CN102161141B - Welding wire machine - Google Patents
Welding wire machine Download PDFInfo
- Publication number
- CN102161141B CN102161141B CN201110071830.XA CN201110071830A CN102161141B CN 102161141 B CN102161141 B CN 102161141B CN 201110071830 A CN201110071830 A CN 201110071830A CN 102161141 B CN102161141 B CN 102161141B
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- CN
- China
- Prior art keywords
- block
- heating
- heat transfer
- bonding equipment
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Arc Welding In General (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses a welding wire machine, wherein a pre-heating module is arranged on the welding wire machine and mainly comprises a pre-heating plate and a heating block which is arranged below the pre-heating plate and used for heating the pre-heating plate, wherein the area of the upper surface of the pre-heating plate is bigger than that of the upper surface of the heating block. The welding wire machine is characterized in that at least one detachable heat-transfer block is arranged beside the heating block. The welding wire machine provided by the invention enlarges the heating area effectively by mounting detachable heat-transfer blocks on the two sides of the heating block, so that a workpiece can be heated rapidly and uniformly and deviation caused by thermal expansion is effectively avoided. The welding wire machine has the advantages of simple structure, convenient use, high pre-heating speed, uniform pre-heating and the like.
Description
Technical field
The present invention relates to a kind of bonding equipment, especially about the warm-up block of bonding equipment.
Background technology
Bonding equipment comprises gold thread machine, aluminum steel machine, ultrasonic wire welding machine etc.Bonding equipment is mainly used in high power device: the lead welding of light emitting diode, laser tube, middle-size and small-size pliotron, integrated circuit and some particular semiconductor device.Bonding equipment, when device (the calling workpiece in the following text) welding to needs welding, often needs first workpiece to be carried out to the pre-heat treatment, and then welds, so bonding equipment is often provided with warm-up block.The warm-up block of described bonding equipment mainly comprises preheating table and heat block, and heat block heats preheating table, and workpiece carries out preheating on preheating table.But the upper surface area of the preheating table of the warm-up block of this existing bonding equipment is often greater than the upper surface area of heat block, so the heating of preheating table is inhomogeneous, on preheating table, the temperature of the position of corresponding heat block is higher, and the temperature of other positions is lower.And workpiece varies, when workpiece hour, workpiece is placed on the position of corresponding heat block on preheating table, the preheating of workpiece is more even, and preheating speed's ratio of workpiece is very fast, but when workpiece is larger, because of the heating of preheating table itself inhomogeneous, make workpiece preheating also inhomogeneous, thereby cause causing welding deviation because workpiece expanded by heating is inhomogeneous, the preheating speed of workpiece is also slow.For this problem, being replaced with a larger heat block is a solution.But heat block price comparison is expensive, and the Comparision trouble of replacing heat block, not only increase operation, and improved operation intensity, reduced the efficiency of machine.
Summary of the invention
The invention provides a kind of solution of the above problems, provide a kind of simple in structure, easy to assembly, preheating speed is fast and the uniform bonding equipment of preheating.
Technical scheme of the present invention is to provide a kind of bonding equipment, which is provided with warm-up block, described in
Warm-up block mainly comprises preheating table and is arranged at the below of preheating table to the heat block of preheating table heating, the area of described preheating table upper surface is greater than the area of described heat block upper surface, it is characterized in that: described heat block side is provided with dismountable at least one heat transfer block.
Preferably, described heat transfer block is symmetricly set on the both sides of described heat block.
Preferably, the upper surface of described heat transfer block and the upper surface of heat block are positioned at same plane
On.
Preferably, described heat transfer block is made by the good metal of thermal conductivity.
Preferably, between the described heat transfer block of described heat block both sides, by horizontal tie-beam, connect
Connect.
Preferably, the two ends of described heat block are all pivotally connected buckle, a clamping of described buckle
End is hook-type, and described buckle joint end detachable card is connected on described horizontal tie-beam.
