CN102201357B - 一种晶圆级封装微小芯片提取翻转置位设备 - Google Patents
一种晶圆级封装微小芯片提取翻转置位设备 Download PDFInfo
- Publication number
- CN102201357B CN102201357B CN 201110098667 CN201110098667A CN102201357B CN 102201357 B CN102201357 B CN 102201357B CN 201110098667 CN201110098667 CN 201110098667 CN 201110098667 A CN201110098667 A CN 201110098667A CN 102201357 B CN102201357 B CN 102201357B
- Authority
- CN
- China
- Prior art keywords
- upset
- chip
- carrier band
- extracting
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 32
- 238000003825 pressing Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 12
- 230000008569 process Effects 0.000 claims abstract description 12
- 239000000284 extract Substances 0.000 claims description 20
- 238000007731 hot pressing Methods 0.000 claims description 17
- 238000000605 extraction Methods 0.000 claims description 13
- 238000004806 packaging method and process Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 238000001514 detection method Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201110098667 CN102201357B (zh) | 2011-04-19 | 2011-04-19 | 一种晶圆级封装微小芯片提取翻转置位设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201110098667 CN102201357B (zh) | 2011-04-19 | 2011-04-19 | 一种晶圆级封装微小芯片提取翻转置位设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102201357A CN102201357A (zh) | 2011-09-28 |
CN102201357B true CN102201357B (zh) | 2013-04-17 |
Family
ID=44661934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201110098667 Active CN102201357B (zh) | 2011-04-19 | 2011-04-19 | 一种晶圆级封装微小芯片提取翻转置位设备 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102201357B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102729023B (zh) * | 2012-07-04 | 2015-05-20 | 吴江市博众精工科技有限公司 | 一种翻转模组 |
CN103871915B (zh) * | 2014-03-24 | 2016-08-17 | 上海微松工业自动化有限公司 | 手动bga植球机 |
CN104752283B (zh) * | 2015-04-07 | 2018-02-13 | 嘉兴景焱智能装备技术有限公司 | 芯片倒装装置 |
CN105446131B (zh) * | 2015-12-18 | 2018-07-31 | 武汉华威科智能技术有限公司 | 一种wafer取片防撞控制方法及*** |
CN106864819B (zh) * | 2017-04-25 | 2023-03-14 | 成都宏明双新科技股份有限公司 | 一种横梁自动包裹生产线及其方法 |
CN111627836B (zh) * | 2020-05-29 | 2021-07-13 | 太极半导体(苏州)有限公司 | 一种芯片封装装置及其封装方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060022957A (ko) * | 2004-09-08 | 2006-03-13 | 삼성전자주식회사 | 반도체 연마 장치 |
CN201075381Y (zh) * | 2007-09-13 | 2008-06-18 | 铜陵三佳科技股份有限公司 | 一种集成电路自动封装***的树脂搬运装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030188997A1 (en) * | 2002-03-29 | 2003-10-09 | Tan Beng Soon | Semiconductor inspection system and method |
-
2011
- 2011-04-19 CN CN 201110098667 patent/CN102201357B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060022957A (ko) * | 2004-09-08 | 2006-03-13 | 삼성전자주식회사 | 반도체 연마 장치 |
CN201075381Y (zh) * | 2007-09-13 | 2008-06-18 | 铜陵三佳科技股份有限公司 | 一种集成电路自动封装***的树脂搬运装置 |
Also Published As
Publication number | Publication date |
---|---|
CN102201357A (zh) | 2011-09-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102201357B (zh) | 一种晶圆级封装微小芯片提取翻转置位设备 | |
CN107093651B (zh) | 太阳能硅片二合一自动上下料设备 | |
CN111916375B (zh) | 转塔式芯片无胶固晶机 | |
CN202878919U (zh) | 一种引线框架的二维码打标机的上料抓手模组 | |
CN101901773B (zh) | 一种适用于自动设备中叠堆硅片自动上料的*** | |
US8819929B2 (en) | Component mounting method | |
CN109979856B (zh) | 倒装固晶设备及其方法 | |
CN109904096B (zh) | 一种半导体装片一体机 | |
TWI582874B (zh) | A test system for testing semiconductor packaged stacked wafers, and a semiconductor automated test machine | |
CN210349783U (zh) | 一种转塔式固晶机 | |
US20110215134A1 (en) | Rotary die bonding apparatus and methodology thereof | |
CN108886002B (zh) | 芯片封装设备及其方法 | |
TWI500098B (zh) | Sticky crystal machine | |
JP4879181B2 (ja) | ワークハンドリング装置 | |
CN110646724B (zh) | 一种半导体芯片分选测试装置的上料输送装置及其工作方法 | |
CN107305916A (zh) | 一种csp封装led的贴片机及其加工工艺 | |
US20180143541A1 (en) | Silicon wafer transportation system | |
CN115863226B (zh) | 一种可自动折断晶片检查移载的折取机 | |
CN115831815B (zh) | 芯片贴装***及其贴装方法 | |
CN112657855A (zh) | 芯片检测分选机及其检测方法 | |
CN116053153A (zh) | 一种固晶机及固晶方法 | |
CN202025729U (zh) | 一种用于晶圆级封装微小芯片的提取翻转置位设备 | |
CN115674704B (zh) | 双工位导电胶膜贴附机 | |
JP2012094634A (ja) | 部品実装装置および部品実装方法 | |
CN108122787B (zh) | 芯片键合装置和芯片键合方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Equipment for extracting, turning and setting wafer-level packaged microchip Effective date of registration: 20170706 Granted publication date: 20130417 Pledgee: Pudong Development Bank of Minhang Shanghai branch Pledgor: Shanghai Weisong Industry Automation Co., Ltd. Registration number: 2017310000037 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20180705 Granted publication date: 20130417 Pledgee: Pudong Development Bank of Minhang Shanghai branch Pledgor: Shanghai Weisong Industry Automation Co., Ltd. Registration number: 2017310000037 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Equipment for extracting, turning and setting wafer-level packaged microchip Effective date of registration: 20180730 Granted publication date: 20130417 Pledgee: Pudong Development Bank of Minhang Shanghai branch Pledgor: Shanghai Weisong Industry Automation Co., Ltd. Registration number: 2018990000616 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20191028 Granted publication date: 20130417 Pledgee: Pudong Development Bank of Minhang Shanghai branch Pledgor: Shanghai Weisong Industry Automation Co., Ltd. Registration number: 2018990000616 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |