CN102230202A - Copper-plating method of MB2 magnesium alloy wires - Google Patents
Copper-plating method of MB2 magnesium alloy wires Download PDFInfo
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- CN102230202A CN102230202A CN201110167238XA CN201110167238A CN102230202A CN 102230202 A CN102230202 A CN 102230202A CN 201110167238X A CN201110167238X A CN 201110167238XA CN 201110167238 A CN201110167238 A CN 201110167238A CN 102230202 A CN102230202 A CN 102230202A
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Abstract
The invention relates to a copper-plating method of magnesium alloy wires, in particular to a copper-plating method of MB2 magnesium alloy wires, which is used for solving the technical problems such as complex process and high possibility of forming bulges and burrs on plating layers in the existing copper-plating method of magnesium alloy wires by utilizing a zinc dipping process. The copper-plating method comprises the following steps: grinding the MB2 magnesium alloy wires by utilizing abrasive paper; ultrasonically cleaning the ground MB2 magnesium alloy wires; de-oiling; acid cleaning; placing the cleaned MB2 magnesium alloy wires in zinc dipping solution for treating at the temperature of 70-90 DEG C for 20-30 minutes to obtain zinc-plated MB2 magnesium alloy wires; and placing the zinc-plated MB2 magnesium alloy wires in electroplating solution for electroplating at the temperature of 35-45 DEG C and current density of 1-2A/dm<2> for 30-40 minutes to finally obtain the copper-plated MB2 magnesium alloy wires. By utilizing the copper-plating method, pre-plating procedures are simplified and the formed plating layers are uniform and compact; and the obtained copper-plated MB2 magnesium alloy wires can be applied to the fields such as electronics, electrical appliances, vehicles, aerospace and civil products.
Description
Technical field
The present invention relates to the Mg alloy wire copper coating.
Background technology
Copper and copper alloy are widely used in electronics, electrical equipment, vehicle, aerospace and product for civilian use field because having characteristics such as favorable conductive, heat conduction, diamagnetism, erosion resistance, plasticity are good, specious.In recent years, along with science and technology development, the whole world is increasing to the demand of copper resource, and copper scarcity of resources and some other reasonses have caused the copper valency to skyrocket, and have strengthened the cost of application industry, has caused big pressure also for this strategic resource of each country.Copper cladded aluminum-magnesium alloy wire is at the certain thickness copper of the surface of aluminum-magnesium alloy wire plating one deck, makes it to become a kind of high performance novel metal silk.The copper layer cross section is long-pending to account for 10% of a material sectional area, and thickness approximately is 3.5% of half warp; Copper-clad silk electric conductivity approximately is 62.9% of a copper wire, the about 3.32g/cm of volume mass
3, be 37.3% of copper wire, the length of the copper cladded aluminum-magnesium alloy wire of same quality is 2.7 times of fine copper silk material length, can save a large amount of copper resources like this, and it is widely used in modern project.The density that good conductivity, intensity height, the weldability that CCAM has copper concurrently reaches aluminum magnesium alloy by force is little, the advantage of easy processing, and it is even self to have copper layer density again, high compactness, characteristics such as high extensibility.It has remarkable advantages than pure copper wire, and is in light weight, convenient transportation, and the copper resource consumption is saved in the soft easily processing of line matter, and is with low cost.At present, the copper-plated general technology of Mg alloy wire be mechanical grinding, ultrasonic cleaning, alkali cleaning oil removing, pickling, activation, once soak zinc, move back zinc, secondary soaking zinc, zinc-plated, electro-coppering in advance.Soak the zinc process in this method and be actually Mg alloy wire spare is immersed in the zincate solution, make the MAGNESIUM METAL alloy and the zine ion generation replacement(metathesis)reaction on surface, form highly dispersed zinc crystal grain.Reduce the activity of Mg alloy surface by zinc or zinc alloy, prevent in operating process or in electroplate liquid magnesium oxidized, prevent simultaneously magnesium spare in electroplate liquid with by metallizing ion generation replacement(metathesis)reaction.Secondary soaking zinc is the dip galvanizing technique of using always.When soaking zinc for the first time, oxide film at first dissolves, and replacement(metathesis)reaction then takes place, the zinc layer rough porous of acquisition, and having oxide film residual, sticking power is not strong, can cause the coating bulge during copper facing, grain raising, problem such as bonding force is bad is so carry out secondary soaking zinc after generally moving back zinc.The main shortcoming of double zincate process is that the technological operation step is more, and natal etch can cause the corrosion dissolution of magnesium base.
