CN102161570A - Upper-lower spray type substrate etching device - Google Patents
Upper-lower spray type substrate etching device Download PDFInfo
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- CN102161570A CN102161570A CN2010102196193A CN201010219619A CN102161570A CN 102161570 A CN102161570 A CN 102161570A CN 2010102196193 A CN2010102196193 A CN 2010102196193A CN 201010219619 A CN201010219619 A CN 201010219619A CN 102161570 A CN102161570 A CN 102161570A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133302—Rigid substrates, e.g. inorganic substrates
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- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention relates to an upper-lower spray type substrate etching device, and more detailedly relates to the upper-lower spray type substrate etching device which is characterized in that, etching is performed in order to reduce thickness of a glass substrate, making at least one of a spray part spraying etching liquid or/and a box provided with laminated substrates vibrate to make the etching liquid be uniformly sprayed on the substrates, thereby improving uniformity of etching.
Description
Technical field
The present invention relates to the substrate etching system, relate to such top downward jet-type substrate etching system in more detail, promptly, carry out etch processes on the two sides of substrate for the thickness of attenuate glass substrate, make spray etching solution injecting-unit or/and be laminated with at least one vibration in the box of substrate and etching solution be injected on the substrate equably, thereby can improve etched homogeneity and productivity.
Background technology
The integrated multiple function along with the development of portable electric appts, for the ease of carrying, therefore more and more very thin change of equipment and slimming also need the substrate thickness of the equipment that is installed in than the unfertile land manufacturing, in order to make substrate thickness than unfertile land, the general technology of using is an etching technique.
Generally be divided into dry-etching (Dry Etching) and Wet-type etching (Wet Etching) for etching (Etching) technology of using than the thickness of unfertile land processed glass substrate, under the situation of dry-etching, there is the limit in attenuate substrate thickness aspect, according to super very thinization requirement, be extensive use of Wet-type etching method as the method that is used to reduce thickness of glass substrate along with the glass substrate of the development of portable electric appts.
The general Wet-type etching that uses is by being arranged on the nozzle ejection etching solution on the box that is laminated with glass substrate, by making the mode of substrate thickness attenuation with the chemical reaction etching glass substrate of above-mentioned glass substrate.
But, the Wet-type etching in past is to spray etching solution under the state that injecting-unit that sprays etching solution and the box that is laminated with glass substrate are fixed, therefore, need take into full account the position, angle of the injecting-unit that sprays etching solution and dispose injecting-unit on the box of glass substrate being laminated with the condition of the physical properties such as distance of substrate, therefore consuming the too much time on the configuration effort, so the problem that exists productivity to reduce in advance.
And when producing error in the position of above-mentioned injecting-unit, the uniformity coefficient that is ejected into the etching solution of substrate descends, the problem that exists qualification rate to descend.
Summary of the invention
The present invention proposes in order to solve the above problems, the objective of the invention is to, a kind of top downward jet-type substrate etching system is provided, highly acid etching solution evenly is ejected into be layered in the substrate of two ends of box, the whole evenly injection on the substrate two sides can improve productivity and improve qualification rate.
And, a kind of top downward jet-type substrate etching system is provided, reduce the quantity of the nozzle that is formed on injecting-unit with respect to the substrate that is layered in box, thereby reduce cost of equipment, and reduce the loss of etching solution.
Summary of the invention
To achieve these goals, according to substrate etching system of the present invention, it is characterized in that, comprising: laminated member possesses the box that stacked vertical has at least one substrate; Injecting-unit sprays etching solution on above-mentioned laminated member top, possesses along at least one the unit nozzles portion that forms with aforesaid substrate direction arranged side by side; Two terminal unit nozzles portions of above-mentioned injecting-unit and the two terminal substrates that are layered in above-mentioned box are configured to be positioned on the same vertical line.
The invention is characterized in, above-mentioned injecting-unit comprises: along nozzle fixed part and at least one unit nozzles portion of forming with the substrate that is layered in above-mentioned box direction arranged side by side, this unit nozzles portion is included on the said nozzle fixed part nozzle of configuration at regular intervals; The aforesaid substrate etching system also comprises the 1st drive element, and the 1st drive element combines with an end of said nozzle fixed part, and control said nozzle fixed part when the etching solution of nozzle sprays makes it pass through rotation and counter-rotating vibration.
