CN102173316B - Film sticking method and equipment - Google Patents
Film sticking method and equipment Download PDFInfo
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- CN102173316B CN102173316B CN 201010604002 CN201010604002A CN102173316B CN 102173316 B CN102173316 B CN 102173316B CN 201010604002 CN201010604002 CN 201010604002 CN 201010604002 A CN201010604002 A CN 201010604002A CN 102173316 B CN102173316 B CN 102173316B
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- glued membrane
- roller
- film
- supporting plate
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Abstract
The invention discloses a film sticking method which is characterized in that an adhesive film roll is driven by an idler wheel for rolling an adhesive film to rotate. By using the film sticking method disclosed by the invention, the adhesive film only needs to overcome the viscous force among the layers of the adhesive film without the need of overcoming the rotating resistance of a roller in the film sticking process, and the viscous force is extremely small, thus compared with the tradition method, through the film sticking method and the film sticking equipment disclosed by the invention, the tensile force to the adhesive film is greatly reduced, the deformation of the adhesive film in the length direction is extremely small, and the tensile force after sticking is also extremely small.
Description
Technical field
The present invention relates to a kind of method for adhering film and film sticking equipment.Relate in particular to a kind of method for adhering film and film sticking equipment in semiconductor production field use.
Background technology
After completing, wafer production needs to carry out packaging and testing.Wafer production is often carried out in different factories from packaging and testing, therefore, need to transport transfer between different places.To the consideration of security wafer, the wafer thickness that wafer factory makes is usually more than 700um, to break in the transfer process that prevents from turning round when mobile.And along with the increase of wafer size, its thickness is increasing gradually.
In the use occasion of wafer, the development trend of chip is more and more thinner.Therefore, before carrying out packaging and testing, need to carry out reduction processing to wafer.Usually with the wafer circuit face, the side of namely completing chip functions is called the front, and one side is the back side in addition.Wafer rear mainly is comprised of silicon materials, plays the supporting wafer effect.The wafer attenuate is exactly that the silicon materials of wafer rear are removed, and at present, the thickness of wafer can drop to more than the 700um when dispatching from the factory below 50um after attenuate.
The method of wafer attenuate be with wafer frontside towards being placed down on wafer bearing device, adopt skive polishing wafer rear, make its attenuation.In order to protect wafer frontside, need to paste one deck glued membrane in wafer frontside before attenuate.The one side that this layer glued membrane contacts with wafer has certain viscosity, paste after and wafer stick together, the glued membrane edge is concordant with crystal round fringes.Use because this layer glued membrane aims at protection wafer attenuate, also can be called the attenuate film.
Along with the reduction of wafer thickness, the rigidity of wafer self reduces thereupon gradually.Be reduced to 200um when following in wafer thickness, the rigidity of wafer self has been not enough to bear the weight of self, if unsettled laying, wafer will occur crooked.The bending of wafer is disadvantageous for subsequent handling.Therefore, especially for thin wafer, the attenuate film that requirement pastes is as far as possible little on the impact that wafer applies, and after this just requires glued membrane to be attached on wafer, the tension force of himself is as far as possible little.If the glued membrane overtension of pad pasting on wafer, it can make wafer crooked, and wafer even may fracture when serious.
Be illustrated in figure 1 as a kind of film sticking apparatus, comprise pedestal 101, pedestal 101 middle parts are provided with the platform dish (not shown) for supporting wafer, and wafer 102 is placed on the platform dish of pedestal 101.Glued membrane 103 is rolled into the hollow cylinder shape, is called for short the glued membrane volume.The glued membrane volume is sleeved on a rotating cylinder 1031.Cylinder 1031 is placed on a side of pedestal 101.At the middle clip 104 that is equipped with of cylinder 1031 and pedestal 101.Clip 104 operation principles are similar to the clip that daily life is used.Roller 105 is installed, but roller 105 moves with clip 104 level of synchronization directions above glued membrane 103.Roller 105 can move along guide rail with clip 104, and the shift motion of horizontal direction makes clip 104 make it cover pedestal 101 by clamping glued membrane 103.