Summary of the invention
The present invention existingly carries out Mg alloy wire copper-plating technique complexity to soak the zinc method in order to solve, the technical problem of the easy bulge grain raising of coating, and the copper coating of MB2 Mg alloy wire is provided.
MB2 Mg alloy wire of the present invention copper coating is carried out according to the following steps: one, the MB2 Mg alloy wire is polished to surface-brightening with abrasive paper for metallograph; Two, will be placed on through the MB2 Mg alloy wire that step 1 is handled and carry out ultrasonic cleaning in the acetone; Three, be that the concentration of 5g/L～15g/L, sodium phosphate concentration 15g/L～25g/L, OP emulsifying agent is that 0.5g/L～1.5g/L weighing sodium hydroxide, sodium phosphate and OP emulsifying agent and adding in the entry mixes by concentration sodium hydroxide, use pH to 8.5～10.5 of phosphoric acid regulator solution again, obtain degreaser; To put into degreaser through the MB2 Mg alloy wire that step 2 is handled, be to be incubated 5min～10min under 45 ℃～75 ℃ the condition in temperature, takes out then and use distilled water flushing, dries; Four, be that 30g/L～50g/L, concentration of phosphoric acid are that the concentration of 55mL/L～65mL/L, boric acid is that 29g/L～31g/L takes by weighing two ammonium hydrogen difluorides, phosphoric acid and boric acid and is added to the water by the concentration of two ammonium hydrogen difluorides, mix, obtain pickle solution; To put into pickle solution through the MB2 Mg alloy wire that step 3 is handled, at room temperature handle 30s～60s, and take out the back and use distilled water flushing, dry up; Five, be that 20g/L～40g/L, potassium pyrophosphate concentration are that the concentration of 100g/L～150g/L, Potassium monofluoride is that the concentration of 5g/L～10g/L, yellow soda ash is that the concentration of 10g/L～20g/L, Seignette salt is that the concentration of Seignette salt, the iron(ic) chloride of 5g/L～10g/L is that the concentration of 5g/L～10g/L, copper sulfate is that 3g/L～10g/L takes by weighing zinc sulfate, potassium pyrophosphate, Potassium monofluoride, yellow soda ash, Seignette salt, iron(ic) chloride and copper sulfate and is added to the water by the sulfuric acid zinc concentration, mix, obtain zincate solution; To put into zincate solution through the MB2 Mg alloy wire that step 4 is handled, be to handle 20min～30min under 70 ℃～90 ℃ the condition in temperature, takes out the back distilled water flushing, dries up, and obtains zinc-plated MB2 Mg alloy wire; Six, concentration by cupric pyrophosphate is 50g/L～70g/L, the concentration of potassium pyrophosphate is 250g/L～300g/L, the concentration of dipotassium hydrogen phosphate is 35g/L～45g/L, the concentration of ammonium citrate is 20g/L～30g/L, the concentration of phytic acid is 0.1g/L～0.5g/L, the concentration of vanillin food grade,1000.000000ine mesh is that 0.1g/L～0.3g/L takes by weighing cupric pyrophosphate, potassium pyrophosphate, dipotassium hydrogen phosphate, ammonium citrate, phytic acid and vanillin food grade,1000.000000ine mesh and being added to the water mixes, use pH to 8～10 of ammoniacal liquor regulator solution again, obtain electroplate liquid, be negative electrode with the zinc-plated MB2 Mg alloy wire that obtains through step 5 again, with the fine copper sheet is anode, is 35 ℃～45 ℃ in temperature, current density is 1A/dm
2～2A/dm
2Condition under electroplate 30min～40min; Finish MB2 Mg alloy wire copper facing process.
The present invention adopts phosphoric acid and nitric acid to carry out pickling, does not contain Toxic matter, environmentally safe in the pre-treating technology; Utilize the acid-wash activation single stage method to obtain one deck densification at Mg alloy surface; uniform magnesium fluoride chemical conversion film; protected magnesium matrix effectively; it can not be corroded in zinc dipping solution; promoted the carrying out of reaction; improved the coverage and the density of zinc settled layer, the corrosion of replacement(metathesis)reaction and plating bath directly takes place and reduces the bonding force of copper settled layer in exposed magnesium matrix and copper when preventing copper facing.Simultaneously, adding iron ion and cupric ion have improved the bonding force between coating and the matrix in the zincate solution, improve the corrosion resistance of coating simultaneously, have reached and have once finished the purpose of soaking zinc, have simplified pre-galvanized program, help industrialized utilization.Compare with other technologies, have that process stabilizing is simple, coating is even, no bulge burr; Advantage such as production cost is low, product lumber recovery height, production efficiency height, energy consumption are low, easy to operate.
