CN102183161A - Vapor chamber - Google Patents

Vapor chamber Download PDF

Info

Publication number
CN102183161A
CN102183161A CN 201110027400 CN201110027400A CN102183161A CN 102183161 A CN102183161 A CN 102183161A CN 201110027400 CN201110027400 CN 201110027400 CN 201110027400 A CN201110027400 A CN 201110027400A CN 102183161 A CN102183161 A CN 102183161A
Authority
CN
China
Prior art keywords
soaking plate
vapor chamber
main body
component structure
closing component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 201110027400
Other languages
Chinese (zh)
Inventor
刘晓东
孟劲功
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
State Energy Research (beijing) Steady-State Heat And Mass Transfer Technology Research Institute Co Ltd
Original Assignee
State Energy Research (beijing) Steady-State Heat And Mass Transfer Technology Research Institute Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by State Energy Research (beijing) Steady-State Heat And Mass Transfer Technology Research Institute Co Ltd filed Critical State Energy Research (beijing) Steady-State Heat And Mass Transfer Technology Research Institute Co Ltd
Priority to CN 201110027400 priority Critical patent/CN102183161A/en
Publication of CN102183161A publication Critical patent/CN102183161A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

The invention discloses a vapor chamber. The vapor chamber comprises a vapor chamber main body and a locking structure, wherein the locking structure is fixedly connected with any position on the outer surface of the vapor chamber main body by a stud welding method; and the stud welding method comprises the following steps of: 1) contacting one end to be fixed of the locking structure and the outer surface of the vapor chamber main body; 2) powering on the locking structure and conducting to the outer surface of the vapor chamber main body until the outer surface of the vapor chamber main body is melted so as to form a melting pool matched with the shape of the contact end of the locking structure; 3) exerting pressure at one end, which is not contacted with the surface of the vapor chamber main body, of the locking structure so that the locking structure is immersed into the melting pool; and 4) stopping powering on, and standing until the melting pool is condensed. The vapor chamber has the advantages of: promoting the heat conducting performance of the vapor chamber effectively, reducing the manufacturing cost of structural pieces on the vapor chamber effectively, enhancing the design and distribution flexibility of the structural pieces on the vapor chamber, enhancing the welding strength of the structural pieces effectively under the condition of guaranteeing the appearance of the vapor chamber, and providing a better and more flexible welding method for designing the structural pieces on the vapor chamber.