When the beginning pad pasting, clip 104 closures are clamped the edge of glued membrane 103, move along guide rail, and glued membrane 103 pairs are covered on wafer 102, and 105 times general who has surrendered's glued membranes 103 of roller are pressed on wafer 102 and platform dish 1011.Roller 105 moves back and forth before and after guide rail, presses glued membrane 103, and glued membrane 103 is closely sticked on wafer 102, completes pad pasting one time.Clip 104 is opened, and removes the chucking power to glued membrane 103.Clip 104 is retracted into the position before pad pasting shown in Figure 1, and clip 104 closure is again clamped glued membrane 103, prepares pad pasting next time.Cutting 106 is moved along glued membrane 103 Widths, and glued membrane 103 is cut off.One time the pad pasting process is complete.
Based on above analysis as seen, the glued membrane that pastes of actual needs in length with Width as long as identical with diameter wafer.And above film sticking apparatus and method, due to the design feature of clip 104, the length and the width that cover the glued membrane on wafer 102 must be complementary with pedestal, rather than mate with diameter wafer.So just certainly will cause at glued membrane length direction and the Width glued membrane greater than diameter wafer and can't use, can only excise in the subsequent treatment program, wastage is very large, has increased production cost.
Another shortcoming of prior art is, is difficult to overcome the glued membrane under tension effect in the pad pasting process and problem that the distortion that produces brings.Glued membrane was arranged on web-like on a glued membrane spool before being pasted wafer.During pad pasting, glued membrane need to be pulled out from the glued membrane volume.In the process that glued membrane is drawn out, need to make the glued membrane volume rotate and constantly glued membrane to be pulled out to the pulling force of glued membrane.The resistance that this pulling force need to overcome glued membrane viscous force between layers and pull the glued membrane volume to rotate.Therefore the pulling force of glued membrane tended to make glued membrane stretcher strain to occur in the longitudinal direction and produce stress, this stress can make the state before glued membrane recovers not to be stretched.Because glued membrane is flexible material, when being elongated, length direction must also can cause occurring fold on Width simultaneously.
Because glued membrane is elastomeric material, after glued membrane was pasted on wafer and cuts off, the pulling force that glued membrane is subject to disappeared, and the inevitable opposite direction according to distortion before of glued membrane is recovered self original form.Due to this moment glued membrane together with wafer is attached on, and wafer can't radially directly stretch or dwindle, it is crooked that the stress that being stretched of glued membrane produces will cause wafer to occur.
Summary of the invention
The method for adhering film that provides a kind of glued membrane that reduces in the pad pasting process to be stretched distortion is provided in order to overcome deficiency of the prior art.
For realizing above purpose, the present invention is achieved through the following technical solutions:
Method for adhering film is characterized in that, utilizes the roller of roll extrusion glued membrane to drive the rotation of glued membrane volume.
Preferably, utilize rotating roller to be pressed against on glued membrane and move, the glued membrane that roll extrusion covers crystal column surface makes it closely be attached on wafer; Roller is pressed against when moving on glued membrane, is subjected to the frictional force effect and rotates; Roller and glued membrane volume synchronizing moving and continuous contact, roller drives the glued membrane volume and rotates; Glued membrane twists in to rotate and moves above wafer simultaneously, constantly emits glued membrane when the glued membrane volume rotates, and the glued membrane volume is mobile covers on wafer the glued membrane of emitting.
Another object of the present invention is in order to overcome deficiency of the prior art, the film sticking equipment that provides a kind of glued membrane that reduces in the pad pasting process to be stretched distortion.
For realizing above purpose, the present invention is achieved through the following technical solutions:
Film sticking equipment is characterized in that, comprises supporting plate and the first drive unit; Rotating roller is installed on supporting plate and is used for placing the back shaft that glued membrane is rolled up; The first drive unit driving arm plate moves.
Preferably, brake apparatus is installed on supporting plate, brake apparatus is used for stoping roller to rotate.
Preferably, described brake apparatus is cylinder, and cylinder is provided with take-off lever extended or that retract, and roller is positioned on the moving direction of take-off lever; Take-off lever when elongation can with roller contact, stop roller to rotate.
Preferably, also comprise the folder film device, described folder film device is arranged on supporting plate movably, and the folder film device can match with roller and clamp glued membrane.
Preferably, described folder film device is arc, and arc drives mobile by the second drive unit, and roller is positioned on the mobile alignment of arc.
Preferably, described the second drive unit is cylinder, and arc is connected with the take-off lever of cylinder.
Preferably, film-receiving axis is installed also on described supporting plate, described film-receiving axis is connected with roller by the first transmission device, and roller rotates and can drive the film-receiving axis rotation.
Preferably, described supporting plate number is two, be arranged in parallel; Be provided with gathering sill on two supporting plates, back shaft can move along gathering sill.
Preferably, described the first drive unit is motor; Motor is connected with supporting plate by the second transmission device.
Preferably, described the second transmission device is screw mandrel, and supporting plate coordinates with threads of lead screw.
Preferably, also comprise bedplate, motor is installed on the bedplate lower surface, is provided with nut on supporting plate, and nut coordinates with wire rod thread.
Preferably, described bedplate upper surface is provided with guide rail, is provided with slide block on supporting plate and matches with guide rail.
Method for adhering film in the present invention and film sticking apparatus, thereby changed and traditional pulled glued membrane to drive the glued membrane volume by the folder film device to rotate and emit glued membrane and pull glued membrane to cover way on wafer, change glued membrane into and twist in wafer top mobile the time, utilize roller to drive the glued membrane volume and rotate and constantly emit glued membrane.
Emit glued membrane because glued membrane twists in wafer top when mobile, the glued membrane of emitting just in time can cover on wafer, and therefore, glued membrane not under tension stretches.In the pad pasting process, glued membrane need not to overcome the resistance that cylinder rotates, only need to overcome glued membrane viscous force between layers, and viscous force is very little, therefore the inventive method and equipment greatly reduce than traditional method the pulling force of glued membrane, glued membrane distortion in the longitudinal direction is very little, and the tension force after pasting is also very little.
Adopt the method and apparatus in the present invention, glued membrane is very short in the time of air exposure after emitting from the glued membrane volume, has avoided glued membrane to be stained with dust, has improved the pad pasting quality.
The present invention also has following beneficial effect:
1, solved that the folder film device can't be opened directly over pedestal and the problem that causes wasting makes each pad pasting not need film is pulled to over base position, can save glued membrane on length.
The explanation glued membrane is saved situation as an example of wafer attenuate pad pasting example.When pasting the attenuate film, use many size wafers of cover permanent plant can be used for the fixedly wafer pad pasting of different size at present, as the wafer of 8 inches, 6 inches and 4 inches.The mode that the wafer permanent plant adopts 8 inches platform dishes to be set with successively 6 inches platform dishes and 4 inches platform dishes designs, and the platform dish of 8 inches is arranged on the centre of pedestal.Like this, the platform dish of the size of pedestal than 4 inches is large a lot.If the film sticking apparatus described in the use background technology, coordinate many size wafers permanent plant, when being 4 inches wafer pad pastings, the folder film device also needs to clamp just can be opened after glued membrane covers pedestal, and the glued membrane that actual needs uses only needs 4 inches parts of diameter, and glued membrane waste ratio surpasses 100%.Even and 8 inches wafer pad pastings, glued membrane waste ratio also will surpass 20%.Use method and apparatus of the present invention, need not to press from both sides the operation of film device stretching glued membrane, only need when the beginning pad pasting, glued membrane to be located, the glued membrane crimping moves the limit and emits glued membrane, as long as glued membrane width and wafer size adapt, therefore, can save glued membrane.
2, when carrying out the substrate pad pasting, substrate need to be sticked together with framework.Substrate and framework are generally rectangle.When the described device pad pasting of background technology, the glued membrane of use must surpass the scope of framework, and after completing pad pasting, the glued membrane that needs to exceed frame part excises again, has both wasted glued membrane, has increased again operation, and efficient is low.After using the inventive method and device, just be complementary by the glued membrane length selecting the suitable glued membrane of width, can make to paste and width and framework, paste and need not carry out secondary cut to glued membrane after completing.After completing pad pasting, there is no unnecessary glued membrane.Therefore not only can save glued membrane, and save operation, improve pad pasting efficient.
Description of drawings
Fig. 1 is a kind of film sticking apparatus schematic diagram.
Fig. 2 is folder film device structural representation and the use principle analysis chart in Fig. 1.
Fig. 3 is the film sticking equipment structural representation in the present invention.