The composition of MB2 Mg alloy wire is the Al of 3-3.2%; 0.8% Zn; 0.4% Mn, all the other are Mg, and are littler than aluminum-magnesium alloy wire weight, and the copper-clad Mg alloy wire has the excellent properties of copper cladded aluminum-magnesium alloy wire, and it replaces aluminum-magnesium alloy wire to have more wide application prospect.Can be used for electronics, electrical equipment, vehicle, aerospace and product for civilian use field.
Embodiment
Embodiment one: the MB2 Mg alloy wire copper coating of present embodiment is carried out according to the following steps: one, the MB2 Mg alloy wire is polished to surface-brightening with abrasive paper for metallograph; Two, will be placed on through the MB2 Mg alloy wire that step 1 is handled and carry out ultrasonic cleaning in the acetone; Three, be that the concentration of 5g/L～15g/L, sodium phosphate concentration 15g/L～25g/L, OP emulsifying agent is that 0.5g/L～1.5g/L weighing sodium hydroxide, sodium phosphate and OP emulsifying agent and adding in the entry mixes by concentration sodium hydroxide, use pH to 8.5～10.5 of phosphoric acid regulator solution again, obtain degreaser; To put into degreaser through the MB2 Mg alloy wire that step 2 is handled, be to be incubated 5min～10min under 45 ℃～75 ℃ the condition in temperature, takes out then and use distilled water flushing, dries; Four, be that 30g/L～50g/L, concentration of phosphoric acid are that the concentration of 55mL/L～65mL/L, boric acid is that 29g/L～31g/L takes by weighing two ammonium hydrogen difluorides, phosphoric acid and boric acid and is added to the water by the concentration of two ammonium hydrogen difluorides, mix, obtain pickle solution; To put into pickle solution through the MB2 Mg alloy wire that step 3 is handled, at room temperature handle 30s～60s, and take out the back and use distilled water flushing, dry up; Five, be that 20g/L～40g/L, potassium pyrophosphate concentration are that the concentration of 100g/L～150g/L, Potassium monofluoride is that the concentration of 5g/L～10g/L, yellow soda ash is that the concentration of 10g/L～20g/L, Seignette salt is that the concentration of Seignette salt, the iron(ic) chloride of 5g/L～10g/L is that the concentration of 5g/L～10g/L, copper sulfate is that 3g/L～10g/L takes by weighing zinc sulfate, potassium pyrophosphate, Potassium monofluoride, yellow soda ash, Seignette salt, iron(ic) chloride and copper sulfate and is added to the water by the sulfuric acid zinc concentration, mix, obtain zincate solution; To put into zincate solution through the MB2 Mg alloy wire that step 4 is handled, be to handle 20min～30min under 70 ℃～90 ℃ the condition in temperature, takes out the back distilled water flushing, dries up, and obtains zinc-plated MB2 Mg alloy wire; Six, concentration by cupric pyrophosphate is 50g/L～70g/L, the concentration of potassium pyrophosphate is 250g/L～300g/L, the concentration of dipotassium hydrogen phosphate is 35g/L～45g/L, the concentration of ammonium citrate is 20g/L～30g/L, the concentration of phytic acid is 0.1g/L～0.5g/L, the concentration of vanillin food grade,1000.000000ine mesh is that 0.1g/L～0.3g/L takes by weighing cupric pyrophosphate, potassium pyrophosphate, dipotassium hydrogen phosphate, ammonium citrate, phytic acid and vanillin food grade,1000.000000ine mesh and being added to the water mixes, use pH to 8～10 of ammoniacal liquor regulator solution again, obtain electroplate liquid, be negative electrode with the zinc-plated MB2 Mg alloy wire that obtains through step 5 again, with the fine copper sheet is anode, is 35 ℃～45 ℃ in temperature, current density is 1A/dm
2～2A/dm
2Condition under electroplate 30min～40min; Finish MB2 Mg alloy wire copper facing process.
Present embodiment adopts phosphoric acid and nitric acid to carry out pickling, does not contain Toxic matter, environmentally safe in the pre-treating technology; Utilize the acid-wash activation single stage method to obtain one deck densification at Mg alloy surface; uniform magnesium fluoride chemical conversion film; protected magnesium matrix effectively; it can not be corroded in zinc dipping solution; promoted the carrying out of reaction; improved the coverage and the density of zinc settled layer, the corrosion of replacement(metathesis)reaction and plating bath directly takes place and reduces the bonding force of copper settled layer in exposed magnesium matrix and copper when preventing copper facing.Simultaneously, adding iron ion and cupric ion have improved the bonding force between coating and the matrix in the zincate solution, improve the corrosion resistance of coating simultaneously, have reached and have once finished the purpose of soaking zinc, have simplified pre-galvanized program, help industrialized utilization.Compare with other technologies, have that process stabilizing is simple, coating is even, no bulge burr; Advantage such as production cost is low, product lumber recovery height, production efficiency height, energy consumption are low, easy to operate.
Embodiment two: what present embodiment and embodiment one were different is: be that the concentration of 7g/L～13g/L, sodium phosphate concentration 17g/L～24g/L, OP emulsifying agent is that 0.7g/L～1.3g/L weighing sodium hydroxide, sodium phosphate and OP emulsifying agent and adding in the entry mixes by concentration sodium hydroxide in the step 3, use pH to 8.6～10.3 of phosphoric acid regulator solution again, obtain degreaser.Other is identical with embodiment one.
Embodiment three: what present embodiment and embodiment one were different is: be that the concentration of 10g/L, sodium phosphate concentration 19g/L, OP emulsifying agent is that 1.2g/L weighing sodium hydroxide, sodium phosphate and OP emulsifying agent and adding in the entry mixes by concentration sodium hydroxide in the step 3, use the pH to 9.3 of phosphoric acid regulator solution again, obtain degreaser.Other is identical with embodiment one.
Embodiment four: what present embodiment was different with one of embodiment one to three is: the MB2 Mg alloy wire is put into degreaser in the step 3, in temperature is to be incubated 6min～9min under 48 ℃～72 ℃ the condition.Other is identical with one of embodiment one to three.
Embodiment five: what present embodiment was different with one of embodiment one to three is: the MB2 Mg alloy wire is put into degreaser in the step 3, in temperature is to be incubated 7min under 60 ℃ the condition.Other is identical with one of embodiment one to three.
Embodiment six: what present embodiment was different with one of embodiment one to five is: be that 33g/L～46g/L, concentration of phosphoric acid are that the concentration of 57mL/L～63mL/L, boric acid is that 29.5g/L～30.5g/L takes by weighing two ammonium hydrogen difluorides, phosphoric acid and boric acid and is added to the water by the concentration of two ammonium hydrogen difluorides in the step 4, mix, obtain pickle solution.Other is identical with one of embodiment one to five.
Embodiment seven: what present embodiment was different with one of embodiment one to five is: be that 40g/L, concentration of phosphoric acid are that the concentration of 60mL/L, boric acid is that 30g/L takes by weighing two ammonium hydrogen difluorides, phosphoric acid and boric acid and is added to the water by the concentration of two ammonium hydrogen difluorides in the step 4, mix, obtain pickle solution.Other is identical with one of embodiment one to five.
Embodiment eight: what present embodiment was different with one of embodiment one to seven is: will put into pickle solution through the MB2 Mg alloy wire that step 3 is handled in the step 4, and at room temperature handle 35s～55s.Other is identical with one of embodiment one to seven.
Embodiment nine: what present embodiment was different with one of embodiment one to seven is: will put into pickle solution through the MB2 Mg alloy wire that step 3 is handled in the step 4, and at room temperature handle 45s.Other is identical with one of embodiment one to seven.
Embodiment ten: what present embodiment was different with one of embodiment one to nine is: be 23g/L～38g/L by the sulfuric acid zinc concentration in the step 5, potassium pyrophosphate concentration is 105g/L～145g/L, the concentration of Potassium monofluoride is 6g/L～9g/L, the concentration of yellow soda ash is 12g/L～18g/L, the concentration of Seignette salt is the Seignette salt of 6g/L～9g/L, the concentration of iron(ic) chloride is 6g/L～9g/L, the concentration of copper sulfate is that 5g/L～9g/L takes by weighing zinc sulfate, potassium pyrophosphate, Potassium monofluoride, yellow soda ash, Seignette salt, iron(ic) chloride and copper sulfate also are added to the water, mix, obtain zincate solution.Other is identical with one of embodiment one to nine.
