CN102192812A - Sensor module and method for producing the same - Google Patents
Sensor module and method for producing the same Download PDFInfo
- Publication number
- CN102192812A CN102192812A CN2011100366029A CN201110036602A CN102192812A CN 102192812 A CN102192812 A CN 102192812A CN 2011100366029 A CN2011100366029 A CN 2011100366029A CN 201110036602 A CN201110036602 A CN 201110036602A CN 102192812 A CN102192812 A CN 102192812A
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- Prior art keywords
- blank
- ribbon conductor
- housing
- sensor assembly
- circuit
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention relates to a sensor module (1), especially a pressure sensor module (1) of a motor vehicle, comprising a housing (15) with two separated chambers (21,22), wherein a sensor element (7) is arranged on one of the separated chambers, a circuit (5), especially an integrated switch circuit (6) is arranged in another one of the separated chamber; the sensor element (7) and the circuit (5) are electrically connected by at least one strip conductor (9), especially a stamping grid strip conductor (10) and the strip conductor is guided to pass through a wall (20) of the housing (15) for mutually separating the chambers (21,22). A housing area (4) for surrounding one section of the strip conductor is connected with the wall (20) and composed of a blank (11), wherein a vertical section of the strip conductor (9) is exposed in the blank and the blank is at least basically filled with a sealing material (12). The invention also relates to a method for producing the sensor module.
Description
Technical field
The present invention relates to the pressure sensor module of a kind of sensor assembly, particularly motor vehicle, comprise a housing, this housing has two chambeies separated from one another, be provided with a sensor element in a chamber therein, and in another chamber, be provided with an electric/electronic circuit, particularly integrated on-off circuit, this sensor element and circuit are electrically connected mutually by at least one ribbon conductor, particularly punching press grid ribbon conductor, described ribbon conductor pass housing with these chambeies wall separated from one another.
The invention still further relates to a kind of method that is used to make the pressure sensor module of sensor assembly, particularly motor vehicle, wherein this sensor assembly has two chambeies separated from one another, in chamber a sensor element is set therein and an electric/electronic circuit, particularly integrated on-off circuit are set in another chamber, by at least one ribbon conductor, particularly punching press grid ribbon conductor this sensor element and circuit are electrically connected mutually, this ribbon conductor passes these chambeies wall separated from one another.
Background technology
The sensor element and the method that start described type are known by prior art.Modern sensor assembly is at the enclosure interior circuit of the data of the element of detecting sensor in other words of supporting sensor element but also supporting control sensor element not only, and their are electrically connected certainly mutually.But usually to sensor element and circuit have different requirements, particularly aspect the application of sensor element.Thereby for example for the pressure transducer in should being used in automobile exhausting equipment, circuit and sensor element spatially must be separated, because the waste gas endurance of the waste gas endurance of the sensor element on-off circuit particularly more integrated than circuit can obviously easily be guaranteed.Because desirable dirigibility when assembling sensor element and circuit, what also be worth expectation is, turn up the soil formation and can correspondingly arranging that sensor element and circuit be separate.Therefore sensor element can be provided with in the chamber that of being arranged in housing in other words bears medium to be studied, particularly waste gas, and circuit be arranged on one separated with it, do not bear in the chamber of medium.
By the known a kind of sensor assembly of open file DE 199 61 776A1, wherein, sensor element and circuit are arranged in the separated chamber, realize being electrically connected by ribbon conductor, and these ribbon conductors extend through these chambeies wall separated from one another.But because the thermal expansivity of ribbon conductor and housing is different, so the disengaging that occurs causing housing and ribbon conductor when temperature fluctuation also thereby blow-by occurs, this can cause waste gas also to enter in second chamber.
Summary of the invention
According to sensor assembly regulation of the present invention, the shell area that on described wall, connects a section of an encirclement ribbon conductor, this shell area has leaves a blank, and exposes a vertical section of ribbon conductor in this is left a blank, and described leaving a blank is filled encapsulant at least basically.That is to say that connect a shell area on described wall, thereby this wall carries out the transition in the shell area, ribbon conductor is introduced to equally and passes this shell area.This shell area is formed by housing.That is regulation, a vertical section of ribbon conductor is formed in one and exposes in the leaving a blank in the shell area of housing and thereby directly do not surrounded by case material.Replace, leave a blank and fill up, during the sealing material remains on and leaves a blank and be wrapped in the ribbon conductor that exposes in leaving a blank with encapsulant.Encapsulant is made by the material different with housing aptly and is preferably had intrinsic elasticity.Being in operation by thermoinducible distortion and can preventing that thus medium from passing described wall and guaranteeing that all the time these chambeies (hermetically) separate along ribbon conductor of flexible encapsulant compensation ribbon conductor and/or housing.