Fig. 4 is the film sticking equipment structural representation of the present invention from another angle signal.
Fig. 5 is film sticking equipment part-structure schematic diagram of the present invention.
Fig. 6 is that film sticking equipment of the present invention is looked up structural representation.
Fig. 7 is film sticking equipment use principle schematic diagram of the present invention.
Fig. 8 is that film sticking equipment first of the present invention uses view.
Fig. 9 is that film sticking equipment second of the present invention uses view.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in detail:
As Fig. 3, Fig. 4, shown in Figure 5, film sticking equipment comprises bedplate 20.Bedplate 20 upper surfaces are provided with two parallel guide rails (201,202).
Supporting plate 31 is arranged on bedplate 20 abreast with supporting plate 32.Supporting plate 31 bottoms are equipped with two slide blocks 311.Two slide blocks 311 are respectively arranged with the groove (not shown) and match with guide rail 201, can only move along guide rail 201 when making supporting plate 31 move.The mounting means of supporting plate 32 is identical with the mounting means of supporting plate 31.Supporting plate 31 all is connected with cover plate 33 with supporting plate 32 upper ends.Supporting plate 31, supporting plate 32 form a movably gantry with cover plate 33.
Be provided with gathering sill 312 on supporting plate 31; Be provided with gathering sill 322 on supporting plate 32.Gathering sill 312 be arranged in parallel with gathering sill 322.
Be provided with platform dish 401 on platform dish seat 40.When supporting plate 31 moves with supporting plate 32, respectively in 40 liang of side shiftings of platform dish seat; Cover plate 33 moves along the direction parallel with platform dish seat 40 above platform dish seat 40.
The first cylinder 72, the first cylinders 72 are installed on supporting plate 32 are provided with the first take-off lever 721 extending or that shorten.During the first take-off lever 721 elongation, can hold out against roller 70, roller 70 can't be rotated.When the first take-off lever 721 shortens, can remove the braking of pair roller 70, this moment, roller 70 was rotatable.
The second cylinder 61 is installed on supporting plate 32, second a cylinder (not shown) also is installed on supporting plate 31.The take-off lever of two the second cylinders 61 is respectively at arc 60 both ends connections.When the elongation of the take-off lever of two the second cylinders 61, can promote arc 60 towards roller 70 move until with roller 70 close contacts.The arc of arc 60 matches with the periphery of roller 70, when arc 60 and roller 70 close contact, glued membrane closely can be clamped.Be after a wafer has pasted film, cutting off glued membrane, gantry returns back to original position.Return back in the original position process at gantry, if do not have clamping device to clamp the glued membrane edge, be difficult to make the glued membrane edge to be positioned to begin the original position that attaches for next wafer, cause to complete pad pasting next time.In the present invention, after cutting off glued membrane, arc 60 moves towards roller 70, until both clamp the glued membrane edge, then gantry returns back to original position again.After arriving original position, arc 60 can carry out pad pasting work next time away from roller 70.Also can make arc 60 and roller 70 clamp glued membrane and cut off again glued membrane.
As shown in Figure 6, bedplate 20 lower surfaces are equipped with motor 90.Motor 90 output shafts are connected with screw mandrel 91.Motor 90 can drive screw mandrel 91 and rotate.Supporting plate 32 lower ends are equipped with nut 321.Be provided with groove 21 on bedplate 20.Nut 321 passes groove 21 and can be in the interior movement of groove 21.Nut 321 is sleeved on screw mandrel 91, and with screw mandrel 91 threaded engagement.When motor 90 drove screw mandrel 91 rotation, nut 921 drove supporting plates 32 and moves.The type of drive of supporting plate 31 is identical with the type of drive of supporting plate 32.
Rotating film-receiving axis 80 also is installed on supporting plate 32.Film-receiving axis 80 ends are equipped with belt pulley 81.Driving belt 73 is in transmission connection belt pulley 71 and belt pulley 81.When roller 70 rotates 71 rotation of drive belt pulley, can drive belt pulley 81 and rotate, and then drive film-receiving axis 80 rotates.Realized the synchronize rotation of roller 60 with film-receiving axis 80.Some glued membranes surface is provided with the strippable diaphragm of one deck.When pad pasting, diaphragm need not to be attached on wafer, therefore, diaphragm need to be collected when emitting glued membrane along with glued membrane volume 52.Roller 70 drives glued membrane volume 52 and rotates when emitting glued membrane, drives film-receiving axis 80 and rotates and diaphragm can be wrapped on film-receiving axis 80.