At this, above-mentioned the 1st drive element comprises: drive-motor, motivating force is provided, make the nozzle that is formed on said nozzle fixed part lower end along with the vertical transverse direction side-to-side vibrations of direction (orbital direction) at the box multilayer board of bottom; Microprocessor is controlled the driving of above-mentioned drive-motor; Transfer part is combined in above-mentioned drive-motor and said nozzle fixed part, and the motivating force of above-mentioned drive-motor is delivered to the said nozzle fixed part.
And above-mentioned transfer part comprises: belt around above-mentioned drive-motor and said nozzle fixed part, and closely contacts with a end in the upper and lower end of said nozzle fixed part; Bearing is formed on the other end in the upper and lower end of said nozzle fixed part and fixing said nozzle fixed part.
In addition, above-mentioned microprocessor is controlled the positive and negative rotation of above-mentioned drive-motor, above-mentioned drive-motor make the nozzle that is formed on said nozzle fixed part lower end along above-mentioned transverse direction about 45 degree scope internal vibrations.
And, the transfer part that the aforesaid substrate etching system also comprises above-mentioned the 1st drive element to outside prolongation the in chamber and with said nozzle fixed part bonded connection section, thereby make above-mentioned the 1st drive element be positioned at the outside, chamber that is formed with injecting-unit.
In addition, also comprise the 2nd drive element, the 2nd drive element is controlled, and making the box of above-mentioned laminated member is that longitudinal direction moves along the direction (orbital direction) that plaque layer is stacked in box, makes the box vibration when perhaps etching solution sprays.
And above-mentioned laminated member comprises: the box that is laminated with substrate; Be formed on above-mentioned box bottom, so that the wheel that can on the track that is formed at the bottom, chamber, move; The interconnecting piece that one end is connected with above-mentioned box; Above-mentioned the 2nd drive element comprises: the drive-motor that is provided for the motivating force that moves and vibrate of above-mentioned box; Control the microprocessor of above-mentioned drive-motor; Transmit the belt portion of the motivating force of above-mentioned drive-motor; And be formed in the above-mentioned belt portion, and be connected with the other end of above-mentioned interconnecting piece and move or vibrate the moving part of above-mentioned box.
At this, the interconnecting piece joint portion of above-mentioned box and moving part is formed with flange, and the two ends of above-mentioned interconnecting piece are formed with concludes at above-mentioned flange and the fixed hook.
As previously discussed, top according to the present invention downward jet-type substrate etching system, with the substrate that is layered in cassette interior or be ejected into the configuration-independent ground of unit nozzles portion on the top of above-mentioned internal base plate, the unit nozzles portion that is formed on two ends of injecting-unit is configured to be positioned on the same vertical line with the substrate that is layered in two ends of box, improve etch effect thereby can evenly spray etching solution on the surface on the substrate two sides that is disposed at two ends, generation can improve the effect of the brilliance of productivity and qualification rate.
In addition, during nozzle ejection etching solution by injecting-unit, in the box of vibration jet parts and laminated member at least one, thereby can irrespectively improve etch effect with configuration position of nozzle and angle, produce the effect of brilliance that can reduce the nozzle quantity of configuration with respect to stacked substrate at the whole etching solution that evenly sprays of substrate.
Description of drawings
Fig. 1 is the stereographic map of substrate etching system according to a preferred embodiment of the invention.
Fig. 2 is the stereographic map that the unit nozzles fixed part that is illustrated in the injecting-unit of Fig. 1 is installed nozzle.
Fig. 3 is the front view of the substrate etching system of schematic representation Fig. 1.
Fig. 4 is the figure of brief configuration of the injecting-unit of the expression vibrating function that is used for injecting-unit.
Fig. 5 is that the expression interconnecting piece is connected the stereographic map between drive element and the box.
Nomenclature:
10: injecting-unit 110: unit nozzles portion
111: nozzle fixed part 112: nozzle
Drive element 130 in 120: the 1: transfer part
20: laminated member 210: box
211: substrate 212: wheel
213: flange 220: interconnecting piece
221: link up with 30: the 2 drive elements
310: driving part 320: belt portion
330: moving part
Embodiment
Below, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Wet-type etching is that etching solution is ejected into the substrate two sides, and etching solution is adsorbed on substrate surface, removes above-mentioned etching solution makes substrate by the reactant that produces with the chemical reaction of substrate thickness attenuation from substrate.
Generally, Wet-type etching can use the method for pickling process, spray method, spray method etc., and substrate etching system according to the present invention is by handling etched mode by the spray method of nozzle ejection etching solution.