Preferably, the two ends of described heat block are provided with horizontal groove, described horizontal tie-beam
Can inlay card in described groove.
Preferably, the upper surface of described horizontal tie-beam and the upper surface of heat block are positioned at same
In plane.
Bonding equipment of the present invention removably installs heat transfer block additional by the both sides at heat block, has effectively strengthened heating region, and workpiece can be heated by Quick uniform, thereby has effectively avoided the deviation that produces because of thermal expansion.There is simple in structure, easy to use, preheating speed's piece, the advantage such as preheating is even.
Accompanying drawing explanation
Fig. 1 is the structural representation of the first embodiment of bonding equipment of the present invention;
Fig. 2 is the structural representation of the second embodiment of bonding equipment of the present invention.
The specific embodiment
Below the specific embodiment of the present invention is described in further detail.
As shown in Figure 1, the bonding equipment of the first embodiment of the present invention, which is provided with warm-up block, the below that warm-up block mainly comprises preheating table (not shown) and is arranged at preheating table is to the heat block 10 of preheating table heating, and workpiece to be welded (not shown) is placed on preheating table to carry out preheating.The area of the upper surface of preheating table is greater than the area of heat block 10 upper surfaces.Heat block 10 is strip, its both sides be provided be similarly strip by the good metal of thermal conductivity, make heat transfer block 12.The upper surface of the upper surface of heat transfer block 12 and heat block 10 is positioned in same plane, makes itself and preheating table close contact.For by heat transfer block 12 and heat block 10 close contacts, and in use not occurrence positions skew, heat transfer block 12 can be connected into an integral body by being positioned at the horizontal tie-beam 14 at heat transfer block 12 two ends; Then, the buckle 16 that can rotate is up and down set at the two ends of heat block 10.The joint end of buckle 16 is hook-type, presses buckle 16 downwards, the joint end of buckle 16 can be connected on horizontal tie-beam 14, thereby heat transfer block 12 is fixed on heat block 10.Upwards unclamp buckle 16, can unclamp heat transfer block 12, heat transfer block 12 is separated with heat block 10.
As shown in Figure 2, the horizontal tie-beam 14 of the second embodiment is positioned at the Pian Nei position, two ends of heat transfer block 12, and two heat transfer blocks 12 are connected into a mouth word, and its upper surface is equal with heat transfer block 12.The two ends of heat block 10 process horizontal to low groove 18 with respect to the position of horizontal tie-beam 14, groove 18 just can be accommodated horizontal tie-beam 14.To transferring heat transfer block 12, laterally tie-beam 14 just in time inlay card in groove 18, thereby heat transfer block 12 is shelved on heat block 10, in use also can occurrence positions skew.Upwards mentioning heat transfer block 12 can make heat transfer block 12 separated with heat block 10.Load and split also very convenient.
For the larger workpiece of welding, by above-mentioned two kinds of modes, heat transfer block 12 and heat block 10 can be fitted together, on it, cover again preheating table.Heat transfer block in the first embodiment 12 is with the upper surface of heat block 10 all in same surface, and the heat transfer block 12 in the second embodiment, tie-beam 14 are with the upper surface of heat block 10 all in same surface, and this can make they and preheating table close contact.Due to the good conductivity of heat of heat transfer block 12, the heat of heat block 10 can be delivered to rapidly on the preheating table that heat transfer block 12 touches.Not only improve the speed of heating, and effectively strengthened the heating surface (area) (HS of preheating table, solved the problem that causes workpiece local heating because heating surface (area) (HS is little.For the less workpiece of welding, heat transfer block 12 can be taken off from heat block 10, reduce the waste of heat.
In fact, by heat transfer block 12 be removably fixed on mode industry those of ordinary skill on heat block 10 can also find out a variety of, such as latch etc.These can make heat transfer block 12 load easily or dismantle, to adapt to the workpiece of the different sizes of heating.