Embodiment 11: what present embodiment was different with one of embodiment one to nine is: be that 30g/L, potassium pyrophosphate concentration are that the concentration of 125g/L, Potassium monofluoride is that the concentration of 7g/L, yellow soda ash is that the concentration of 15g/L, Seignette salt is that the concentration of Seignette salt, the iron(ic) chloride of 8g/L is that the concentration of 8g/L, copper sulfate is that 8g/L takes by weighing zinc sulfate, potassium pyrophosphate, Potassium monofluoride, yellow soda ash, Seignette salt, iron(ic) chloride and copper sulfate and is added to the water by the sulfuric acid zinc concentration in the step 5, mix, obtain zincate solution.Other is identical with one of embodiment one to nine.
Embodiment 12: what present embodiment was different with one of embodiment one to 11 is: will put into zincate solution through the MB2 Mg alloy wire that step 4 is handled in the step 5, be to handle 22min～28min under 75 ℃～85 ℃ the condition in temperature.Other is identical with one of embodiment one to 11.
Embodiment 13: what present embodiment was different with one of embodiment one to 11 is: will put into zincate solution through the MB2 Mg alloy wire that step 4 is handled in the step 5, be to handle 25min under 80 ℃ the condition in temperature.Other is identical with one of embodiment one to 11.
Embodiment 14: what present embodiment was different with one of embodiment one to 13 is: the concentration by cupric pyrophosphate in the step 6 is 55g/L～67g/L, the concentration of potassium pyrophosphate is 255g/L～295g/L, the concentration of dipotassium hydrogen phosphate is 36g/L～44g/L, the concentration of ammonium citrate is 22g/L～28g/L, the concentration of phytic acid is 0.2g/L～0.4g/L, the concentration of vanillin food grade,1000.000000ine mesh is that 0.15g/L～0.25g/L takes by weighing cupric pyrophosphate, potassium pyrophosphate, dipotassium hydrogen phosphate, ammonium citrate, phytic acid and vanillin food grade,1000.000000ine mesh and being added to the water mixes, use pH to 8.5～9.5 of ammoniacal liquor regulator solution again, obtain electroplate liquid.Other is identical with one of embodiment one to 13.
Embodiment 15: what present embodiment was different with one of embodiment one to 13 is: be that the concentration of 60g/L, potassium pyrophosphate is that the concentration of 270g/L, dipotassium hydrogen phosphate is that the concentration of 40g/L, ammonium citrate is that the concentration of 25g/L, phytic acid is that the concentration of 0.3g/L, vanillin food grade,1000.000000ine mesh is that 0.20g/L takes by weighing cupric pyrophosphate, potassium pyrophosphate, dipotassium hydrogen phosphate, ammonium citrate, phytic acid and vanillin food grade,1000.000000ine mesh and is added to the water and mixes by the concentration of cupric pyrophosphate in the step 6, use the pH to 9.0 of ammoniacal liquor regulator solution again, obtain electroplate liquid.Other is identical with one of embodiment one to 13.
Embodiment 16: what present embodiment was different with one of embodiment one to 15 is: the temperature when electroplating in the step 6 is that 36 ℃～44 ℃, current density are 1.2A/dm
2～1.8A/dm
2, electroplating time is 32min～38min.Other is identical with one of embodiment one to 15.
Embodiment 17: what present embodiment was different with one of embodiment one to 15 is: the temperature when electroplating in the step 6 is that 40 ℃, current density are 1.5A/dm
2, electroplating time is 35min.Other is identical with one of embodiment one to 15.