Preferably, encapsulant constitutes adhesive material.When adhesive material had enough viscosity after sclerosis, it can utilize above-mentioned intrinsic flexible ability, so that the distortion of compensation ribbon conductor and/or housing.In addition, adhesive material itself since its bonding effect and/or its intensity (after sclerosis) remain on leave a blank in and on ribbon conductor.In a word, thereby provide a kind of sensor assembly, this sensor assembly to guarantee that especially reliably these chambeies separate.
Advantageously, casing structure becomes two-piece type at least, and wherein said wall is formed by in the housing component one or two.That is regulation here, the time at first form housing in assembling by at least two housing components, wherein make these chambeies wall separated from one another or form jointly by one of housing component or by two housing components fully.For example can stipulate that under latter event each housing component forms a wall section.The formation of the multi-piece type by housing, sensor and circuit can need not greatly to be provided with expending and to be fixed on the housing.Particularly, in case of necessity here can be in a simple manner and method connect setting up essential bonding (Bond) between sensor element and the ribbon conductor and/or between circuit and ribbon conductor.
Preferably, first housing component not only has sensor element but also has circuit and ribbon conductor.Remaining second housing component thereby final with acting on the sealing or the lid of closure casing partly.By sensor element, circuit and ribbon conductor are set, can realize the pre-assembled completely of the electrical/electronic components of sensor assembly here on first housing component.
Aptly, first housing component comprises having the shell area of leaving a blank.Advantageously, have the shell area of leaving a blank and constitute teat on the basic element of character of first housing component or housing.On the basic element of character, place described one or more ribbon conductors, make them for example connect and to arrive easily in order to make bonding.By constituting the shell area of teat, the ribbon conductor that is placed on the basic element of character is surrounded by the material of first housing component in other words of housing in described shell area.Aptly, teat and housing or first housing component constitute shell area integratedly in other words.Conversion ground, shell area can be meant a section of first housing component or the basic element of character, this section is connected on the described wall.Here, ribbon conductor preferably extends in the basic element of character basically, and wherein its end regions can free closely be arranged in or leaving a blank at the basic element of character at least.Can expect that also described at least one ribbon conductor is crooked in this wise, promptly it extends in a plurality of planes, thereby it for example is arranged in the shell area of the basic element of character and is bearing on the basic element of character near sensor element or circuit.Particularly preferably, leaving a blank constitutes perforation, and this perforation extends through whole first housing component and extends on this first housing component height in other words.Except task as the storage portion of encapsulant, perforation and/or leave a blank and also satisfy another task: when making first housing component, with ribbon conductor aptly as described above by housing or by the material of housing component in the zone of described wall and in the teat zone that also is being attached thereto around injection moulding.For can make ribbon conductor, particularly punching press grid ribbon conductor during the Shooting Technique reliably on housing component/middle orientation, ribbon conductor is remained in the injection mold with corresponding keeper.Aptly, keeper here is configured to like this, promptly forms described leaving a blank by keeper when injection moulding first housing component.Therefore, can make ribbon conductor accurately directed during fabrication and can make simultaneously and be used for leaving a blank of encapsulant.
Stipulate that in addition second housing component of housing has one and covers described projection of leaving a blank.The projection covering of second housing component is left a blank and is extended on the whole width of housing as teat aptly, and the separation in these chambeies is supported thus.In addition, projection covers in this wise and leaves a blank, and makes the encapsulant that is positioned at wherein be securely held on wherein.This particularly has meaning during fabrication, wherein advantageously encapsulant is filled into to leave a blank after the assemble case part.The projection of second housing component is just as the bottom surface of leaving a blank, during encapsulant is securely held on and leaves a blank thus.
According to a kind of favourable improvement project regulation of sensor assembly, first housing component has a sealing lath or sealing receptacle, and second housing component has a sealing receptacle or sealing lath, and their assembling ground forms described wall.The sealing lath of first housing component or sealing receptacle can be lifted from the teat that has been provided with from shell area in other words at this.Aptly, sealing lath and sealing receptacle constitute complimentary to one anotherly, thereby fit together when forming housing when first housing component and second housing component, and sealing lath shape at least basically joins to sealedly and seals in the receptacle.
