CN102164006A - Dual-channel compact small from-factor pluggable circuit - Google Patents

Dual-channel compact small from-factor pluggable circuit Download PDF

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CN102164006A
CN102164006A CN2011100619249A CN201110061924A CN102164006A CN 102164006 A CN102164006 A CN 102164006A CN 2011100619249 A CN2011100619249 A CN 2011100619249A CN 201110061924 A CN201110061924 A CN 201110061924A CN 102164006 A CN102164006 A CN 102164006A
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signal
optical
transceiver
chip
transceiver chip
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CN102164006B (en
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陈钢
赵家闯
宛明
周美娜
赵迎春
曹阳
陈慧
黄晓雷
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Eoptolink Technology Inc
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Eoptolink Technology Inc
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Abstract

The invention discloses a dual-channel compact small from-factor pluggable circuit, which relates to an optical communication technology, in particular to an optical module circuit realizing photoelectric signal conversion in optical communication. The designing key points of the circuit are that: the circuit comprises an interface circuit, a microcontroller, a first bi-directional optical sub-assembly, a second bi-directional optical sub-assembly, a first integrated transceiver chip, a second integrated transceiver chip and a power starting circuit, wherein the first bi-directional optical sub-assembly and the first integrated transceiver chip form a first optical channel; the second bi-directional optical sub-assembly and the second integrated transceiver chip form a second optical channel; the electric signal output ends of the bi-directional optical sub-assemblies of each optical channel are connected with the electric signal receiving ends of the integrated transceiver chips of the same optical channel; and the interface circuit is used for realizing the communication of the microcontroller, signal interfaces of the two integrated transceiver chips and the power starting circuit with an upper computer. The dual-channel compact small from-factor pluggable circuit has the advantages of low cost, simple circuit structure and small size.

Description

A kind of binary channels compact pluggable optical module circuit
Technical field
The present invention relates to optical communication technique, relate in particular to a kind of compact pluggable light transceiving module circuit structure.
Background technology
The abbreviation definition:
BOSA:(Bi-directional Optical Sub-Assembly) optical transceiver module interface module;
CSFP:(Compact Small From-Factor Pluggable) compact pluggable optical module;
SFP:(Small From-Factor Pluggable) SFP optical module;
MSA:(Multi-Source Agreement) multi-source agreement;
PLC:(Planar optical waveguide) planar optical waveguide;
PCB:(Printed Circuit Board) printed circuit board;
TO38/TO56/TO46: the packing forms of the different mechanical dimensions of optical device chip, more expensive being of little use of the less price of TO38 size wherein, TO56 and TO46 are mechanical dimension's structure commonly used;
DDM:(Digital Diagnostic Monitor) digital diagnostic monitoring.
Along with the development of optical fiber communication, optical transmission system is had higher requirement to optical module.Optical module develops to low cost, small size, big capacity direction gradually.In order to reach big capacity and undersized requirement, CSFP MSA(Multi Source Agreement) League of Nations has proposed to adopt traditional SFP industrial standard overall dimensions single channel SFP MSA mechanical structure domestic demand to realize the requirement of the CSFP optical module of binary channels transfer of data, thereby and then makes original SFP panel space obtain double utilization to have improved port utilization ratio.
To in single pass SFP module, place twin-channel CSFP, size, the integrated level of twin-channel CSFP are had higher requirement.For the selection of binary channels CSFP optical device, employing scheme in the industry is the BOSA of TO38 for adopting PLC technology or adopting small size encapsulation BOSA as adopting the encapsulation specification.
But it is high that currently used PLC technology light transmitting-receiving subassembly exists encapsulation technology to require, shortcomings such as the higher and design flexibility difference of cost, simultaneously, this light transmitting-receiving subassembly production and sell overseas enterprise's monopolization is all arranged.In addition, adopt PLC technology, laser and light signal receiving terminal chip all need be installed on the fixed position of fiber waveguide, need newly research and develop overall optical transceiver module interface module if need to change the chip model, can not satisfy the customization requirement.