Embodiment 18: MB2 Mg alloy wire of the present invention copper coating is carried out according to the following steps: one, the MB2 Mg alloy wire with 120#, abrasive paper for metallograph polishing, is polished to surface-brightening with the abrasive paper for metallograph of 1000# earlier again; Two, will be placed in the acetone through the MB2 Mg alloy wire that step 1 is handled, use ultrasonic cleaning 5min; Three, be that the concentration of 10g/L, sodium phosphate concentration 20g/L, OP emulsifying agent is that 1.0g/L weighing sodium hydroxide, sodium phosphate and OP emulsifying agent and adding in the entry mixes by concentration sodium hydroxide, use the pH to 8.5 of phosphoric acid regulator solution again, obtain degreaser; To put into degreaser through the MB2 Mg alloy wire that step 2 is handled, be to be incubated 5min under 60 ℃ the condition in temperature, take out with distilled water flushing then clean, oven dry; Four, be that 40g/L, concentration of phosphoric acid are that the concentration of 60mL/L, boric acid is that 30g/L takes by weighing two ammonium hydrogen difluorides, phosphoric acid and boric acid and is added to the water by the concentration of two ammonium hydrogen difluorides, mix, obtain pickle solution; To put into pickle solution through the MB2 Mg alloy wire that step 3 is handled, at room temperature locate 60s, clean after taking out with distilled water flushing, dry up; Five, be that 35g/L, potassium pyrophosphate concentration are that the concentration of 140g/L, Potassium monofluoride is that the concentration of 8g/L, yellow soda ash is that the concentration of 18g/L, Seignette salt is that the concentration of Seignette salt, the iron(ic) chloride of 8g/L is that the concentration of 7g/L, copper sulfate is that 5g/L takes by weighing zinc sulfate, potassium pyrophosphate, Potassium monofluoride, yellow soda ash, Seignette salt, iron(ic) chloride and copper sulfate and is added to the water by the sulfuric acid zinc concentration, mix, obtain zincate solution; To put into zincate solution through the MB2 Mg alloy wire that step 4 is handled, be to handle 20min under 80 ℃ the condition in temperature, takes out the back distilled water flushing, dries up, and obtains zinc-plated MB2 Mg alloy wire; Six, be that the concentration of 60g/L, potassium pyrophosphate is that the concentration of 250g/L, dipotassium hydrogen phosphate is that the concentration of 40g/L, ammonium citrate is that the concentration of 25g/L, phytic acid is that the concentration of 0.3g/L, vanillin food grade,1000.000000ine mesh is that 0.2g/L takes by weighing cupric pyrophosphate, potassium pyrophosphate, dipotassium hydrogen phosphate, ammonium citrate, phytic acid and vanillin food grade,1000.000000ine mesh and is added to the water and mixes by the concentration of cupric pyrophosphate, use the pH to 8.5 of ammoniacal liquor regulator solution again, obtain electroplate liquid, the zinc-plated MB2 Mg alloy wire that obtains with step 5 is a negative electrode again, with the fine copper sheet is anode, is that 40 ℃, current density are 1.5A/dm in temperature
2Condition under electroplate 30min, obtain copper facing MB2 Mg alloy wire.
The zinc-plated MB2 Mg alloy wire that present embodiment is obtained through step 5 adopts the cross cut test of standard GB/T9286-1988 paint and varnish paint film to evaluate binding force of cladding material, and marking area with Checker marking knife is 1mm
2Grid square 100 lattice, observe in the grid whether peeling or come off of coating.With the glutinous back of adhesive plaster with the lattice number that do not come off as scoring, the scoring of bonding force test result reaches 97 fens.
The copper facing MB2 Mg alloy wire that present embodiment is obtained adopts the cross cut test of standard GB/T9286-1988 paint and varnish paint film to evaluate binding force of cladding material, and marking area with Checker marking knife is 1mm
2Grid square 100 lattice, observe in the grid whether peeling or come off of coating.With the glutinous back of adhesive plaster with the lattice number that do not come off as scoring, the scoring of bonding force test result reaches 95 fens.
From above evidence present embodiment preparation coating with the substrate combinating strength height.
The zinc-plated MB2 Mg alloy wire that present embodiment is obtained through step 5 is placed in the dilute nitric acid solution that concentration is 0.1mol/L, and no bubbling phenomenon proves even film layer, pore-free.
The copper facing MB2 Mg alloy wire that present embodiment is obtained is placed in the dilute nitric acid solution that concentration is 0.1mol/L, and no bubbling phenomenon proves even film layer, pore-free.
It is to soak 32h in the 5%NaCl solution that the zinc-plated MB2 Mg alloy wire that present embodiment is obtained through step 5 is placed on massfraction, and no corrosion phenomenon proves that the zinc coating solidity to corrosion is good.
It is 1mol/dm that the copper facing MB2 Mg alloy wire that present embodiment is obtained is put concentration
3Dilute sulphuric acid in soak 60min, no corrosion phenomenon proves that the zinc coating solidity to corrosion is good.