Description

A kind of soaking plate
Technical field
The present invention relates to a kind of soaking plate.
Background technology
Develop rapidly along with industries such as IT, communication, LED, solar energy, wherein the heating power of used electronic element is also improving constantly, the miniaturization of electrical equipment simultaneously, the heat flow density of the electrical equipment that makes significantly increases, and the extensive use that utilizes traditional radiating subassembly to be difficult to the hot arraign Ti ﹐ Vapor chamber that well solution is relevant provides more, better thinking for overcoming these problems.
The topmost advantage of soaking plate (Vapor Chamber) is that not only its heat exchange surface and heat flow density are much larger than general heat pipe (Heat Pipe), and because the relative heat pipe of soaking plate (Vapor chamber) has very big evaporation gas flow area, the backflow capillary force can satisfy that condensate liquid reflux to require before put the defeated heat of maximum that ﹐ can effectively improve soaking plate (Vapor chamber), and can satisfy the heat dissipation problem of multiple spot thermal source, big (utilizing latent heat) ﹑ volume in light weight, little (hollow container) ﹑ Jie structure Jian Dan ﹑ can be in characteristics such as agravic runnings after the match because soaking plate (Vapor chamber) has Wen degree Fen cloth Jun Yun ﹑ thermal resistance Xiao ﹑ thermal response Kuai Su ﹑ heat output.So it is widely used in hot biography fields such as IT ﹑ Tong Xun ﹑ Dian ﹑ Dian Li ﹑ Aero-Space.
But in the design and processing and making process of soaking plate (Vapor chamber), keep the design and the layout of the good locking mechanism (screw, double-screw bolt, shell fragment etc.) that contacts to exist following difficult point in order to guarantee soaking plate (Vapor chamber) and heat dissipation element:
In traditional soaking plate (Vapor chamber) locking mechanism design, how to open on soaking plate (Vapor chamber) surface that via hole adds copper sheathing or to be sealed supporting mechanism with via hole, facilitate the use the spring attachment screw carry out sealed, as shown in Figure 1.Fig. 2 is traditional arranging in the last sealed perforate of using soaking plate (Vapor chamber) of server (Server), and Fig. 3 is that the perforate that soaking plate (Vapor chamber) is used on many thermals source is arranged.
As Fig. 2, shown in Figure 3, in order to increase the sealed perforate of mechanism, diverse location and requirement according to CPU or application thermal source increase via hole at diverse location and zone.Because soaking plate (Vapor chamber) application need is steam flow channel fully reasonably, so the hollow of mostly being (or tool portion hollow) structure, its intensity can reduce greatly.As figure two soaking plate (Vapor chamber) when mechanism is sealed, might cause that the CPU zone deforms, have a strong impact on soaking plate (Vapor chamber) and CPU(or thermal source) contact effect, thermal contact resistance is significantly promoted, influence radiating effect, so under the prerequisite that guarantees soaking plate (Vapor chamber) performance, how the position and the locking mode of flexible topology's locking mechanism are extremely important, but conventional welding method can only be made position, the hole layout type as Fig. 2, Fig. 3 pattern.
Soaking plate structure as shown in Figure 3 because the existence of many thermals source or the restriction of design condition, is carried in the mesozone and has been increased a sealed via hole in order to increase sealed effect, has not only dwindled steam void, and steam flow also become not smooth and easy; Simultaneously, at soaking plate (Vapor chamber) opening area, can form heat and pass inactive area, thereby reduce effective usable floor area of soaking plate (Vapor chamber).These all can cause the performance of monoblock soaking plate (Vapor chamber) to descend.
Owing to the sealed needs of mechanism, going up left side, CPU zone in soaking plate (Vapor chamber) has increased a shell fragment in Fig. 4.Method commonly used is to use soldering that shell fragment and soaking plate (Vapor chamber) are welded together, but because soaking plate (Vapor chamber) has extraordinary heat diffusivity, amount of localized heat can be diffused into whole soaking plate (Vapor chamber) very soon, make local welding be difficult to meet the requirements of welding temperature, and too high temperature may cause that soaking plate (Vapor chamber) plays problems such as drum distortion, so local heat mode commonly used is difficult to shell fragment well is welded to above the soaking plate (Vapor chamber).Can not reach the requirement of strength that mechanism uses even weld together.
Another very important problem, owing to go up increase mechanism via hole in soaking plate (Vapor chamber), so in the seal welding process of soaking plate (Vapor chamber), can cause sealing dew point increases, the seal welding yield descends, and causes soaking plate (Vapor chamber) cost of manufacture to increase.
Summary of the invention
Purpose of the present invention is exactly at above-mentioned defective, and a kind of soaking plate is provided, and includes soaking plate main body 1 and closing component structure 2, and described closing component structure 2 is connected with arbitrary fixed-site of soaking plate main body 1 outer surface by welding.
Described welding manner is stud welding.
Described stud welding may further comprise the steps:
1) need a fixing end to contact closing component structure 2 with the outer surface of soaking plate main body 1;
2), form a molten bath that adapts with closing component structure 2 contact jaw shapes with closing component structure 2 energising and conduct to the welding region that soaking plate main body 1 outer surface causes the soaking plate outer surface and melt;
3) do not exert pressure so that closing component structure 2 is immersed in the described molten bath at closing component structure 2 with the end that soaking plate main body 1 surface contacts;
4) stop energising, leave standstill and treat that the molten bath solidifies.
Described closing component structure 2 is one or more in screw, swivel nut and/or the shell fragment.
Described closing component structure 2 is at least one.
Described stud welding step 2) current type in is a direct current, and intensity is 200-500A.
Described energising welding step 3) pressure in is 20-80N.
Beneficial effect of the present invention is: itself has the following advantages stud welding, 1., weld interval short (<1s); 2., cooling velocity is fast; 3., need not boring; 4., structural strength is big; 5., welding precision height; 6., all-position welding; 7., save material.Because the above-mentioned advantage of stud welding is highly suitable for soaking plate (Vapor chamber) surface soldered mechanism securing member.Do not need punching on soaking plate (Vapor chamber) surface, help the design of steam void, reduce the steam flow resistance, reduce heat and pass inactive area, increase effective usable floor area of soaking plate (Vapor chamber), promote the heat transfer property of soaking plate (Vapor chamber), better the probability of leaking is welded in control, reduces cost of manufacture.Because stud welding speed is fast, and can cool off fast, can overcome soaking plate (Vapor chamber) fully because the heat-conducting system height, heat transfer rate is unfavorable for the problem of spot welding or local welding soon, can avoid local heat may cause that soaking plate (Vapor chamber) areal deformation plays the problem of drum or depression simultaneously.Stud welding can make securing member and the fusion under the condition of shelf depreciation of soaking plate (Vapor chamber) surface metal-layer, and in conjunction with forming the very big weld layer of intensity, its welding effect can satisfy the structural strength instructions for use fully.And but the high accuracy of welding and all-position welding can satisfied optional position and the zone that mechanism design requires, and implement the welding of structural member.Shown in Fig. 6,7, structural design and distribution are more flexible, thereby better meet various structural design demands.The used securing member of stud welding can satisfy different structural design demands in a different manner for various mechanism parts such as double-screw bolt, swivel nut, shell fragment, screw, springs, thereby provides more, better mentality of designing for mechanism design.
Description of drawings
Fig. 1 is traditional soaking plate (Vapor chamber) locking mechanism design.
Fig. 2 is traditional arranging in the last sealed perforate of using soaking plate (Vapor chamber) of server (Server).
Fig. 3 is that the perforate that soaking plate (Vapor chamber) is used on many thermals source is arranged.
Fig. 4 has increased a shell fragment for go up left side, CPU zone in soaking plate (Vapor chamber).
Fig. 5 is the manufacturing process flow of soaking plate of the present invention (Vapor chamber).
Fig. 6 is a kind of embodiment of soaking plate of the present invention (Vapor chamber).
Fig. 7 is the another kind of embodiment of soaking plate of the present invention (Vapor chamber).
Wherein, 1 is the soaking plate main body, and 2 is closing component structure.
The specific embodiment
Describe the specific embodiment of the present invention in detail below in conjunction with accompanying drawing.
The present invention has numerous embodiments, just is used for representing implementation process and part final products among the embodiment, does not limit other embodiment of the present invention.
Embodiment 1:
A kind of soaking plate includes soaking plate main body 1 and closing component structure 2, and closing component structure 2 is a swivel nut, and soaking plate main body 1 is circular, and swivel nut is by the center of stud welding in circular soaking plate main body.
Its running is as shown in Figure 5:
1) end that swivel nut need be fixed contacts with the outer surface of circular soaking plate main body;
2), form a molten bath that adapts with swivel nut contact jaw shape with swivel nut energising and conduct to the welding region that circular soaking plate main body outer surface causes the soaking plate outer surface and melt;
3) do not exert pressure so that swivel nut is immersed in the above-mentioned molten bath at swivel nut with the contacted end of circular soaking plate body surfaces;
4) stop energising, leave standstill and treat that the molten bath solidifies.
Embodiment 2:
A kind of soaking plate includes soaking plate main body 1 and closing component structure 2, and closing component structure 2 is a bolt, and soaking plate main body 1 is a rectangle, and four bolts are respectively by the corner location of stud welding in rectangle soaking plate main body.
Its running is as shown in Figure 5:
1) end that bolt need be fixed contacts with the outer surface of rectangle soaking plate main body;
2), form a molten bath that adapts with bolt contact jaw shape with bolt energising and conduct to the welding region that rectangle soaking plate main body outer surface causes the soaking plate outer surface and melt;
3) do not exert pressure so that bolt is immersed in the above-mentioned molten bath at bolt with the contacted end of rectangle soaking plate body surfaces;
4) stop energising, leave standstill and treat that the molten bath solidifies.