Characteristics such as though the free space coupling light transceiver module interface module size of TO38 encapsulation is less, and TO38 size optical chip generally can not use in the SFP of routine optical module, and this has also caused its price higher, and encapsulation technology is immature.Simultaneously, utilize the BOSA structure of this TO38 size encapsulation also to be offbeat form, further increased the cost of optical module.
Drive and the optical signal amplifying broad aspect at optical device, the traditional method of optical module manufacturer is the twin-core sheet scheme that adopts Laser Drive unit and amplitude limit amplifying unit to separate in the industry.But because the restriction of mechanical dimension aspect, twin-channel CSFP has higher requirement to selected chip size and function, and twin-core sheet scheme can not satisfy CSFP design needs.For the digital diagnostic monitoring module, adopt microcontroller that all analog quantitys that need monitor are carried out analog-to-digital conversion in the industry usually, and the result is carried out the computing conversion and outputs to host computer.The analog-to-digital conversion of this method need increase a large amount of external component and increase the difficulty of algorithm, and then increases the cost of optical module.
Summary of the invention
The objective of the invention is to provide a kind of and satisfy binary channels CSFP consensus standard, low cost, integrated level height at deficiency of the prior art, circuit structure is simple, volume is little, have great receiving terminal power monitoring dynamic range, highly sensitive binary channels compact SFP optical module (being designated hereinafter simply as optical module) circuit.
The technical solution used in the present invention is such: a kind of binary channels compact pluggable optical module circuit, comprise interface circuit, microcontroller, the first optical transceiver module assembly and the second optical transceiver module assembly, it is characterized in that, also comprise the first transceiver chip and the second transceiver chip, power initiation circuit; Described power initiation circuit is used for to microcontroller and two groups of transceiver chip power supplies; The electrical signal of the first optical transceiver module assembly is connected with the signal of telecommunication receiving terminal of the first transceiver chip, and the Laser Drive signal output part of the first transceiver chip is connected with the Laser Drive signal receiving end of the first optical transceiver module assembly; The electrical signal of the second optical transceiver module assembly is connected with the signal of telecommunication receiving terminal of the second transceiver chip, and the Laser Drive signal output part of the second transceiver chip is connected with the Laser Drive signal receiving end of the second optical transceiver module assembly; Described microcontroller has signal line to be connected with the first transceiver chip with the second transceiver chip respectively; Described interface circuit is used to realize these three circuit modules of signaling interface of microcontroller, two groups of transceiver chips and communicating by letter of host computer.
Preferably, described power initiation circuit is the power supply soft-start circuit; Host computer provides the input power supply by interface circuit to the power supply soft-start circuit.
Preferably, the described first or second optical transceiver module assembly also comprises received signal intensity indication output end, laser Output optical power pilot signal output;
The described first or second transceiver chip internal comprises: chip configuration and signal gathering unit, amplitude limit amplifying unit and Laser Drive unit, transmitting terminal Signal Fail index signal output; First or the second transceiver chip is also lost index signal by interface circuit to host computer output receiving end signal;
Microcontroller has signal to be connected with the chip configuration and the collecting unit of two groups of transceiver chips;
In every group of transceiver chip, chip configuration and collecting unit also have signal to be connected with amplitude limit amplifying unit, Laser Drive unit respectively;
The chip configuration of the described first transceiver chip and signal gathering unit receive the indication of received signal intensity and laser Output optical power pilot signal of first optical transceiver module assembly output, the amplitude limit amplifying unit signal input part of the first transceiver chip is connected with the electrical signal of the first optical transceiver module assembly, and the amplitude limit amplifying unit electrical signal of the first transceiver chip is connected with host computer by interface circuit; The Laser Drive cell signal output of the first transceiver chip is connected with the Laser Drive signal receiving end of the first optical transceiver module assembly, and the Laser Drive unit electric signal input end of the first transceiver chip is connected with host computer by interface circuit;
The chip configuration of the described second transceiver chip and signal gathering unit receive the indication of received signal intensity and laser Output optical power pilot signal of second optical transceiver module assembly output; The amplitude limit amplifying unit signal input part of the second transceiver chip is connected with the electrical signal of the second optical transceiver module assembly, and the amplitude limit amplifying unit electrical signal of the second transceiver chip is connected with host computer by interface circuit; The Laser Drive cell signal output of the second transceiver chip is connected with the Laser Drive signal receiving end of the second optical transceiver module assembly, and the Laser Drive unit electric signal input end of the second transceiver chip is connected with host computer by interface circuit.