The copper facing MB2 Mg alloy wire of present embodiment preparation, the coating of formation even compact on Mg alloy wire, and membranous layer corrosion resistance is good, and with the high base strength height, coating is even, no bulge burr, the reaction times is short, and production energy consumption is low, low production cost.General cable TV signal transmission, the transmission of large vol communication network signal, control signal cable, light body vehicle cable, cabtyre cable, the aspects such as urgent removal cable of being applied to of the copper facing MB2 Mg alloy wire of preparation.
Claims (10)
1.MB2 the Mg alloy wire copper coating is characterized in that the copper coating of MB2 Mg alloy wire carries out according to the following steps: one, the MB2 Mg alloy wire is polished to surface-brightening with abrasive paper for metallograph; Two, will be placed on through the MB2 Mg alloy wire that step 1 is handled and carry out ultrasonic cleaning in the acetone; Three, be that the concentration of 5g/L～15g/L, sodium phosphate concentration 15g/L～25g/L, OP emulsifying agent is that 0.5g/L～1.5g/L weighing sodium hydroxide, sodium phosphate and OP emulsifying agent and adding in the entry mixes by concentration sodium hydroxide, use pH to 8.5～10.5 of phosphoric acid regulator solution again, obtain degreaser; To put into degreaser through the MB2 Mg alloy wire that step 2 is handled, be to be incubated 5min～10min under 45 ℃～75 ℃ the condition in temperature, takes out then and use distilled water flushing, dries; Four, be that 30g/L～50g/L, concentration of phosphoric acid are that the concentration of 55mL/L～65mL/L, boric acid is that 29g/L～31g/L takes by weighing two ammonium hydrogen difluorides, phosphoric acid and boric acid and is added to the water by the concentration of two ammonium hydrogen difluorides, mix, obtain pickle solution; To put into pickle solution through the MB2 Mg alloy wire that step 3 is handled, at room temperature handle 30s～60s, and take out the back and use distilled water flushing, dry up; Five, be that 20g/L～40g/L, potassium pyrophosphate concentration are that the concentration of 100g/L～150g/L, Potassium monofluoride is that the concentration of 5g/L～10g/L, yellow soda ash is that the concentration of 10g/L～20g/L, Seignette salt is that the concentration of Seignette salt, the iron(ic) chloride of 5g/L～10g/L is that the concentration of 5g/L～10g/L, copper sulfate is that 3g/L～10g/L takes by weighing zinc sulfate, potassium pyrophosphate, Potassium monofluoride, yellow soda ash, Seignette salt, iron(ic) chloride and copper sulfate and is added to the water by the sulfuric acid zinc concentration, mix, obtain zincate solution; To put into zincate solution through the MB2 Mg alloy wire that step 4 is handled, be to handle 20min～30min under 70 ℃～90 ℃ the condition in temperature, takes out the back distilled water flushing, dries up, and obtains zinc-plated MB2 Mg alloy wire; Six, concentration by cupric pyrophosphate is 50g/L～70g/L, the concentration of potassium pyrophosphate is 250g/L～300g/L, the concentration of dipotassium hydrogen phosphate is 35g/L～45g/L, the concentration of ammonium citrate is 20g/L～30g/L, the concentration of phytic acid is 0.1g/L～0.5g/L, the concentration of vanillin food grade,1000.000000ine mesh is that 0.1g/L～0.3g/L takes by weighing cupric pyrophosphate, potassium pyrophosphate, dipotassium hydrogen phosphate, ammonium citrate, phytic acid and vanillin food grade,1000.000000ine mesh and being added to the water mixes, use pH to 8～10 of ammoniacal liquor regulator solution again, obtain electroplate liquid, be negative electrode with the zinc-plated MB2 Mg alloy wire that obtains through step 5 again, with the fine copper sheet is anode, is 35 ℃～45 ℃ in temperature, current density is 1A/dm
2～2A/dm
2Condition under electroplate 30min～40min; Finish MB2 Mg alloy wire copper facing process.
2. MB2 Mg alloy wire according to claim 1 copper coating, it is characterized in that in the step 3 by concentration sodium hydroxide being that the concentration of 7g/L～13g/L, sodium phosphate concentration 17g/L～24g/L, OP emulsifying agent is that 0.7g/L～1.3g/L weighing sodium hydroxide, sodium phosphate and OP emulsifying agent and adding in the entry mixes, use pH to 8.6～10.3 of phosphoric acid regulator solution again, obtain degreaser.
