secondly, the present invention utilizes schematic diagram to describe in detail, and when the embodiment of the invention was described in detail in detail, for convenience of explanation, schematic diagram was disobeyed the local amplification of general ratio, should be with this as limitation of the invention.
Please referring to Fig. 1, Fig. 1 is the cross-sectional view of the magnetic suspension pump that adopted in the lapping liquid supply system in the cmp of the present invention.As shown in Figure 1, the magnetic suspension pump that is adopted among the present invention mainly is made up of pump main support 1, impeller 2, rotor 3, coil 4 and stator 5 five major parts.Described rotor 3 is covered by in the described impeller 2, and described coil 4 is wrapped on the described stator 5, and described impeller 2 is fixed by the screw snap close in described pump main support 1 with described rotor 3.Be respectively equipped with lapping liquid inlet 6 and lapping liquid outlet 7 on the described pump main support 1.
Fig. 2 is the structural representation of the lapping liquid supply system in the cmp of the present invention, as shown in Figure 2, the lapping liquid supply system in the cmp of the present invention comprises lapping liquid Sheng bucket 8, magnetic suspension pump 9, lapping liquid supply outlet 10, pressure sensor 11, filter 12 and controller 13.Described magnetic suspension pump comprises lapping liquid inlet 6, lapping liquid outlet 7 and control voltage input end 15.Described lapping liquid is contained bucket 8 and is connected with the lapping liquid inlet 6 of described magnetic suspension pump 9 by pipeline, the lapping liquid outlet 7 of described magnetic suspension pump 9 is led to lapping liquid supply outlet 10 through piping, described lapping liquid is supplied with outlet 10 and is connected a plurality of distribution duct 14 that lapping liquid are assigned to grinder station, the distribution duct 14 of described grinder station can have a plurality of, on described a plurality of lapping liquid distribution duct 14, each pipeline all is provided with a filter 12.What described lapping liquid was supplied with outlet 10 has a lapping liquid bypass outlet 16, and described lapping liquid bypass outlet 16 is contained bucket 8 by pipeline and described lapping liquid and is connected, the current return circuit of formation lapping liquid.Described pressure sensor 11 is arranged on the current return circuit of described lapping liquid, the pressure sensitive signal outlet of described pressure sensor 11 is connected with described controller 13 signal input parts, and the current controling signal output of described controller 13 is connected with the control voltage input end 15 of described magnetic suspension pump 9.
Below introduce the running of the lapping liquid supply system in the cmp of the present invention.Please consult Fig. 1 and Fig. 2 simultaneously, when described magnetic suspension pump 9 is started working, described coil 4 on the described stator 5 is because the feeding of electric current produces high-frequency vortex, drive described rotor 3 rotations, thereby described rotor 3 drives described impeller 2 and produces rotation, described lapping liquid is contained the lapping liquid inlet 6 of the described magnetic suspension pump 9 of lapping liquid suction in the bucket 8, lapping liquid outlet 7 through described magnetic suspension pump 9 is fed to described lapping liquid supply outlet 10, described lapping liquid is supplied with outlet 10 lapping liquid is dispensed to a plurality of lapping liquid distribution duct 14, lapping liquid through the filtration of filter 12 set on described each lapping liquid distribution duct 14 the most at last lapping liquid be supplied to different grinder stations.Because different differences of grinding required lapping liquid supply flow of processing procedure and pressure, unnecessary lapping liquid is back to lapping liquid by the lapping liquid bypass outlet 16 in the lapping liquid supply outlet 10 and contains in the bucket 8.In this simultaneously, the pressure sensor 11 that is provided with on the described current return circuit is transferred to described controller 13 with sensing lapping liquid flow pressure signal, described controller 13 is transferred to the size of current of the control voltage input end 15 of described magnetic suspension pump 9 according to the needs control of grinding processing procedure, the control size of current of importing described control voltage input end 15 has been controlled the size of the high-frequency vortex that the coil on the stator 54 produces in the described magnetic suspension pump 9, thereby control the rotating speed of described rotor 3 and described impeller 2, and then controlled pressure and flow size that described magnetic suspension pump 9 is contained the lapping liquid that extracts the bucket 8 from described lapping liquid.
Fig. 3 is the comparison chart of the distribution situation of lapping liquid supply system of the present invention and lapping liquid micronic dust that supply system produces of the prior art.The accompanying drawing data on the left side correspond to the distribution situation of the lapping liquid micronic dust that supply system produces that adopts magnetic suspension pump among Fig. 3, and the accompanying drawing data on the right correspond to the distribution situation of the lapping liquid micronic dust that supply system produces that adopts air driven pump.By among Fig. 3 as can be seen, along with the increase of lapping liquid cycle-index, the micronic dust particle that adopts the lapping liquid system of air driven pump to produce can constantly increase, and adopts the micronic dust particle of lapping liquid system of magnetcisuspension pump then constant, can not increase.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, if of the present invention these are revised and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.
Claims (4)
1. the lapping liquid supply system in the cmp, comprise lapping liquid Sheng bucket, pump, lapping liquid is supplied with outlet, pressure sensor and controller, it is characterized in that, described pump is a magnetic suspension pump, described magnetic suspension pump comprises the lapping liquid inlet, lapping liquid outlet and control voltage input end, described lapping liquid is contained bucket and is connected with the lapping liquid inlet of described magnetic suspension pump by pipeline, the lapping liquid outlet of described magnetic suspension pump transfers to described lapping liquid by pipeline with lapping liquid and supplies with outlet, described lapping liquid is supplied with outlet and is comprised the lapping liquid bypass outlet, described lapping liquid bypass outlet is contained the bucket formation current return circuit that is connected by pipeline and described lapping liquid, described pressure sensor is arranged on the described current return circuit, the pressure sensitive signal outlet of described pressure sensor is connected with the signal input part of described controller, and the current controling signal output of described controller is connected with the control voltage input end of described magnetic suspension pump.