Preferably, also comprise module inefficacy decision unit; Described module inefficacy decision unit is used to receive the transmitting terminal Signal Fail index signal of the first transceiver chip and the output of the second transceiver chip, and described module inefficacy decision unit is output as the result that transmitting terminal Signal Fail index signal that the first transceiver chip and the second transceiver chip export is made exclusive disjunction; And the output signal of module inefficacy decision unit transfers to host computer by interface circuit.
Preferably, also comprise first filter and second filter;
Described first and second optical transceiver module component internal comprises laser diode, optical detection diode and trans-impedance amplifier; Wherein, the laser diode signal of telecommunication that is used for sending from the transceiver integrated chip transforms into light signal and output; The optical detection diode is used for the light signal of input is converted into faint current signal; Trans-impedance amplifier is used for the current signal of optical detection diode output is converted into voltage signal, and with this voltage signal output;
Be connected to first filter between the input of the limiting amplifier in the output of the trans-impedance amplifier of the described first optical transceiver module assembly and the first transceiver chip;
Be connected to second filter between the input of the limiting amplifier in the output of the trans-impedance amplifier of the described second optical transceiver module assembly and the second transceiver chip.
Preferably, also comprise first filter and second filter;
First filter inserts in the signal path between the first optical transceiver module assembly and the first transceiver chip, is used for the noise of the filtering first optical transceiver module assembly to the signal of telecommunication of first transceiver chip output;
Second filter inserts in the signal path between the second optical transceiver module assembly and the second transceiver chip, is used for the noise of the filtering second optical transceiver module assembly to the signal of telecommunication of second transceiver chip output.
Preferably, described first or second filter is a Bessel filter.
Preferably, also comprise temperature collecting cell, described temperature collecting cell is used for temperature signal is converted to the signal of telecommunication, and this signal of telecommunication is transferred to microcontroller.
Preferably, described microcontroller, interface circuit, two groups of transceiver chips, temperature collection circuit, low pass filter and module inefficacy decision units are arranged on the pcb board.
Preferably, described two groups of optical transceiver module assemblies communicate by the impedance matching transmission line that is provided with on the soft board and transceiver chip and the filter on the pcb board.
In sum, owing to adopted technique scheme, the invention has the beneficial effects as follows:
Transceiver chip internal integrated limiting amplifier unit and Laser Drive unit that the present invention adopts have the advantage that circuit structure is simple, integrated level is high;
The intensity of input optical power when the design adopts microcontroller configuration transceiver chip to lose so that receiving end signal to be set, and then convenient production and debugging.
The present invention disturbs by increasing Bezier low pass filter filters out signal bandwidth high-frequency noise in addition in the signal path between each group optical transceiver module assembly and transceiver chip, optical module sensitivity is improved 1~3dB, improved the jamproof performance of optical receiver.