The reactant reservoir (not shown) that substrate etching system according to the present invention can comprise the etching solution reservoir (not shown) that stores etching solution, collect the reactant of the chemical reaction generation by etching solution and substrate surface.
Can constitute: the work of the etching solution that is stored in above-mentioned etching solution reservoir by pump is via nozzle ejection, and the reactant of the chemical reaction generation by etching solution and substrate surface is removed to the reactant of bottom and collects the reactant reservoir.
In addition, can constitute in the reactant of collecting above-mentioned reactant collection unit unreacted etching solution flows into the etching solution reservoir again and circulates.
According to the present invention, the etching solution that is ejected into the two sides integral body of the substrate that is installed in box can use hydrofluoric acid normally used all etching solutions such as (HF), the composition of etching solution and the effect of etching solution, those of ordinary skill to technical field of the present invention is conspicuous, and be the part that breaks away from feature of the present invention, so omit specific description.
Fig. 1 is the stereographic map of substrate etching system according to a preferred embodiment of the invention.Fig. 2 is the stereographic map that the unit nozzles fixed part that is illustrated in the injecting-unit of Fig. 1 is installed nozzle.Fig. 3 is the front view of the substrate etching system of schematic representation Fig. 1.
If referring to figs. 1 through Fig. 3, substrate etching system according to the present invention can comprise: the laminated member 20 that possesses the box that is laminated with substrate; Spray etching solution on above-mentioned laminated member top and possess along the injecting-unit 10 of at least one the unit nozzles portion that forms with aforesaid substrate direction arranged side by side; Two terminal unit nozzles portions 110 of above-mentioned injecting-unit and the two terminal substrates 211 that are layered in above-mentioned box 210 are configured to be positioned on the same vertical line.
The nozzle 112 that is formed on above-mentioned unit nozzles portion 110 forms at regular intervals in nozzle fixed part 111 lower ends, the etching solution spray angle of nozzle 112 and the spray angle of adjacent nozzles 112 are overlapping, can fully spray etching solution on the two sides so be layered in the substrate of cassette interior, but be positioned under the situation of substrate of two ends, the nozzle on aforesaid substrate top seldom is subjected to the influence of adjacent nozzles, therefore in order evenly to spray etching solution at the substrate that is positioned at two ends, the position of nozzle is very important.
If two terminal unit nozzles portions of above-mentioned injecting-unit break away from the vertical line of two terminal substrates under the situation about being provided with, the etching solution that is ejected into the one side in the substrate two sides does not fully spray, one side in the two sides is sprayed etching solution too much and is made the surface inhomogeneous, perhaps less sprays etching solution and reduces etch effect.
Therefore, as shown in Figure 3, two terminal unit nozzles portions of injecting-unit 10 and the two terminal substrates that are layered in above-mentioned box are positioned under the situation on the same vertical line, can evenly spray etching solution and keep etched uniformity coefficient in the two sides of the two terminal substrates that are laminated in above-mentioned box integral body, and can improve qualification rate.
In addition, the present invention can constitute at least one vibration in injecting-unit 10 and the laminated member 20 in order evenly to spray etching solution on the substrate two sides.
Fig. 4 is the figure of brief configuration of the injecting-unit of the expression vibrating function that is used for injecting-unit 10.
If with reference to Fig. 4, injecting-unit 10 comprises: along nozzle fixed part 111 and at least one unit nozzles portion 110 of forming with the substrate that is layered in above-mentioned box direction arranged side by side, this unit nozzles portion is included on the said nozzle fixed part nozzle 112 of configuration at regular intervals; Can also comprise: the 1st drive element 120 that motivating force controls vibration is provided, the motivating force of above-mentioned the 1st drive element is delivered to the transfer part 130 of above-mentioned unit nozzles portion to above-mentioned unit nozzles portion.
By aforesaid structure, the vertical transverse direction of direction (orbital direction of bottom, chamber) that constituent parts spray nozzle part 110 edges of injecting-unit and plaque layer are stacked in the bottom box is worked by rotation/counter-rotating side-to-side vibrations ground in the original place.
At this, above-mentioned the 1st drive element 120 can comprise the drive-motor that produces motivating force and the above-mentioned motor of control action microprocessor and constitute, above-mentioned drive-motor is for meticulous vibration control, can be made of stepper-motor that can positive and negative rotation.
And above-mentioned transfer part 130 is born and is used for transmitting the function of the vibration of being undertaken by the motivating force that is produced by above-mentioned the 1st drive element to constituent parts spray nozzle part 110.