Advantageously, be additionally provided with encapsulant, particularly adhesive seal material between sealing lath and sealing receptacle, described encapsulant improves tightness on the one hand, on the other hand each housing component is fixed against each other.
Regulation at last, housing component is by plastics, particularly formed by thermoplastics.
Be characterised in that according to the method that is used to make sensor assembly, particularly aforesaid sensor assembly of the present invention, the shell area that on described wall, connects a section of an encirclement ribbon conductor of ground moulding, setting one for this shell area leaves a blank, in this is left a blank, expose a vertical section of ribbon conductor, described leaving a blank filled up at least basically with encapsulant.As mentioned above, leaving a blank can together form when producing housing component of housing or housing, perhaps also can be presented in housing component or the housing afterwards.Advantageously, as encapsulant the adhesive seal material is filled into and leaves a blank, each chamber that it guarantees the sealing of sensor assembly or housing is to each other along the separation of at least one ribbon conductor.
Description of drawings
Should illustrate in greater detail the present invention with reference to the accompanying drawings below.For this reason,
Fig. 1 illustrates the vertical view of a housing component of a favourable sensor assembly,
Fig. 2 illustrates the vertical view of the housing component that comprises encapsulant,
Fig. 3 illustrates the distribution of the ribbon conductor of this sensor assembly,
Fig. 4 illustrates the side view of sensor assembly, and
Fig. 5 illustrates the skeleton view of sensor assembly.
Embodiment
Fig. 1 illustrates the vertical view of the perspective of a sensor assembly 1, and this sensor assembly is configured to pressure sensor module 2, particularly is configured to the low pressure sensor module, comprises one first housing component 3, and this first housing component is made with thermoplastics.First housing component has a shell area 4 that constitutes teat in the centre, this shell area is extended on the whole width of first housing component 3.In the figure, shell area 4 left sides, first housing component 3 are provided with an electric/electronic circuit 5, and this circuit structure becomes integrated on-off circuit 6.On a relative side, with shell area 4 partition distance be provided with a sensor element 7, this sensor element is configured to pressure sensor component 8.Sensor element 7 and integrated circuit 6 are configured to chip respectively at this under present case.
Sensor element 7 is connected with four ribbon conductors 9 under present case by bonding with on-off circuit 6 and is connected, and these ribbon conductors pass teat and extend.Ribbon conductor 9 is configured to punching press grid ribbon conductor 10 in processing during housing component 3, and when making housing component 3 by plastic material around injection moulding.When a corresponding injection mold, make punching press grid ribbon conductor 10 orientations for this reason and remain in the holding device, and plastics are expelled in the mould.Holding device constitutes in this wise and is arranged in the shell area 4 in other words in the zone at teat at this, make and during injection moulding process, a zone of teat is vacated, thereby in teat, form one and leave a blank 11, in this is left a blank, expose a vertical section of each punching press grid ribbon conductor 10 respectively.
As shown in FIG. 2, and then fill up or fill up at least basically this with encapsulant 12 and leave a blank 11, the sealing material advantageously constitutes adhesive seal material 13.Thus, each vertical section that exposes in leaving a blank of punching press grid ribbon conductor 10 is surrounded by bonding agent encapsulant 13.
Fig. 3 illustrates the vertical view according to the housing component 3 of Fig. 2, and wherein the distribution of punching press grid ribbon conductor 10 in the teat zone is shown in broken lines.Ribbon conductor 9 in other words punching press grid ribbon conductor 10 by the plastic material of first housing component 3 around the section of injection moulding may be when the temperature fluctuation owing to its temperature expansion coefficient different with the temperature expansion coefficient of plastics by thermoinducible distortion and plastics in other words housing component 3 break away from, and guarantee the sealing of system at the adhesive seal material 13 in 11 of leaving a blank.If the adhesive seal material the sclerosis after have enough viscosity or intrinsic elasticity, then by adhesive seal material balance compensate in other words ribbon conductor 9 by thermoinducible distortion.Therefore, ribbon conductor 9 can be out of shape in 11 the zone of leaving a blank, and does not endanger sealing thus.
Fig. 4 illustrates the side view of sensor assembly 1.Except first housing component 3, one second housing component 14 of sensor assembly 1 also is shown, this second housing component forms the housing 15 of sensor assembly 1 with housing component 3.Second housing component 14 has a projection 16, and this projection is extended on the whole width of second housing component 14.As seen from Figure 5, the width of housing component 14 equals the width of housing component 3.Here it should be noted that in these diagrams not mark the sidewall of sensor assembly 1, yet certainly be provided with sidewall and advantageously be provided with sidewall for reason clearly.Projection 16 upside, promptly the surface towards housing component 3 of projection 16 is configured such that projection 16 covers generally and thereby seals and leave a blank 11.