The transceiver chip that the present invention adopts adopts trans-impedance amplifier that the current signal of the received signal intensity indication of optical transceiver module interface module output is converted into voltage signal, and this voltage analog signal is transformed into digital signal and deposit the collection of chip internal register with the receiving end luminous power that achieves a butt joint in by the analog to digital conversion circuit of transceiver built-in chip type.Adopt similar mode, the transceiver chip utilizes the chip internal integrated analog digit converter that laser bias current, laser Output optical power and chip voltage are gathered, and deposits transformation result in chip internal corresponding register.Micro controller unit by and the transceiver chip between the I2C bus read the transformation result of chip internal storage.Simultaneously, microcontroller will obtain that transformation result is simply changed and the register of the correspondence position that stores into according to CSFP MSA.The I2C bus access microcontroller of host computer by the 20PIN electrical interface is to obtain the numerical diagnostic result of CSFP optical module.
Micro controller unit is realized A0H, B0H, A2H, the B2H register mappings of CSFP MSA definition among the present invention by software.For the design of digital diagnostic monitoring (DDM), existing universal method is directly by the collection of microcontroller and the information such as transmitting optical power, received optical power, module temperature, module voltage and bias current of D/A conversion unit acquisition optical module.This method for designing can meet the demands substantially for single pass SFP, but for twin-channel CSFP, the collection and the translation burden of universal method microcontroller will double if adopt in the industry, and microcontroller performance and program complexity are had higher requirement.Among the present invention, other all collection of simulant signal is gathered by the transceiver chip except that temperature information, and then has reduced the programming complexity greatly, has reduced peripheral components.
Compare with traditional optical module, all indexs that need debug of CSFP among the present invention (comprising that power index, extinction ratio index, dropout amplitude are provided with etc.) all can be provided with by computer automation software and be convenient to mass automatic production, and then the cost that has further reduced module has improved the reliability of module.
Description of drawings
The present invention will illustrate by example and with reference to the mode of accompanying drawing, wherein:
Fig. 1 is a schematic block circuit diagram of the present invention.
Fig. 2 is light channel structure and a signal transmission schematic diagram among the present invention.
Fig. 3 is the front of 20PIN electrical interface circuit board of the present invention.
Fig. 4 is the reverse side of 20PIN electrical interface circuit board of the present invention.
Embodiment
Disclosed all features in this specification, or the step in disclosed all methods or the process except mutually exclusive feature and/or step, all can make up by any way.
Disclosed arbitrary feature in this specification (comprising any accessory claim, summary and accompanying drawing) is unless special narration all can be replaced by other equivalences or the alternative features with similar purpose.That is, unless special narration, each feature is an example in a series of equivalences or the similar characteristics.
As Fig. 1, binary channels compact optical module of the present invention comprises that interface circuit, power initiation circuit, microcontroller, two groups of transceiver chips, two-way general light transceiver module assembly, module inefficacy decision unit, temperature collecting cells of satisfying CSFP MSA definition form.
Described power initiation circuit is to cooperate the power supply soft-start circuit of forming by electric capacity, gate circuit, and the power supply of going into to hold of power supply soft-start circuit is provided by host computer, and its power supply output is connected with two groups of transceiver chips and microcontroller chip respectively.Behind the optical module connecting system, the slow start unit of this power supply postpones follow-up transceiver chip and microcontroller chip to power on and exerts an influence at the power supply of powered on moment capacitive load to host computer to reduce.
The optical transceiver module assembly adopts the BOSA of traditional TO56/TO46 encapsulation.Its inside comprises laser diode, optical detection diode and trans-impedance amplifier.Wherein, laser diode will transform into light signal and output to external fiber from the signal of telecommunication that the transceiver integrated chip sends; The optical detection diode will be converted into faint current signal from the light signal of optical fiber input, by thereafter trans-impedance amplifier current signal will be converted into voltage signal then, and with this voltage signal output.
Temperature collecting cell is transferred to microcontroller after the temperature signal of gathering is converted to the signal of telecommunication; The major function of microcontroller is by the I2C bus and host computer communicates and by the configuration information of I2C bus according to host computer two groups of integrated chips, temperature collection circuits are configured, and state information and the temperature information with this three part is transferred to host computer simultaneously.