Glued membrane volume 52, roller 70 and film-receiving axis 80 drive mobile by gantry.
Fig. 7 is use principle figure of the present invention.As shown in Figure 7, first cover on wafer 63 from glued membrane volume 52 glued membrane of emitting 62 parts.Roller 70 is pressed against on glued membrane 62.When roller 70 moved right with glued membrane volume 52, roller 70 was subjected to the frictional force effect of glued membrane 62 and clockwise rotates.Roller 70 contacts with glued membrane volume 52, can utilize frictional force drives glued membrane volume 52 to rotate counterclockwise.The glued membrane volume 52 that rotates counterclockwise is constantly emitted glued membrane.Like this, glued membrane volume 52 is when glued membrane is emitted in rotation, and the glued membrane of will emit that moves right covers on wafer 63.Roller 70 is when moving right, together with roll extrusion glued membrane 62 makes it and wafer 63 closely is attached to.Roller 70 can drive glued membrane volume 52 and rotate when rotating.Therefore, the film sticking equipment in the present invention, when constantly emitting glued membrane, the resistance that need to overcome is little, and is also just little to the pulling force of glued membrane 62, can effectively avoid the glued membrane distortion that is stretched, and the pad pasting quality is high.
Fig. 8 is that the film sticking equipment first in the present invention uses state diagram, and before not beginning pad pasting, gantry is positioned at the original position in platform dish 401 left sides, on wafer (not shown) mounting table dish 401.During pad pasting, gantry moves right, until move to state as shown in Figure 9.Glued membrane closely is attached on wafer.Then utilize cutting equipment to cut off glued membrane.
Embodiment in the present invention only is used for that the present invention will be described, does not consist of the restriction to the claim scope, and other substituting of being equal in fact that those skilled in that art can expect are all in protection range of the present invention.
Claims (11)
1. method for adhering film, is characterized in that, utilizes the roller of roll extrusion glued membrane to drive the rotation of glued membrane volume; Utilize rotating roller to be pressed against on glued membrane and move, the glued membrane that roll extrusion covers crystal column surface makes it closely be attached on wafer; Roller is pressed against when moving on glued membrane, is subjected to the frictional force effect and rotates; Roller and glued membrane volume synchronizing moving and continuous contact, roller drives the glued membrane volume and rotates; Glued membrane twists in to rotate and moves above wafer simultaneously, constantly emits glued membrane when the glued membrane volume rotates, and the glued membrane volume is mobile covers on wafer the glued membrane of emitting.
2. film sticking equipment, is characterized in that, comprises supporting plate and the first drive unit; Be equipped with rotatable on supporting plate and can drive glued membrane and roll up the roller that rotates and the back shaft that is used for placing the glued membrane volume; The first drive unit driving arm plate moves; Also comprise the folder film device, described folder film device is arranged on supporting plate movably, and the folder film device can match with roller and clamp glued membrane; Described folder film device is arc, and arc drives mobile by the second drive unit, and roller is positioned on the mobile alignment of arc.
3. film sticking equipment according to claim 2, is characterized in that, brake apparatus is installed on supporting plate, and brake apparatus is used for stoping roller to rotate.
4. film sticking equipment according to claim 3, is characterized in that, described brake apparatus is cylinder, and cylinder is provided with take-off lever extended or that retract, and roller is positioned on the moving direction of take-off lever; Take-off lever when elongation can with roller contact, stop roller to rotate.
5. film sticking equipment according to claim 2, is characterized in that, described the second drive unit is cylinder, and arc is connected with the take-off lever of cylinder.
6. film sticking equipment according to claim 2, is characterized in that, film-receiving axis also is installed on described supporting plate, and described film-receiving axis is connected with roller by the first transmission device, and roller rotates and can drive the film-receiving axis rotation.
7. film sticking equipment according to claim 2, is characterized in that, described supporting plate number is two, be arranged in parallel; Be provided with gathering sill on two supporting plates, back shaft can move along gathering sill.