Sealing lath 18 and sealing receptacle 17 form a wall 20 under the assembled state of the housing 15 of sensor assembly 1, this wall separates housing 15 in this wise, promptly forms two chambeies 21,22 separated from one another.At this, integrated on-off circuit 6 is arranged in the chamber 21, and sensor element 7 is arranged in the chamber 22.Certainly, wall 20 also can constitute and is arranged on 11 the opposite side of leaving a blank in other words that is is close to pressure sensor component 8.
Via the separation of wall 20 and in case of necessity by wall 23, the electrical/electronic element of sensor assembly 1 (sensor element 7 and circuit 5) can bear different media by chamber 21 and 22.Low pressure sensor module 2 therefore can sensor element 7 be born the waste gas of internal combustion engine of motor vehicle, and integrated on-off circuit 6 is separated to turn up the soil with it and for example suffered surrounding air.Be arranged in 11 the adhesive seal material 13 of leaving a blank and guarantee that waste gas can not enter into chamber 22 in 21 paths along ribbon conductor 9 from the chamber.Even ribbon conductor 9 owing to temperature fluctuation is out of shape, is also guaranteed sealing by adhesive seal material 13.Also must realize more without difficultyly or not realize the formation of the opposing waste gas of integrated on-off circuit 6 thus.
If gel should be essential, so that additionally protect sensor element 7 and/or integrated on-off circuit (ASIC) 6 to avoid waste gas or other media, then this can realize under the situation that does not have the measure on other structural or manufacturing technologies.Teat in sensor housing 15 or wall 20 and/or 23 usefulness act on the limited section of distribution gel.Do not produce additional member and thereby additional purchase cost.
Favourable sensor assembly 1 and manufacture method thereof are simple especially, do not need the member or the processing technology of adding because ignore adhesive seal material 13.Except the support of moulding ribbon conductor in injection mold and inserting the adhesive seal material 13, sensor assembly 1 can be by common mode and method manufacturing.Therefore, sensor assembly 1 is provided at certified and healthy and strong being electrically connected that is connected with corresponding bonding by punching press grid ribbon conductor 10 between sensor element 7 and the integrated on-off circuit 6.
Claims (10)
1. sensor assembly (1), the pressure sensor module of motor vehicle (2) particularly, comprise a housing (15), this housing has two chambeies (21 separated from one another, 22), be provided with a sensor element (7) in the chamber (22) therein, and in another chamber (21), be provided with a circuit (5), particularly integrated on-off circuit (6), this sensor element (7) and this circuit (5) are by at least one ribbon conductor (9), particularly punching press grid ribbon conductor (10) is electrically connected mutually, described ribbon conductor pass described housing (15) with these chambeies (21,22) wall separated from one another (20), it is characterized in that, go up the shell area (4) of a section that connects a described ribbon conductor of encirclement at described wall (20), this shell area (4) has leave a blank (11), expose a vertical section of described ribbon conductor (9) in this is left a blank, described leaving a blank (11) is filled encapsulant (12) at least basically.
2. sensor assembly according to claim 1 is characterized in that, described encapsulant (12) is adhesive seal material (13).
3. each described sensor assembly in requiring according to aforesaid right is characterized in that, described housing (15) is configured to two-piece type at least, and described wall (20) is formed by in the housing component (3,14) at least one.
4. each described sensor assembly in requiring according to aforesaid right is characterized in that first housing component (3) has described sensor element (7), described circuit (5) and described ribbon conductor (9).
5. each described sensor assembly in requiring according to aforesaid right is characterized in that described first housing component (3) comprises the described shell area (4) with leave a blank (11).
6. each described sensor assembly in requiring according to aforesaid right is characterized in that second housing component (14) has the described projection of leaving a blank (16) of covering.
7. each described sensor assembly in requiring according to aforesaid right, it is characterized in that, described first housing component (3) has a sealing lath (18) or sealing receptacle (17), and described second housing component (14) has a sealing receptacle (17) or sealing lath (18), and described sealing receptacle and sealing lath assembling ground form described wall (20).
8. each described sensor assembly in requiring according to aforesaid right is characterized in that, is provided with encapsulant, particularly adhesive seal material (19) between described sealing lath (18) and described sealing receptacle (17).
9. each described sensor assembly in requiring according to aforesaid right is characterized in that these housing components (3,14) are made by plastic injection-moulded.