3. MB2 Mg alloy wire according to claim 1 and 2 copper coating is characterized in that the MB2 Mg alloy wire is put into degreaser in the step 3, in temperature is to be incubated 6min～9min under 48 ℃～72 ℃ the condition.
4. MB2 Mg alloy wire according to claim 1 and 2 copper coating, it is characterized in that in the step 4 that concentration by two ammonium hydrogen difluorides is that 33g/L～46g/L, concentration of phosphoric acid are that the concentration of 57mL/L～63mL/L, boric acid is that 29.5g/L～30.5g/L takes by weighing two ammonium hydrogen difluorides, phosphoric acid and boric acid and is added to the water, mix, obtain pickle solution.
5. MB2 Mg alloy wire according to claim 1 and 2 copper coating is characterized in that will putting into pickle solution through the MB2 Mg alloy wire that step 3 is handled in the step 4, at room temperature handles 35s～55s.
6. MB2 Mg alloy wire according to claim 1 and 2 copper coating, it is characterized in that in the step 5 by the sulfuric acid zinc concentration being 23g/L～38g/L, potassium pyrophosphate concentration is 105g/L～145g/L, the concentration of Potassium monofluoride is 6g/L～9g/L, the concentration of yellow soda ash is 12g/L～18g/L, the concentration of Seignette salt is the Seignette salt of 6g/L～9g/L, the concentration of iron(ic) chloride is 6g/L～9g/L, the concentration of copper sulfate is that 5g/L～9g/L takes by weighing zinc sulfate, potassium pyrophosphate, Potassium monofluoride, yellow soda ash, Seignette salt, iron(ic) chloride and copper sulfate also are added to the water, mix, obtain zincate solution.
7. MB2 Mg alloy wire according to claim 1 and 2 copper coating is characterized in that will putting into zincate solution through the MB2 Mg alloy wire that step 4 is handled in the step 5, in temperature is to handle 22min～28min under 75 ℃～85 ℃ the condition.
8. MB2 Mg alloy wire according to claim 1 and 2 copper coating, it is characterized in that the concentration by cupric pyrophosphate is 55g/L～67g/L in the step 6, the concentration of potassium pyrophosphate is 255g/L～295g/L, the concentration of dipotassium hydrogen phosphate is 36g/L～44g/L, the concentration of ammonium citrate is 22g/L～28g/L, the concentration of phytic acid is 0.2g/L～0.4g/L, the concentration of vanillin food grade,1000.000000ine mesh is that 0.15g/L～0.25g/L takes by weighing cupric pyrophosphate, potassium pyrophosphate, dipotassium hydrogen phosphate, ammonium citrate, phytic acid and vanillin food grade,1000.000000ine mesh and being added to the water mixes, use pH to 8.5～9.5 of ammoniacal liquor regulator solution again, obtain electroplate liquid.
9. MB2 Mg alloy wire according to claim 1 and 2 copper coating, the temperature when it is characterized in that in the step 6 electroplating are that 36 ℃～44 ℃, current density are 1.2A/dm
2～1.8A/dm
2, electroplating time is 32min～38min.
10. MB2 Mg alloy wire according to claim 1 and 2 copper coating, the temperature when it is characterized in that in the step 6 electroplating are that 40 ℃, current density are 1.5A/dm
2, electroplating time is 35min.
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| CN103898584A (en) * | 2013-06-03 | 2014-07-02 | 无锡市锡山区鹅湖镇荡口青荡金属制品厂 | Pre-galvanizing process for electroplating copper on surface of magnesium alloy shell |
| CN103898578A (en) * | 2013-06-03 | 2014-07-02 | 无锡市锡山区鹅湖镇荡口青荡金属制品厂 | Plating solution for electrocoppering on surface of magnesium alloy shell |
| CN103898572A (en) * | 2013-06-03 | 2014-07-02 | 无锡市锡山区鹅湖镇荡口青荡金属制品厂 | Process for plating copper on surface of magnesium alloy shell |
| CN103898581A (en) * | 2013-06-03 | 2014-07-02 | 无锡市锡山区鹅湖镇荡口青荡金属制品厂 | Cyanide-free electro-coppering process for electroplating nickel on surface of magnesium alloy die-cast piece |
| CN104282355A (en) * | 2014-10-31 | 2015-01-14 | 杨攀 | Copper-coated magnesium alloy wire and preparation method thereof |
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