Above-mentioned transfer part 130 can comprise: closely contact with a end in the upper and lower end of above-mentioned drive-motor and each nozzle fixed part and the other end in the belt 131 that centers on and the upper and lower end that is formed on said nozzle fixed part 111 fixes the bearing 132 of said nozzle fixed part 111 and constitute.
Thus, if replace transmission of drive force to left and right direction to belt 131 from the 1st drive element 120, then belt 131 side-to-side movements, one end of nozzle fixed part 111 closely contacts with belt 131, be formed with bearing 132 at the other end, nozzle fixed part 111 is along with vibration action is carried out in the side-to-side movement of belt 131 in the left rotation and right rotation of original place.
Above-mentioned Fig. 5 only is an embodiment, if can make nozzle fixed part 111 about the original place just/despun structure all can.
And, if the radius of said nozzle fixed part 111 left rotation and right rotation cross less than, might reduce vibrating effect, under the too big situation, nozzle is towards the substrate outside, may produce the waste of etching solution, therefore, preferably be adjusted to the nozzle 112 that is arranged on nozzle fixed part lower end about 45 degree scope internal vibrations.
On the other hand, when above-mentioned the 1st drive element 120 is positioned at etched cavity inside,, therefore between above-mentioned transfer part 130 and nozzle fixed part 111, can also comprise the connection section (not shown) of rod-shape because the infiltration of highly acid etching solution might be corroded.Because above-mentioned connection section (not shown), above-mentioned the 1st drive element 120 and transfer part 130 can be formed on the etched cavity outside.
In addition, above-mentioned the 1st drive element 120 can be formed on each nozzle fixed part 111, and microprocessor constitutes for each nozzle fixed part 111 and vibrates unequally.
More specifically, end at above-mentioned each nozzle fixed part 111 can be provided with the 1st drive element that is connected with drive-motor, the microprocessor of controlling above-mentioned a plurality of drive-motor can make above-mentioned each drive-motor irregular oscillation ground control, and may be controlled to etching solution thus and is injected in substrate surface more equably.
By as the vibration of above-mentioned injecting-unit 10, can increase the spray angle of jetting fluid, the quantity that can reduce nozzle with respect to the substrate that is layered in box reduces the loss of etching solution thus.
On the other hand, laminated member 20 can comprise multilayer board 211 box 210, connect the interconnecting piece 220 of above-mentioned box and the 2nd drive element 30 and constitute.Be positioned under the situation of etched cavity at the 2nd drive element 30, above-mentioned interconnecting piece 220 may produce fault and shorten the life-span by the etching solution corrosion, so be to be used to make drive element to be positioned at the structure of etched cavity outside.
Fig. 5 is illustrated in the stereographic map that connects interconnecting piece 220 between the 2nd drive element 30 and the box 210.
If with reference to Fig. 5, drive element 30 can comprise: provide motivating force driving part 310, transmit the motivating force that produces from above-mentioned driving part belt portion 320, conclude an end of above-mentioned interconnecting piece and mobile moving part 330 in above-mentioned belt portion.
At this, above-mentioned driving part 310 can comprise the microprocessor of drive-motor and the above-mentioned drive-motor of control and constitute.
Substrate etching system according to the present invention comprises above-mentioned injecting-unit 10 and laminated member 20 in the chamber, be formed with track 50 in the lower end, chamber, is formed with wheel 212 in box 210 lower ends of above-mentioned laminated member, so that can move on track 50.
Above-mentioned chamber can be made of the multistage chamber of etched cavity, cleaning chambers etc., so the track 50 in the lower end, chamber inserts above-mentioned wheel 212 and mobile in the chamber along above-mentioned track 50, so that above-mentioned box moves between a plurality of chambeies.
Therefore, above-mentioned belt portion 320 is moved, moving part 330 in the above-mentioned belt portion moves along with moving of belt portion, one end is combined in interconnecting piece 220 on the above-mentioned moving part 330 when moving, and the box 210 that is connected the other end is along with above-mentioned track 50 moves.
At this, above-mentioned interconnecting piece 220 has hook 221 at two ends, so that conclude at box 210 and moving part 330 at two ends, above-mentioned hook 221 is installed in the groove 213,333 of above-mentioned box 210 and moving part 330, and box 210 and moving part 330 are by interconnecting piece 220 combinations.
Then, with above-mentioned moving part 330 one bonded interconnecting pieces 220 and box 210 along with moving of moving part moved towards orbital direction, thereby box 210 moves.