10. be used for making particularly method according to aforesaid right requirement each or multinomial described sensor assembly (1), wherein this sensor assembly (1) has two chambeies (21 separated from one another, 22), in the chamber (22) sensor element (7) is set therein, and an electric/electronic circuit (5) is set in another chamber (21), particularly integrated on-off circuit (6), by at least one ribbon conductor (9), particularly punching press grid ribbon conductor (10) is electrically connected this sensor element (7) and this circuit (5) mutually, this ribbon conductor (9) passes these chambeies (21,22) wall separated from one another (20), its spy is being, go up the shell area (4) of a section that connects a described ribbon conductor of encirclement of ground moulding (9) at described wall (20), set one leave a blank (11) for this shell area (4), in this is left a blank, expose a vertical section of described ribbon conductor (9), described leaving a blank (11) filled up encapsulant (12) at least basically.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010001418.4 | 2010-02-01 | ||
DE201010001418 DE102010001418A1 (en) | 2010-02-01 | 2010-02-01 | Sensor module i.e. low pressure sensor module, for examining exhaust gas in exhaust system of combustion engine in motor car, has housing region comprising recess that is filled with sealant i.e. adhesive sealant |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102192812A true CN102192812A (en) | 2011-09-21 |
Family
ID=44315844
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011100366029A Pending CN102192812A (en) | 2010-02-01 | 2011-01-31 | Sensor module and method for producing the same |
Country Status (2)
Country | Link |
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CN (1) | CN102192812A (en) |
DE (1) | DE102010001418A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106030270A (en) * | 2014-02-17 | 2016-10-12 | 罗伯特·博世有限公司 | Connection device for a pressure sensor, pressure sensor, and method for producing a connection device |
CN107112706A (en) * | 2015-01-08 | 2017-08-29 | 雷蒙德·休伯 | Electric functional part with contact plug and the method for manufacturing electric functional part |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4850227A (en) * | 1987-12-22 | 1989-07-25 | Delco Electronics Corporation | Pressure sensor and method of fabrication thereof |
US5900554A (en) * | 1995-07-28 | 1999-05-04 | Nippendenso Co., Ltd. | Pressure sensor |
US20070193359A1 (en) * | 2006-02-20 | 2007-08-23 | Mitsubishi Electric Corp. | Semiconductor pressure sensor and die for molding the one |
US20080034877A1 (en) * | 2004-03-12 | 2008-02-14 | Thomas Fessele | Sensor Module |
DE102008005153A1 (en) * | 2008-01-18 | 2009-07-23 | Robert Bosch Gmbh | Pressure measurement module |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3452835B2 (en) | 1999-05-28 | 2003-10-06 | 三菱電機株式会社 | Pressure sensor device |
-
2010
- 2010-02-01 DE DE201010001418 patent/DE102010001418A1/en not_active Withdrawn
-
2011
- 2011-01-31 CN CN2011100366029A patent/CN102192812A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4850227A (en) * | 1987-12-22 | 1989-07-25 | Delco Electronics Corporation | Pressure sensor and method of fabrication thereof |
US5900554A (en) * | 1995-07-28 | 1999-05-04 | Nippendenso Co., Ltd. | Pressure sensor |
US20080034877A1 (en) * | 2004-03-12 | 2008-02-14 | Thomas Fessele | Sensor Module |
US20070193359A1 (en) * | 2006-02-20 | 2007-08-23 | Mitsubishi Electric Corp. | Semiconductor pressure sensor and die for molding the one |
DE102008005153A1 (en) * | 2008-01-18 | 2009-07-23 | Robert Bosch Gmbh | Pressure measurement module |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106030270A (en) * | 2014-02-17 | 2016-10-12 | 罗伯特·博世有限公司 | Connection device for a pressure sensor, pressure sensor, and method for producing a connection device |
CN106030270B (en) * | 2014-02-17 | 2019-02-15 | 罗伯特·博世有限公司 | For the coupling arrangement of pressure sensor, pressure sensor and the method for manufacturing coupling arrangement |
CN107112706A (en) * | 2015-01-08 | 2017-08-29 | 雷蒙德·休伯 | Electric functional part with contact plug and the method for manufacturing electric functional part |
US10700445B2 (en) | 2015-01-08 | 2020-06-30 | Raimund Huber | Electrical functional component having a contact pin and method for producing an electrical functional component |
Also Published As
Publication number | Publication date |
---|---|
DE102010001418A1 (en) | 2011-08-04 |
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Application publication date: 20110921 |