Claims (7)

1. a soaking plate includes soaking plate main body (1) and closing component structure (2), it is characterized in that: described closing component structure (2) is connected with arbitrary fixed-site of soaking plate main body (1) outer surface by welding.
2. soaking plate as claimed in claim 1 is characterized in that: described welding manner is stud welding.
3. soaking plate as claimed in claim 2 is characterized in that: described stud welding may further comprise the steps:
1) need a fixing end to contact closing component structure (2) with the outer surface of soaking plate main body (1);
2) closing component structure (2) is switched on and conduct to the welding region that soaking plate main body (1) outer surface causes the soaking plate outer surface and melt, form a molten bath that adapts with closing component structure (2) contact jaw shape;
3) do not exert pressure so that closing component structure (2) is immersed in the described molten bath at closing component structure (2) with the end that soaking plate main body (1) surface contacts;
4) stop energising, leave standstill and treat that the molten bath solidifies.
4. soaking plate as claimed in claim 4 is characterized in that: described closing component structure (2) is one or more in screw, swivel nut and/or the shell fragment.
5. soaking plate as claimed in claim 4 is characterized in that: described closing component structure (2) is at least one.
6. soaking plate as claimed in claim 5 is characterized in that: the current type described stud welding step 2) is a direct current, and intensity is 200-500A.
7. soaking plate as claimed in claim 6 is characterized in that: the pressure described energising welding step 3) is 20-80N.
CN 201110027400 2011-01-25 2011-01-25 Vapor chamber Pending CN102183161A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201110027400 CN102183161A (en) 2011-01-25 2011-01-25 Vapor chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201110027400 CN102183161A (en) 2011-01-25 2011-01-25 Vapor chamber