As Fig. 2, be the composition of one of them passage of binary channels CSFP.The transceiver chip comprises chip configuration and signal gathering unit, amplitude limit amplifying unit and Laser Drive unit, transmitting terminal Signal Fail index signal output; Described chip configuration and collecting unit have signal to be connected with amplitude limit amplifying unit, Laser Drive unit respectively; Chip configuration and collecting unit are used for configuration information according to controller to the amplitude limit amplifying unit of chip internal, the configuration effort that its operate as normal necessity is kept in the Laser Drive unit; Chip configuration and collecting unit also receive the indication of received signal intensity and laser Output optical power pilot signal from the output of optical transceiver module assembly.
The signal that limiting amplifier unit in the transceiver chip will receive after the signal of telecommunication further amplifies and will amplify is transferred to host computer.The laser driver unit then is that the voltage signal that will transmit from host computer is converted into the modulated current signal of drive laser and modulated current signal is transferred to laser diode the optical transceiver module assembly, produces light signal output.
The transceiver chip is also lost index signal to host computer output receiving end signal; The transceiver chip has transmitting terminal Signal Fail index signal output, is used to export transmitting terminal Signal Fail index signal.
The transceiver chip adopts trans-impedance amplifier that the current signal of the received signal intensity indication of optical transceiver module interface module output is converted into voltage signal, and this voltage analog signal is transformed into digital signal and deposit the collection of chip internal register with the receiving end luminous power that achieves a butt joint in by the analog to digital conversion circuit of transceiver built-in chip type.Adopt similar mode, the transceiver chip utilizes the chip internal integrated analog digit converter that laser bias current, laser Output optical power and chip voltage are gathered, and deposits transformation result in chip internal corresponding register.Micro controller unit by and the transceiver chip between the I2C bus read the transformation result of chip internal storage.Simultaneously, microcontroller will obtain that transformation result is simply changed and the register of the correspondence position that stores into according to CSFP MSA, and promptly microcontroller is realized A0H, B0H, A2H, the B2H register mappings of CSFP MSA definition by software.The I2C bus access microcontroller of host computer by the 20PIN electrical interface is to obtain the numerical diagnostic result of CSFP optical module.
Binary channels compact pluggable optical module circuit disclosed by the invention is provided with the first transceiver chip, the second transceiver chip, the first optical transceiver module assembly, the second optical transceiver module assembly.First optical channel is made up of the first transceiver chip and the first optical transceiver module assembly; Second optical channel is made up of the second transceiver chip and the second optical transceiver module assembly.
The chip configuration of the described first transceiver chip and signal gathering unit receive the indication of received signal intensity and laser Output optical power pilot signal of first optical transceiver module assembly output, the amplitude limit amplifying unit signal input part of the first transceiver chip is connected with the electrical signal of the first optical transceiver module assembly, and the amplitude limit amplifying unit of the first transceiver chip is by the signal of telecommunication of interface circuit after host computer output is amplified; The Laser Drive cell signal output of the first transceiver chip is connected with the Laser Drive signal receiving end of the first optical transceiver module assembly; The Laser Drive cell signal of the first transceiver chip receives the signal of telecommunication to be sent of host computer output by interface circuit.
The connected mode of the annexation of the second transceiver chip and the second optical transceiver module assembly and first passage is identical in second optical channel, no longer is repeated in this description at this.
Module inefficacy decision unit is used to receive the transmitting terminal Signal Fail index signal of the first transceiver chip and the output of the second transceiver chip, and described module inefficacy decision unit is output as the result that transmitting terminal Signal Fail index signal that the first transceiver chip and the second transceiver chip export is made exclusive disjunction; And the output signal of module inefficacy decision unit transfers to host computer.