Along with aforesaid action, the 2nd drive element 30 can be formed on laminated member 20 outsides, can prevent etching solution by the 2nd drive element 30 thereupon, particularly is driven portion 310 and absorbs and the corrosion drive element.
Along with aforesaid action, box 210 is moved under the interior situation of etched cavity, and by the injecting-unit injection etching solution on top, it is the whole etching solution that evenly sprays on the two sides of substrate that above-mentioned box can vibrate.
For this reason, the drive-motor of the 2nd drive element 30 is with positive and negative rotation alternating movement, and when belt portion 320 alternately moved in the other direction towards orbital direction and track thereupon, the moving part 330 in the belt portion also alternately moved in the other direction towards orbital direction and track.
Thus, in the other direction alternately vibration the time, etching solution can evenly be injected in substrate two sides integral body towards orbital direction and track for interconnecting piece 220 that is connected with above-mentioned moving part 330 one and box 210.
The present invention can constitute, injecting-unit 10 edges and the vertical transverse direction side-to-side vibrations of the direction that is laminated with substrate (orbital direction), perhaps above-mentioned box 210 is the longitudinal direction side-to-side vibrations along the direction (orbital direction) that is laminated with substrate, thereby can improve the etching solution jeting effect, and constitute above-mentioned injecting-unit 10 and box 210 vibrates simultaneously, and make the maximization of etching solution jeting effect.
In the detailed description of the present invention of above explanation; be illustrated with reference to the preferred embodiments of the present invention; but protection scope of the present invention is not limited to the foregoing description, and those skilled in the art are appreciated that modifications and changes the present invention in many ways in the scope that does not break away from thought of the present invention and technical field.
Claims (9)
1. a top downward jet-type substrate etching system is characterized in that, comprising:
Laminated member possesses the box that stacked vertical has at least one substrate;
Injecting-unit sprays etching solution on above-mentioned laminated member top, possesses along at least one the unit nozzles portion that forms with aforesaid substrate direction arranged side by side;
Two terminal unit nozzles portions of above-mentioned injecting-unit and the two terminal substrates that are layered in above-mentioned box are configured to be positioned on the same vertical line.
2. top as claimed in claim 1 downward jet-type substrate etching system is characterized in that,
Above-mentioned injecting-unit comprises: along nozzle fixed part and at least one unit nozzles portion of forming with the substrate that is layered in above-mentioned box direction arranged side by side, this unit nozzles portion is included on the said nozzle fixed part nozzle of configuration at regular intervals;
The aforesaid substrate etching system also comprises the 1st drive element, and the 1st drive element combines with an end of said nozzle fixed part, and control said nozzle fixed part when the etching solution of nozzle sprays makes it pass through rotation and counter-rotating vibration.
3. top as claimed in claim 2 downward jet-type substrate etching system is characterized in that,
Above-mentioned the 1st drive element comprises:
Drive-motor provides motivating force, make the nozzle that is formed on said nozzle fixed part lower end along with direction at the box multilayer board of bottom be the vertical transverse direction side-to-side vibrations of orbital direction;
Microprocessor is controlled the driving of above-mentioned drive-motor;
Transfer part is combined in above-mentioned drive-motor and said nozzle fixed part, and the motivating force of above-mentioned drive-motor is delivered to the said nozzle fixed part.
4. top as claimed in claim 3 downward jet-type substrate etching system is characterized in that,
Above-mentioned transfer part comprises:
Belt around above-mentioned drive-motor and said nozzle fixed part, and closely contacts with a end in the upper and lower end of said nozzle fixed part;
Bearing is formed on the other end in the upper and lower end of said nozzle fixed part and fixing said nozzle fixed part.
5. top as claimed in claim 3 downward jet-type substrate etching system is characterized in that,
Above-mentioned microprocessor is controlled the positive and negative rotation of above-mentioned drive-motor, above-mentioned drive-motor make the nozzle that is formed on said nozzle fixed part lower end along above-mentioned transverse direction about 45 degree scope internal vibrations.
6. top as claimed in claim 3 downward jet-type substrate etching system is characterized in that,
The transfer part that also comprises above-mentioned the 1st drive element to outside prolongation the in chamber and with said nozzle fixed part bonded connection section, thereby make above-mentioned the 1st drive element be positioned at the outside, chamber that is formed with injecting-unit.
7. top as claimed in claim 1 downward jet-type substrate etching system, it is characterized in that, also comprise the 2nd drive element, the 2nd drive element is controlled, the direction that the box that makes above-mentioned laminated member is stacked in box along plaque layer is that the longitudinal direction of orbital direction moves, and makes the box vibration when perhaps etching solution sprays.