Publications (1)

Publication Number Publication Date
CN102183161A true CN102183161A (en) 2011-09-14

Family

ID=44569412

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201110027400 Pending CN102183161A (en) 2011-01-25 2011-01-25 Vapor chamber

Country Status (1)

Country Link
CN (1) CN102183161A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112113450A (en) * 2020-09-16 2020-12-22 武汉大学 Oscillation composite capillary core soaking plate structure for aerospace electronic heat dissipation

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10321774A (en) * 1997-05-21 1998-12-04 Showa Alum Corp Manufacture of heat sink
JP2005121345A (en) * 2003-10-20 2005-05-12 Furukawa Electric Co Ltd:The Plate type heat pipe and method for producing it
CN101026944A (en) * 2006-02-22 2007-08-29 富准精密工业(深圳)有限公司 Radiating device
CN101681896A (en) * 2007-05-29 2010-03-24 联合材料公司 Heat spreader for semiconductor device and method for manufacturing the heat spreader
CN202041107U (en) * 2011-01-25 2011-11-16 国研高能(北京)稳态传热传质技术研究院有限公司 Novel uniform heating plate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10321774A (en) * 1997-05-21 1998-12-04 Showa Alum Corp Manufacture of heat sink
JP2005121345A (en) * 2003-10-20 2005-05-12 Furukawa Electric Co Ltd:The Plate type heat pipe and method for producing it
CN101026944A (en) * 2006-02-22 2007-08-29 富准精密工业(深圳)有限公司 Radiating device
CN101681896A (en) * 2007-05-29 2010-03-24 联合材料公司 Heat spreader for semiconductor device and method for manufacturing the heat spreader
CN202041107U (en) * 2011-01-25 2011-11-16 国研高能(北京)稳态传热传质技术研究院有限公司 Novel uniform heating plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112113450A (en) * 2020-09-16 2020-12-22 武汉大学 Oscillation composite capillary core soaking plate structure for aerospace electronic heat dissipation

Similar Documents

Publication Publication Date Title
CN206609325U (en) Planar heat pipe
KR20120005438A (en) Masking jig, substrate heating device, and coating method
JP5321600B2 (en) Semiconductor device manufacturing method and semiconductor device
CN106856180B (en) A method of welding IGBT module
CN101934432B (en) Coaxial composite welding method of laser spot welding and resistance spot welding
CN101676671A (en) Equalizing plate structure
CN202041107U (en) Novel uniform heating plate
CN102183161A (en) Vapor chamber
CN208848885U (en) A kind of New IGBT module copper soleplate structure
CN105472879A (en) Auxiliary welding structure of ALC PCB and preparation technology of auxiliary welding structure
CN105636411A (en) Manufacturing method of metal runners used for liquid cooling and liquid cooling metal runner cold plate
CN109640581A (en) A kind of air cold plate and its processing method of embedded heat pipes
CN204042774U (en) One can solder type LED-baseplate
TW201604674A (en) Etched vapor chamber
CN105764239B (en) A kind of great-power electronic component lines plate of high heat dispersion and preparation method thereof
CN207800592U (en) Power semiconductor modular
CN111076574A (en) Heat transfer assembly, heat exchange assembly, parallel flow heat exchanger and air heater
CN102284761B (en) Electronic component desoldering method and heat conduction module
JP6428087B2 (en) Component mounting apparatus, mounting stage, and component mounting method
CN103900044A (en) Welding type LED substrate and manufacturing technology thereof
CN205069617U (en) Power module and vehicle that has it
CN105244755B (en) Semiconductor laser single tube chip packaging method
TWM451579U (en) Ultra thin isothermal plate
CN109362174A (en) The radiator structure and automobile electric booster steering system of metal-oxide-semiconductor
CN209341205U (en) A kind of LED heat dissipation structure

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20110914