All need set up communication with host computer or interfaces of being electrically connected all be connected with host computer by interface circuit in described microcontroller, two groups of transceiver chips, the slow start unit of power supplys and module inefficacy decision unit four parts.As Fig. 4, described interface circuit is the 20PIN electric interface unit of CSFP MSA definition.The 20PIN electric interface unit that the present invention adopts and traditional SFP pin compatibility can be used binary channels CSFP optical module of the present invention and conventional single channel SFP module instead and not produce any problem.
In the optical module design, one of principal element that influences optical module sensitivity is cross-interference issue.The present invention can increase low pass filter between the signal of telecommunication receiving terminal of the electrical signal of the optical transceiver module assembly of every group of optical channel and transceiver chip, particularly, be that the high-frequency noise that increases between the input stage of the output of the trans-impedance amplifier of optical transceiver module assembly and the limiting amplifier in the transceiver chip beyond the Bezier low pass filter filters out signal bandwidth disturbs.
As the execution mode of optical module circuit of the present invention, interface circuit, microprocessor, two groups of transceiver chips, temperature collection circuit, low pass filter and module inefficacy decision units can be arranged on the pcb board.The reception of optical transceiver module assembly communicates by the impedance matching transmission line that is provided with on the soft board and transceiver chip and the filter on the pcb board in every group of optical channel.With respect to prior art, the present invention has only kept necessary welding pin in the soft board design process, has further reduced the shared space of soft board welding.
The present invention is not limited to aforesaid embodiment.The present invention expands to any new feature or any new combination that discloses in this manual, and the arbitrary new method that discloses or step or any new combination of process.

Claims (10)

1. binary channels compact pluggable optical module circuit, comprise interface circuit, microcontroller, the first optical transceiver module assembly and the second optical transceiver module assembly, it is characterized in that, also comprise the first transceiver chip and the second transceiver chip, power initiation circuit; Described power initiation circuit is used for to microcontroller and two groups of transceiver chip power supplies; The electrical signal of the first optical transceiver module assembly is connected with the signal of telecommunication receiving terminal of the first transceiver chip, and the Laser Drive signal output part of the first transceiver chip is connected with the Laser Drive signal receiving end of the first optical transceiver module assembly; The electrical signal of the second optical transceiver module assembly is connected with the signal of telecommunication receiving terminal of the second transceiver chip, and the Laser Drive signal output part of the second transceiver chip is connected with the Laser Drive signal receiving end of the second optical transceiver module assembly; Described microcontroller has signal line to be connected with the first transceiver chip with the second transceiver chip respectively; Described interface circuit is used to realize these three circuit modules of signaling interface of microcontroller, two groups of transceiver chips and communicating by letter of host computer.
2. a kind of binary channels compact pluggable optical module circuit according to claim 1 is characterized in that described power initiation circuit is the power supply soft-start circuit; Host computer provides the input power supply by interface circuit to the power supply soft-start circuit.
3. a kind of binary channels compact pluggable optical module circuit according to claim 1 is characterized in that the described first or second optical transceiver module assembly also comprises received signal intensity indication output end, laser Output optical power pilot signal output;
The described first or second transceiver chip internal comprises: chip configuration and signal gathering unit, amplitude limit amplifying unit and Laser Drive unit, transmitting terminal Signal Fail index signal output; First or the second transceiver chip is also lost index signal by interface circuit to host computer output receiving end signal;
Microcontroller has signal to be connected with the chip configuration and the collecting unit of two groups of transceiver chips;
In every group of transceiver chip, chip configuration and collecting unit also have signal to be connected with amplitude limit amplifying unit, Laser Drive unit respectively;
The chip configuration of the described first transceiver chip and signal gathering unit receive the indication of received signal intensity and laser Output optical power pilot signal of first optical transceiver module assembly output, the amplitude limit amplifying unit signal input part of the first transceiver chip is connected with the electrical signal of the first optical transceiver module assembly, and the amplitude limit amplifying unit electrical signal of the first transceiver chip is connected with host computer by interface circuit; The Laser Drive cell signal output of the first transceiver chip is connected with the Laser Drive signal receiving end of the first optical transceiver module assembly, and the Laser Drive unit electric signal input end of the first transceiver chip is connected with host computer by interface circuit;
The chip configuration of the described second transceiver chip and signal gathering unit receive the indication of received signal intensity and laser Output optical power pilot signal of second optical transceiver module assembly output; The amplitude limit amplifying unit signal input part of the second transceiver chip is connected with the electrical signal of the second optical transceiver module assembly, and the amplitude limit amplifying unit electrical signal of the second transceiver chip is connected with host computer by interface circuit; The Laser Drive cell signal output of the second transceiver chip is connected with the Laser Drive signal receiving end of the second optical transceiver module assembly, and the Laser Drive unit electric signal input end of the second transceiver chip is connected with host computer by interface circuit.