2. the lapping liquid supply system in the cmp according to claim 1, it is characterized in that, described magnetic suspension pump comprises pump main support, impeller, rotor, coil and stator, described rotor is covered by in the described impeller, described impeller and described rotor are fixed by snap close in described pump main support, described coil is wrapped on the described stator, and described coil and stator place described pump main support below, is respectively equipped with lapping liquid inlet and lapping liquid outlet on the described pump main support.
3. the lapping liquid supply system in the cmp according to claim 1 is characterized in that described lapping liquid is supplied with outlet and connected a plurality of lapping liquid distribution duct that lapping liquid are supplied to different grinder stations.
4. as the lapping liquid supply system in the cmp as described in the claim 3, it is characterized in that, on the described lapping liquid distribution duct filter is set all.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101642958A CN102233546A (en) | 2010-04-29 | 2010-04-29 | Slurry supplying system in chemical mechanical polishing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101642958A CN102233546A (en) | 2010-04-29 | 2010-04-29 | Slurry supplying system in chemical mechanical polishing |
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| Publication Number | Publication Date |
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| CN102233546A true CN102233546A (en) | 2011-11-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101642958A Pending CN102233546A (en) | 2010-04-29 | 2010-04-29 | Slurry supplying system in chemical mechanical polishing |
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| CN (1) | CN102233546A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103745943A (en) * | 2014-01-29 | 2014-04-23 | 上海华力微电子有限公司 | Surface particle detector measurement platform |
| CN105196182A (en) * | 2015-09-21 | 2015-12-30 | 蓝思科技（长沙）有限公司 | Liquid delivery device and device for adding grinding liquid into grinding disc |
| CN111927796A (en) * | 2020-09-18 | 2020-11-13 | 天津飞旋科技有限公司 | Power-on self-test method and device for magnetic suspension molecular pump and electronic equipment |
| CN112536722A (en) * | 2019-09-20 | 2021-03-23 | 夏泰鑫半导体(青岛)有限公司 | Slurry supply system and clean room |
Citations (6)
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| GB2313158A (en) * | 1996-05-13 | 1997-11-19 | Totton Pumps Ltd | Dispensing soda water |
| US5993647A (en) * | 1998-05-02 | 1999-11-30 | United Microelectronics Corp. | Circulation system of slurry |
| US20010033800A1 (en) * | 2000-04-25 | 2001-10-25 | Aisan Kogyo Kabushiki Kaisha | Magnetic coupling pump |
| CN1491776A (en) * | 2002-09-10 | 2004-04-28 | m.FSI��ʽ���� | Device and method for supplying mixed grinding slurry for chemical mechanial grinder |
| US20040200733A1 (en) * | 2002-03-13 | 2004-10-14 | Applied Materials, Inc. | Method and apparatus for substrate polishing |
| CN101016906A (en) * | 2006-12-11 | 2007-08-15 | 江苏大学 | Permanent magnet suspension bearing centrifugal pump |
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2010
- 2010-04-29 CN CN2010101642958A patent/CN102233546A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2313158A (en) * | 1996-05-13 | 1997-11-19 | Totton Pumps Ltd | Dispensing soda water |
| US5993647A (en) * | 1998-05-02 | 1999-11-30 | United Microelectronics Corp. | Circulation system of slurry |
| US20010033800A1 (en) * | 2000-04-25 | 2001-10-25 | Aisan Kogyo Kabushiki Kaisha | Magnetic coupling pump |
| US20040200733A1 (en) * | 2002-03-13 | 2004-10-14 | Applied Materials, Inc. | Method and apparatus for substrate polishing |
| CN1491776A (en) * | 2002-09-10 | 2004-04-28 | m.FSI��ʽ���� | Device and method for supplying mixed grinding slurry for chemical mechanial grinder |
| CN101016906A (en) * | 2006-12-11 | 2007-08-15 | 江苏大学 | Permanent magnet suspension bearing centrifugal pump |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103745943A (en) * | 2014-01-29 | 2014-04-23 | 上海华力微电子有限公司 | Surface particle detector measurement platform |
| CN103745943B (en) * | 2014-01-29 | 2016-05-25 | 上海华力微电子有限公司 | Surface particles detector measures platform |
| CN105196182A (en) * | 2015-09-21 | 2015-12-30 | 蓝思科技（长沙）有限公司 | Liquid delivery device and device for adding grinding liquid into grinding disc |
| CN105196182B (en) * | 2015-09-21 | 2017-12-19 | 蓝思科技（长沙）有限公司 | A kind of liquid transporting apparatus and a kind of device that grinding fluid is added into mill |
| CN112536722A (en) * | 2019-09-20 | 2021-03-23 | 夏泰鑫半导体(青岛)有限公司 | Slurry supply system and clean room |
| CN111927796A (en) * | 2020-09-18 | 2020-11-13 | 天津飞旋科技有限公司 | Power-on self-test method and device for magnetic suspension molecular pump and electronic equipment |
| CN111927796B (en) * | 2020-09-18 | 2021-01-05 | 天津飞旋科技有限公司 | Power-on self-test method and device for magnetic suspension molecular pump and electronic equipment |
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Application publication date: 20111109 |
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