Above embodiment is only the present invention's a kind of embodiment wherein, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (6)
1. a bonding equipment, which is provided with warm-up block, described warm-up block mainly comprises preheating table and is arranged at the below of preheating table to the heat block of preheating table heating, the area of described preheating table upper surface is greater than the area of described heat block upper surface, it is characterized in that: described heat block side is provided with dismountable at least one heat transfer block; Described heat transfer block is symmetricly set on the both sides of described heat block; The upper surface of described heat transfer block and the upper surface of heat block are positioned in same plane.
2. bonding equipment according to claim 1, is characterized in that: described heat transfer block is made by the good metal of thermal conductivity.
3. bonding equipment according to claim 1, is characterized in that: between the described heat transfer block of described heat block both sides, by horizontal tie-beam, connect.
4. bonding equipment according to claim 3, is characterized in that: the two ends of described heat block are all pivotally connected a buckle, and the joint end of described buckle is hook-type, and described buckle joint end detachable card is connected on described horizontal tie-beam.
5. bonding equipment according to claim 3, is characterized in that: the two ends of described heat block are provided with horizontal groove, described horizontal tie-beam can inlay card in described groove.
6. bonding equipment according to claim 5, is characterized in that: the upper surface of described horizontal tie-beam and the upper surface of heat block are positioned in same plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110071830.XA CN102161141B (en) | 2011-03-24 | 2011-03-24 | Welding wire machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110071830.XA CN102161141B (en) | 2011-03-24 | 2011-03-24 | Welding wire machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102161141A CN102161141A (en) | 2011-08-24 |
| CN102161141B true CN102161141B (en) | 2014-01-29 |
Family
ID=44462739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110071830.XA Expired - Fee Related CN102161141B (en) | 2011-03-24 | 2011-03-24 | Welding wire machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102161141B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113020742B (en) * | 2021-05-28 | 2021-08-17 | 广东阿达智能装备有限公司 | Improve welding wire machine of welding precision |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6025101A (en) * | 1997-12-16 | 2000-02-15 | Fuji Xerox, Co., Ltd. | Image forming method and image forming apparatus for use in the method |
| CN201247694Y (en) * | 2008-05-27 | 2009-05-27 | 苏州工业职业技术学院 | Heat treatment equipment for aluminum electrolysis capacitor |
| CN201677109U (en) * | 2010-04-28 | 2010-12-22 | 台达电子工业股份有限公司 | Heating device and preheating module and preheating device utilizing same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2631691B1 (en) * | 1988-05-20 | 1990-07-13 | Commissariat Energie Atomique | DEVICE FOR TRANSMITTING VACUUM HEAT BY GRAINS |
| US5366585A (en) * | 1993-01-28 | 1994-11-22 | Applied Materials, Inc. | Method and apparatus for protection of conductive surfaces in a plasma processing reactor |
| JP2005285355A (en) * | 2004-03-26 | 2005-10-13 | Ngk Insulators Ltd | Heating apparatus |
-
2011
- 2011-03-24 CN CN201110071830.XA patent/CN102161141B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6025101A (en) * | 1997-12-16 | 2000-02-15 | Fuji Xerox, Co., Ltd. | Image forming method and image forming apparatus for use in the method |
| CN201247694Y (en) * | 2008-05-27 | 2009-05-27 | 苏州工业职业技术学院 | Heat treatment equipment for aluminum electrolysis capacitor |
| CN201677109U (en) * | 2010-04-28 | 2010-12-22 | 台达电子工业股份有限公司 | Heating device and preheating module and preheating device utilizing same |
Non-Patent Citations (2)
| Title |
|---|
| JP平2-43937A 1990.02.14 |
| JP特开2003-249455A 2003.09.05 |
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| Publication number | Publication date |
|---|---|
| CN102161141A (en) | 2011-08-24 |
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Granted publication date: 20140129 Termination date: 20150324 |
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| EXPY | Termination of patent right or utility model |