4. a kind of binary channels compact pluggable optical module circuit according to claim 3 is characterized in that, also comprises module inefficacy decision unit; Described module inefficacy decision unit is used to receive the transmitting terminal Signal Fail index signal of the first transceiver chip and the output of the second transceiver chip, and described module inefficacy decision unit is output as the result that transmitting terminal Signal Fail index signal that the first transceiver chip and the second transceiver chip export is made exclusive disjunction; And the output signal of module inefficacy decision unit transfers to host computer by interface circuit.
5. a kind of compact pluggable optical module circuit according to claim 4 is characterized in that, also comprises first filter and second filter;
Described first and second optical transceiver module component internal comprises laser diode, optical detection diode and trans-impedance amplifier; Wherein, the laser diode signal of telecommunication that is used for sending from the transceiver integrated chip transforms into light signal and output; The optical detection diode is used for the light signal of input is converted into faint current signal; Trans-impedance amplifier is used for the current signal of optical detection diode output is converted into voltage signal, and with this voltage signal output;
Be connected to first filter between the input of the limiting amplifier in the output of the trans-impedance amplifier of the described first optical transceiver module assembly and the first transceiver chip;
Be connected to second filter between the input of the limiting amplifier in the output of the trans-impedance amplifier of the described second optical transceiver module assembly and the second transceiver chip.
6. a kind of compact pluggable optical module circuit according to claim 1 is characterized in that, also comprises first filter and second filter;
First filter inserts in the signal path between the first optical transceiver module assembly and the first transceiver chip, is used for the noise of the filtering first optical transceiver module assembly to the signal of telecommunication of first transceiver chip output;
Second filter inserts in the signal path between the second optical transceiver module assembly and the second transceiver chip, is used for the noise of the filtering second optical transceiver module assembly to the signal of telecommunication of second transceiver chip output.
7. according to claim 5 or 6 described a kind of binary channels compact pluggable optical module circuit, it is characterized in that described first or second filter is a Bessel filter.
8. a kind of binary channels compact pluggable optical module circuit according to claim 7 is characterized in that also comprise temperature collecting cell, described temperature collecting cell is used for temperature signal is converted to the signal of telecommunication, and this signal of telecommunication is transferred to microcontroller.
9. a kind of binary channels compact pluggable optical module circuit according to claim 8, it is characterized in that described microcontroller, interface circuit, two groups of transceiver chips, temperature collection circuit, low pass filter and module inefficacy decision units are arranged on the pcb board.
10. a kind of binary channels compact pluggable optical module circuit according to claim 9, it is characterized in that described two groups of optical transceiver module assemblies communicate by the impedance matching transmission line that is provided with on the soft board and transceiver chip and the filter on the pcb board.
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CN107800486A (en) * 2016-09-06 2018-03-13 方密技术(深圳)有限公司 The compatible pluggable CSFP optical modules of binary channels compact of electrical interface
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WO2023108575A1 (en) * 2021-12-16 2023-06-22 成都瑞通视讯科技股份有限公司 Optical communication module, device, and system
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