8. film sticking equipment according to claim 2, is characterized in that, described the first drive unit is motor; Motor is connected with supporting plate by the second transmission device.
9. film sticking equipment according to claim 8, is characterized in that, described the second transmission device is screw mandrel, and supporting plate coordinates with wire rod thread.
10. film sticking equipment according to claim 9, is characterized in that, comprises that also bedplate, motor are installed on the bedplate lower surface, is provided with nut on supporting plate, and nut coordinates with wire rod thread.
11. film sticking equipment according to claim 10 is characterized in that, described bedplate upper surface is provided with guide rail, is provided with slide block on supporting plate and matches with guide rail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010604002 CN102173316B (en) | 2010-12-21 | 2010-12-21 | Film sticking method and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010604002 CN102173316B (en) | 2010-12-21 | 2010-12-21 | Film sticking method and equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102173316A CN102173316A (en) | 2011-09-07 |
| CN102173316B true CN102173316B (en) | 2013-06-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010604002 Expired - Fee Related CN102173316B (en) | 2010-12-21 | 2010-12-21 | Film sticking method and equipment |
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| CN (1) | CN102173316B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104340407B (en) * | 2013-08-06 | 2016-08-10 | 富鼎电子科技(嘉善)有限公司 | Automatic coating equipment |
| CN104150011A (en) * | 2014-08-25 | 2014-11-19 | 昆山迈致治具科技有限公司 | Automatic sticking film machine |
| CN106813591A (en) * | 2016-12-30 | 2017-06-09 | 华进半导体封装先导技术研发中心有限公司 | For the sample preparation methods of buckling deformation test |
| CN106698037A (en) * | 2017-02-28 | 2017-05-24 | 江苏冠达通电子科技有限公司 | Automatic film winding structure |
| CN108527833B (en) * | 2018-04-28 | 2024-03-15 | 奥克斯空调股份有限公司 | Film laminating mechanism and film laminating machine |
| CN110265349B (en) * | 2019-06-20 | 2021-11-19 | 深圳市华腾半导体设备有限公司 | Film laminating machine for laminating semiconductor substrate |
| CN110723348B (en) * | 2019-11-03 | 2021-03-30 | 邵倩倩 | Two-sided pad pasting device |
| CN110723347B (en) * | 2019-11-03 | 2021-10-29 | 邵勇奋 | Single-side film pasting device |
| CN113140491B (en) * | 2021-05-26 | 2022-07-12 | 吉林华微电子股份有限公司 | Film sticking machine and semiconductor device production system |
| CN115339093A (en) * | 2022-06-30 | 2022-11-15 | 河南通用智能装备有限公司 | Full-automatic wafer laminating machine |
| CN115285420A (en) * | 2022-08-30 | 2022-11-04 | 华天科技（西安）有限公司 | Automatic film sticking machine |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1208946A (en) * | 1997-05-30 | 1999-02-24 | 琳得科株式会社 | Method and apparatus for applying protecting film to semiconductor wafer |
| CN101870371A (en) * | 2009-04-22 | 2010-10-27 | 昆达电脑科技(昆山)有限公司 | Jig for pasting protective film of electronic product |
| CN101891025A (en) * | 2009-05-21 | 2010-11-24 | 昆达电脑科技(昆山)有限公司 | Protective film packaging device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4641984B2 (en) * | 2006-07-31 | 2011-03-02 | 日東電工株式会社 | Adhesive tape affixing method to semiconductor wafer and protective tape peeling method from semiconductor wafer |
| JP2009088357A (en) * | 2007-10-01 | 2009-04-23 | Toyota Motor Corp | Removing device and removing method for protective tape |
-
2010
- 2010-12-21 CN CN 201010604002 patent/CN102173316B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1208946A (en) * | 1997-05-30 | 1999-02-24 | 琳得科株式会社 | Method and apparatus for applying protecting film to semiconductor wafer |
| CN101870371A (en) * | 2009-04-22 | 2010-10-27 | 昆达电脑科技(昆山)有限公司 | Jig for pasting protective film of electronic product |
| CN101891025A (en) * | 2009-05-21 | 2010-11-24 | 昆达电脑科技(昆山)有限公司 | Protective film packaging device |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2009-88357A 2009.04.23 |
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| CN102173316A (en) | 2011-09-07 |
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