8. top as claimed in claim 7 downward jet-type substrate etching system is characterized in that,
Above-mentioned laminated member comprises:
Box is laminated with substrate;
Wheel is formed on above-mentioned box bottom, so that can move on the track that is formed at the bottom, chamber;
Interconnecting piece, an end is connected with above-mentioned box;
Above-mentioned drive element comprises:
Drive-motor is provided for moving of above-mentioned box and reaches the motivating force of vibrating;
Belt portion transmits the motivating force of above-mentioned drive-motor;
Moving part is formed in the above-mentioned belt portion, and is connected with the other end of above-mentioned interconnecting piece and moves or vibrate above-mentioned box.
9. top as claimed in claim 8 downward jet-type substrate etching system is characterized in that,
The interconnecting piece joint portion of above-mentioned box and moving part is formed with flange,
The two ends of above-mentioned interconnecting piece are formed with concludes at above-mentioned flange and the fixed hook.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2010-0016078 | 2010-02-23 | ||
| KR1020100016078A KR101007306B1 (en) | 2010-02-23 | 2010-02-23 | Substrate etching device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102161570A true CN102161570A (en) | 2011-08-24 |
| CN102161570B CN102161570B (en) | 2013-11-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102196193A Expired - Fee Related CN102161570B (en) | 2010-02-23 | 2010-07-07 | Upper-lower spray type substrate etching device |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101007306B1 (en) |
| CN (1) | CN102161570B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013033932A1 (en) * | 2011-09-09 | 2013-03-14 | 深圳市华星光电技术有限公司 | Wet etching device and method |
| CN103241956A (en) * | 2012-02-03 | 2013-08-14 | Mm技术股份有限公司 | Apparatus for etching substrate |
| CN109680278A (en) * | 2019-02-26 | 2019-04-26 | 合肥永淇智材科技有限公司 | A kind of the vertical Etaching device and its engraving method of FMM sheet metal |
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| KR101371159B1 (en) * | 2012-01-30 | 2014-03-06 | (주) 청심이엔지 | Anti-shock etching apparatus for glass wafer |
| KR101352469B1 (en) | 2012-02-02 | 2014-01-17 | (주) 청심이엔지 | Apparatus for etching glass wafer |
| KR101317680B1 (en) * | 2012-02-10 | 2013-10-15 | 주식회사 이코니 | Thickness gauging system for etching panel |
| KR101471096B1 (en) * | 2013-07-03 | 2014-12-09 | 주식회사 위스코하이텍 | Apparatus for etching substrate |
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| CN101481217A (en) * | 2008-01-09 | 2009-07-15 | 伊可尼股份有限公司 | An apparatus for etching a glass wafer, and a glass sheet manufactured by the same |
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| KR20090122894A (en) * | 2009-10-06 | 2009-12-01 | 우진선행기술 주식회사 | Device for slimming of plate and assembly for sliming of plate |
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- 2010-02-23 KR KR1020100016078A patent/KR101007306B1/en active IP Right Grant
- 2010-07-07 CN CN2010102196193A patent/CN102161570B/en not_active Expired - Fee Related
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| CN1669967A (en) * | 2004-03-17 | 2005-09-21 | 西山不锈化学股份有限公司 | Glass panel surface etching method and apparatus, glass panel and flat display |
| CN101481217A (en) * | 2008-01-09 | 2009-07-15 | 伊可尼股份有限公司 | An apparatus for etching a glass wafer, and a glass sheet manufactured by the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013033932A1 (en) * | 2011-09-09 | 2013-03-14 | 深圳市华星光电技术有限公司 | Wet etching device and method |
| CN103241956A (en) * | 2012-02-03 | 2013-08-14 | Mm技术股份有限公司 | Apparatus for etching substrate |
| CN103241956B (en) * | 2012-02-03 | 2014-10-08 | Mm技术股份有限公司 | Apparatus for etching substrate |
| TWI489574B (en) * | 2012-02-03 | 2015-06-21 | Mm Tech Co Ltd | Apparatus for etching substrate |
| CN109680278A (en) * | 2019-02-26 | 2019-04-26 | 合肥永淇智材科技有限公司 | A kind of the vertical Etaching device and its engraving method of FMM sheet metal |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101007306B1 (en) | 2011-01-13 |
| CN102161570B (en) | 2013-11-06 |
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